JP2013069483A - Substrate processing device and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of restraining adhesion of a processing liquid onto a side face of a substrate.SOLUTION: A substrate processing device 20 comprises: a substrate holding part 30 for holding a substrate S almost parallely; and an emission part 50 for emitting coating liquid to the substrate S while moving along a main scanning mechanism guide part 42 extending in a main scanning direction almost parallel to the substrate S. A pair of side walls 60a, 60b are provided so as to sandwich an existence region ER of the substrate S, and upper ends thereof are positioned above a main face Sm of the substrate S. When the emission part 50 approaches to a vicinity of the side face of the substrate S from outside of the existence region ER of the substrate S, the coating liquid emitted from the emission part 50 is shielded by the side walls 60a, 60b, and is not adhered to both side faces Ss1, Ss2 of the substrate S.

Description

  The present invention includes a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (Plasma Display Panel), a glass substrate for an organic EL display panel, a substrate for a solar cell, a glass for a magnetic or optical disk, or a ceramic substrate. The present invention relates to a technique for applying a processing liquid to various substrates to be processed.

  Conventionally, there is an apparatus disclosed in Patent Document 1 as an apparatus for applying a processing liquid to a substrate to be processed.

  Patent Document 1 discloses a substrate processing apparatus in which a nozzle is disposed to face a substrate, and an organic EL coating liquid is discharged from the nozzle to form an organic layer on the substrate. In this substrate processing apparatus, the coating liquid is continuously discharged from the nozzle until the substrate processing is completed. For this reason, the non-application area | region of the coating liquid in the main surface of a board | substrate was masked with the tape beforehand, and it prevented that the coating liquid was apply | coated to the area | region of the main surface of a board | substrate applicable to the said non-application area | region. .

JP 2006-216414 A

  Masking with the tape described above is effective in forming a non-application region of the application liquid on the main surface of the substrate. However, it was not possible to prevent the coating liquid from adhering to the side surface portion of the substrate. For this reason, there is a possibility that the coating liquid applied to the portion is dried and scattered as particles.

  This invention is made | formed in view of the said subject, and it aims at providing the technique which can suppress that a process liquid adheres to the side surface of a board | substrate.

  1st invention is a substrate processing apparatus, Comprising: The board | substrate holding part which hold | maintains a board | substrate substantially horizontal, and the guide part which is installed above the said board | substrate and extends along the main scanning direction substantially parallel with respect to the said board | substrate. And a processing liquid on the substrate while moving along the main scanning direction by the guide portion in a section between a pair of moving ends set so as to sandwich the substrate existing area along the main scanning direction. In the space between each of the pair of moving ends and the existence area of the substrate with respect to the main scanning direction, and the respective upper end heights are equal to or higher than the main surface height of the substrate. A pair of side walls.

  A second invention is a substrate processing apparatus according to the first invention, wherein at least an upper part of the side wall part is formed of a porous material.

  3rd invention is the substrate processing apparatus which concerns on 1st invention or 2nd invention, Comprising: The processing liquid collected by the said side wall part is collected among the processing liquid discharged from the said discharge part. A collecting means is attached to the side wall portion.

  4th invention is the substrate processing apparatus as described in any one of 1st invention thru | or 3rd invention, Comprising: The said side wall part is formed with the elastic material, The said pair of side wall part is made into the said It further comprises a drive mechanism that moves in a direction to sandwich both sides of the substrate.

  5th invention is a substrate processing method, Comprising: Between the board | substrate holding process which hold | maintains a board | substrate substantially horizontally, and a pair of moving end set so that the presence area of the said board | substrate might be pinched | interposed along the main scanning direction In a section, the discharge unit is moved along the main scanning direction by a predetermined guide unit, and a discharge process liquid is discharged downward from the discharge unit, the pair of moving ends with respect to the main scanning direction, Among the processing liquids discharged from the discharge unit, in a pair of side walls that are installed in spaces between each of the substrate existing areas and whose upper end height is equal to or higher than the main surface height of the substrate. And a shielding step of shielding a portion facing the side surface of the substrate.

  In the first to fifth aspects of the invention, the pair of side wall portions are formed in spaces between the region where the substrate exists in the main scanning direction and the pair of moving ends of the discharge portion set so as to sandwich the substrate. . For this reason, since the process liquid discharged from the discharge part moving along the main scanning direction is blocked by the side wall part, it is possible to suppress the process liquid from adhering to the side surface of the substrate.

  In particular, in the second invention, at least the upper part of the side wall part is formed of a porous material. For this reason, since the processing liquid adhering to the side wall portion is absorbed by the hole portion of the side wall portion, the processing liquid adhering to the outside of the side wall portion can be prevented from drying and scattering as particles inside the apparatus.

  In particular, in the third invention, a collecting part for collecting the processing liquid collected at the side wall part of the processing liquid discharged from the discharge part is attached to the side wall part. Therefore, the state where the processing liquid collected at the side wall portion adheres to the side wall portion can be eliminated relatively quickly.

  In particular, in the fourth invention, the side wall portion is formed of an elastic material, and the drive mechanism can move the pair of side wall portions in a direction sandwiching both side surfaces of the substrate. Accordingly, since the coating liquid is discharged from the discharge portion in a state where the pair of side wall portions sandwich the substrate, it is possible to more reliably suppress the treatment liquid from adhering to both side surfaces of the substrate.

1 is a plan view of a substrate processing apparatus according to a first embodiment. 1 is a front view of a substrate processing apparatus according to a first embodiment. It is a flowchart which shows the flow of a board | substrate process. It is a figure which shows the state transition of the principal part of the substrate processing apparatus which concerns on 1st Embodiment. It is a schematic front view of the substrate processing apparatus which concerns on 2nd Embodiment. It is a schematic plan view which shows the mode of the process of the principal part of the substrate processing apparatus which concerns on 3rd Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiment is an example embodying the present invention, and is not an example of limiting the technical scope of the present invention.

<First Embodiment>
FIG. 1 shows a plan view of a substrate processing apparatus 20 according to the first embodiment. FIG. 2 shows a front view of the substrate processing apparatus 20.

  In the following description, XYZ orthogonal coordinates shown in the drawings are used as appropriate when indicating directions and orientations. Here, the X-axis and Y-axis directions indicate the horizontal direction, and the Z-axis direction indicates the vertical direction (the + Z side is the upper side and the -Z side is the lower side). For convenience, the Y-axis direction is the substrate transport direction (+ Y side is the downstream side, -Y side is the upstream side), and the X-axis direction is the main scanning direction (+ X side, -X side).

  The substrate processing apparatus 20 is an apparatus that applies a coating liquid as a processing liquid to the substrate S. As the substrate S, a rectangular substrate, for example, a glass substrate for a flat display device or the like is assumed. Further, as the coating liquid, a forming material such as a pattern to be formed on the substrate S, for example, a liquid containing an organic EL material and its solvent or the like is assumed when manufacturing an organic EL display device is assumed.

  The substrate processing apparatus 20 includes a substrate holding unit 30 that holds the substrate S, a main scanning mechanism 40, a discharge unit 50 that discharges a coating liquid, and a pair of side wall portions 60 that are formed outside the substrate holding unit 30. , Mainly.

  The substrate holding unit 30 is configured to be able to hold the substrate S in a substantially horizontal posture. Here, the substrate holding part 30 has a stage 32 having its main surface disposed in a substantially horizontal position upward at a predetermined height position. A plurality of suction holes (not shown) are formed on the upper surface of the stage 32. By forming a negative pressure (suction pressure) in the suction holes, the substrate S placed on the stage 32 is fixed and held in a horizontal posture. Is done. In addition, the substrate holding unit may be configured to hold the substrate by gripping the periphery of the substrate. The edge portions S1 and S2 of the substrate S in the main scanning direction protrude beyond the edge portions 32a and 32b of the stage 32 in the main scanning direction.

  A substrate moving mechanism 34 that moves the substrate S relative to the ejection unit 50 along the Y direction (sub-scanning direction) is provided below the substrate holding unit 30. Here, the substrate moving mechanism 34 includes a base portion 36 that supports the stage 32 and a pair of slide receiving portions 37. The slide receiving portion 37 is provided at the lower end of the base portion 36 and is configured to be slidable on a pair of sub-scanning direction guide portions 39 extending along the Y direction. The substrate moving mechanism 34 moves along the Y direction together with the stage 32 and the substrate S by receiving a driving force from a substrate moving drive unit (not shown) such as a linear motor. Instead of moving the substrate S along the Y direction, the main scanning mechanism 40 and the ejection unit 50 may be moved along the Y direction with respect to the substrate S. The stage 32 is configured to be rotatable around the vertical axis with respect to the substrate moving mechanism 34, and is used for adjusting the alignment of the substrate.

  The main scanning mechanism 40 includes a main scanning mechanism guide portion 42 and a slider 44 that moves along the main scanning mechanism guide portion 42. The main scanning mechanism guide portion 42 is formed in a long member extending along the main scanning direction (X direction) substantially parallel to the substrate S at a position above the substrate S. The slider 44 is a member having an internal space in which the main scanning mechanism guide portion 42 can be inserted and arranged, and is supported by the main scanning mechanism guide portion 42 so as to be movable along the X direction. The outer shape of the slider 44 is formed in a substantially rectangular parallelepiped shape.

  Inside the slider 44, an internal space (not shown) that can surround the outer peripheral surface of the main scanning mechanism guide 42 with a space is formed. A part of the air supplied from an air supply source 86 (described later) through the air pipe 80 a is discharged toward the inner peripheral surface of the slider 44. Thus, the slider 44 is supported so as to be movable along the X direction with an air layer interposed between the slider 44 and the outer peripheral surface of the main scanning mechanism guide portion 42.

  In the present embodiment, the slider 44 corresponds to the moving unit. The moving unit is not limited to the slider, and may be a member that can move along the main scanning mechanism guide unit 42. The slider need not be supported movably with the air layer interposed between the main scanning mechanism guide portion and the main scanning mechanism guide portion. For example, the slider may be configured to be movably supported in contact with the elongated main scanning mechanism guide portion via another low friction member, a rolling element, or the like.

  Further, here, a counter guide portion 46 and a counter slider 48 are provided above the main scanning mechanism guide portion 42.

  The counter guide portion 46 is formed as a long bar-like member extending along the X direction. The counter slider 48 is a member having an internal space in which the counter guide portion 46 can be inserted and arranged, and is supported by the counter guide portion 46 so as to be movable along the X direction.

  Here, the counter guide portion 46 is formed in a substantially round bar shape, and two counter guide portions 46 are provided in a substantially parallel state above the main scanning mechanism guide portion 42. In addition, an internal space (not shown) that can surround the outer peripheral surface of each counter guide portion 46 with a space is formed inside the counter slider 48. A part of the air supplied from an air supply source 86 (described later) through the air pipe 80 a is discharged toward the inner peripheral surface of the counter slider 48. Thus, the counter slider 48 is supported so as to be movable along the X direction with the air layer interposed between the counter slider 48 and the outer peripheral surface of the counter guide portion 46.

  Here, as the configuration in which the counter slider is supported so as to be movable with respect to the counter guide portion, various configurations can be adopted as described with respect to the main scanning mechanism 40. That is, the counter slider need not be movably supported with the air layer interposed between the counter guide portion as described above. For example, the counter slider may be configured to be movably supported in contact with the long counter guide portion via another low friction member, a rolling element, or the like.

  The discharge unit 50 is supported by the slider 44 so as to be movable in the main scanning direction, and is configured to discharge the coating liquid onto the substrate S. In particular, the ejection unit 50 in the present embodiment is a section between a pair of moving ends that is set so as to sandwich the existence area ER of the substrate S along the main scanning direction. It can move along. Here, the ejection unit 50 includes a nozzle support unit 52 and at least one nozzle 54. In FIG. 1, it is assumed that three nozzles 54 are provided for convenience of illustration.

  The nozzle support portion 52 has a base end portion 52a attached to one side surface of the slider 44 and a nozzle attachment plate portion 52b extending outward from the lower end portion of the base end portion 52a. The plurality of nozzles 54 are attached and fixed to the nozzle attachment plate portion 52b while shifting their positions in the X direction and the Y direction. Each nozzle 54 has a discharge port through which the coating liquid can be discharged, and is fixed to the nozzle mounting plate portion 52b in such a posture that the discharge port faces downward of the nozzle mounting plate portion 52b. The application liquid is applied to the substrate S placed on the stage 32 by discharging the application liquid from each nozzle 54 while moving the slider 44 in the X direction.

  A nozzle counter 44 </ b> C is provided on the side of the slider 44 opposite to the discharge unit 50.

  A pair of side wall part 60 is a plate-shaped member, and is comprised with materials, such as resin. The pair of side wall portions 60 are respectively formed on the outer side in the main scanning direction than the side surface Ss1 constituting the end edge portion S1 of the substrate S placed on the stage 32 and the side surface Ss2 constituting the end edge portion S2. Hereinafter, the side wall 60 formed on the (−X) side of the side Ss1 of the substrate S is the side wall 60a, the side 60 formed on the (+ X) side of the side Ss2 of the substrate S is the side 60b, The side wall portions 60a and 60b are collectively referred to as the side wall portion 60.

  Further, in the following, among the surfaces constituting the side wall portion 60a, the side surface on the (−X) side is the outer side surface 601a, the side surface on the stage 32 side is the inner side surface 602a, and the upper end surface in the Z direction is the upper end surface 603a. Called. Of the surfaces constituting the side wall portion 60b, the side surface on the (+ X) side is referred to as the outer side surface 601b, the side surface on the stage 32 side is referred to as the inner side surface 602b, and the upper end surface in the Z direction is referred to as the upper end surface 603b.

  The side wall portion 60 is disposed along the direction orthogonal to the main scanning direction, that is, the Y direction. That is, the inner side surfaces 602a and 602b face the side surfaces Ss1 and Ss2 of the substrate S, respectively. Further, the length in the Y direction of the side wall 60 is based on the width of the coating liquid region (the length in the Y direction) formed on the substrate S when the slider 44 supporting the nozzle 54 scans in one direction. Is configured to be larger. The arrangement position of the side wall 60 in the Y direction is a position corresponding to the position immediately below the nozzle 54 that is scanned and moved by the slider 44.

  Outside the side wall portion 60 in the main scanning direction, a slider 44 that moves along the main scanning mechanism guide portion 42 and movement stop positions SP1 and SP2 of the discharge portion 50 supported by the slider 44 are set. Specifically, the movement stop position SP1 is located on the (−X) side of the side wall portion 60a in the main scanning movement path of the ejection unit 50 supported by the slider 44, and the movement stop position SP2 is The side wall portion 60b is located on the (+ X) side. In other words, the movement stop positions SP1 and SP2 are a pair of movement ends set so as to sandwich the existence area ER of the substrate S in the main scanning direction.

  The movement stop positions SP1 and SP2 correspond to the start position and the end position of the main scanning of the slider 44 and the ejection unit 50 supported by the slider 44 in one direction. Since one direction is switched each time main scanning is performed, each of the movement stop positions SP1 and SP2 takes on a start position and an end position alternately. Here, the side walls 60a and 60b are formed between both side surfaces Ss1 and Ss2 of the substrate S in the main scanning direction and movement stop positions SP1 and SP2 set outside the substrate S in the main scanning direction. . Therefore, the nozzle 54 that moves as the slider 44 scans scans the substrate S after scanning one side wall portion 60 without fail.

  Specifically, in the present embodiment, when the coating process of the coating liquid onto the substrate S is started, the slider 44 in a state where the coating liquid is discharged from the nozzle 54 moves in the (+ X) direction from the movement stop position SP1. Then, the side wall portion 60a, the substrate S, and the side wall portion 60b are scanned before reaching the movement stop position SP2. The slider 44 that has reached the movement stop position SP2 temporarily stops, waits while the substrate S is transported by a predetermined distance along the transport direction, and then starts main scanning in the (−X) direction. That is, the slider 44 scans the side wall 60b, the substrate S, and the side wall 60a in the (−X) direction, and stops at the movement stop position SP1. By repeatedly performing such scanning movement, the coating liquid ejected from the nozzle 54 forms a coating region on the substrate S.

  Predetermined gaps H1 and H2 are provided between the inner side surface 602a of the side wall portion 60a and the side surface Ss1 of the substrate S, and between the inner side surface 602b of the side wall portion 60b and the side surface Ss2 of the substrate S, respectively. The intervals H1 and H2 are used for a space where alignment adjustment of the substrate S held by the substrate holding unit 30 is performed, for example.

  When the intervals H1 and H2 are provided, the upper end surface 603a of the side wall portion 60a and the upper end surface 603b of the side wall portion 60b are configured to be positioned above the main surface Sm of the substrate S to which the coating liquid is applied. Is done. The distance L1 between the upper end surface 603a and the main surface Sm is set based on the interval H1. Further, the distance L2 between the upper end surface 603b and the main surface Sm is set based on the interval H2.

  Specifically, when the intervals H1 and H2 become large, the distances L1 and L2 need to be set large. Therefore, the side wall portions 60a and 60b are formed such that the upper end surface 603a of the side wall portion 60a and the upper end surface 603b of the side wall portion 60b are positioned further upward. On the other hand, when the intervals H1 and H2 are small, the distances L1 and L2 need to be set small. Accordingly, the side wall portions 60a and 60b are formed so that the upper end surface 603a of the side wall portion 60a and the upper end surface 603b of the side wall portion 60b are closer to the main surface Sm of the substrate S.

Quantitatively, the intervals H1 and H2 and the distances L1 and L2 are approximately when the flow rate of the coating liquid from the discharge unit 50 is U and the horizontal movement speed of the discharge unit 50 during main scanning is V.
L1: (H1 + ΔH) = L2: (H2 + ΔH) = U: V (Formula 1)
It is determined so that the above condition is satisfied. Among these, ΔH (not shown) is a margin width measured from the side surfaces Ss1, Ss2 toward the center side of the substrate S in the main surface of the substrate S, and a coating liquid is applied to the region of the margin width. This is the width that can be omitted.

  The above equation 1 is a conditional equation obtained by approximation that the coating liquid falls obliquely at a constant speed without considering gravity acceleration, air resistance, etc., but for the purpose of reducing the footprint of the apparatus, the interval H1 , H2 are preferably as small as possible, so that the distances H1, H2 are relatively short distances. Therefore, approximate evaluation is also possible using Equation 1 obtained by approximation under constant velocity conditions. Fine adjustment may be performed experimentally.

  The side wall portion 60 and the substrate S are in contact with each other, that is, between the inner side surface 602a of the side wall portion 60a and the side surface Ss1 of the substrate S, and between the inner side surface 602b of the side wall portion 60b and the side surface Ss2 of the substrate S. When no gap is formed, the distances L1 and L2 need not be set. That is, the upper end surfaces 603a and 603b of the side wall portions 60a and 60b may be formed at the same height as the main surface Sm of the substrate S. Further, when the ejection unit 50 has a degree of freedom to move in the main scanning direction (horizontal direction) as in this embodiment, the upper end surface is set so that the ejection unit 50 and the side wall portions 60a and 60b do not interfere with each other. The heights 603a and 603b are lower than the installation height of the discharge unit 50. In the case where the ejection unit 50 also has a degree of freedom to retract upward, even if the upper end surfaces 603a and 603b are slightly higher than the main scanning movement path of the ejection unit 50, the ejection unit 50 is located near the side walls 60a and 60b. Interference can be prevented by retracting upward.

  Such side wall parts 60 are each fixedly installed inside the liquid receiving part 63. That is, the liquid receiving part 63 includes a liquid receiving part 63a in which the side wall part 60a is installed, and a liquid receiving part 63b in which the side wall part 60b is installed. Hereinafter, the liquid receiving part 63a and the liquid receiving part 63b are collectively referred to as the liquid receiving part 63.

  The liquid receiving part 63 has a tank shape with an open upper surface, and has a rectangular shape in plan view. The liquid receiving unit 63 is filled with an adsorbent 631. Therefore, the coating liquid that adheres to the side wall portion 60, that is, is collected and flows down along the side wall portion 60, is collected in the liquid receiving portion 63 and is adsorbed by the adsorbent 631. For such an adsorbent 631, an occlusion-type organic oil adsorbent (oil-absorbing polymer) such as polypropylene fiber is used. Note that the inside of the liquid receiving unit 63 is not necessarily filled with the adsorbent 631.

  A predetermined gap is formed along the main scanning direction between the side surface of the liquid receiving unit 63 on the stage 32 side and the side surface of the stage 32. And the liquid receiving part 63 is installed so that it may overlap with the edge part S1, S2 of the board | substrate S mounted so that one part may protrude from the side surface of the stage 32 by planar view. That is, the side end portion of the liquid receiving portion 63 is positioned below the lower surface of the substrate S at the portion protruding from the side surface of the stage 32. Therefore, the upper surface of the liquid receiving portion 63 is located immediately below the side surfaces Ss1, Ss2 of the substrate S.

  A predetermined gap is provided between the lower surface of the portion of the substrate S protruding from the stage 32 and the upper surface of the liquid receiving portion 63. That is, a gap is provided between the main surface of the stage 32 and the upper surface of the liquid receiving unit 63. For this reason, when the substrate S is transported, the liquid receiving unit 63 can be prevented from interfering with the substrate S.

  Further, of the side surfaces of the liquid receiving portion 63, the side surfaces facing the side surface on the stage 32 side are respectively outside the movement stop position SP1 in the (−X) direction and outside the movement stop position SP2 in the (+ X) direction. Has been placed. Therefore, when the discharge unit 50 supported by the slider 44 scans a range other than the existence region ER of the substrate S, the coating liquid discharged from the nozzle 54 surely flows down into the liquid receiving unit 63.

  A discharge pipe 64 is connected to the bottom surface of the liquid receiving portion 63. The coating liquid adhering to the side wall part 60 is adsorbed by the adsorbent 631 of the liquid receiving part 63 and is discharged to a drain tank (not shown) installed outside the apparatus via the discharge pipe 64. In other words, the liquid receiving part 63 is attached to the side wall part 60 and serves as a collecting part for collecting the coating liquid part collected by the side wall part 60.

  Note that a suction mechanism 300 is provided in the discharge pipe 64. For the suction mechanism 300, for example, a fan such as a fan or a blower, a vacuum motor, or the like can be used. When the suction mechanism 300 is driven, the coating liquid adsorbed by the adsorbent 631 is sucked, flows through the discharge pipe 64, and is discharged out of the liquid receiving unit 63.

  The liquid receiving unit 63 is provided with a moving mechanism 350. For example, an air cylinder or a motor is used as the moving mechanism 350. The liquid receiver 63 is movable along the main scanning direction by the operation of the moving mechanism 350. Therefore, according to the size of the substrate S, more specifically, according to the length of the portion of the substrate S that protrudes from the stage 32, the side surfaces Ss1, Ss2 of the substrate S are surely positioned directly below the liquid receiving portion 63. In addition, the moving mechanism 350 adjusts the position of the liquid receiving unit 63.

  The pipe 80 includes an air pipe 80a and a coating liquid pipe 80b. Each of the pipes 80a and 80b is connected to an air supply source 86 or a coating liquid supply source 88 on the upstream side in the air or coating liquid feeding direction, and is supported so as to be suspended above the substrate processing apparatus 20. In the following description, when the two pipes are distinguished from each other, they are referred to as an air pipe 80a or a coating liquid pipe 80b.

  The air pipe 80a is configured by a flexible pipe made of resin or the like that guides air from the air supply source 86. Here, the air pipe 80a has one air pipe 80a. One end of the air pipe 80 a is connected to an air supply source 86. The other end of the air pipe 80a is connected to the slider 44 so that air can be supplied.

  The coating liquid piping 80 b is configured by a pipe made of a flexible resin or the like that guides the coating liquid from the coating liquid supply source 88, and is provided in the same number as the nozzles 54. One end portion of each coating solution pipe 80 b is connected to a coating solution supply source 88, and the other end portion is connected to the nozzle 54 so that the coating solution can be supplied.

  The substrate processing apparatus 20 includes a slider drive mechanism 72 that drives the slider 44 along the X direction.

  The slider drive mechanism 72 includes a pair of pulley bodies 73 and 73 provided at both ends of the main scanning mechanism guide section 42, a drive belt 74 wound around the pair of pulley bodies 73 and 73, and one pulley body 73. And a motor 75 that can be driven to rotate in both forward and reverse directions. The slider 44 is connected and fixed to one side (lower side) of the two paths of the drive belt 74 that travels between the pair of pulley bodies 73 and 73. The counter slider 48 is connected and fixed to the other side (upper side) of the two paths of the drive belt 74 that travels between the pair of pulley bodies 73 and 73. The counter slider 48 is driven so as to be disposed at a substantially symmetrical position with respect to the slider 44 with the center position of the reciprocating movement range of the slider 44 (usually the center position of the pair of pulley bodies 73, 73) interposed therebetween. It is connected and fixed to the belt 74. Then, by rotating the motor 75 while controlling the rotation direction, the rotation speed, the rotation amount, and the like, the slider 44 and the discharge unit 50 are driven to reciprocate along the X direction. At this time, the counter slider 48 reciprocates along the X direction while maintaining a symmetrical position with respect to the slider 44 with the central position of the pair of pulley bodies 73 and 73 interposed therebetween.

  The configuration as hardware is the same as that of a general computer. That is, the control unit 90 stores a CPU that performs various arithmetic processes, a ROM that is a read-only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, control software, or data. An input unit such as a magnetic disk, a keyboard and a mouse to be connected is connected to a bus line. Operation control of the substrate processing apparatus 20 is performed according to a software program stored in advance in the control unit 90. A coating liquid supply source 88, an air supply source 86, and a motor 75 are connected to the bus line. The controller 90 drives the motor 75 in a state where the air is supplied to the air supply source 86 and, at the same time, the coating liquid is supplied to the coating liquid supply source 88, that is, the coating liquid is discharged from each nozzle 54. A process of moving the slider 44 under control is performed.

  Hereinafter, a flow of processing using the substrate processing apparatus 20 will be described. FIG. 3 shows a flowchart showing the flow of processing. FIG. 4 shows the state transition of the main part of the substrate processing apparatus 20.

  First, the substrate S that has been processed in the previous process is transported in a state of being held on the stage 32 of the substrate holding unit 30, and is disposed at a coating position where the coating process is performed (step S1). The control unit 90 transmits a signal to the coating liquid supply source 88 to start supplying the coating liquid Ln. As a result, the coating liquid Ln is discharged from the nozzle 54 and a liquid column of the coating liquid Ln is formed (step S2, state ST1). Note that the alignment adjustment of the substrate S or the position adjustment of the nozzle 54 may be performed before the coating process is started.

  The control unit 90 transmits a signal to a motor 75 that is a drive mechanism of the main scanning mechanism 40. As a result, the slider 44 stopped at the movement stop position SP1 starts main scanning in the (+ X) direction while maintaining the state where the coating liquid Ln is discharged from the nozzle 54.

  First, the slider 44 scans one side wall portion 60a. The liquid column of the coating liquid Ln discharged from the nozzle 54 contacts the outer side surface 601a and the upper end surface 603a of the side wall 60a, and the coating liquid Ln is applied to the outer side surface 601a and the upper end surface 603a of the side wall 60a. (Step S3).

  Then, the slider 44 scans between the inner side surface 602a of the side wall 60a and the side surface Ss1 of the substrate S, and then reaches the edge S1 of the substrate S (state ST2). At this time, while the coating liquid Ln flows down from the upper end surface 603a onto the main surface Sm of the substrate S along the vertical direction, the discharge unit 50 supported by the slider 44 and positioned above the upper end surface 603a is , Move in the (+ X) direction and reach above the edge S1 of the substrate S. In other words, the ejection unit 50 moves above the substrate S until the liquid column of the coating liquid Ln reaches the side of the side surface Ss1 of the substrate S. Therefore, since the liquid column of the coating liquid Ln does not contact the side surface Ss1 of the substrate S, it is possible to suppress the coating liquid Ln from adhering to the side surface Ss1 of the substrate S. As described above, the liquid column of the coating liquid Ln is blocked by the outer side surface 601a and the upper end surface 603a of the side wall 60a, and the coating liquid Ln is collected at the portion. The coating liquid collected by the side wall part 60a flows down the surface of the side wall part 60a and is adsorbed by the adsorbent 631 in the liquid receiving part 63a.

  The slider 44 that has reached the edge S1 of the substrate S scans and moves on the substrate S. As a result, the coating liquid Ln is discharged onto the main surface Sm of the substrate S, and a coating region of the coating liquid Ln is formed on the substrate S (step S4, state ST3).

  Then, the slider 44 scans and moves from the edge S2 of the substrate S to the other side wall 60b, and temporarily stops at the movement stop position SP2 that is the folding position (state ST4). At this time, since the liquid column of the coating liquid Ln does not contact the side surface Ss2 of the substrate S on the side wall 60b side, it is possible to suppress the coating liquid from adhering to the side surface Ss2 of the substrate S on the side wall 60b side. Since the upper end surface 603b of the side wall portion 60b is located above the main surface Sm of the substrate S, the liquid column of the coating liquid Ln adheres to the inner side surface 602b and the upper end surface 603b of the side wall portion 60b, and The coating liquid Ln is collected (step S5). The coating liquid collected by the side wall part 60b flows down the surface of the side wall part 60b and is adsorbed by the adsorbent 631 in the liquid receiving part 63b.

  The controller 90 determines whether or not to continue the coating process (step S6). When the coating process is continued, the substrate S is transported by a predetermined distance while the slider 44 is temporarily stopped at the movement stop position SP2 (step S7). As a result, a region where the coating region of the coating liquid Ln is not formed is arranged below the movement range of the nozzle 54.

  Then, the slider 44 starts scanning movement in the (−X) direction. Since the slider 44 scans the side wall 60b, the coating liquid discharged from the nozzle 54 is blocked by the side wall 60b and collected by the side wall 60b (step S8). Subsequently, the slider 44 scans the substrate S, and the coating liquid Ln discharged from the nozzle 54 forms a coating region on the substrate S (step S9). Thereafter, the slider 44 scans the side wall 60a, and the coating liquid Ln discharged from the nozzle 54 adheres to the side wall 60a and is collected (step S10). Then, the slider 44 stops at the turn-back position (movement stop position SP1). Such a scanning movement of the slider 44 in the (−X) direction causes a similar action in the opposite direction to the scanning movement of the slider 44 in the (+ X) direction described above, and therefore the side surfaces Ss1, Ss2 of the substrate S. The coating liquid Ln can be prevented from adhering to the surface.

  The controller 90 determines whether or not to continue the coating process (step S11). When the coating process is continued, the substrate S is transported by a predetermined distance while the slider 44 is temporarily stopped at the turn-back position (step S12). Then, the scanning movement of the slider 44 in the (+ X) direction is performed again.

  As described above, in the substrate processing apparatus 20, the side wall portions 60 a and 60 b have the existence area ER of the substrate S in the main scanning direction (specifically, the side surfaces Ss1 and Ss2 of the substrate S defining the existence area ER) and the main scanning. Are installed in respective spaces between the movement stop positions SP1 and SP2 of the slider 44 set outside the side surfaces Ss1 and Ss2 of the substrate S in the direction. For this reason, the discharge part 50 moved along the main scanning direction by the slider 44 discharges the coating liquid onto the substrate S after discharging the coating liquid onto the side wall part 60a or the side wall part 60b. That is, since the side wall portions 60a and 60b block the coating liquid toward the side surfaces Ss1 and Ss2 of the substrate S, it is possible to suppress the coating liquid from adhering to the side surfaces Ss1 and Ss2 of the substrate S.

  Accordingly, it is possible to suppress the coating liquid adhering to the side surface of the substrate from being dried and scattered as particles inside the substrate processing apparatus. In addition, by transporting the substrate with the coating liquid attached to the side surfaces, it is possible to suppress the coating liquid from being scattered to surrounding devices and causing contamination.

  Further, predetermined intervals H1 and H2 are provided between the side wall portions 60a and 60b and the substrate S, and a distance L1 between the upper end surfaces 603a and 603b of the side wall portions 60a and 60b and the main surface Sm of the substrate S is provided. L2 is set according to the intervals H1 and H2. For this reason, even if it is a case where the space is formed between the side wall parts 60a and 60b and the board | substrate S, it can suppress that a coating liquid adheres to the side surfaces Ss1 and Ss2 of the board | substrate S. FIG.

<Second Embodiment>
FIG. 5 shows a schematic front view of the main part of the substrate processing apparatus 20b according to the second embodiment. In the substrate processing apparatus 20b according to the second embodiment, the pair of side wall portions 65, 65 are formed of a porous material. As the porous material, for example, a processed member obtained by processing a resin, ceramic, or the like can be used. Further, a member in which a specific base material is used as a core material and the periphery of the base material is covered with a flexible porous material such as a nonwoven fabric may be employed.

  By using the side wall portion 65 having such a configuration, the coating liquid applied to the outer surface of the side wall portion 65 can enter the inside of the side wall portion 65 through a plurality of holes formed in the side wall portion 65. Soak up. Therefore, the state in which the coating liquid is applied to the outer portion of the side wall portion 65 is not maintained. For this reason, it can suppress that the dried process liquid scatters as a particle inside the substrate processing apparatus 20b.

  In particular, since the coating liquid adhering to the side surfaces 650a and 650b of the side wall portion 65 flows downward due to gravity, the state of adhering to the side wall portion 65 is difficult to be originally maintained. However, the coating liquid adhering to the upper end surface 650c of the side wall portion 65 is easily maintained as it is. Therefore, it is desirable that at least the upper portion including the upper end surface 650c of the side wall portion 65 is formed of a porous material.

  In the present embodiment, the coating solution suction mechanism 300 is connected to the discharge pipe 64 as described above. For this reason, the coating liquid adhering to the side wall portion 65 is effectively sucked by driving the suction mechanism 300. The suction mechanism 300 can employ the same configuration as described above. The suction pressure formed by the suction mechanism 300 soaks the coating liquid adhering to the outer portion of the side wall portion 60b into the inside, so that the state where the coating liquid remains on the outer surface of the side wall portion 65 is quickly resolved. Is done. The coating liquid soaked into the side wall 65 flows out from the lower end of the side wall 65 to the adsorbent 631 and the discharge pipe 64. Therefore, it can suppress more reliably that the dried process liquid scatters as a particle inside the substrate processing apparatus 20b.

  Note that the suction mechanism 300 may be installed not on the discharge pipe 64 extending from the liquid receiving part 63 but on a pipe directly connected to the side wall part 65. In other words, the configuration may be such that when the suction mechanism 300 is driven, the coating liquid sucked into the side wall portion 65 is discharged to the outside of the apparatus through a pipe directly connected to the side wall portion 65. In this case, the suction mechanism 300 functions as a collecting unit that collects the coating liquid portion collected by the side wall portion 65.

  In addition, the structure by which the suction mechanism different from the above-mentioned suction mechanism 300 is connected to the lower surface of the side wall part 65 may be sufficient.

<Third Embodiment>
FIG. 6 is a plan view showing a state of processing of main parts of the substrate processing apparatus according to the third embodiment. In the third embodiment, the pair of side wall portions 69a and 69b are made of an elastic material such as resin, and the side wall portions 69a and 69b are moved in a direction in which the side surfaces Ss1 and Ss2 of the substrate S are sandwiched. 150. The drive mechanism 150 is electrically connected to the control unit 90 and can be driven by a signal from the control unit 90. The driving mechanism 150 can use various members such as an air cylinder or a motor. Further, as shown in FIG. 6, the side wall portions 69a and 69b are formed in an arc shape in plan view.

  For this reason, as shown by the one-dot chain line in FIG. 6, the side surfaces Ss1 and Ss2 of the substrate S transported in an oblique direction are sandwiched between the inner side surfaces 609a and 609b of the side wall portions 69a and 69b, as shown in FIG. As indicated by the solid line, the robot is disposed in a posture along the transport direction.

  In a state where the substrate S is sandwiched between the side wall portions 69a and 69b, the scanning movement by the slider 44 is performed as in the first embodiment. At this time, the slider 44 moves above the portion where the side wall portions 69 a and 69 b are in contact with the edge portions S 1 and S 2 of the substrate S, and the nozzle 54 discharges the coating liquid onto the substrate S. In this case, since the side surfaces Ss1, Ss2 of the substrate S are in contact with the side wall portions 69a, 69b, it is possible to reliably suppress the coating liquid from adhering to the side surfaces Ss1, Ss2 of the substrate S. Further, the upper end heights of the side wall portions 69a and 69b can be made substantially the same height as the main surface of the substrate S.

  Further, since the side wall portions 69a and 69b are formed of an elastic material, the substrate S can move along the transport direction even when the side wall portions 69a and 69b sandwich the substrate S. Therefore, it is possible to repeatedly apply the coating liquid onto the substrate S along the main scanning direction while maintaining the state where the side walls 69a and 69b sandwich the substrate S.

  As described above, in the substrate processing apparatus according to the third embodiment, the slider 44 can be scanned and moved while the side walls 69a and 69b are in contact with the side surfaces Ss1 and Ss2 of the substrate S. It can suppress reliably that a coating liquid adheres to side surface Ss1, Ss2.

<Modification>
In the following, modifications will be described.

  The slider may have a mechanism that can move along the conveyance direction of the substrate. In this case, the slider moves in the transport direction and the main scanning direction with respect to the fixedly installed substrate, and as a result, the coating liquid discharged from the nozzle is applied to the region of the substrate. At this time, the side wall portion has a length equivalent to the entire side surface of the substrate. The liquid receiving part is also formed to be longer than the length of the substrate in the transport direction.

  The present invention is generally applicable not only to a coating solution but also to a substrate processing apparatus and a substrate processing method for applying a processing solution to a substrate in a substantially horizontal posture.

20, 20b Substrate processing apparatus 30 Substrate holding part 40 Main scanning mechanism 42 Main scanning mechanism guide part 44 Slider 50 Discharge part 54 Nozzle 60 Side wall part 60a, 60b Side wall part 65 Side wall part 69a, 69b Side wall part 90 Control part 100 Suction mechanism 150 Drive mechanism ER Substrate existence area SP1, SP2 Movement stop position (movement end)
W substrate S1, S2 Edge of substrate

Claims (5)

A substrate holding section for holding the substrate substantially horizontally;
A guide portion installed above the substrate and extending along a main scanning direction substantially parallel to the substrate;
In a section between a pair of moving ends set so as to sandwich the existence area of the substrate along the main scanning direction, the processing liquid is ejected to the substrate while moving along the main scanning direction by the guide portion. A discharge part to be
A pair of side wall portions installed in the space between each of the pair of moving ends and the existence area of the substrate with respect to the main scanning direction, each upper end height being equal to or higher than the main surface height of the substrate;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
A substrate processing apparatus, wherein at least an upper part of the side wall part is formed of a porous material. The substrate processing apparatus according to claim 1, wherein:
A substrate processing apparatus, wherein a collecting unit that collects the processing liquid collected by the side wall portion of the processing liquid discharged from the discharge unit is attached to the side wall portion. A substrate processing apparatus according to any one of claims 1 to 3,
The side wall is formed of an elastic material;
A drive mechanism for moving the pair of side wall portions in a direction to sandwich both side surfaces of the substrate;
A substrate processing apparatus further comprising: A substrate holding step for holding the substrate substantially horizontally;
The ejection unit is configured to move the ejection unit along the main scanning direction by a predetermined guide unit in a section between a pair of moving ends set so as to sandwich the area where the substrate exists along the main scanning direction. A moving discharge step of discharging the processing liquid downward from,
In the pair of side wall portions installed in the space between each of the pair of moving ends and the existence area of the substrate with respect to the main scanning direction, each upper end height is equal to or higher than the main surface height of the substrate, A shielding step of shielding a portion of the processing liquid discharged from the discharge portion toward the side surface of the substrate;
A substrate processing method comprising:

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