JP4197238B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technique in a substrate processing apparatus. More specifically, the present invention relates to a technique for removing dust, organic solvent, and the like generated when a predetermined process is performed on a substrate such as a glass substrate for manufacturing a flat panel display from the atmosphere.
[0002]
[Prior art]
Techniques for performing various processes on a substrate held at a predetermined position on a mounting table by scanning with a predetermined processing tool are known. For example, as an example of such a technique, Japanese Patent Application Laid-Open No. 11-165111 discloses that a ball screw is rotated by a ball motor to move two moving bases rigidly coupled to both ends of a slit nozzle that discharges processing liquid. Thus, a technique for performing scanning by moving the slit nozzle in a predetermined direction has been proposed.
[0003]
[Problems to be solved by the invention]
However, in the technique described in the above publication, when moving the slit nozzle, which is a processing tool, contaminants such as lubricating oil and metal powder due to friction are generated from a driving unit such as a ball screw. Then, these are scattered on the substrate to cause particles, and the substrate being processed has a problem of processing failure.
[0004]
Further, when a chemical solution such as a resist applied on the substrate is dried, a gas of a solvent component such as an organic solvent is generated. If these gases are left in the atmosphere, there is a problem of causing air pollution.
[0005]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus that can quickly remove contaminants, organic solvents, and the like generated during processing from the atmosphere.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, the invention of claim 1 is a substrate processing apparatus for performing a process for forming a layer of a processing liquid on the surface of a substrate, and a process for discharging the processing liquid and a holding table for holding the substrate. A tool is mounted in a substantially horizontal direction, and a bridging structure spanned substantially horizontally above the holding table, and the bridging structure is guided to move the bridging structure in a substantially horizontal direction along the surface of the substrate. A moving mechanism that is contact-type or non-contact-type with respect to the holding table, and a first duct having a suction port that opens between the substrate holding region of the holding table and the moving mechanism and sucks the atmosphere. The first duct is a cover opening duct in which the suction port is formed in a duct cover disposed on the holding table, and the suction port provided in the duct cover is on the substrate holding region side And the moving mechanism side It is formed on.
[0007]
Further, the invention of claim 2, in the substrate processing apparatus according to the invention of claim 1, wherein the processing tool is a slit nozzle for ejecting a predetermined processing liquid.
[0008]
The invention of claim 3 is the substrate processing apparatus according to the invention of claim 1 or 2, wherein the first duct, that provided in the vicinity of the substrate holding area.
[0009]
The invention of claim 4 is further provided in the substrate processing apparatus according to the invention of claim 2 or 3, the second duct, for exhausting the vicinity of the standby position before Symbol slit nozzle.
[0010]
According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fourth aspects, the first duct has a base surface opening duct in which the suction port is formed on the base surface of the holding base. It is .
[0012]
Also, the invention of claim 6, in the substrate processing apparatus according to the invention of claims 1 to 5, wherein the suction port of the provided in the duct cover substrate holding region side, with opened upward, The suction port on the moving mechanism side is opened so as to face the moving mechanism.
[0013]
According to a seventh aspect of the present invention, in the substrate processing apparatus according to any one of the first to sixth aspects, the first duct is configured to adjust the flow rate of the atmosphere sucked from the suction port. movably provided so as to cover the mouth, having an adjustment plate to vary the opening area before Symbol suction port.
[0014]
According to an eighth aspect of the present invention, in the substrate processing apparatus according to any one of the first to seventh aspects, the substrate is a square substrate, the substrate holding region is rectangular, and the first Ducts are provided at positions along two sides parallel to the moving direction of the bridging structure by the moving mechanism of the substrate holding region.
[0015]
According to a ninth aspect of the present invention, in the substrate processing apparatus according to the eighth aspect of the present invention, a third duct is provided at a position along a side perpendicular to the moving direction of the bridging structure by the moving mechanism of the substrate holding region. Is provided.
According to a tenth aspect of the present invention, in the substrate processing apparatus according to the first aspect of the present invention, the first duct has an opening at a height position higher than the upper surface of the holding table.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
[0017]
<1. Embodiment>
<1.1 Description of configuration>
FIG. 1 is a perspective view schematically showing a substrate processing apparatus 1 according to an embodiment of the present invention. FIG. 2 is a plan view of the main body 2 of the substrate processing apparatus 1 as viewed from above, and FIG. 3 is a front view of the main body 2. 4 is a cross-sectional side view of the main body 2 cut along the cutting line shown in FIG. In addition, in FIG. 2, illustration is abbreviate | omitted about the bridge | crosslinking structure 4 mentioned later.
[0018]
The substrate processing apparatus 1 is roughly divided into a main body 2 and a control system 6, and a rectangular glass substrate for manufacturing a screen panel of a liquid crystal display device is a substrate 90 to be processed, and an electrode layer formed on the surface of the substrate 90. In the process of selectively etching, etc., it is configured as a coating apparatus that applies a resist solution to the surface of the substrate 90. Therefore, in this embodiment, the slit nozzle 41 discharges the resist solution. In addition, the substrate processing apparatus 1 can be modified and used not only as a glass substrate for a liquid crystal display device but also as a device for applying a processing liquid (chemical solution) to various substrates for a flat panel display.
[0019]
The main body 2 includes a stage 3 that functions as a holding table for mounting and holding the substrate to be processed 90 and also functions as a base for each attached mechanism. The stage 3 is made of an integral stone having a rectangular parallelepiped shape, and the upper surface and side surfaces of the surface (the base surface 30) are processed into flat surfaces.
[0020]
A large number of vacuum suction ports or vacuum suction grooves (not shown) are distributed and formed in the substrate holding region 300 which is a rectangular region provided in the center of the upper surface of the stage 3. The substrate 90 is held in a predetermined horizontal position by adsorbing the substrate 90 while the substrate 90 is processed.
[0021]
A pair of travel rails 31a extending in parallel in a substantially horizontal direction is fixed to both ends sandwiching the substrate holding region 300 (region where the substrate 90 is held). The traveling rail 31 a guides the movement of the bridging structure 4 together with the support blocks 31 b fixed at both ends of the bridging structure 4 (the moving direction is defined in a predetermined direction), and the bridging structure 4 is moved to the substrate holding region 300. A linear guide supported upward is configured.
[0022]
Further, suction ducts 32 and 33 are provided on the upper surface of the stage 3 between the substrate holding region 300 and the traveling rail 31a so as to be substantially parallel to the traveling rail 31a, and further, a suction duct is provided at the front portion. 34 is provided in the vicinity of the substrate holding region 300 along the Y-axis direction.
[0023]
5 to 7 are diagrams showing the configuration of the suction duct 33. FIG. The suction duct 33 is a cover opening duct including a duct cover 330, a slit 331, an adjustment plate 332 and an exhaust pipe 333. The duct cover 330 is disposed on the stage 3 and is sucked by the exhaust pipe 333 from the lower surface of the end portion. The slits 331 having a function as a suction port for sucking the atmosphere are formed on the upper surface (substrate holding region 300 side) and side surface (traveling rail 31a side) of the duct cover 330. The adjustment plate 332 is disposed so as to cover each slit 331, and each of them can be moved.
[0024]
Since the opening area of each slit 331 is changed by changing the position of the adjusting plate 332 and the flow rate of the atmosphere from each slit 331 can be adjusted, the substrate processing apparatus 1 is efficient with a small amount of exhaust. Suction is possible.
[0025]
The exhaust pipe 333 is attached to the lower surface of the end of the duct cover 330, and is connected to, for example, exhaust equipment in a factory via an exhaust box (not shown).
[0026]
With such a configuration, the suction duct 33 has a function of exhausting the atmosphere sucked from the slit 331 from the exhaust equipment as indicated by the arrow in FIG.
[0027]
Here, as described above, the slit 331 is provided on the upper surface and the side surface of the suction duct 33, and becomes a source of contaminants by sucking the atmosphere on the substrate 90 side and the atmosphere on the traveling rail 31a side. Since the atmosphere of the place can be selectively sucked, contaminants can be efficiently removed.
[0028]
The suction duct 32 also has a configuration that is substantially symmetrical to the suction duct 33 and has the same function. Further, the shape, size, number, and the like of each slit 331 are not limited to those shown in this embodiment, and the shape, size, and the like of each slit 331 may be different.
[0029]
8 and 9 are diagrams showing the configuration of the suction duct 34. The suction duct 34 includes a duct cover 340, a slit 341, an adjustment plate 342 and an exhaust pipe 343, and has substantially the same configuration as the suction ducts 32 and 33. However, as shown in FIG. 9, the suction duct 34 has an exhaust pipe 343 attached near the center.
[0030]
As described above, by providing the suction ducts 32 and 33 between the substrate holding region 300 and the traveling rail 31a, when the bridge structure 4 is moved, dust generated by friction between the traveling rail 31a and the support block 31b is generated. Contaminants such as can be removed. Further, by providing the suction duct 34 in the vicinity of the substrate holding region 300, it is possible to prevent diffusion of the organic solvent generated from the substrate 90 when the resist solution is dried.
[0031]
Further, since the suction ducts 32 to 34 are provided at positions along the three sides of the substrate 90 held in the substrate holding region 300, contaminants such as generated dust and organic solvents are efficiently generated in the atmosphere. Can be removed.
[0032]
In the substrate processing apparatus 1 according to the present embodiment, it has been described that the atmosphere sucked by the suction ducts 32 to 34 is sucked and discharged by the exhaust equipment provided in the factory. It is not something that can be done. For example, the substrate processing apparatus 1 may be provided with a blower device in the main body 2 independently, and the blower device exerts a suction function so that the atmosphere is sucked from each slit.
[0033]
Above the stage 3, a bridging structure 4 is provided that extends substantially horizontally from both sides of the stage 3. The bridging structure 4 is mainly composed of a nozzle support portion 40 that uses carbon fiber resin as an aggregate, and lifting mechanisms 43 and 44 that support both ends thereof.
[0034]
A slit nozzle 41 and a gap sensor 42 are attached to the nozzle support portion 40.
[0035]
The slit nozzle 41 extending in the horizontal Y direction is connected to a discharge mechanism (not shown) including a pipe for supplying a chemical solution to the slit nozzle 41 and a resist pump. The slit nozzle 41 is supplied with a resist solution by a resist pump and scans the surface of the substrate 90, thereby discharging the resist solution to a predetermined region on the surface of the substrate 90 (hereinafter referred to as “resist application region”). To do.
[0036]
The gap sensor 42 is attached to the nozzle support portion 40 so as to be in the vicinity of the slit nozzle 41, and the height difference (gap) between the lower presence object (for example, the surface of the substrate 90 or the surface of the resist film) is determined. The measurement result is transmitted to the control system 6.
[0037]
As described above, the slit nozzle 41 and the gap sensor 42 are attached to the nozzle support portion 40, so that their relative positional relationship is fixed. Therefore, the control system 6 can detect the distance between the surface of the substrate 90 and the slit nozzle 41 based on the measurement result of the gap sensor 42. The substrate processing apparatus 1 according to the present embodiment includes two gap sensors 42. However, the number of gap sensors 42 is not limited to this, and more gap sensors 42 may be provided. .
[0038]
The elevating mechanisms 43 and 44 are divided on both sides of the slit nozzle 41 and are connected to the slit nozzle 41 by the nozzle support portion 40. The elevating mechanisms 43 and 44 are used for moving the slit nozzle 41 in translation and adjusting the posture of the slit nozzle 41 in the YZ plane.
[0039]
A pair of AC coreless linear motors (hereinafter simply abbreviated as “linear motors”) 50, 51 arranged separately along the edges on both sides of the stage 3 are fixed to both ends of the bridge structure 4. Established.
[0040]
The linear motor 50 includes a stator (stator) 50a and a mover 50b, and generates a driving force for moving the bridging structure 4 in the X-axis direction by electromagnetic interaction between the stator 50a and the mover 50b. It is a motor. Further, the moving amount and moving direction of the linear motor 50 can be controlled by a control signal from the control system 6. The linear motor 51 has substantially the same function and configuration.
[0041]
Each of the linear encoders 52 and 53 includes a scale unit and a detector (not shown), detects the relative positional relationship between the scale unit and the detector, and transmits the relative positional relationship to the control system 6. Since each detector is fixed to both ends of the bridge structure 4, the linear encoders 52 and 53 have a function of detecting the position of the bridge structure 4.
[0042]
As shown in FIG. 4, a groove 35 is provided behind the upper surface of the stage 3, and a suction duct 36 is provided in the groove 35. The suction duct 36 is a base surface opening duct constituted by a suction port 360 formed on the lower surface (the base surface 30) of the groove 35 and an exhaust pipe 361 that sucks the lower side of the suction port 360, and is similar to the suction ducts 32 to 34. It has a function of sucking the atmosphere in the periphery.
[0043]
Thus, by providing the suction duct 36 behind the stage 3 in the vicinity of the standby position of the slit nozzle 41, the diffusion of the organic solvent generated from the standby slit nozzle 41, the resist supply tank, and the like can be prevented. Can do. The exhaust pipe 361 is connected to the exhaust equipment in the factory through an exhaust box (not shown) like the exhaust pipe 333 and the like.
[0044]
The control system 6 includes an arithmetic unit 60 that processes various data according to a program and a storage unit 61 that stores the program and various data. In addition, an operation unit 62 for an operator to input necessary instructions to the substrate processing apparatus 1 and a display unit 63 for displaying various data are provided on the front surface.
[0045]
The control system 6 is connected to each mechanism attached to the main body 2 by a cable (not shown), and based on signals from the operation unit 62 and various sensors, the elevating mechanisms 43 and 44, the linear motors 50 and 51, and the suction duct. Each component such as 32-34 and suction duct 36 is controlled.
[0046]
Specifically, the storage unit 61 corresponds to a RAM that temporarily stores data, a read-only ROM, a magnetic disk device, and the like, and a storage medium such as a portable magneto-optical disk and a memory card; Those readers may be used. The operation unit 62 includes buttons and switches (including a keyboard and a mouse), but may have a function of the display unit 63 such as a touch panel display. The display unit 63 corresponds to a liquid crystal display or various lamps.
[0047]
<1.2 Explanation of operation>
Next, the operation of the substrate processing apparatus 1 will be described. In the substrate processing apparatus 1, the resist coating process is started when the substrate 90 is transferred by an operator or a transfer mechanism (not shown). Note that the instruction for starting the processing may be input by operating the operation unit 62 by the operator when the transfer of the substrate 90 is completed. Further, it is assumed that the suction ducts 32 to 34 and 36 suck the atmosphere in advance, and the positions of the adjustment plates provided in the suction ducts 32 to 34 are manually adjusted by an operator in advance.
[0048]
First, the stage 3 sucks and holds the substrate 90 in the substrate holding region 300. Subsequently, the elevating mechanisms 43 and 44 move the gap sensor 42 attached to the nozzle support 40 to a predetermined altitude (hereinafter referred to as “measurement altitude”) higher than the thickness of the substrate 90.
[0049]
When the gap sensor 42 is set at the measurement altitude, the linear motors 50 and 51 move the gap sensor 42 to above the resist coating region by moving the bridging structure 4 in the X direction. Here, the resist application region is a region in the surface of the substrate 90 where the resist solution is to be applied, and is usually a region obtained by excluding a region having a predetermined width along the edge from the entire area of the substrate 90. It is. At this time, the control system 6 controls the position of the gap sensor 42 by giving a control signal to the linear motors 50 and 51 based on the detection results of the linear encoders 52 and 53.
[0050]
As described above, not only the resist solution coating process but also the cross-linking structure 4 moves, contaminants such as dust are generated due to friction between the running rail 31a and the support block 31b. These contaminants are mainly sucked by suction ducts 32 and 33 provided between the substrate 90 and the traveling rail 31a, and are effectively removed.
[0051]
Next, the gap sensor 42 starts measuring the gap between the surface of the substrate 90 and the slit nozzle 41 in the resist coating region on the surface of the substrate 90. When the measurement is started, the linear motors 50 and 51 further move the bridging structure 4 in the X direction so that the gap sensor 42 scans the resist coating region and transmits the measurement result during the scanning to the control system 6. At this time, the control system 6 stores the measurement result of the gap sensor 42 in the storage unit 61 in association with the horizontal position detected by the linear encoders 52 and 53.
[0052]
When the bridging structure 4 passes over the substrate 90 in the X direction and scanning by the gap sensor 42 is completed, the control system 6 stops the bridging structure 4 at that position, and based on the measurement result from the gap sensor 42. The posture of the slit nozzle 41 in the YZ plane is an appropriate posture (the posture in which the interval between the slit nozzle 41 and the resist application region is an appropriate interval for applying the resist solution. Hereinafter, referred to as “appropriate posture”). The position of the nozzle support portion 40 is calculated, and a control signal is given to each of the lifting mechanisms 43 and 44 based on the calculation result. Based on the control signal, the respective lifting mechanisms 43 and 44 move the nozzle support portion 40 in the Z-axis direction to adjust the slit nozzle 41 to an appropriate posture. Further, the linear motors 50 and 51 move the bridging structure 4 in the −X direction, and move the slit nozzle 41 to the discharge start position. Here, the ejection start position is a position where the slit nozzle 41 substantially extends along one side of the resist coating region.
[0053]
When the slit nozzle 41 moves to the discharge start position, the control system 6 gives a control signal to the linear motors 50 and 51 and a resist pump (not shown). Based on the control signal, the linear motors 50, 51 move the bridging structure 4 in the −X direction so that the slit nozzle 41 scans the surface of the substrate 90, and the resist pump is activated during the scanning of the slit nozzle 41. By operating, the resist is sent to the slit nozzle 41, and the slit nozzle 41 discharges the resist solution to the resist coating region. Thereby, a layer of a resist solution is formed on the surface of the substrate 90.
[0054]
When the slit nozzle 41 moves to the discharge end position, the control system 6 gives a control signal to the linear motors 50 and 51 and the registration pump. Based on the control signal, the resist pump is stopped and the discharge of the resist from the slit nozzle 41 is stopped, and the elevating mechanisms 43 and 44 move the gap sensor 42 to the measurement altitude.
[0055]
Further, when the linear motors 50 and 51 move the bridging structure 4 in the X direction, the gap sensor 42 scans the resist coating region, measures the gap with the resist film formed on the substrate 90, and enters the control system 6. introduce. The control system 6 compares the gap value (distance to the surface of the substrate 90) measured before resist coating with the gap value (distance to the surface of the resist film) measured after resist coating. The thickness of the resist film 90 is calculated, and the calculation result is displayed on the display unit 63.
[0056]
When the inspection of the resist film is completed, the control system 6 gives a control signal to the linear motors 50 and 51 to move the bridging structure 4 in the −X direction and move the slit nozzle to the standby position behind the stage 3. . Further, the substrate processing apparatus 1 stands by until the applied resist is dried to such an extent that the substrate 90 can be transported.
[0057]
As described above, vapor of the organic solvent is generated because the resist solution is dried at the slit nozzle 41 in the standby position. However, since the suction duct 36 is provided in the vicinity of the standby position, the vapor of the organic solvent is generated. Can be efficiently removed, and the diffusion of the vapor of the organic solvent can be prevented. Further, vapor of the organic solvent is also generated from the substrate 90 coated with the resist solution, but the vapor of the organic solvent is mainly removed by the suction ducts 32 to 34.
[0058]
The substrate processing apparatus 1 waits until a predetermined time elapses, stops the suction of the substrate 90 by the stage 3, and the operator or the transport mechanism picks up the substrate 90 from the substrate holding region 300 and transports it to the next processing step. .
[0059]
As described above, in the substrate processing apparatus 1 according to the present embodiment, the suction ducts 32 and 33 provided between the substrate holding region 300 and the traveling rail 31a suck the atmosphere to move the bridging structure 4. Contaminants such as dust generated by friction between the traveling rail 31a and the support block 31b can be removed. Also, the suction ducts 32 to 34 and 36 can remove the organic solvent vapor generated from the substrate 90 coated with the resist solution, the waiting slit nozzle 41 and the like.
[0060]
<2. Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.
[0061]
For example, the suction ducts 32 to 34 have been described as using a type having a duct cover (cover opening duct), but these have suction ports (slits) formed on the stage surface 30 of the stage 3 like the suction duct 36. May be a type (base surface opening duct). Further, the suction duct 36 may be a cover opening duct.
[0062]
Further, the adjustment plates of the suction ducts 32 to 34 are not limited to being moved manually. For example, a mechanism for moving each adjustment plate may be provided separately, and the control system 6 may be configured to automatically adjust the flow rate of the atmosphere by controlling the movement of each adjustment plate.
[0063]
Further, in the above embodiment, only the example in which the adjustment plate is provided in the cover opening duct (suction ducts 32 to 34) has been described, but the adjustment plate is provided in the suction port of the base surface opening duct (suction duct 36), You may make it adjust the flow volume of the atmosphere to attract | suck.
[0064]
In the above-described embodiment, the case where the contact-type moving mechanism (travel rail 31a and support block 31b) is used to move the bridging structure 4 is described as an example. However, the present invention is not limited to this. For example, a non-contact type moving mechanism such as an air bearing may be used. In such a case, the moving mechanism needs to eject air for floating the bridging structure 4, and dust and the like are diffused by the ejection, so that the moving mechanism moves with the substrate holding region 300 like the substrate processing apparatus 1. It is effective to perform suction by providing a suction duct between the mechanism.
[0065]
【The invention's effect】
In the first to tenth aspects of the present invention, the first duct is mainly used when the processing tool is moved because the suction port is opened between the substrate holding region of the holding table and the moving mechanism. Contaminants such as dust generated from the moving mechanism can be removed.
In the invention according to any one of claims 1 to 10, since the first duct is a cover opening duct in which a suction port is formed in a duct cover arranged on the holding table, the duct has an arbitrary position. Therefore, the design can be facilitated.
In the inventions according to claims 1 to 10, the suction ports provided in the duct cover are formed on the substrate holding region side and the moving mechanism side, respectively, thereby becoming a source of contaminants and the like. Since the atmosphere of the place can be selectively sucked, efficient contamination prevention can be performed.
[0066]
In the invention according to claim 3, by providing the first duct in the vicinity of the substrate holding region, it is possible to prevent diffusion of vapor of organic solvent generated when the processing liquid dries. it can.
[0067]
In the invention according to claim 4, the second duct is provided in the vicinity of the standby position of the slit nozzle, thereby preventing the diffusion of the vapor of the organic solvent generated from the standby slit nozzle. it can.
[0068]
In the invention according to claim 5, the invention according to any one of claims 1 to 4 is easily realized by being a base surface opening duct in which a suction port is formed on the base surface of the holding base as the first duct. Can do.
[0071]
In the invention according to claim 7 , since the duct has an adjustment plate that adjusts the flow rate of the atmosphere sucked from the suction port, the distribution can be adjusted, so that efficient suction can be performed with a small amount of exhaust.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an outline of a substrate processing apparatus 1 according to an embodiment of the present invention.
FIG. 2 is a plan view of the main body 2 of the substrate processing apparatus 1 as viewed from above.
3 is a front view of the main body 2. FIG.
4 is a cross-sectional side view in which a main body 2 is cut along a cutting line (IV-IV line) shown in FIG. 2;
FIG. 5 is a diagram showing a configuration of a suction duct.
FIG. 6 is a diagram showing a configuration of a suction duct.
7 is a view showing a state in which the suction duct is cut along the cutting line (VII-VII line) shown in FIG. 6;
FIG. 8 is a diagram showing a configuration of a suction duct.
9 is a view showing a state where the suction duct is cut along the cutting line (IX-IX line) shown in FIG. 8;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 3 Stage 30 Base surface 300 Substrate holding area 31a Traveling rail 31b Support blocks 32, 33 Suction duct 330 Duct cover 331 Slit 332 Adjustment plate 333 Exhaust pipe 34 Suction duct 340 Duct cover 341 Slit 342 Adjustment plate 343 Exhaust pipe 36 Suction Duct 360 Suction port 361 Exhaust pipe 4 Bridge structure 41 Slit nozzle 90 Substrate

Claims (10)

In a substrate processing apparatus that performs a process of forming a layer of a processing solution on the surface of a substrate,
A holding table for holding a substrate;
A processing tool for discharging the processing liquid is attached in a substantially horizontal direction, and a bridging structure spanned substantially horizontally above the holding table;
A contact mechanism or a non-contact type moving mechanism for guiding the bridge structure in order to move the bridge structure in a substantially horizontal direction along the surface of the substrate;
A first duct having a suction port that opens between a substrate holding region of the holding table and the moving mechanism and sucks an atmosphere;
With
The first duct is a cover opening duct in which the suction port is formed in a duct cover disposed on the holding table, and the suction port provided in the duct cover includes the substrate holding region side, A substrate processing apparatus formed on each of the moving mechanisms . The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the processing tool is a slit nozzle that discharges a predetermined processing liquid. The substrate processing apparatus according to claim 1 or 2,
The substrate processing apparatus, wherein the first duct is provided in the vicinity of the substrate holding region. In the substrate processing apparatus of Claim 2 or 3,
A second duct for exhausting the vicinity of the standby position of the slit nozzle;
A substrate processing apparatus, further comprising: The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the first duct is a table opening duct in which the suction port is formed on a table surface of the holding table. The substrate processing apparatus according to any one of claims 1 to 5 ,
The suction port on the substrate holding region side provided in the duct cover opens upward, and the suction port on the moving mechanism side opens so as to face the moving mechanism. A substrate processing apparatus. The substrate processing apparatus according to claim 1 ,
The first duct is
It said movably provided so as to cover the suction port, before Symbol adjusting plate for varying the opening area of the suction port to adjust the flow rate of the atmosphere sucked through the suction port,
A substrate processing apparatus comprising: The substrate processing apparatus according to any one of claims 1 to 7 ,
The substrate is a square substrate, and the substrate holding region is rectangular;
The substrate processing apparatus, wherein the first duct is provided at a position along two sides parallel to a moving direction of the bridging structure by the moving mechanism of the substrate holding region. The substrate processing apparatus according to claim 8 ,
3. A substrate processing apparatus, wherein a third duct is provided at a position along a side perpendicular to the moving direction of the bridging structure by the moving mechanism of the substrate holding region. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the first duct has an opening at a height position higher than an upper surface of the holding table.

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