JP2013048218A - Ｓｏｉ基板の作製方法 - Google Patents

Ｓｏｉ基板の作製方法 Download PDF

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Publication number
JP2013048218A
JP2013048218A JP2012159942A JP2012159942A JP2013048218A JP 2013048218 A JP2013048218 A JP 2013048218A JP 2012159942 A JP2012159942 A JP 2012159942A JP 2012159942 A JP2012159942 A JP 2012159942A JP 2013048218 A JP2013048218 A JP 2013048218A
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JP
Japan
Prior art keywords
semiconductor wafer
heat treatment
wafer
semiconductor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012159942A
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English (en)
Japanese (ja)
Other versions
JP2013048218A5 (OSRAM
Inventor
Kazuya Hanaoka
一哉 花岡
Yujiro Sakurada
勇二郎 櫻田
Hideki Tsuya
英樹 津屋
Makoto Furuno
誠 古野
Miku Fujita
未来 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2012159942A priority Critical patent/JP2013048218A/ja
Publication of JP2013048218A publication Critical patent/JP2013048218A/ja
Publication of JP2013048218A5 publication Critical patent/JP2013048218A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Thin Film Transistor (AREA)
JP2012159942A 2011-07-22 2012-07-18 Ｓｏｉ基板の作製方法 Withdrawn JP2013048218A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012159942A JP2013048218A (ja) 2011-07-22 2012-07-18 Ｓｏｉ基板の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011161320 2011-07-22
JP2011161320 2011-07-22
JP2012159942A JP2013048218A (ja) 2011-07-22 2012-07-18 Ｓｏｉ基板の作製方法

Publications (2)

Publication Number Publication Date
JP2013048218A true JP2013048218A (ja) 2013-03-07
JP2013048218A5 JP2013048218A5 (OSRAM) 2015-07-30

Family

ID=47556062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012159942A Withdrawn JP2013048218A (ja) 2011-07-22 2012-07-18 Ｓｏｉ基板の作製方法

Country Status (2)

Country Link
US (1) US20130023108A1 (OSRAM)
JP (1) JP2013048218A (OSRAM)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102072592B1 (ko) * 2012-09-24 2020-02-03 삼성전자 주식회사 ｅＵＩＣＣ의 식별자 관리 방법 및 그 장치
JP6086056B2 (ja) * 2013-11-26 2017-03-01 信越半導体株式会社 熱処理方法
US10305933B2 (en) * 2015-11-23 2019-05-28 Blackberry Limited Method and system for implementing usage restrictions on profiles downloaded to a mobile device
JP6531743B2 (ja) * 2016-09-27 2019-06-19 信越半導体株式会社 貼り合わせｓｏｉウェーハの製造方法
CN110828311B (zh) * 2018-08-08 2024-04-16 北京北方华创微电子装备有限公司 晶片处理方法、辅助控制器和晶片处理系统

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03123027A (ja) * 1989-10-05 1991-05-24 Toshiba Ceramics Co Ltd シリコンウエハの清浄化方法
JPH0684925A (ja) * 1992-07-17 1994-03-25 Toshiba Corp 半導体基板およびその処理方法
JPH11135511A (ja) * 1997-10-29 1999-05-21 Nippon Steel Corp シリコン半導体基板及びその製造方法
JPH11145436A (ja) * 1997-11-10 1999-05-28 Nec Corp 張り合わせｓｏｉ基板及びその製造方法
JP2000036583A (ja) * 1998-05-15 2000-02-02 Canon Inc 半導体基板、半導体薄膜の作製方法および多層構造体
JP2000049063A (ja) * 1998-07-29 2000-02-18 Shin Etsu Handotai Co Ltd Ｓｏｉウエーハの製造方法およびｓｏｉウエーハ
JP2001156076A (ja) * 1999-11-29 2001-06-08 Nippon Steel Corp シリコン半導体基板の製造方法
JP2003204048A (ja) * 2002-01-09 2003-07-18 Shin Etsu Handotai Co Ltd Ｓｏｉウエーハの製造方法及びｓｏｉウエーハ
JP2004040012A (ja) * 2002-07-08 2004-02-05 Toshiba Ceramics Co Ltd 半導体ウェーハの製造方法
JP2006086305A (ja) * 2004-09-15 2006-03-30 Shin Etsu Handotai Co Ltd Ｓｏｉウェーハの製造方法
JP2010056543A (ja) * 2008-08-01 2010-03-11 Semiconductor Energy Lab Co Ltd Ｓｏｉ基板の作製方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4398126B2 (ja) * 2001-12-06 2010-01-13 ケイ・エス・ティ・ワ−ルド株式会社 二酸化シリコン膜の生成方法
WO2003088346A1 (en) * 2002-04-10 2003-10-23 Memc Electronic Materials, Inc. Process for controlling denuded zone depth in an ideal oxygen precipitating silicon wafer
JP4552856B2 (ja) * 2003-09-05 2010-09-29 株式会社Ｓｕｍｃｏ Ｓｏｉウェーハの作製方法
JP4715470B2 (ja) * 2005-11-28 2011-07-06 株式会社Sumco 剥離ウェーハの再生加工方法及びこの方法により再生加工された剥離ウェーハ
JP2008235309A (ja) * 2007-03-16 2008-10-02 Tokyo Electron Ltd 基板処理装置、基板処理方法および記録媒体
JP5276863B2 (ja) * 2008-03-21 2013-08-28 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハ

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03123027A (ja) * 1989-10-05 1991-05-24 Toshiba Ceramics Co Ltd シリコンウエハの清浄化方法
JPH0684925A (ja) * 1992-07-17 1994-03-25 Toshiba Corp 半導体基板およびその処理方法
JPH11135511A (ja) * 1997-10-29 1999-05-21 Nippon Steel Corp シリコン半導体基板及びその製造方法
JPH11145436A (ja) * 1997-11-10 1999-05-28 Nec Corp 張り合わせｓｏｉ基板及びその製造方法
JP2000036583A (ja) * 1998-05-15 2000-02-02 Canon Inc 半導体基板、半導体薄膜の作製方法および多層構造体
JP2000049063A (ja) * 1998-07-29 2000-02-18 Shin Etsu Handotai Co Ltd Ｓｏｉウエーハの製造方法およびｓｏｉウエーハ
JP2001156076A (ja) * 1999-11-29 2001-06-08 Nippon Steel Corp シリコン半導体基板の製造方法
JP2003204048A (ja) * 2002-01-09 2003-07-18 Shin Etsu Handotai Co Ltd Ｓｏｉウエーハの製造方法及びｓｏｉウエーハ
JP2004040012A (ja) * 2002-07-08 2004-02-05 Toshiba Ceramics Co Ltd 半導体ウェーハの製造方法
JP2006086305A (ja) * 2004-09-15 2006-03-30 Shin Etsu Handotai Co Ltd Ｓｏｉウェーハの製造方法
JP2010056543A (ja) * 2008-08-01 2010-03-11 Semiconductor Energy Lab Co Ltd Ｓｏｉ基板の作製方法

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US20130023108A1 (en) 2013-01-24

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