JP2013026260A5 - - Google Patents

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Publication number
JP2013026260A5
JP2013026260A5 JP2011156437A JP2011156437A JP2013026260A5 JP 2013026260 A5 JP2013026260 A5 JP 2013026260A5 JP 2011156437 A JP2011156437 A JP 2011156437A JP 2011156437 A JP2011156437 A JP 2011156437A JP 2013026260 A5 JP2013026260 A5 JP 2013026260A5
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JP
Japan
Prior art keywords
substrate
processed
supporting substrate
holding member
held
Prior art date
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Granted
Application number
JP2011156437A
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English (en)
Japanese (ja)
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JP5478565B2 (ja
JP2013026260A (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2011156437A external-priority patent/JP5478565B2/ja
Priority to JP2011156437A priority Critical patent/JP5478565B2/ja
Priority to TW101119349A priority patent/TWI529841B/zh
Priority to PCT/JP2012/066135 priority patent/WO2013011806A1/ja
Priority to KR1020147000945A priority patent/KR101883028B1/ko
Priority to US14/131,247 priority patent/US20140158303A1/en
Publication of JP2013026260A publication Critical patent/JP2013026260A/ja
Publication of JP2013026260A5 publication Critical patent/JP2013026260A5/ja
Publication of JP5478565B2 publication Critical patent/JP5478565B2/ja
Application granted granted Critical
Active legal-status Critical Current
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JP2011156437A 2011-07-15 2011-07-15 接合システム Active JP5478565B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011156437A JP5478565B2 (ja) 2011-07-15 2011-07-15 接合システム
TW101119349A TWI529841B (zh) 2011-07-15 2012-05-30 接合系統、基板處理系統、接合方法、及電腦記憶媒體
US14/131,247 US20140158303A1 (en) 2011-07-15 2012-06-25 Bonding system, substrate processing system, and bonding method
KR1020147000945A KR101883028B1 (ko) 2011-07-15 2012-06-25 접합 시스템, 기판 처리 시스템 및 접합 방법
PCT/JP2012/066135 WO2013011806A1 (ja) 2011-07-15 2012-06-25 接合システム、基板処理システム及び接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011156437A JP5478565B2 (ja) 2011-07-15 2011-07-15 接合システム

Publications (3)

Publication Number Publication Date
JP2013026260A JP2013026260A (ja) 2013-02-04
JP2013026260A5 true JP2013026260A5 (enExample) 2013-06-06
JP5478565B2 JP5478565B2 (ja) 2014-04-23

Family

ID=47557987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011156437A Active JP5478565B2 (ja) 2011-07-15 2011-07-15 接合システム

Country Status (5)

Country Link
US (1) US20140158303A1 (enExample)
JP (1) JP5478565B2 (enExample)
KR (1) KR101883028B1 (enExample)
TW (1) TWI529841B (enExample)
WO (1) WO2013011806A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014165217A (ja) 2013-02-21 2014-09-08 Tokyo Electron Ltd 基板搬送装置および剥離システム
JP6568773B2 (ja) * 2015-11-10 2019-08-28 東京エレクトロン株式会社 基板搬送装置及び剥離システム
TWI765918B (zh) * 2016-09-30 2022-06-01 日商尼康股份有限公司 搬運裝置、曝光裝置、曝光方法、平板顯示器的製造方法、元件製造方法以及搬運方法
JP2017085177A (ja) * 2017-02-10 2017-05-18 東京エレクトロン株式会社 基板搬送装置および剥離システム
KR102459089B1 (ko) * 2017-12-21 2022-10-27 삼성전자주식회사 반도체 패키징 장비 및 이를 이용한 반도체 소자의 제조방법
US10665494B2 (en) 2018-01-31 2020-05-26 Applied Materials, Inc. Automated apparatus to temporarily attach substrates to carriers without adhesives for processing
JP7129793B2 (ja) * 2018-03-06 2022-09-02 シャープ株式会社 接合装置
CN118263105A (zh) * 2018-03-14 2024-06-28 东京毅力科创株式会社 基板处理系统、基板处理方法以及计算机存储介质
TWI797461B (zh) * 2019-07-26 2023-04-01 日商新川股份有限公司 封裝裝置
KR20250164322A (ko) * 2020-04-13 2025-11-24 도쿄엘렉트론가부시키가이샤 접합 시스템
JP7709877B2 (ja) * 2021-09-15 2025-07-17 株式会社Ｓｃｒｅｅｎホールディングス 端部状態確認装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6672358B2 (en) * 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
JP2002100595A (ja) * 2000-07-21 2002-04-05 Enya Systems Ltd ウエ−ハ剥離装置及び方法並びにこれを用いたウエ−ハ処理装置
KR100877044B1 (ko) * 2000-10-02 2008-12-31 도쿄엘렉트론가부시키가이샤 세정처리장치
KR20070000183A (ko) * 2005-06-27 2007-01-02 삼성전자주식회사 웨이퍼 이송 장치
JP5027460B2 (ja) * 2006-07-28 2012-09-19 東京応化工業株式会社 ウエハの接着方法、薄板化方法、及び剥離方法
JP2008153337A (ja) * 2006-12-15 2008-07-03 Tokyo Electron Ltd 貼り合せ基板の分離方法、貼り合せ基板の分離装置及びプログラムを記録したコンピュータ読み取り可能な記録媒体
JP2008166536A (ja) * 2006-12-28 2008-07-17 Tokyo Ohka Kogyo Co Ltd 貼り合わせ装置
JP2008182016A (ja) 2007-01-24 2008-08-07 Tokyo Electron Ltd 貼り合わせ装置、貼り合わせ方法

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