JP2013021044A - 荷電粒子線描画装置、および、物品の製造方法 - Google Patents

荷電粒子線描画装置、および、物品の製造方法 Download PDF

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Publication number
JP2013021044A
JP2013021044A JP2011151520A JP2011151520A JP2013021044A JP 2013021044 A JP2013021044 A JP 2013021044A JP 2011151520 A JP2011151520 A JP 2011151520A JP 2011151520 A JP2011151520 A JP 2011151520A JP 2013021044 A JP2013021044 A JP 2013021044A
Authority
JP
Japan
Prior art keywords
stage
substrate
drawing apparatus
charged particle
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011151520A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013021044A5 (enExample
Inventor
Tomonori Ishikawa
智規 石川
Nobushige Korenaga
伸茂 是永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2011151520A priority Critical patent/JP2013021044A/ja
Priority to US13/534,044 priority patent/US8476607B2/en
Priority to TW101123886A priority patent/TW201303953A/zh
Priority to KR1020120073645A priority patent/KR20130006355A/ko
Publication of JP2013021044A publication Critical patent/JP2013021044A/ja
Publication of JP2013021044A5 publication Critical patent/JP2013021044A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/026—Shields
    • H01J2237/0264—Shields magnetic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20221—Translation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2011151520A 2011-07-08 2011-07-08 荷電粒子線描画装置、および、物品の製造方法 Pending JP2013021044A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011151520A JP2013021044A (ja) 2011-07-08 2011-07-08 荷電粒子線描画装置、および、物品の製造方法
US13/534,044 US8476607B2 (en) 2011-07-08 2012-06-27 Charged particle beam drawing apparatus and article manufacturing method
TW101123886A TW201303953A (zh) 2011-07-08 2012-07-03 帶電粒子束繪圖設備及物品製造方法
KR1020120073645A KR20130006355A (ko) 2011-07-08 2012-07-06 하전 입자 빔 묘화 장치 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011151520A JP2013021044A (ja) 2011-07-08 2011-07-08 荷電粒子線描画装置、および、物品の製造方法

Publications (2)

Publication Number Publication Date
JP2013021044A true JP2013021044A (ja) 2013-01-31
JP2013021044A5 JP2013021044A5 (enExample) 2014-08-21

Family

ID=47438864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011151520A Pending JP2013021044A (ja) 2011-07-08 2011-07-08 荷電粒子線描画装置、および、物品の製造方法

Country Status (4)

Country Link
US (1) US8476607B2 (enExample)
JP (1) JP2013021044A (enExample)
KR (1) KR20130006355A (enExample)
TW (1) TW201303953A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021521595A (ja) * 2018-05-02 2021-08-26 エーエスエムエル ネザーランズ ビー．ブイ． 電子ビーム装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI661471B (zh) * 2013-12-13 2019-06-01 日商荏原製作所股份有限公司 真空容器之基座的設置構造
US9952255B2 (en) * 2015-10-30 2018-04-24 Texas Instruments Incorporated Magnetically shielded probe card
CN106019854A (zh) * 2016-07-18 2016-10-12 无锡宏纳科技有限公司 图形可变的电子束光刻机
TWI886395B (zh) * 2021-06-14 2025-06-11 日商紐富來科技股份有限公司 多帶電粒子束描繪裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047170A (ja) * 2002-07-09 2004-02-12 Hitachi Ltd 電子線描画装置
JP2005268268A (ja) * 2004-03-16 2005-09-29 Canon Inc 電子ビーム露光装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW466542B (en) * 1999-02-26 2001-12-01 Nippon Kogaku Kk A stage device and a method of manufacturing same, a position controlling method, an exposure device and a method of manufacturing same, and a device and a method of manufacturing same
JP2002184664A (ja) 2000-12-12 2002-06-28 Canon Inc 荷電粒子線露光装置及び方法並びにステージ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047170A (ja) * 2002-07-09 2004-02-12 Hitachi Ltd 電子線描画装置
JP2005268268A (ja) * 2004-03-16 2005-09-29 Canon Inc 電子ビーム露光装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021521595A (ja) * 2018-05-02 2021-08-26 エーエスエムエル ネザーランズ ビー．ブイ． 電子ビーム装置
JP7016969B2 (ja) 2018-05-02 2022-02-07 エーエスエムエル ネザーランズ ビー．ブイ． 電子ビーム装置
US11315752B2 (en) 2018-05-02 2022-04-26 Asml Netherlands B.V. E-beam apparatus

Also Published As

Publication number Publication date
TW201303953A (zh) 2013-01-16
KR20130006355A (ko) 2013-01-16
US8476607B2 (en) 2013-07-02
US20130011797A1 (en) 2013-01-10

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