JP2013014809A5 - - Google Patents
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- Publication number
- JP2013014809A5 JP2013014809A5 JP2011149138A JP2011149138A JP2013014809A5 JP 2013014809 A5 JP2013014809 A5 JP 2013014809A5 JP 2011149138 A JP2011149138 A JP 2011149138A JP 2011149138 A JP2011149138 A JP 2011149138A JP 2013014809 A5 JP2013014809 A5 JP 2013014809A5
- Authority
- JP
- Japan
- Prior art keywords
- tin
- nickel plating
- electroless nickel
- ion
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 13
- 229910052759 nickel Inorganic materials 0.000 claims 6
- 238000007747 plating Methods 0.000 claims 6
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims 3
- 229910001432 tin ion Inorganic materials 0.000 claims 3
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000003112 inhibitor Substances 0.000 claims 2
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- GEZAUFNYMZVOFV-UHFFFAOYSA-J 2-[(2-oxo-1,3,2$l^{5},4$l^{2}-dioxaphosphastannetan-2-yl)oxy]-1,3,2$l^{5},4$l^{2}-dioxaphosphastannetane 2-oxide Chemical compound [Sn+2].[Sn+2].[O-]P([O-])(=O)OP([O-])([O-])=O GEZAUFNYMZVOFV-UHFFFAOYSA-J 0.000 claims 1
- CJAZCKUGLFWINJ-UHFFFAOYSA-N 3,4-dihydroxybenzene-1,2-disulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C(S(O)(=O)=O)=C1O CJAZCKUGLFWINJ-UHFFFAOYSA-N 0.000 claims 1
- YXTDAZMTQFUZHK-UHFFFAOYSA-L 5,6-dihydroxy-1,3,2$l^{2}-dioxastannepane-4,7-dione Chemical compound [Sn+2].[O-]C(=O)C(O)C(O)C([O-])=O YXTDAZMTQFUZHK-UHFFFAOYSA-L 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- CIWBSHSKHKDKBQ-DUZGATOHSA-N D-araboascorbic acid Natural products OC[C@@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-DUZGATOHSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims 1
- 235000010323 ascorbic acid Nutrition 0.000 claims 1
- 229960005070 ascorbic acid Drugs 0.000 claims 1
- 239000011668 ascorbic acid Substances 0.000 claims 1
- JALQQBGHJJURDQ-UHFFFAOYSA-L bis(methylsulfonyloxy)tin Chemical compound [Sn+2].CS([O-])(=O)=O.CS([O-])(=O)=O JALQQBGHJJURDQ-UHFFFAOYSA-L 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 claims 1
- 235000010350 erythorbic acid Nutrition 0.000 claims 1
- 239000004318 erythorbic acid Substances 0.000 claims 1
- GQZXNSPRSGFJLY-UHFFFAOYSA-N hydroxyphosphanone Chemical compound OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 claims 1
- 229940005631 hypophosphite ion Drugs 0.000 claims 1
- 229940026239 isoascorbic acid Drugs 0.000 claims 1
- 229910001453 nickel ion Inorganic materials 0.000 claims 1
- 230000033116 oxidation-reduction process Effects 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 235000011150 stannous chloride Nutrition 0.000 claims 1
- -1 tetrahydroborate ion Chemical class 0.000 claims 1
- OBBXFSIWZVFYJR-UHFFFAOYSA-L tin(2+);sulfate Chemical compound [Sn+2].[O-]S([O-])(=O)=O OBBXFSIWZVFYJR-UHFFFAOYSA-L 0.000 claims 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 claims 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011149138A JP2013014809A (ja) | 2011-07-05 | 2011-07-05 | 無電解ニッケルめっき皮膜および無電解ニッケルめっき液 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011149138A JP2013014809A (ja) | 2011-07-05 | 2011-07-05 | 無電解ニッケルめっき皮膜および無電解ニッケルめっき液 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013014809A JP2013014809A (ja) | 2013-01-24 |
| JP2013014809A5 true JP2013014809A5 (enExample) | 2014-03-27 |
Family
ID=47687743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011149138A Pending JP2013014809A (ja) | 2011-07-05 | 2011-07-05 | 無電解ニッケルめっき皮膜および無電解ニッケルめっき液 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013014809A (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103014786B (zh) * | 2013-01-22 | 2016-01-20 | 广州博泉环保材料科技有限公司 | 电镀液、其制备方法及应用此电镀液的镀锡工艺 |
| JP6095056B2 (ja) * | 2013-02-25 | 2017-03-15 | 学校法人関東学院 | 無電解ＮｉＳｎＰめっき膜、無電解めっき液、及びめっき膜の製造方法 |
| JP2014214341A (ja) * | 2013-04-25 | 2014-11-17 | 日本カニゼン株式会社 | 無電解複合めっき皮膜、並びにそれが形成された摺動部品、転動部品及び金型 |
| JP6218473B2 (ja) * | 2013-07-22 | 2017-10-25 | 株式会社クオルテック | 無電解Ｎｉ−Ｐ−Ｓｎめっき液 |
| JP2015053455A (ja) * | 2013-09-09 | 2015-03-19 | 株式会社東芝 | 電力用半導体装置及びその製造方法 |
| JP6570054B2 (ja) * | 2015-03-30 | 2019-09-04 | 株式会社 コーア | 摺動部材 |
| JP6531277B2 (ja) * | 2015-03-30 | 2019-06-19 | 株式会社 コーア | 無電解めっき液及び無電解めっき方法 |
| JP6918902B2 (ja) * | 2015-09-15 | 2021-08-11 | 三菱電機株式会社 | 半導体装置の製造方法 |
| JP6516067B2 (ja) * | 2016-06-08 | 2019-05-22 | 三菱電機株式会社 | 半導体装置 |
| JP6960677B2 (ja) * | 2019-01-22 | 2021-11-05 | メルテックス株式会社 | 無電解Ｎｉ−Ｆｅ合金めっき液 |
| CN113832510B (zh) * | 2021-09-09 | 2023-03-10 | 张家口原轼新型材料股份有限公司 | 一种表面镀附高磷镍合金的金钢砂、镀附液、镀附工艺、镀附装置及含有该金钢砂的金钢线 |
| CN114016008B (zh) * | 2021-10-27 | 2023-08-29 | 东北电力大学 | 一种化学镀Ni-P-PTFE-TiO2复合纳米镀层及其制备方法 |
| CN114262883A (zh) * | 2021-12-27 | 2022-04-01 | 上海电气燃气轮机有限公司 | 应用在燃气轮机高温部件内壁的防腐涂层制备方法 |
| CN114774897A (zh) * | 2022-06-21 | 2022-07-22 | 西安欧中材料科技有限公司 | Slm用高磷硼元素gh4169粉末的制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06306624A (ja) * | 1993-04-26 | 1994-11-01 | Hitachi Cable Ltd | 無電解はんだめっき液 |
| JP4150901B2 (ja) * | 2002-11-27 | 2008-09-17 | 石原薬品株式会社 | 無電解スズ系メッキの前処理方法、及びスズ系メッキ皮膜の異常析出防止方法 |
| JP2005194562A (ja) * | 2004-01-06 | 2005-07-21 | Murata Mfg Co Ltd | 無電解ニッケルめっき液、及びセラミック電子部品の製造方法 |
| JP4960142B2 (ja) * | 2007-05-08 | 2012-06-27 | 日本カニゼン株式会社 | 無電解ニッケルめっき液及びそれを用いた無電解ニッケルめっき方法 |
| JP5278988B2 (ja) * | 2007-08-03 | 2013-09-04 | 石原薬品株式会社 | 無電解スズメッキ浴及び電子部品の無電解スズメッキ方法 |
-
2011
- 2011-07-05 JP JP2011149138A patent/JP2013014809A/ja active Pending
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