JP2012531039A - アビオニクスシャーシ - Google Patents
アビオニクスシャーシ Download PDFInfo
- Publication number
- JP2012531039A JP2012531039A JP2012516097A JP2012516097A JP2012531039A JP 2012531039 A JP2012531039 A JP 2012531039A JP 2012516097 A JP2012516097 A JP 2012516097A JP 2012516097 A JP2012516097 A JP 2012516097A JP 2012531039 A JP2012531039 A JP 2012531039A
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- avionics chassis
- circuit board
- printed circuit
- transfer plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
【選択図】図2
Description
12 アビオニクスシャーシ
14 回路板
16 シャーシハウジング
18 内部
19 外部
20 熱伝導性カードレール
21 スロット
22 取付け脚部
24 発熱構成要素
26 基板
28 側部ストリップ
30 内部経路
34 フレーム
36 上部カバー
38 底壁
40 後壁
42 前部カバー
44 側壁
46 側壁
47 開口
48 内面
50 外面
54 電波シールド
55 金属層
56 金属ストリップ
58 放熱フィン
Claims (15)
- 内部を画定し、向かい合う壁を有するハウジングと、
一対の離隔配置されたレールを備えるカードレールアセンブリであって、各レールが、向かい合う壁の対向するレールに、互いに熱伝導するように取り付けられ、各レールが、レール間に延在する所定の高さを有する効果的なスロットを画定するようにチャネルを有する、カードレールアセンブリと、
プリント回路板と、前記プリント回路板と重畳関係にある伝熱平面とを備える回路カードアセンブリであって、前記プリント回路板が第1の主平面を画定し、伝熱平面が第2の主平面を画定する、回路カードアセンブリと
を備え、
前記プリント回路板と前記伝熱平面の空間的関係が、前記回路カードアセンブリが前記カードレールアセンブリに取り付けられたときに前記第1及び第2の主平面が前記スロット内部に位置されるようなものであり、前記伝熱平面が、前記レールの少なくとも一方に導電結合されて、前記伝熱平面から前記向かい合う壁の少なくとも一方への第1の導電性経路を形成し、前記プリント回路板が、前記レールの少なくとも一方に導電結合されて、前記プリント回路板から前記向かい合う壁の少なくとも一方への第2の導電性経路を形成する、アビオニクスシャーシ。 - 前記伝熱平面と前記プリント回路板の少なくとも一方が、前記対応する第1又は第2の導電性経路を形成するために、前記対応するレールに直に接触する請求項1記載のアビオニクスシャーシ。
- 前記回路カードアセンブリが、前記レール内で前記プリント回路板を選択的に係止するための楔係止をさらに備え、前記楔係止が、対応する第1又は第2の導電性経路の一部分を形成するために熱導電性である請求項1記載のアビオニクスシャーシ。
- 前記伝熱平面が、炭素繊維強化複合材と炭素−炭素複合材の少なくとも一方から形成される請求項1記載のアビオニクスシャーシ。
- 前記炭素繊維が、前記伝熱平面が2次元平面、3次元平面、及び1次元平面の少なくとも1つで熱伝導性であるようにレイアップされる請求項4記載のアビオニクスシャーシ。
- 前記炭素繊維が、前記伝熱平面が前記レールに向かって横方向に熱を伝導するようにレイアップされる請求項5記載のアビオニクスシャーシ。
- 前記伝熱平面が熱分解性炭素からなる請求項1記載のアビオニクスシャーシ。
- 前記プリント回路板が発熱構成要素を備え、前記伝熱平面が、前記第1の導電性経路の一部を形成するために前記発熱構成要素を前記伝熱平面に導電結合する熱パッドを備える請求項1記載のアビオニクスシャーシ。
- 前記熱パッドが熱伝導性材料から形成される請求項8記載のアビオニクスシャーシ。
- 前記熱パッドが前記発熱構成要素に直に接触する請求項8記載のアビオニクスシャーシ。
- 前記熱パッドが、前記プリント回路板に対して調節可能である請求項10記載のアビオニクスシャーシ。
- 前記プリント回路板が、熱伝導性側部ストリップをさらに備え、前記側部ストリップが、前記回路カードアセンブリが前記スロット内部に受け取られたときに前記カードレールと位置合わせされて、前記第2の導電性経路の一部分を形成する請求項1記載のアビオニクスシャーシ。
- 前記プリント回路板が、発熱構成要素と、前記発熱構成要素から前記熱伝導性側部ストリップの少なくとも1つに延在する少なくとも1つの熱伝導要素とをさらに備える請求項12記載のアビオニクスシャーシ。
- 前記回路カードアセンブリが、前記回路カードアセンブリが前記スロット内部に位置されるときに前記プリント回路板と前記伝熱平面の間に位置される補剛具をさらに備える請求項1記載のアビオニクスシャーシ。
- 前記補剛具の一部分が、前記回路カードアセンブリが前記スロット内部に位置されるときに前記カードレールの一方の内部に位置されて、前記第1及び第2の導電性経路の少なくとも一方の一部分を形成する請求項14記載のアビオニクスシャーシ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/487,834 US8023267B2 (en) | 2009-06-19 | 2009-06-19 | Avionics chassis |
US12/487,834 | 2009-06-19 | ||
PCT/US2010/035177 WO2010147727A2 (en) | 2009-06-19 | 2010-05-18 | Avionics chassis |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012531039A true JP2012531039A (ja) | 2012-12-06 |
JP2012531039A5 JP2012531039A5 (ja) | 2013-06-20 |
JP5624614B2 JP5624614B2 (ja) | 2014-11-12 |
Family
ID=42782281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012516097A Expired - Fee Related JP5624614B2 (ja) | 2009-06-19 | 2010-05-18 | アビオニクスシャーシ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8023267B2 (ja) |
JP (1) | JP5624614B2 (ja) |
CA (1) | CA2764975C (ja) |
DE (1) | DE112010002564B4 (ja) |
GB (1) | GB2484216B (ja) |
WO (1) | WO2010147727A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021517445A (ja) * | 2018-03-07 | 2021-07-15 | フラマトム・ゲーエムベーハー | 原子力発電所のためのモジュール構造を有するプラグインコンバータユニット及び制御技術電力供給システム |
JP2022508729A (ja) * | 2018-10-15 | 2022-01-19 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | モジュールied |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US8023267B2 (en) | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
US8222541B2 (en) * | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
US8059409B2 (en) * | 2009-06-19 | 2011-11-15 | General Electric Company | Avionics chassis |
US8427828B2 (en) * | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
FR2969379B1 (fr) * | 2010-12-17 | 2013-02-15 | Thales Sa | Refroidissement d'un equipement electronique |
DE102011004801B4 (de) | 2011-02-25 | 2013-11-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Selektiv beschichtete CFK-Bauteile und Verfahren zu deren Herstellung |
TWI543702B (zh) * | 2012-02-08 | 2016-07-21 | 鴻準精密工業股份有限公司 | 散熱裝置 |
US20130299131A1 (en) * | 2012-05-14 | 2013-11-14 | Alexander Timashov | Adjustable heat dissipation assembly for magnetic devices |
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US9818669B2 (en) * | 2014-08-06 | 2017-11-14 | Honeywell International Inc. | Printed circuit board assembly including conductive heat transfer |
US10383261B2 (en) * | 2015-10-20 | 2019-08-13 | Ge Global Sourcing Llc | Heat transfer chassis and method for forming the same |
US9848697B2 (en) * | 2015-10-20 | 2017-12-26 | The Keyw Corporation | Modular aviation equipment rack |
FR3052629B1 (fr) * | 2016-06-08 | 2018-06-15 | Safran Electronics & Defense | Boitier pour equipement avionique comprenant une paroi en materiau composite et des drains thermiques metalliques |
US10039203B2 (en) | 2016-07-12 | 2018-07-31 | Hamilton Sundstrand Corporation | Molded card guide chassis |
FR3062246A1 (fr) * | 2017-01-24 | 2018-07-27 | Zodiac Aero Electric | Boitier de distribution de puissance electrique pour un aeronef |
CN109665122A (zh) * | 2018-12-21 | 2019-04-23 | 吉林省大千电子科技有限公司 | 卫星通信电源信号综合电磁保护壳 |
US11160184B2 (en) * | 2019-10-08 | 2021-10-26 | Hamilton Sundstrand Corporation | Vehicle circuit card assembly |
CN113423246B (zh) * | 2021-06-29 | 2023-01-10 | 长光卫星技术股份有限公司 | 一种用于立方卫星电子设备高效散热的轻型装置 |
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- 2010-05-18 DE DE112010002564.9T patent/DE112010002564B4/de active Active
- 2010-05-18 JP JP2012516097A patent/JP5624614B2/ja not_active Expired - Fee Related
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JP2021517445A (ja) * | 2018-03-07 | 2021-07-15 | フラマトム・ゲーエムベーハー | 原子力発電所のためのモジュール構造を有するプラグインコンバータユニット及び制御技術電力供給システム |
JP7321175B2 (ja) | 2018-03-07 | 2023-08-04 | フラマトム・ゲーエムベーハー | 原子力発電所のためのモジュール構造を有するプラグインコンバータユニット及び制御技術電力供給システム |
JP2022508729A (ja) * | 2018-10-15 | 2022-01-19 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | モジュールied |
JP7203237B2 (ja) | 2018-10-15 | 2023-01-12 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | モジュールied |
Also Published As
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CA2764975A1 (en) | 2010-12-23 |
US8023267B2 (en) | 2011-09-20 |
WO2010147727A3 (en) | 2011-07-14 |
DE112010002564B4 (de) | 2023-09-21 |
GB201121057D0 (en) | 2012-01-18 |
GB2484216A (en) | 2012-04-04 |
CA2764975C (en) | 2017-09-05 |
JP5624614B2 (ja) | 2014-11-12 |
GB2484216B (en) | 2014-08-13 |
US20100321890A1 (en) | 2010-12-23 |
WO2010147727A2 (en) | 2010-12-23 |
DE112010002564T5 (de) | 2012-09-27 |
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