JP5698736B2 - アビオニクスシャーシ - Google Patents
アビオニクスシャーシ Download PDFInfo
- Publication number
- JP5698736B2 JP5698736B2 JP2012516090A JP2012516090A JP5698736B2 JP 5698736 B2 JP5698736 B2 JP 5698736B2 JP 2012516090 A JP2012516090 A JP 2012516090A JP 2012516090 A JP2012516090 A JP 2012516090A JP 5698736 B2 JP5698736 B2 JP 5698736B2
- Authority
- JP
- Japan
- Prior art keywords
- avionics chassis
- housing
- chassis
- avionics
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims description 64
- 239000002184 metal Substances 0.000 claims description 64
- 239000002131 composite material Substances 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 238000001465 metallisation Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- QHZSDTDMQZPUKC-UHFFFAOYSA-N 3,5-dichlorobiphenyl Chemical compound ClC1=CC(Cl)=CC(C=2C=CC=CC=2)=C1 QHZSDTDMQZPUKC-UHFFFAOYSA-N 0.000 description 36
- 238000012546 transfer Methods 0.000 description 29
- 229920000049 Carbon (fiber) Polymers 0.000 description 28
- 239000004917 carbon fiber Substances 0.000 description 28
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 16
- 239000000835 fiber Substances 0.000 description 14
- 239000011159 matrix material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000003351 stiffener Substances 0.000 description 10
- 229920002239 polyacrylonitrile Polymers 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000011295 pitch Substances 0.000 description 7
- 239000003570 air Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- SXZSFWHOSHAKMN-UHFFFAOYSA-N 2,3,4,4',5-Pentachlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC(Cl)=C(Cl)C(Cl)=C1Cl SXZSFWHOSHAKMN-UHFFFAOYSA-N 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011304 carbon pitch Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
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- 239000000806 elastomer Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011156 metal matrix composite Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002296 pyrolytic carbon Substances 0.000 description 1
- 239000011208 reinforced composite material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0045—Casings being rigid plastic containers having a coating of shielding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D45/00—Aircraft indicators or protectors not otherwise provided for
- B64D45/02—Lightning protectors; Static dischargers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G13/00—Installations of lightning conductors; Fastening thereof to supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0062—Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Description
12 アビオニクスシャーシ
14 回路板
16 シャーシハウジング
18 内部
19 外部
20 熱伝導性カードレール
21 スロット
22 取付け脚部
24 発熱構成要素
26 基板
28 側部ストリップ
30 内部経路
34 フレーム
36 上部カバー
38 底壁
40 後壁
42 前部カバー
44 側壁
46 側壁
47 開口
48 内面
50 外面
54 電波シールド
55 金属層
56 金属ストリップ
58 放熱フィン
Claims (21)
- ハウジングの外部を画定する外面と、ハウジングの内部を画定する内面とを有し、外面の少なくとも一部から突出する複数の放熱フィンを有する、炭素複合材料からなるハウジングと、
前記ハウジング上に設けられ、少なくとも60dBだけ電波エネルギーを減衰させるのに十分な厚さを有する金属層と、
前記放熱フィンの少なくとも一部の上に設けられ、損傷なしで落雷誘発電流を搬送するのに十分な厚さ及び密度を有する金属ストリップと、
を備える、アビオニクスシャーシ。 - 前記金属層が前記ハウジング外部に被さる、請求項1に記載のアビオニクスシャーシ。
- 前記金属ストリップが前記金属層の一部分に被さる、請求項2に記載のアビオニクスシャーシ。
- 前記金属層が前記ハウジング内部にさらに被さる、請求項2に記載のアビオニクスシャーシ。
- 前記金属層が金属堆積層を備える、請求項1に記載のアビオニクスシャーシ。
- 前記金属ストリップが前記金属堆積層に塗布された溶射アルミニウムの層を備える、請求項5に記載のアビオニクスシャーシ。
- 電気的な接地を形成する少なくとも1つの部位をさらに備え、前記電気的な接地を航空機に動作可能に結合させることができ、それにより前記電気的な接地を介して前記アビオニクスシャーシから前記航空機に電気を伝導することができ、前記金属ストリップが前記部位に電気的に結合される請求項1に記載のアビオニクスシャーシ。
- 前記アビオニクスシャーシが接着継手をさらに備え、前記金属ストリップが接着継手にわたる電気経路を形成する、請求項1に記載のアビオニクスシャーシ。
- ハウジングの外部を画定する外面と、ハウジングの内部を画定する内面とを有し、外面の少なくとも一部から突出する複数の放熱フィンを有する、炭素複合材料からなるハウジングと、
前記ハウジング上に設けられた金属層を備える電波シールドと、
前記放熱フィンの少なくとも一部の上に設けられた金属ストリップを備える落雷導電経路と、
を備え、
前記電波シールドが、前記内部に入る、かつ前記内部から出る電磁妨害を減衰させ、前記落雷導電経路が、落雷からの電流を、前記ハウジングの内部から逃がすように導く、
アビオニクスシャーシ。 - 前記落雷導電経路が、溶射アルミニウムを備える、請求項9に記載のアビオニクスシャーシ。
- 前記電波シールドが、前記ハウジング上に金属堆積層を備える、請求項10に記載のアビオニクスシャーシ。
- 前記金属層が、前記ハウジング外部に被さる、請求項9に記載のアビオニクスシャーシ。
- 前記金属層が、前記ハウジング内部に被さる、請求項12に記載のアビオニクスシャーシ。
- 前記金属ストリップが、前記金属層の一部分に被される、請求項12に記載のアビオニクスシャーシ。
- 前記ハウジング内部に取り付けられた少なくとも1つのアビオニクス要素をさらに備え、前記アビオニクス要素が、発熱し、電波に敏感である、請求項9に記載のアビオニクスシャーシ。
- 前記電波シールドが、少なくとも60dBだけ電波エネルギーを減衰するのに十分な厚さを有する、請求項9に記載のアビオニクスシャーシ。
- 前記落雷導電経路が、損傷なく、落雷による誘発電流を搬送するのに十分な厚さ及び密度を有する請求項9に記載のアビオニクスシャーシ。
- 少なくとも1つの電気的な接地をさらに備え、電気をシャーシから電気接点を通って航空機に伝導することができるように前記電気的な接地を航空機に動作可能に結合させることができる、請求項9に記載のアビオニクスシャーシ。
- 前記落雷導電経路が、前記少なくとも1つの接地に電気的に結合される、請求項18に記載のアビオニクスシャーシ。
- 前記少なくとも1つの接地が取付け脚部を備える、請求項19に記載のアビオニクスシャーシ。
- 前記金属層が、前記ハウジング外部に被さり、前記落雷導電経路が、前記金属層の一部分に被さる、請求項19に記載のアビオニクスシャーシ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/487,784 US8222541B2 (en) | 2009-06-19 | 2009-06-19 | Avionics chassis |
US12/487,784 | 2009-06-19 | ||
PCT/US2010/034008 WO2010147711A1 (en) | 2009-06-19 | 2010-05-07 | Avionics chassis |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012531178A JP2012531178A (ja) | 2012-12-06 |
JP5698736B2 true JP5698736B2 (ja) | 2015-04-08 |
Family
ID=42668369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012516090A Expired - Fee Related JP5698736B2 (ja) | 2009-06-19 | 2010-05-07 | アビオニクスシャーシ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8222541B2 (ja) |
JP (1) | JP5698736B2 (ja) |
CA (1) | CA2764952C (ja) |
DE (1) | DE112010002580T5 (ja) |
GB (1) | GB2483582B (ja) |
WO (1) | WO2010147711A1 (ja) |
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US8222541B2 (en) | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
US8023267B2 (en) * | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
US8059409B2 (en) * | 2009-06-19 | 2011-11-15 | General Electric Company | Avionics chassis |
FR2956557B1 (fr) * | 2010-02-18 | 2013-01-04 | Airbus Operations Sas | Module electronique et ensemble electronique comportant un tel module |
US8513541B2 (en) * | 2011-01-21 | 2013-08-20 | Remy Technologies, L.L.C. | Method of blocking electro-magnetic interference (EMI) in an electric machine and apparatus |
GB2487557B (en) * | 2011-01-26 | 2015-12-16 | Ge Aviat Systems Ltd | Electrical housings for aircraft |
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US9333599B2 (en) | 2013-12-20 | 2016-05-10 | General Electric Company | Electronics chassis and method of fabricating the same |
US9848697B2 (en) | 2015-10-20 | 2017-12-26 | The Keyw Corporation | Modular aviation equipment rack |
US10070562B2 (en) * | 2016-05-17 | 2018-09-04 | Ge Aviation Systems Llc | Method and apparatus for heat-dissipation in an avionics chassis |
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-
2009
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2010
- 2010-05-07 JP JP2012516090A patent/JP5698736B2/ja not_active Expired - Fee Related
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- 2010-05-07 WO PCT/US2010/034008 patent/WO2010147711A1/en active Application Filing
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US20100319948A1 (en) | 2010-12-23 |
GB2483582A (en) | 2012-03-14 |
JP2012531178A (ja) | 2012-12-06 |
GB2483582B (en) | 2013-10-02 |
WO2010147711A1 (en) | 2010-12-23 |
US8222541B2 (en) | 2012-07-17 |
GB201121058D0 (en) | 2012-01-18 |
CA2764952C (en) | 2017-09-05 |
DE112010002580T5 (de) | 2012-08-30 |
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