JP2012526906A5 - - Google Patents
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- Publication number
- JP2012526906A5 JP2012526906A5 JP2012510960A JP2012510960A JP2012526906A5 JP 2012526906 A5 JP2012526906 A5 JP 2012526906A5 JP 2012510960 A JP2012510960 A JP 2012510960A JP 2012510960 A JP2012510960 A JP 2012510960A JP 2012526906 A5 JP2012526906 A5 JP 2012526906A5
- Authority
- JP
- Japan
- Prior art keywords
- alkyl
- boron nitride
- hexagonal boron
- substituted
- nitride particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002245 particle Substances 0.000 claims description 16
- 229910052582 BN Inorganic materials 0.000 claims description 12
- PZNSFCLAULLKQX-UHFFFAOYSA-N N#B Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 150000002431 hydrogen Chemical class 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 2
- 125000003107 substituted aryl group Chemical group 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 229920001721 Polyimide Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/465,059 US8288466B2 (en) | 2009-05-13 | 2009-05-13 | Composite of a polymer and surface modified hexagonal boron nitride particles |
| US12/465,059 | 2009-05-13 | ||
| PCT/US2010/034459 WO2010132510A2 (en) | 2009-05-13 | 2010-05-12 | Composite of a polymer and surface modified hexagonal boron nitride particles |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012526906A JP2012526906A (ja) | 2012-11-01 |
| JP2012526906A5 true JP2012526906A5 (US20080242721A1-20081002-C00053.png) | 2013-06-20 |
| JP5597699B2 JP5597699B2 (ja) | 2014-10-01 |
Family
ID=43067764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012510960A Expired - Fee Related JP5597699B2 (ja) | 2009-05-13 | 2010-05-12 | ポリマーおよび表面改質六方晶窒化ホウ素粒子の複合体 |
Country Status (6)
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8258346B2 (en) * | 2009-05-13 | 2012-09-04 | E I Du Pont De Nemours And Company | Surface modified hexagonal boron nitride particles |
| JP2012096432A (ja) | 2010-11-01 | 2012-05-24 | Sony Corp | バリアフィルム及びその製造方法 |
| WO2013090168A1 (en) | 2011-12-16 | 2013-06-20 | Ticona Llc | Injection molding of polyarylene sulfide compositions |
| JP6046741B2 (ja) | 2011-12-16 | 2016-12-21 | ティコナ・エルエルシー | ポリアリーレンスルフィド組成物用の成核系 |
| US8796392B2 (en) | 2011-12-16 | 2014-08-05 | Ticona Llc | Low temperature injection molding of polyarylene sulfide compositions |
| CN103998506B (zh) | 2011-12-16 | 2016-08-24 | 提克纳有限责任公司 | 用于聚苯硫醚的含硼成核剂 |
| CN102786815B (zh) * | 2012-08-15 | 2014-04-02 | 中国科学院上海硅酸盐研究所 | 氮化硼粉体表面改性的方法、改性氮化硼及聚合物复合材料 |
| US9464214B2 (en) | 2014-02-25 | 2016-10-11 | The Boeing Company | Thermally conductive flexible adhesive for aerospace applications |
| KR101924197B1 (ko) | 2015-04-20 | 2018-11-30 | 주식회사 엘지화학 | 질화붕소 분산액 |
| TWI671364B (zh) | 2015-12-30 | 2019-09-11 | 美商聖高拜陶器塑膠公司 | 改質氮化物顆粒、寡聚物官能化氮化物顆粒及基於聚合物之複合材料 |
| JP6721219B2 (ja) * | 2016-03-14 | 2020-07-08 | ナミックス株式会社 | 窒化ホウ素フィラ―、樹脂組成物、フィルム、窒化ホウ素フィラ―の製造方法 |
| US10246623B2 (en) * | 2016-09-21 | 2019-04-02 | NAiEEL Technology | Resin composition, article prepared by using the same, and method of preparing the same |
| KR101850244B1 (ko) * | 2017-04-05 | 2018-06-07 | 한국과학기술원 | Bnnp를 포함하는 나노 복합 재료 및 그의 제조 방법 |
| CN109135267B (zh) * | 2017-06-15 | 2021-04-27 | 中国科学院化学研究所 | 一种表面胺基化的氮化硼/尼龙复合材料及其制备方法和用途 |
| CN110799455B (zh) * | 2017-07-14 | 2023-04-18 | 富士胶片株式会社 | 表面修饰无机氮化物、组合物、导热材料及带导热层的器件 |
| MX2020005259A (es) * | 2018-01-26 | 2020-08-24 | Firmenich & Cie | Composicion colorante para cabello que comprende microcapsulas. |
| WO2021010291A1 (ja) * | 2019-07-17 | 2021-01-21 | 富士フイルム株式会社 | 熱伝導材料形成用組成物、熱伝導材料、表面修飾無機物 |
Family Cites Families (36)
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| DE2555515C2 (de) | 1975-12-10 | 1990-04-19 | Hoechst Ag, 6230 Frankfurt | Verfahren zur Herstellung von einheitlichen 4-Aminobenzoldiazoniumsalzen |
| US4670325A (en) * | 1983-04-29 | 1987-06-02 | Ibm Corporation | Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure |
| DE69115171T2 (de) | 1990-08-27 | 1996-05-15 | Du Pont | Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung. |
| JPH07215705A (ja) | 1994-02-07 | 1995-08-15 | Shin Etsu Chem Co Ltd | シリコーンゴム添加用窒化ほう素粉末およびシリコーンゴム製品 |
| JP2732822B2 (ja) * | 1995-12-28 | 1998-03-30 | デュポン帝人アドバンスドペーパー株式会社 | 複合体シートおよびその製造方法 |
| US5681883A (en) * | 1996-03-05 | 1997-10-28 | Advanced Ceramics Corporation | Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
| US6160042A (en) * | 1997-05-01 | 2000-12-12 | Edison Polymer Innovation Corporation | Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
| JP3948642B2 (ja) * | 1998-08-21 | 2007-07-25 | 信越化学工業株式会社 | 熱伝導性グリース組成物及びそれを使用した半導体装置 |
| US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
| EP1114843B1 (en) * | 1999-12-16 | 2006-03-29 | Edison Polymer Innovation Corporation | Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
| US6162849A (en) | 1999-01-11 | 2000-12-19 | Ferro Corporation | Thermally conductive thermoplastic |
| US6623791B2 (en) * | 1999-07-30 | 2003-09-23 | Ppg Industries Ohio, Inc. | Coating compositions having improved adhesion, coated substrates and methods related thereto |
| US7976941B2 (en) * | 1999-08-31 | 2011-07-12 | Momentive Performance Materials Inc. | Boron nitride particles of spherical geometry and process for making thereof |
| US7445797B2 (en) * | 2005-03-14 | 2008-11-04 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and polymer-based compositions made therewith |
| US20070241303A1 (en) * | 1999-08-31 | 2007-10-18 | General Electric Company | Thermally conductive composition and method for preparing the same |
| JP2001192500A (ja) * | 2000-01-12 | 2001-07-17 | Edison Polymer Innovation Corp | 低粘度高熱伝導性ポリマー系窒化ホウ素組成物形成用表面処理窒化ホウ素及び該組成物の形成方法 |
| US6764975B1 (en) * | 2000-11-28 | 2004-07-20 | Saint-Gobain Ceramics & Plastics, Inc. | Method for making high thermal diffusivity boron nitride powders |
| US6652822B2 (en) * | 2001-05-17 | 2003-11-25 | The Regents Of The University Of California | Spherical boron nitride particles and method for preparing them |
| US7026436B2 (en) | 2002-11-26 | 2006-04-11 | E.I. Du Pont De Nemours And Company | Low temperature polyimide adhesive compositions and methods relating thereto |
| US7470990B2 (en) * | 2004-03-31 | 2008-12-30 | Endicott Interconnect Technologies, Inc. | Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
| US20060127686A1 (en) * | 2004-12-15 | 2006-06-15 | Meloni Paul A | Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device |
| JPWO2007018120A1 (ja) * | 2005-08-05 | 2009-02-19 | 日立化成工業株式会社 | 接着フィルム及びこれを用いた半導体装置 |
| US7524560B2 (en) * | 2005-08-19 | 2009-04-28 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
| US20070205706A1 (en) * | 2006-03-01 | 2007-09-06 | General Electric Company | Optical Substrate Comprising Boron Nitride Particles |
| US7658988B2 (en) * | 2006-04-03 | 2010-02-09 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from filled epoxy compositions |
| US7829188B2 (en) * | 2006-04-03 | 2010-11-09 | E.I. Du Pont De Nemours And Company | Filled epoxy compositions |
| US20070259211A1 (en) * | 2006-05-06 | 2007-11-08 | Ning Wang | Heat spread sheet with anisotropic thermal conductivity |
| US7527859B2 (en) * | 2006-10-08 | 2009-05-05 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
| JP5491031B2 (ja) * | 2006-10-11 | 2014-05-14 | 住友電気工業株式会社 | ポリイミドチューブ、その製造方法、ポリイミドワニスの製造方法、及び定着ベルト |
| US20100051879A1 (en) | 2006-11-22 | 2010-03-04 | The Regents od the Univesity of California | Functionalized Boron Nitride Nanotubes |
| WO2009149445A1 (en) * | 2008-06-06 | 2009-12-10 | E. I. Du Pont De Nemours And Company | Polymers containing hexagonal boron nitride particles coated with turbostratic carbon and process for preparing same |
| US20090305043A1 (en) * | 2008-06-06 | 2009-12-10 | E. I. Du Point De Nemours And Company | Boron nitride encapsulated in turbostratic carbon and process for making same |
| US8277936B2 (en) * | 2008-12-22 | 2012-10-02 | E I Du Pont De Nemours And Company | Hexagonal boron nitride compositions characterized by interstitial ferromagnetic layers, process for preparing, and composites thereof with organic polymers |
| US8258346B2 (en) * | 2009-05-13 | 2012-09-04 | E I Du Pont De Nemours And Company | Surface modified hexagonal boron nitride particles |
| US8784980B2 (en) * | 2009-05-13 | 2014-07-22 | E I Du Pont De Nemours And Company | Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles |
| US8440292B2 (en) * | 2009-05-13 | 2013-05-14 | E I Du Pont De Nemours And Company | Multi-layer article for flexible printed circuits |
-
2009
- 2009-05-13 US US12/465,059 patent/US8288466B2/en not_active Expired - Fee Related
-
2010
- 2010-05-12 JP JP2012510960A patent/JP5597699B2/ja not_active Expired - Fee Related
- 2010-05-12 CN CN201080021274.9A patent/CN102421841B/zh not_active Expired - Fee Related
- 2010-05-12 EP EP10775443.4A patent/EP2430091B1/en not_active Not-in-force
- 2010-05-12 WO PCT/US2010/034459 patent/WO2010132510A2/en active Application Filing
- 2010-05-12 KR KR1020117029687A patent/KR20120044935A/ko not_active Application Discontinuation
