JP2012524905A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012524905A5 JP2012524905A5 JP2012507350A JP2012507350A JP2012524905A5 JP 2012524905 A5 JP2012524905 A5 JP 2012524905A5 JP 2012507350 A JP2012507350 A JP 2012507350A JP 2012507350 A JP2012507350 A JP 2012507350A JP 2012524905 A5 JP2012524905 A5 JP 2012524905A5
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contacts
- push
- test
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 claims description 246
- 238000001514 detection method Methods 0.000 claims description 93
- 238000007373 indentation Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 9
- 238000013461 design Methods 0.000 description 37
- 239000012528 membrane Substances 0.000 description 30
- 238000005259 measurement Methods 0.000 description 21
- 239000000758 substrate Substances 0.000 description 19
- 101100444142 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) dut-1 gene Proteins 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000002950 deficient Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000013459 approach Methods 0.000 description 5
- 230000009977 dual effect Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000013536 elastomeric material Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000013102 re-test Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Images
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17114109P | 2009-04-21 | 2009-04-21 | |
| US61/171,141 | 2009-04-21 | ||
| US25723609P | 2009-11-02 | 2009-11-02 | |
| US61/257,236 | 2009-11-02 | ||
| US30750110P | 2010-02-24 | 2010-02-24 | |
| US61/307,501 | 2010-02-24 | ||
| PCT/US2010/031896 WO2010123991A2 (en) | 2009-04-21 | 2010-04-21 | Electrically conductive kelvin contacts for microcircuit tester |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012524905A JP2012524905A (ja) | 2012-10-18 |
| JP2012524905A5 true JP2012524905A5 (enExample) | 2014-05-29 |
| JP5695637B2 JP5695637B2 (ja) | 2015-04-08 |
Family
ID=42980534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012507350A Active JP5695637B2 (ja) | 2009-04-21 | 2010-04-21 | 超小型回路試験器の導電ケルビン接点 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US8558554B2 (enExample) |
| EP (1) | EP2422205B1 (enExample) |
| JP (1) | JP5695637B2 (enExample) |
| KR (1) | KR101399071B1 (enExample) |
| CN (1) | CN102483435B (enExample) |
| CA (1) | CA2759189C (enExample) |
| MY (1) | MY179297A (enExample) |
| SG (1) | SG175302A1 (enExample) |
| WO (1) | WO2010123991A2 (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4133505A1 (de) | 1990-11-15 | 1992-05-21 | Juergen Kulle | Vorrichtung zur fuehrung wenigstens eines werkzeugs |
| GB0724736D0 (en) | 2007-12-19 | 2008-01-30 | Oxford Nanolabs Ltd | Formation of layers of amphiphilic molecules |
| US9329204B2 (en) | 2009-04-21 | 2016-05-03 | Johnstech International Corporation | Electrically conductive Kelvin contacts for microcircuit tester |
| US8988090B2 (en) * | 2009-04-21 | 2015-03-24 | Johnstech International Corporation | Electrically conductive kelvin contacts for microcircuit tester |
| US9069011B2 (en) * | 2009-09-11 | 2015-06-30 | Exelon Generation Company, Llc | Electrical terminal test point and methods of use |
| US8912810B2 (en) | 2011-09-09 | 2014-12-16 | Texas Instruments Incorporated | Contactor with multi-pin device contacts |
| TWI453425B (zh) * | 2012-09-07 | 2014-09-21 | Mjc Probe Inc | 晶片電性偵測裝置及其形成方法 |
| CN102565468B (zh) * | 2011-12-26 | 2013-10-16 | 天津中环半导体股份有限公司 | 开尔文测试载片台 |
| US9040986B2 (en) | 2012-01-23 | 2015-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Three dimensional integrated circuit having a resistance measurement structure and method of use |
| US8933720B2 (en) * | 2012-02-10 | 2015-01-13 | Asm Technology Singapore Pte Ltd | Apparatus for conducting automated maintenance of a test contactor module |
| KR101838347B1 (ko) * | 2012-04-17 | 2018-04-26 | 유니테크노 인코퍼레이티드 | 켈빈 접촉 프로브 및 이를 포함하는 켈빈 검사 지그 |
| US20140070831A1 (en) * | 2012-08-27 | 2014-03-13 | Advantest Corporation | System and method of protecting probes by using an intelligent current sensing switch |
| GB201313121D0 (en) | 2013-07-23 | 2013-09-04 | Oxford Nanopore Tech Ltd | Array of volumes of polar medium |
| US9274141B1 (en) * | 2013-01-22 | 2016-03-01 | Johnstech International Corporation | Low resistance low wear test pin for test contactor |
| DE102013100700B3 (de) * | 2013-01-24 | 2014-05-15 | Infineon Technologies Ag | Verfahren zur herstellung einer halbleitermodulanordnung |
| DE102013100701B4 (de) | 2013-01-24 | 2022-07-21 | Infineon Technologies Ag | Halbleitermodulanordnung und verfahren zur herstellung einer halbleitermodulanordnung |
| US10006942B2 (en) * | 2013-05-13 | 2018-06-26 | Intel IP Corporation | Board, integrated circuit testing arrangement, and method for operating an integrated circuit |
| JP6407672B2 (ja) * | 2014-11-18 | 2018-10-17 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US10156586B2 (en) * | 2015-01-16 | 2018-12-18 | Modus Test, Llc | Force deflection and resistance testing system and method of use |
| US11385277B2 (en) | 2019-08-05 | 2022-07-12 | Modus Test, Llc | Modular electronic testing system with flexible test PCB format |
| US10151774B2 (en) * | 2015-06-10 | 2018-12-11 | Asm Technology Singapore Pte Ltd | Electrical contact having electrical isolated members for contacting an electrical component |
| KR101728399B1 (ko) | 2015-10-08 | 2017-04-20 | 주식회사 이노글로벌 | 켈빈 테스트용 프로브, 켈빈 테스트용 프로브 모듈 및 그 제조방법 |
| MY179228A (en) * | 2016-02-22 | 2020-11-02 | Jf Microtechnology Sdn Bhd | Kelvin contact assembly and method of installation thereof |
| US10495688B1 (en) | 2016-04-26 | 2019-12-03 | Johnstech International Corporation | Manual test socket and method of adjustment |
| IT201700019437A1 (it) * | 2017-02-21 | 2018-08-21 | St Microelectronics Srl | Scheda di test per un dispositivo attuabile magneticamente, e sistema di test includente la scheda di test |
| KR101780476B1 (ko) | 2017-03-03 | 2017-09-21 | (주)티에스이 | 검사용 소켓 |
| MY185304A (en) * | 2017-05-18 | 2021-04-30 | Jf Microtechnology Sdn Bhd | High precision vertical motion kelvin contact assembly |
| TWI623996B (zh) * | 2017-07-24 | 2018-05-11 | 中華精測科技股份有限公司 | 整合信號及電源完整性模組之積體電路測試座 |
| CN107545246A (zh) * | 2017-08-17 | 2018-01-05 | 华天科技（西安）有限公司 | 一种指纹识别芯片的封装结构及其封装方法 |
| SG11202000790YA (en) * | 2017-09-25 | 2020-02-27 | Johnstech Int Corp | High isolation contactor with test pin and housing for integrated circuit testing |
| US10367279B2 (en) * | 2017-10-26 | 2019-07-30 | Xilinx, Inc. | Pusher pin having a non-electrically conductive portion |
| GB2568895B (en) | 2017-11-29 | 2021-10-27 | Oxford Nanopore Tech Ltd | Microfluidic device |
| CN110376511A (zh) * | 2019-08-17 | 2019-10-25 | 深圳斯普瑞溙科技有限公司 | 测试极小间距及触点芯片的金手指 |
| TWI737199B (zh) * | 2020-02-27 | 2021-08-21 | 黃文斌 | 電子元件測試夾具 |
| US12411125B2 (en) | 2020-07-17 | 2025-09-09 | Oxford Nanopore Technologies Plc | Nanopore sensing device |
| CN112083315A (zh) * | 2020-09-15 | 2020-12-15 | 苏州韬盛电子科技有限公司 | 一种针对qfn的开尔文测试插座 |
| TWI755919B (zh) * | 2020-11-03 | 2022-02-21 | 中華精測科技股份有限公司 | 板狀連接器與其雙環式串接件、及晶圓測試組件 |
| US11906576B1 (en) | 2021-05-04 | 2024-02-20 | Johnstech International Corporation | Contact assembly array and testing system having contact assembly array |
| US11867752B1 (en) * | 2021-05-13 | 2024-01-09 | Johnstech International Corporation | Contact assembly and kelvin testing system having contact assembly |
| USD1015282S1 (en) | 2022-02-01 | 2024-02-20 | Johnstech International Corporation | Spring pin tip |
| CN115184754B (zh) * | 2022-09-09 | 2022-12-06 | 江苏通强电气设备有限公司 | 一种用于配电柜的绝缘检测设备 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4308498A (en) * | 1979-07-19 | 1981-12-29 | Rca Corporation | Kelvin test fixture for electrically contacting miniature, two terminal, leadless, electrical components |
| JPH02271263A (ja) * | 1989-04-12 | 1990-11-06 | Nec Corp | コンタクトピン |
| JPH0743408B2 (ja) * | 1990-05-24 | 1995-05-15 | 積水化学工業株式会社 | 表示装置用導電性透明体の導通検出装置 |
| JPH0451675U (enExample) * | 1990-09-05 | 1992-04-30 | ||
| JP3054003B2 (ja) * | 1993-09-01 | 2000-06-19 | 株式会社東芝 | Ｉｃコンタクタ |
| US6069480A (en) * | 1997-12-31 | 2000-05-30 | Aetrium-Fsa, Lp | Kelvin contact-type testing device |
| US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
| US20020149388A1 (en) * | 2001-04-11 | 2002-10-17 | Cleston Messick | Method for the accurate electrical testing of semiconductor devices |
| US7218127B2 (en) * | 2004-02-18 | 2007-05-15 | Formfactor, Inc. | Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component |
| US7074049B2 (en) | 2004-03-22 | 2006-07-11 | Johnstech International Corporation | Kelvin contact module for a microcircuit test system |
| JP4395165B2 (ja) * | 2004-06-03 | 2010-01-06 | 株式会社日本マイクロニクス | 接触子及び電気的接続装置 |
| JP4571640B2 (ja) * | 2004-07-05 | 2010-10-27 | 株式会社日本マイクロニクス | 接触子ブロック及び電気的接続装置 |
| KR100673007B1 (ko) * | 2005-07-27 | 2007-01-24 | 삼성전자주식회사 | 비휘발성 반도체 메모리 장치 및 그 제조방법 |
| US7639026B2 (en) | 2006-02-24 | 2009-12-29 | Johnstech International Corporation | Electronic device test set and contact used therein |
| CN101067642A (zh) * | 2006-02-24 | 2007-11-07 | 丹尼斯·B·歇尔 | 电子器件测试装置及其所使用的触头 |
| US7615434B2 (en) * | 2006-03-24 | 2009-11-10 | United Microelectronics Corp. | CMOS device and fabricating method thereof |
| US8354854B2 (en) * | 2007-01-02 | 2013-01-15 | Johnstech International Corporation | Microcircuit testing interface having kelvin and signal contacts within a single slot |
| JP2008224640A (ja) * | 2007-03-08 | 2008-09-25 | Isao Kimoto | 先端回転型プローブ組立 |
-
2010
- 2010-04-21 EP EP10767700.7A patent/EP2422205B1/en active Active
- 2010-04-21 US US12/764,603 patent/US8558554B2/en active Active
- 2010-04-21 WO PCT/US2010/031896 patent/WO2010123991A2/en not_active Ceased
- 2010-04-21 KR KR1020117027706A patent/KR101399071B1/ko active Active
- 2010-04-21 SG SG2011077252A patent/SG175302A1/en unknown
- 2010-04-21 CA CA2759189A patent/CA2759189C/en active Active
- 2010-04-21 JP JP2012507350A patent/JP5695637B2/ja active Active
- 2010-04-21 MY MYPI2011005038A patent/MY179297A/en unknown
- 2010-04-21 CN CN201080027549.XA patent/CN102483435B/zh active Active
-
2013
- 2013-10-15 US US14/053,794 patent/US9500673B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5695637B2 (ja) | 超小型回路試験器の導電ケルビン接点 | |
| JP2012524905A5 (enExample) | ||
| KR101890825B1 (ko) | 마이크로 회로 테스터를 위한 전기 전도성 핀 | |
| US10877090B2 (en) | Electrically conductive pins for microcircuit tester | |
| US10247755B2 (en) | Electrically conductive kelvin contacts for microcircuit tester | |
| US8102184B2 (en) | Test contact system for testing integrated circuits with packages having an array of signal and power contacts | |
| US9007082B2 (en) | Electrically conductive pins for microcircuit tester | |
| US8988090B2 (en) | Electrically conductive kelvin contacts for microcircuit tester | |
| US20140266279A1 (en) | Electrically Conductive Pins For Microcircuit Tester | |
| JP2012520461A5 (enExample) | ||
| US9606143B1 (en) | Electrically conductive pins for load boards lacking Kelvin capability for microcircuit testing | |
| TWI503553B (zh) | 用於微電路測試器的導電開爾文接觸件 | |
| US20190302145A1 (en) | Electrically Conductive Kelvin Contacts For Microcircuit Tester | |
| HK1171264B (en) | Electrically conductive kelvin contacts for microcircuit tester |