JP2012519966A5 - - Google Patents

Download PDF

Info

Publication number
JP2012519966A5
JP2012519966A5 JP2011553159A JP2011553159A JP2012519966A5 JP 2012519966 A5 JP2012519966 A5 JP 2012519966A5 JP 2011553159 A JP2011553159 A JP 2011553159A JP 2011553159 A JP2011553159 A JP 2011553159A JP 2012519966 A5 JP2012519966 A5 JP 2012519966A5
Authority
JP
Japan
Prior art keywords
target
array
narrow
mounting
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011553159A
Other languages
English (en)
Japanese (ja)
Other versions
JP5827569B2 (ja
JP2012519966A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2010/026447 external-priority patent/WO2010102263A1/en
Publication of JP2012519966A publication Critical patent/JP2012519966A/ja
Publication of JP2012519966A5 publication Critical patent/JP2012519966A5/ja
Application granted granted Critical
Publication of JP5827569B2 publication Critical patent/JP5827569B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011553159A 2009-03-05 2010-03-05 面発光半導体装置によるデジタル熱注入 Active JP5827569B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15779909P 2009-03-05 2009-03-05
US61/157,799 2009-03-05
US22476509P 2009-07-10 2009-07-10
US61/224,765 2009-07-10
PCT/US2010/026447 WO2010102263A1 (en) 2009-03-05 2010-03-05 Digital heat injection by way of surface emitting semi-conductor devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015095259A Division JP2015207766A (ja) 2009-03-05 2015-05-07 面発光半導体装置によるデジタル熱注入

Publications (3)

Publication Number Publication Date
JP2012519966A JP2012519966A (ja) 2012-08-30
JP2012519966A5 true JP2012519966A5 (enExample) 2013-07-04
JP5827569B2 JP5827569B2 (ja) 2015-12-02

Family

ID=42710031

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011553159A Active JP5827569B2 (ja) 2009-03-05 2010-03-05 面発光半導体装置によるデジタル熱注入
JP2015095259A Pending JP2015207766A (ja) 2009-03-05 2015-05-07 面発光半導体装置によるデジタル熱注入

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015095259A Pending JP2015207766A (ja) 2009-03-05 2015-05-07 面発光半導体装置によるデジタル熱注入

Country Status (12)

Country Link
US (1) US9282851B2 (enExample)
EP (1) EP2404353A4 (enExample)
JP (2) JP5827569B2 (enExample)
KR (1) KR101769312B1 (enExample)
CN (2) CN102405568A (enExample)
AU (1) AU2010221086A1 (enExample)
BR (1) BRPI1010249A2 (enExample)
CA (1) CA2754572C (enExample)
MX (1) MX2011009327A (enExample)
RU (1) RU2011140351A (enExample)
SG (1) SG174246A1 (enExample)
WO (1) WO2010102263A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10687391B2 (en) 2004-12-03 2020-06-16 Pressco Ip Llc Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing
US10857722B2 (en) 2004-12-03 2020-12-08 Pressco Ip Llc Method and system for laser-based, wavelength specific infrared irradiation treatment
US7425296B2 (en) 2004-12-03 2008-09-16 Pressco Technology Inc. Method and system for wavelength specific thermal irradiation and treatment
AU2010221086A1 (en) * 2009-03-05 2011-10-06 Pressco Technology, Inc. Digital heat injection by way of surface emitting semi-conductor devices
CA2774523A1 (en) * 2009-09-18 2011-03-24 Pressco Technology, Inc. A narrowband de-icing and ice release system and method
US8815059B2 (en) * 2010-08-31 2014-08-26 Guardian Industries Corp. System and/or method for heat treating conductive coatings using wavelength-tuned infrared radiation
US9332877B2 (en) 2010-06-11 2016-05-10 Pressco Ip Llc Cookware and cook-packs for narrowband irradiation cooking and systems and methods thereof
KR102173068B1 (ko) 2010-06-11 2020-11-02 프레스코 아이피 엘엘씨 협대역 조사 조리를 위한 취사도구 및 조리용 팩과 그 시스템 및 방법
GB201114048D0 (en) * 2011-08-16 2011-09-28 Intrinsiq Materials Ltd Curing system
RU2624526C2 (ru) * 2012-01-17 2017-07-04 Конинклейке Филипс Н.В. Система обогрева для обогрева живого существа
US11388788B2 (en) 2015-09-10 2022-07-12 Brava Home, Inc. In-oven camera and computer vision systems and methods
US10085592B1 (en) 2015-09-10 2018-10-02 Brava Home, Inc. Sequential broiling
CN108474562B (zh) 2015-09-10 2021-10-29 布拉瓦家居公司 烤箱内相机
US11156366B2 (en) 2015-09-10 2021-10-26 Brava Home, Inc. Dynamic heat adjustment of a spectral power distribution configurable cooking instrument
US10064244B2 (en) 2015-09-10 2018-08-28 Brava Home, Inc. Variable peak wavelength cooking instrument with support tray
AU2017209317A1 (en) 2016-01-22 2018-08-16 Pressco Ip Llc A system and method for producing an engineered irradiation pattern in a narrowband system
US10465976B2 (en) 2016-05-19 2019-11-05 Bsh Home Appliances Corporation Cooking within a refrigeration cavity
CN109792802B (zh) * 2016-08-02 2021-08-03 布拉瓦家居公司 带支撑托盘的可变峰值波长烹饪器具
AU2016423191B2 (en) 2016-09-15 2020-09-03 Google Llc Multilayer printed circuit board for reducing quantum signal crosstalk
US10223933B1 (en) 2017-08-09 2019-03-05 Brava Home, Inc. Multizone cooking utilizing a spectral-configurable cooking instrument
WO2019033089A1 (en) 2017-08-11 2019-02-14 Brava Home, Inc. CONFIGURABLE COOKING SYSTEMS AND METHODS
CN111801986B (zh) 2017-11-06 2022-10-28 布拉瓦家居公司 烹饪器具中的功率密度射线操纵
US11206949B1 (en) 2017-11-15 2021-12-28 Brava Home, Inc. High power density toaster
US11422037B2 (en) 2018-03-15 2022-08-23 Brava Home, Inc. Temperature probe systems and methods
US10502430B1 (en) 2018-10-10 2019-12-10 Brava Home, Inc. Particulates detection in a cooking instrument
DE102019106805A1 (de) * 2019-03-18 2020-09-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierender halbleiterchip und strahlungsemittierendes halbleiterbauelement
US12280396B2 (en) 2019-04-19 2025-04-22 Photex Inc. Narrowband can manufacturing
BR112021020607A2 (pt) 2019-04-19 2022-02-15 Photex Inc Sistema e método para curar o interior de uma lata
JP7336377B2 (ja) * 2019-12-12 2023-08-31 シャープ福山レーザー株式会社 半導体レーザ素子
DE102021129563A1 (de) 2021-11-12 2023-05-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement mit integrierter konverterschicht und verfahren zur herstellung eines bauelements

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128587A (ja) * 1985-11-29 1987-06-10 Matsushita Electric Ind Co Ltd 半導体レ−ザ
FR2639150B1 (fr) * 1988-11-15 1991-01-25 Thomson Hybrides Microondes Dispositif optoelectronique de puissance et son procede de realisation
US5238531A (en) 1992-01-17 1993-08-24 Hughes Aircraft Company Apparatus and method for fabricating a chirped grating in a surface emitting distributed feedback semiconductor laser diode device
US5241556A (en) 1992-01-28 1993-08-31 Hughes Aircraft Company Chirped grating surface emitting distributed feedback semiconductor laser
US5282220A (en) * 1992-04-24 1994-01-25 Hughes Aircraft Company Talbot filtered surface emitting distributed feedback semiconductor laser array
US5867521A (en) * 1992-11-12 1999-02-02 Raytheon Company Curved grating surface-emitting distributed feedback laser
US5345466A (en) 1992-11-12 1994-09-06 Hughes Aircraft Company Curved grating surface emitting distributed feedback semiconductor laser
US5778018A (en) 1994-10-13 1998-07-07 Nec Corporation VCSELs (vertical-cavity surface emitting lasers) and VCSEL-based devices
US6543693B1 (en) * 1995-02-27 2003-04-08 Symbol Technologies, Inc. Bar code readers using surface emitting laser diode
US5610930A (en) 1995-03-02 1997-03-11 Hughes Aircraft Company Voltage adding diode laser array
US6195381B1 (en) 1998-04-27 2001-02-27 Wisconsin Alumni Research Foundation Narrow spectral width high-power distributed feedback semiconductor lasers
US6219365B1 (en) 1998-11-03 2001-04-17 Wisconsin Alumni Research Foundation High performance aluminum free active region semiconductor lasers
DE29900811U1 (de) 1999-01-19 1999-03-18 Sator Laser GmbH, 22525 Hamburg Vorrichtung zum Verschweißen des Endes von rohrartigen Behältern aus Kunststoff, insbesondere von Tuben
AU6628700A (en) 1999-08-13 2001-03-13 Wisconsin Alumni Research Foundation Single mode, single lobe surface emitting distributed feedback semiconductor laser
US6979194B2 (en) 1999-09-24 2005-12-27 Cao Group, Inc. Light for activating light-activated materials, the light including a plurality of individual chips and providing a particular spectral profile
JP3667188B2 (ja) * 2000-03-03 2005-07-06 キヤノン株式会社 電子線励起レーザー装置及びマルチ電子線励起レーザー装置
JP2002026452A (ja) * 2000-07-12 2002-01-25 Toyota Central Res & Dev Lab Inc 面発光型光源及びその製造方法、レーザ加工機用光源
JP2002109769A (ja) 2000-09-29 2002-04-12 Tokai Univ 半導体レーザを搭載した高機能・高密度光学ヘッド
DE20020150U1 (de) * 2000-10-17 2001-03-08 Advanced Photonics Tech Ag Erwärmungsstrecke zum Streckblasen
JP2002147762A (ja) 2000-11-14 2002-05-22 Fuji Photo Film Co Ltd 食品調理器
CA2332190A1 (en) * 2001-01-25 2002-07-25 Efos Inc. Addressable semiconductor array light source for localized radiation delivery
US7061958B2 (en) 2001-10-23 2006-06-13 Krupke William F Diode-pumped alkali lasers (DPALs) and amplifiers (DPAAs) with reduced buffer gas pressures
US7457340B2 (en) * 2002-01-18 2008-11-25 Wisconsin Alumni Research Foundation High coherent power, two-dimensional surface-emitting semiconductor diode array laser
WO2003092131A1 (en) 2002-04-24 2003-11-06 Alfalight, Inc. Feedback stabilized multi-mode and method of stabilizing a multi-mode laser
DE10233015A1 (de) * 2002-07-20 2004-02-05 Mann + Hummel Gmbh Vorrichtung und Verfahren zur Trocknung eines Gasstromes
US8442084B2 (en) 2002-10-03 2013-05-14 Laser Operations Llc High performance vertically emitting lasers
US6845116B2 (en) 2002-10-24 2005-01-18 Wisconsin Alumni Research Foundation Narrow lateral waveguide laser
JP4058635B2 (ja) * 2003-09-18 2008-03-12 セイコーエプソン株式会社 面発光型半導体レーザおよびその製造方法
US20050180482A1 (en) * 2004-01-23 2005-08-18 Osowski Mark L. Very low cost surface emitting laser diode arrays
WO2006044314A1 (en) 2004-10-12 2006-04-27 Alfalight Inc Semiconductor laser diode
FR2878185B1 (fr) * 2004-11-22 2008-11-07 Sidel Sas Procede de fabrication de recipients comprenant une etape de chauffe au moyen d'un faisceau de rayonnement electromagnetique coherent
US10857722B2 (en) * 2004-12-03 2020-12-08 Pressco Ip Llc Method and system for laser-based, wavelength specific infrared irradiation treatment
US7425296B2 (en) * 2004-12-03 2008-09-16 Pressco Technology Inc. Method and system for wavelength specific thermal irradiation and treatment
US10687391B2 (en) 2004-12-03 2020-06-16 Pressco Ip Llc Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing
DE102005061334B4 (de) * 2005-12-21 2016-12-29 Khs Corpoplast Gmbh Streckblasanlage und Verfahren zum Streckblasen
US7403552B2 (en) 2006-03-10 2008-07-22 Wisconsin Alumni Research Foundation High efficiency intersubband semiconductor lasers
US7408966B2 (en) 2006-08-18 2008-08-05 Wisconsin Alumni Research Foundation Intersubband quantum box stack lasers
JP2008124358A (ja) 2006-11-15 2008-05-29 Sumitomo Electric Ind Ltd レーザモジュール
EP2094460B1 (en) 2006-12-19 2011-07-13 Philips Intellectual Property & Standards GmbH System for and method of heating objects in a production line
US7586970B2 (en) 2007-02-23 2009-09-08 Alfalight, Inc. High efficiency partial distributed feedback (p-DFB) laser
BRPI0812745A2 (pt) * 2007-06-08 2014-12-23 Pressco Tech Inc Método e sistema para irradiação e tratamento térmico específico de comprimento de onda
AU2010221086A1 (en) * 2009-03-05 2011-10-06 Pressco Technology, Inc. Digital heat injection by way of surface emitting semi-conductor devices

Similar Documents

Publication Publication Date Title
RU2011140351A (ru) Цифровой подвод тепла посредством полупроводниковых устройств с поверхностным излучением
JP2009539646A5 (enExample)
TWI701740B (zh) 基板加熱及處理系統
RU2011125603A (ru) Способ обработки инфракрасным лазерным излучением с заданной длиной волны и предназначенная для этого система
JP5746288B2 (ja) 波長特定熱照射および処理用の方法およびシステム
WO2011159076A3 (ko) 열전대를 이용한 고출력 광소자 가로등
KR100998480B1 (ko) 열전달/발산 모듈을 구비한 반도체 발광 장치
US11224937B2 (en) Line beam light source, line beam irradiation device, and laser lift off method
JP6143785B2 (ja) 色調整可能照明アセンブリ、光源、及び照明器具
MX2012011434A (es) Disipadores de calor ligeros y lamparas de led que los emplean.
WO2013130861A1 (en) Deflectors for a lighting module
US20120061054A1 (en) Distributed cooling of arrayed semi-conductor radiation emitting devices
TWI615575B (zh) 光源、照光的方法及照明系統
WO2014133743A1 (en) Integrated solution for solid state light sources in a process chamber
KR101207571B1 (ko) 열전소자로 이루어진 냉각판을 갖는 라인 엘이디 조명 장치
JP2012253175A5 (enExample)
JP2013513943A (ja) 発光素子の制御回路
KR20160006944A (ko) 열전소자를 갖는 조명수단용 발전장치의 제어방법
CN205208350U (zh) 一种路灯
KR101320935B1 (ko) 방열판 제작방법
TW200923626A (en) Heat dissipation control system and heat dissipation control method thereof
Fredes et al. Thermoelectric Control of Deep UV LED to Improve Optical
KR20250162501A (ko) 인체 또는 동물의 신체 중 적어도 일부에 전자기 방사선을 조사하는 장치 및 방법
JP2015173129A5 (enExample)
HK1133412A (en) A method and system for laser-based, wavelength specific infrared irradiation treatment