200923626 九、發明’說明： 【發明所屬之技術領域】 、土本發明係有關於一種散熱控制系統及其散熱控制方 仏，更砰而言之，係關於一種應用於發熱元 控制系統及其散熱控制方法。 卩之放熱 【先前技術】 按般發光二極體（LightEmittingDi〇de)的發光 f :制主要係仰賴半導體P，介面上電子電洞的結 查光材料激發出光能，然而， = 能讓電能完全龍…t ㈣對電子-而的結合皆 效率來看二且以目前發光元件的光電轉換 有六二士 四成可轉換成有用的光源，換言之約 /、 、％忐將變成無法利用的熱能釋放出來。 〜導體材料(如：陶删)普遍具有極佳的保 二=熱不易），造成上述之熱能將容易累積在内部 且過度的熱量累積將會造成P-N介面材質崩 壞，進而致使整體工作效能降低甚至喪失，因此一^ = 體主動元件皆需要採用有效的散熱設計。 熱模、作择如嶋的散 7吊用的虱冷式散熱模組的結構，其主要係 將埶译：隹、—散熱鰭片及一風扇所構成，藉由該熱導片 :嗜片板並傳導分散至該散熱韓片’再由該散 二斤散逸出空氣透過該風扇將散編 ”纟出，惟乳冷式散熱模組仍有相當的缺 1導熱元件使用—段時間後會達到熱平衡，且熱 110490 200923626 源（如’··發光層）與冷源（ . ^ F. 虱）彺往會因機構配置設 〇十句而間隔一段距離，使得教累 外風戶m ⑽―積的問題仍難以根除，另 卜風扇右過小，則帶動冷空氣與 至 _ ^ ^ 4熱空氣的循環效果較 圭，阳右風扇過大，雖或可得到翁 介4> 奴<土之循環效果’但相對 亦曰τ來兩耗電、容積佔用及噪音等問題。 μ基於Λ述之缺失，有不同的技術被提出並嘗試發展， 例如·微導管水冷技術、焦耳_ * 此 …、 '麥林(J〇ule-Thomson)元 件致峙技術、半導體致冷技術等。 ' # ^ Β ^ τ丹甲锨導官水冷技術及 居、斗-芴森元件致冷技術由於目箭 目刖仍在貫驗認證階段且製 =IM貝昂，故短時間内難以普遍使用而不具備市場經濟 仏值。而半導體致冷技術主要包括有熱電致冷、熱離子場 =射（FieldEraisslGn)致冷、標準電子穿隧（⑽㈣ ectr〇nics T刪e丨土ng)致冷，其中後兩者雖效能強大， 但亦仍在實驗發展階段而尚未達到實用經濟價值，故在此 不予以贅述。 在熱電致冷技術中之致冷原理主要係依據珀爾帖效 應（Peltier Effect)與席貝克效應（“的&以 分別從不同角度解釋電流產生溫差或是溫差產生電流的 物理現象’即利用—冷導板及—熱導板相互進行熱交換， 以達到散熱之效果，由於熱電裝置具有體積小、壽命長、 無噪音、無須使用冷媒（無環保公害）、可倒立或侧立使 用（無方向限制）、極低的維護成本等優點，故目前廣為 業界所普遍採用，惟其造價依然較氣冷式散熱模組高，'且 月b源轉換效率低（約4 〇〜5 〇 % )。 110490 6 200923626 高能源使用效二電致冷技術，且可同時提 .了之散熱控制系統及其散熱控制目方;延元件使用壽 中亟待解決之問題。 乃泛芦、為目珂此產業界 【發明内容】 鑒於上述習知技術之缺點，本發明 _種可提高能源使用效率 目的在於提供 方法。 卞之放熱控制系統及其散熱控制 本發明之另一目的在於提— ^ 散熱控制系統及其散熱控制方法。討“放熱效率之 本發明之又一目的在於提供一 用壽命之散熱控制系統及其散熱控制方法曰加《熱疋件使 冷原Ϊ二之達再:二的二於提供-_ ^ 風扇使二低耗能目的’以及減少 其散熱控制方I放熱拉組損壞之散熱控制系統及 季絲為二上揭目的及其他目的’本發明所提供之散熱控制 係應用於發熱元件之冷卻控制，該散熱控制系統包 ’:熱電模組’係與該發熱元件相互接觸，用以冷卻該 熱兀件之溫度，及將該發熱元件之熱轉換為電能；-電 源模組’係與該發熱元件以及該熱電模組電性連接，用以 分別供給該發熱元件及該熱電模組作動所需電能；以及一 控制模组’係與該發熱元件、該熱電模组以及該電源模組 電性連接，用以感測該發熱元件之溫度，以對所感測之溫 110490 7 200923626 度與預設乏溫度值進行比較程序，俾於該發熱元件作動溫 度高於預設溫度值時，令該熱電模組冷卻該發熱元件，相 對於該發熱元件作動溫度低於預設溫度值時，令該熱電模 組將該發熱元件作動所產生之熱轉換成電能。該預設之溫 ' 度值包含一溫度上限值及一溫度下限值；該熱電模組例如 為致冷晶片。 對應上述散熱控制系統，本發明復揭示一種散熱控制 方法，係應用於一發熱元件之冷卻控制，該散熱控制方法 ί 包括：預設一溫度值，並將該發熱元件與一熱電模組相互 接觸，且感測該發熱元件之溫度；於該發熱元件作動溫度 高於所預設之溫度值時，令該熱電模組冷卻該發熱元件； 以及於該發熱元件作動溫度低於所預設之溫度值時，令該 熱電模組將該發熱元件作動所產生之熱轉換成電能。. 該散熱控制方法進一步包括以下步驟：於步驟1，預 設一溫度上限值與一溫度下限值，並將該熱電模組與該發 ,熱元件相互接觸，再進至步驟2 ;於步驟2，感測該發熱 元件之溫度，並將該發熱元件作動產生之熱轉換成電能， 再進至步驟3 ;於步驟3，判斷該發熱元件之作動溫度是 否到達溫度上限值，若是，令該熱電模組開始冷卻該發熱 元件，並進至步驟4，若否，則回到步驟2 ;以及於步驟 4判斷該發熱元件之作動溫度是否降低至溫度下限值，若 是，令該熱電模組停止冷卻該發熱元件，並回到步驟2， 若否，則繼續冷卻該發熱元件。 因此，本發明係提供一種散熱控制系統及其散熱控制 8 110490 200923626 方法’其i要係藉由一埶命 以一护制、f…包拉，，且與發熱元件相互接觸，並 人控制扠組感源]該發熱元件、、θ , 牛/里度，俾透過與所預設之溫 反徂耵α而之發熱兀件溫度 件# n #丄 返仃比各耘序，俾當該發熱元 仔作勤皿度升尚至預設溫度入 始冷卻該發敎元杜士啦山 $ 7該熱电模組相應地開 知…7〇件’相對當該發埶 值時，令該埶雷 I、、、兀件/皿度低於預設溫度 t 該發熱元件作動產生之教轉換成電 月巨儲存，而未進行洽邱将猓成玉 f 可相對提高發熱元件之能源使目用技術而言’本案 延長該發熱元件的使用壽命‘上效率，以相對 由於本發明中可使發熱元 者 之安全範圍時，使執作/皿度在未超過預設值 了便熱电杈組採取溫差發電模 成可用之電力並儲存起來，接 、U換 設值之筮戒、、®声护 ^、，、兀之刼作溫度達成預 S戒概度日守，即驅動該熱電模組進 發熱元件能維持在一定之操作溫 ：以保障 用，£从士 ， 又文月b使廢熱回收利 ，亦可減少風扇使用、降低噪 目的。 卞曰寺兼具％保節能 【實施方式】 以下係藉由特定的具體實例說明本發明之每 悉此技藝之人士可由本說明書所揭示之内容 ^本發明之其他優點與功效。本發明亦可藉由 基於不同觀點與應用，在不㈣本發以===可 修飾與變更。 Τ卜進仃各種 以下之實施例係進一步詳細說明本發明之觀點、 ”、'一並 110490 200923626 非以枉何誕點限制本發明之範疇。 荼閱第1圖，係為本發明散熱控制系統試舉一較佳實 把例之基本木構方塊示意圖。如圖所示，本發明係應用於 對-發熱7L件1G進行冷卻控制，本實施例之散熱控制系 、充要係c括.熱電模組2 0、一電源模組3 〇及一控制 模組4 0。 .該發熱元件10則係可為發光二極體（LightEmitting D1〇de)模組、大型電子展示面板…哪200923626 IX. Invention 'Description: 【Technical field to which the invention belongs 】 The invention relates to a heat dissipation control system and its heat dissipation control method, and more particularly, to a heating element control system and its heat dissipation. Control Method.放 放 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 Dragon...t (4) The combination of electrons and efficiency is two. And the photoelectric conversion of current light-emitting elements can be converted into useful light sources by six or two. In other words, about /, and %忐 will become unusable heat energy release. come out. ~ Conductor materials (such as: Tao deleted) generally have excellent protection = heat is not easy, so that the above thermal energy will easily accumulate inside and excessive heat accumulation will cause the PN interface material to collapse, resulting in lower overall performance Even lost, so a ^ ^ body active components need to use an effective heat dissipation design. The structure of the hot-cooling heat-dissipating module for the hot mold and the choice of the squid, which is mainly composed of 隹, - heat sink fins and a fan, by the heat guide sheet: The plate is conductively dispersed to the heat-dissipating Korean film, and then the air is dissipated by the fan and the air is dissipated through the fan. However, the milk-cooled heat-dissipating module still has a considerable lack of heat-conducting components. The heat balance is reached, and the heat 110490 200923626 source (such as '·· luminescent layer) and the cold source ( . ^ F. 虱) 彺 因 因 因 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构The problem of product is still difficult to eradicate, and the fan is too small to drive the cold air to the circulation of _ ^ ^ 4 hot air. The positive fan is too large, although it can be obtained by Weng Jie 4> The effect 'but relatively 曰τ comes with two power consumption, volume occupancy and noise. μ Based on the lack of description, different technologies have been proposed and tried to develop, for example, micro-catheter water cooling technology, Joule _ * this..., ' J〇ule-Thomson component-induced technology, semiconductor refrigeration technology Etc. ' # ^ Β ^ τ Dan A 锨 锨 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水 水Use without market economy depreciation. Semiconductor refrigeration technology mainly includes thermoelectric cooling, thermal ion field = field (FieldEraisslGn) refrigeration, standard electron tunneling ((10) (four) ectr〇nics T deleted e 丨) cold Although the latter two are powerful, they are still in the experimental development stage and have not yet reached the practical economic value, so they will not be described here. The cooling principle in thermoelectric cooling technology is mainly based on the Peltier Effect. The heat transfer effect is achieved by the heat exchange between the Schbeck effect and the "physical phenomenon of generating a current by a temperature difference or a temperature difference from a different angle", that is, using a cold guide plate and a heat guide plate. Since the thermoelectric device has the advantages of small size, long life, no noise, no need to use refrigerant (no environmental pollution), can be inverted or used sideways (no direction limitation), and extremely low maintenance cost, It is widely used in the industry, but its cost is still higher than that of the air-cooled heat-dissipating module, and the monthly b source conversion efficiency is low (about 4 〇~5 〇%). 110490 6 200923626 High energy use two electric cooling technology, and The heat dissipation control system and the heat dissipation control target thereof can be simultaneously mentioned; the problem of the use of the component is urgently solved. The purpose of improving the energy use efficiency is to provide a method. The heat release control system and its heat dissipation control Another object of the present invention is to provide a heat dissipation control system and a heat dissipation control method thereof. Another object of the present invention is to provide a heat-dissipating control system and a heat-dissipating control method for the use of heat-dissipating heat-cooling, and to provide a cooling element to make the cold source Ϊ 之 再 : : : : : : : : : : : : : : : : : : 风扇The second low-energy-consumption purpose and the heat-dissipation control system and the quaternary wire for reducing the damage of the heat-dissipating control unit I are the second object and the other objects. The heat-dissipating control system provided by the present invention is applied to the cooling control of the heating element. The heat dissipation control system package ':the thermoelectric module' is in contact with the heating element to cool the temperature of the heating element and convert the heat of the heating element into electrical energy; the power module 'and the heating element and The thermoelectric module is electrically connected to respectively supply the heating element and the electric energy required for the thermoelectric module to operate; and a control module is electrically connected to the heating element, the thermoelectric module and the power module. The method is configured to sense a temperature of the heating element to compare a sensed temperature of 110490 7 200923626 degrees with a preset temperature loss value, when the heating element operating temperature is higher than a preset temperature value The thermoelectric module cools the heating element, and when the operating temperature of the heating element is lower than a preset temperature value, the thermoelectric module converts heat generated by the heating element to electric energy. The preset temperature is The value includes a temperature upper limit value and a temperature lower limit value; the thermoelectric module is, for example, a refrigerant chip. Corresponding to the above heat dissipation control system, the present invention further discloses a heat dissipation control method applied to cooling control of a heat generating component, The heat dissipation control method 包括 includes: presetting a temperature value, contacting the heating element with a thermoelectric module, and sensing a temperature of the heating element; when the heating element operating temperature is higher than a preset temperature value, The thermoelectric module is configured to cool the heating element; and when the operating temperature of the heating element is lower than a preset temperature value, the thermoelectric module converts heat generated by the heating element into electrical energy. The heat dissipation control method The method further includes the following steps: in step 1, presetting a temperature upper limit value and a temperature lower limit value, and contacting the thermoelectric module with the heat generating component and then entering Step 2; in step 2, sensing the temperature of the heating element, and converting the heat generated by the heating element into electrical energy, and then proceeding to step 3; in step 3, determining whether the operating temperature of the heating element reaches the upper temperature limit a value, if so, causing the thermoelectric module to start cooling the heating element, and proceeding to step 4, if not, returning to step 2; and determining in step 4 whether the operating temperature of the heating element is lowered to a lower temperature limit, and if so, Having the thermoelectric module stop cooling the heating element and returning to step 2, if not, continuing to cool the heating element. Accordingly, the present invention provides a heat dissipation control system and heat dissipation control thereof. By means of a command, a f, a ..., and a heating element, and a person controlling the fork group source] the heating element, θ, cow / ri, 俾 through and preset Temperature anti-徂耵α and the heating element temperature part # n #丄回仃 than the order of each, when the fever element is used to increase the temperature to the preset temperature to start cooling the hair of the Yuan Du Shi Lashan $7 The thermoelectric module is opened accordingly 7〇's relative to the value of the hairpin, so that the 埶雷I,, 兀 / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / /猓成玉f can relatively improve the energy of the heating element, so that the purpose of the technology is to extend the service life of the heating element, so as to be relatively safe due to the safety range of the heating element in the present invention. / The degree of the dish does not exceed the preset value, and the thermoelectric group adopts the thermoelectric power generation to form the usable power and store it, and the temperature of the U, ®, 声, 兀, 兀Achieving the pre-S or the precautionary day, that is, driving the thermoelectric module into the heating element can maintain a certain operating temperature: to protect the use, and the waste heat is recovered, and the fan can be used and reduced. Noise.卞曰 兼 兼 兼 % 节能 【 【 【 【 【 【 【 【 【 【 【 【 【 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The present invention can also be modified and modified by the use of === based on different opinions and applications. The following embodiments are described in further detail to the present invention. "," and 110490 200923626, the scope of the present invention is not limited by any number of births. Referring to Figure 1, the present invention is a heat dissipation control system of the present invention. A schematic diagram of a basic wood block diagram of a preferred embodiment is shown. As shown in the figure, the present invention is applied to cooling control of a heat-generating 7L piece 1G, and the heat-dissipation control system and the charging system of the embodiment are included. The module 20, a power module 3, and a control module 40. The heating element 10 can be a Light Emitting D1 module or a large electronic display panel.
DlSPlay Panel)、微處理器（Micr〇Processor)等電子 元件，但不以此為限。 該熱毛杈組係與該發熱元件丨〇之熱源相互接觸，用 以々部該發熱7C件的溫度，該熱電模組2〇係可為一熱電 致冷晶片（ThenK)lelectricC〇〇lingMc)dule),但不以 此為限，即任何具有熱電致冷（The〇K>eleetrie y ing Ef feet)及溫差發電（Therm〇electric ρ〇· g加卿Electronic components such as DlSPlay Panel) and microprocessors (Micr〇Processor) are not limited to this. The hot bristles are in contact with the heat source of the heat generating component to contact the temperature of the heat generating component, and the thermoelectric module 2 can be a thermoelectric cooling chip (ThenK) lelectricC〇〇lingMc) Dule), but not limited to this, that is, any thermoelectric cooling (The〇K>eleetrie y ing Ef feet) and thermoelectric power generation (Therm〇electric ρ〇·g 加卿
Effect)效應之元件或模組皆可，在實際運用中，本發明 之熱電模組20至少具有—冷導板（c〇ld仙⑷及一熱 導板（hot plate)(圖未示），其中該冷導板係緊貼接 觸該發熱元件之熱源表面，該熱導板則相對設於冷導板之 另端與冷空氣接觸’但該熱導板與冷導板之設置對應關係 並=限於垂直或水平相對，即任何使該熱導板直接朝向冷 空氣界面的位置或角度皆可。 該電源模組30係包括一供電單元31及一儲能單元 32，其中該供電單元31分別電性連接該發熱元件10、該 1〇、 110490 200923626 熱電模組’20以及該控制模組40，用以供給該發電元件 10、該熱電模組20及控制模組40電能，該儲能單元32 則用以電性連接該熱電模組20，用以儲存自該熱電模組 20所產生之電能。 — 該控制模組40係與該發熱元件1 0、該熱電模組20 以及該供電單元31電性連接，用以感測該發熱元件10 之溫度，並預設一溫度值，較佳包含一溫度上限值與一溫 度下限值，其中該控制模組40所預設之溫度上限值係小 於會造成發熱元件損壞的臨界溫度值（Critical Temperature )，以將所感測之該發熱元件10之溫度分別 與溫度上限值及溫度下限值進行比較程序，俾當該發熱元 件1 0作動使溫度升高至該溫度上限值時，令該供電單元 31供給電能予該熱電模組20，並使該熱電模組20相應地 冷卻該發熱元件1 0，使熱量直接向環境冷空氣移出（請 參閱第2圖所示之粗線箭頭流向），通常移去熱量係與所 .供給之電流成正比；相對地，當該發熱元件10被該熱電 i. 模組20冷卻，使該發熱元件10之溫度降低至該溫度下限 值時，則令該供電單元31切斷對該熱電模組20的供電， 使該熱電模組20相應地停止冷卻該發熱元件10，此時該 熱電模組20利用溫差產生電流的物理現象，將該發熱元 件1 0因作動所產生之熱轉換成電能，再藉由該熱電模組 20與該電源模組30之儲能單元32之電性連接，將電能 儲存於該儲能單元32内（請參閱第3圖所示之粗線箭頭 流向），藉此讓發熱元件10所產生之”廢熱”亦可成為電 π 110490 200923626 能的來‘源；例如：若逢斷電時，經儲能單元32所獨立儲 存的電能亦可當作緊急照明用；若在供電單元31供電正 常且該儲能單元32又達充電飽和狀態時，則可將電能收 集轉為其他用途；再者於該發熱元件10起始作動時產生 ' 之熱量亦可透過該熱電模組20轉換成電能，俾以相對提 高能源使用效率，且使電源模組30耗電程度可有效控管。 另外該熱電模組20中冷導板及熱導板之溫差復可透 過該控制模組40加以監控，避免通過熱電模組20電流大 ^ 於容許值時而無法再提供致冷功效，同時亦可由該熱電模 組20中冷導板及熱導板之溫差計算所產生電流。 同時配合參閱第4圖，其係用以說明本發明散熱控制 方法之作動流程圖，主要即預設一溫度值，並將該發熱元 件與一熱電模組相互接觸，且感測該發熱元件之溫度；於 該發熱元件作動溫度高於所預設之溫度值時，令該熱電模 組冷卻該發熱元件；以及於該發熱元件作動溫度低於所預 f 設之溫度值時，令該熱電模組將該發熱元件作動所產生之 熱轉換成電能。 如圖所示，於步驟S1，在控制模組4 0中預設一溫度 上限值與一溫度下限值，其中該溫度上限值係小於會造成 發熱元件 10 損壞的臨界溫度值 （Critical Temperature )，並將熱電模組20與該發熱元件10相互 接觸，接著進至步驟S2。 於步驟S2，在該發熱元件1 0開始作動生熱時，由控 制模組40感測該發熱元件10之溫度，並令該熱電模組 12 110490 200923626 20將該’發熱元件〗〇起 C“乍動之-差轉換成電能儲存至儲 早兀32 ’接耆進至步驟S3。 於步驟 S 3，藉由 一· Jtri rfo r^-10之作m: 序，判斷該發熱元件 ^乍動度疋否大於溫度上限值，若是，進至步驟S4, 右否，則重覆步驟S2。 ㈣T步知S4’當該發熱元件1()之作動溫度大於溫度上 ，值=，由該控龍組4〇發出_第―溫度訊號令該供電 早兀/動㈣電模組2M目應地開始冷卻該發熱元件 1 〇 ’接著進至步驟§5。 件I。？/: %’係藉由一比較判斷程序，判斷該發熱元 #動溫度是否小於溫度下限值，^是，進至步驟 ’右否’則重覆步驟S5。 於步驟S6,當該發熱元件1〇溫度降低至該溫度下限 =，由該控制模組4。感測—第二溫度訊號令該熱電模 目應地停止冷卻該發熱元件1〇，並令該發熱元件Μ 動所產生之熱轉換成電能儲存於儲能單元32， 回到步驟S2。 # 由於讀制模組4G與該熱電模組2()之間係為回授控 一，故可相對修正該控制模組4〇擷取第一溫度訊號盥第 ς溫度訊號的頻率響應，以確保該發熱元件1〇之溫度趨 於。玄概度上限值與溫度下限值之區間内的安全操作溫 俾藉以達到良好的散熱效率，另外由於熱電模組20 直處於驅動狀g ’故可相對延長該熱電模組別使 110490 13 200923626 综上戶斤述，本發明係提供-種散熱控制系統及其散熱 控制方法，其主要係藉由-熱電模組與發熱元件相互接 觸，並以一控制模組感測該發熱元件溫度，俾透過與所預 設之溫度值對感測之發熱元件溫度進行比較程序n 發熱元件作動溫度升高至預設溫度值時，令該熱電模= 應地開始冷卻該發熱元件，相對當該發熱元件溫度低於預 設溫度值時，令該熱電模組將該發熱元件作動產生之埶轉 (^成電能儲存，而未進行冷卻工作，相較於習知技術而 2 ’本案可相對提高發熱元件之能源使用效率及散熱效 干’以相對延長該發熱元件的使用壽命。 、再者，由於本發明中可使發熱元件之操作溫度在未 將女王範圍％，使熱電模組採取溫差發電模式， 將熱轉換成可用之電力並儲存起來，待發熱元件之 ”成預，值之警戒溫度時，即驅動該熱電模組進行： ，皿以保p早發熱兀件能維持在一定之操作溫 亦可減少風扇使一= 上述實施例僅例示性說明本發明之原理及其功效，而 /用於限制本發明。任何熟習此項技藝之人士均可在 =本發明之精神及範訂’對上述實施例進行 =因此，本發明之權利保護範圍，應如後述專The component or module of the effect may be used. In practical use, the thermoelectric module 20 of the present invention has at least a cold guide plate (c〇ld fairy (4) and a hot plate (not shown), Wherein the cold guide plate is in close contact with the heat source surface of the heating element, and the heat guide plate is in contact with the cold air at the other end of the cold guide plate; but the heat guide plate and the cold guide plate are arranged correspondingly and = The power module 30 includes a power supply unit 31 and an energy storage unit 32, wherein the power supply unit 31 is respectively electrically connected to the cold air interface. The heating element 10, the 1 〇, 110490 200923626 thermoelectric module '20 and the control module 40 are connected to supply power to the power generating component 10, the thermoelectric module 20 and the control module 40, and the energy storage unit 32 The electrical module 20 is electrically connected to the electrical energy generated by the thermoelectric module 20. The control module 40 is coupled to the heating element 10, the thermoelectric module 20, and the power supply unit 31. Electrical connection for sensing the temperature of the heating element 10 And presetting a temperature value, preferably including a temperature upper limit value and a temperature lower limit value, wherein the preset temperature upper limit value of the control module 40 is less than a critical temperature value that causes damage of the heating element (Critical) Temperature), the temperature of the sensed heating element 10 is compared with the temperature upper limit value and the lower temperature limit value respectively, and when the heating element 10 is activated to raise the temperature to the upper limit of the temperature, The power supply unit 31 supplies electric energy to the thermoelectric module 20, and the thermoelectric module 20 cools the heating element 10 correspondingly, so that heat is directly removed to the ambient cold air (refer to the thick arrow flow direction shown in FIG. 2). The heat removal is generally proportional to the supplied current; in contrast, when the heating element 10 is cooled by the thermoelectric module, the temperature of the heating element 10 is lowered to the lower limit of the temperature. Then, the power supply unit 31 cuts off the power supply to the thermoelectric module 20, and causes the thermoelectric module 20 to stop cooling the heating element 10 correspondingly. At this time, the thermoelectric module 20 generates a current phenomenon by using a temperature difference, and the heat is generated. Component 1 The heat generated by the operation is converted into electric energy, and the electric energy module 20 is electrically connected to the energy storage unit 32 of the power module 30 to store electric energy in the energy storage unit 32 (refer to the third The thick arrow shown in the figure flows, so that the "waste heat" generated by the heating element 10 can also become the source of the electric π 110490 200923626; for example, if the power is off, it is independent of the energy storage unit 32. The stored electrical energy can also be used for emergency lighting; if the power supply unit 31 is powered normally and the energy storage unit 32 is in charge saturation state, the electric energy collection can be converted to other uses; The heat generated during the operation can also be converted into electric energy through the thermoelectric module 20, so as to relatively improve the energy use efficiency, and the power consumption of the power module 30 can be effectively controlled. In addition, the temperature difference between the cold guide plate and the heat guide plate in the thermoelectric module 20 can be monitored through the control module 40, so as to prevent the current from being greater than the allowable value of the thermoelectric module 20, and the cooling effect can no longer be provided. The generated current can be calculated from the temperature difference between the cold guide plate and the heat guide plate in the thermoelectric module 20. At the same time, referring to FIG. 4, it is a flowchart for explaining the operation of the heat dissipation control method of the present invention, which mainly presets a temperature value, and contacts the heating element and a thermoelectric module, and senses the heating element. a temperature; when the operating temperature of the heating element is higher than a preset temperature value, causing the thermoelectric module to cool the heating element; and when the operating temperature of the heating element is lower than a pre-set temperature value, the thermoelectric mode is The heat generated by the actuation of the heating element is converted into electrical energy. As shown in the figure, in step S1, a temperature upper limit value and a temperature lower limit value are preset in the control module 40, wherein the temperature upper limit value is less than a critical temperature value that causes the heat generating component 10 to be damaged (Critical) Temperature ), and the thermoelectric module 20 and the heat generating component 10 are brought into contact with each other, and then proceeds to step S2. In step S2, when the heating element 10 starts to generate heat, the temperature of the heating element 10 is sensed by the control module 40, and the thermoelectric module 12 110490 200923626 20 picks up the 'heating element' C. The swaying-difference is converted into electric energy and stored in the storage 兀 32'. Then, the process proceeds to step S3. In step S3, the heating element is judged by the m: order of JJR rfo r^-10. If the value is greater than the upper temperature limit, if yes, go to step S4, right if no, repeat step S2. (4) T step knows S4' when the heating element 1 () is activated at a temperature greater than the temperature, the value =, by the dragon The group 4 sends out a _th temperature signal to make the power supply early/moving (four) electrical module 2M to start cooling the heating element 1 〇 'and then proceeds to step § 5. Item I.?:: %' is by a comparison judgment program determines whether the heating element # dynamic temperature is lower than the temperature lower limit value, and is, proceeds to step 'right no' to repeat step S5. In step S6, when the heating element 1〇 temperature is lowered to the lower temperature limit =, by the control module 4. Sensing - the second temperature signal causes the thermoelectric module to stop cooling the heat 1 件, and the heat generated by the heating element is converted into electric energy and stored in the energy storage unit 32, and returns to step S2. # Since the reading module 4G and the thermoelectric module 2() are back By controlling one, the control module 4 can relatively correct the frequency response of the first temperature signal 盥th temperature signal to ensure that the temperature of the heating element 1 趋 tends to be. The safe operating temperature in the range of the limit value can achieve good heat dissipation efficiency, and the thermoelectric module 20 can be relatively extended in the driving mode, so that the thermoelectric module can be relatively extended. 110490 13 200923626 The invention provides a heat dissipation control system and a heat dissipation control method thereof, which mainly contacts a heating element and a heating element, and senses the temperature of the heating element by a control module, and transmits and presets a temperature value. Comparing the temperature of the sensed heating element. When the heating element operating temperature rises to a preset temperature value, the thermoelectric mold is caused to start cooling the heating element, when the heating element temperature is lower than a preset temperature value. ,make The thermoelectric module generates the entanglement of the heating element (^ into electrical energy storage without cooling work, compared with the prior art 2 'this case can relatively improve the energy use efficiency and heat dissipation effect of the heating element' Extending the service life of the heating element. Furthermore, since the operating temperature of the heating element in the present invention is not in the range of the Queen, the thermoelectric module adopts the thermoelectric power generation mode to convert the heat into usable power and store it. When the heating element is "pre-set, the warning temperature of the value, the driving of the thermoelectric module is carried out:, the dish can be maintained at a certain operating temperature to prevent the fan from being heated. The above embodiment is merely exemplified The principles and effects of the invention are described and/or are used to limit the invention. Anyone skilled in the art can make the above embodiments in the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as described later.
摩巳圍所列。 T月兮；f J 【圖式簡單說明】 第1圖係顯示本發明散熱控制系統之基本架構方塊 110490 14 200923626 示意圖’； 第2圖係顯示本發明散熱控制系統於發熱元件之溫 度大於溫度上限值之熱流方向示意圖； 第3圖係顯示本發明散熱控制系統於發熱元件之溫 ' 度小於溫度下限值之熱、電流方向示意圖；以及 第4圖係顯示本發明散熱控制方法之作動流程圖。 【主要元件符號說明】 10 發熱元件 20 熱電模組 30 電源模組 31 供電單元 32 儲能單元 40 控制模組 S1-S5 步驟 15 110490Listed in Capricorn. T 兮 f; f J [Simple diagram of the diagram] Figure 1 shows the basic architecture of the heat dissipation control system of the present invention 110490 14 200923626 schematic diagram; Figure 2 shows the heat dissipation control system of the present invention at the temperature of the heating element is greater than the temperature Schematic diagram of the heat flow direction of the limit; FIG. 3 is a schematic diagram showing the heat and current directions of the heat-dissipating control system of the present invention in which the temperature of the heating element is less than the lower limit of the temperature; and FIG. 4 shows the operation flow of the heat-dissipating control method of the present invention. Figure. [Main component symbol description] 10 Heating element 20 Thermoelectric module 30 Power module 31 Power supply unit 32 Energy storage unit 40 Control module S1-S5 Step 15 110490