TWI395355B - Thermo-electric conversion module - Google Patents

Description

Thermoelectric conversion module

The present invention relates to a thermoelectric conversion module, and more particularly to a thermoelectric conversion module using a refrigerator and a thermoelectric generator.

At present, refrigerators have been widely used in aircraft or space capsules in the aerospace industry, as well as in consumer products such as chillers, small refrigerators, car heating and cooling cushions or pet warm and cold mattresses in daily life. In 1834, the Peltier Effect published by French watchmaker Jean Charles Athanase Peltier stated that the Peltier effect is used to explain a physical phenomenon in which a current can produce a temperature difference. Please refer to the first figure, which is a schematic diagram of the internal structure and mode of operation of the refrigerator. As shown in the first figure, the refrigerator 1 includes a first insulator 11, a second insulator 12, a plurality of N-type semiconductors 13, a plurality of P-type semiconductors 14, and a plurality of metal conductors 15. The material of the first insulator 11 and the second insulator 12 is a heat conductive material, wherein the first insulator 11 is connected to a heat source, such as the CPU chip 101, and the second insulator 12 is connected to a heat sink 102 for discharging heat to the refrigerator. 1. Each of the N-type semiconductors 13 and the P-type semiconductors 14 is made of a semiconductor material, such as a bismuth telluride, and is made of a thermocouple having a joint end connected to the metal conductor 15 and arranged in a staggered arrangement to form an electrical coupling pair. The first insulator 11 and the second insulator 12 are respectively connected to the corresponding metal conductors 15. When the circuit is electrically connected to the DC power source, the current I supplied by the DC power source 10 will flow from the N-type semiconductor 13 to the P-type. The junction end of the semiconductor 14 absorbs heat of the first insulator 11 to make the first insulator 11 the opposite cold end (T _C ), and conversely, when the current I flows from the P-type semiconductor 14 to the joint end of the N-type semiconductor 13 Then, the heat is released to the second insulator 12, and the second insulator 12 becomes the opposite hot end (T _H ), so that heat can be transferred from the first insulator 11 to the second insulator 12 to achieve heat transfer. The heat absorption or heat release of the insulator of the refrigerator 1 is determined by the direction of the current I, and the energy of the heat absorption and heat release is determined by the magnitude of the current I.

It can be seen from the above that when the refrigerator is powered by the DC power source, the first insulator absorbs the heat of the heat source to lower the temperature of the heat source, and the first insulator becomes the cold end, and transfers the heat to the second insulator according to the Peltier effect. And the second insulator is made into a hot end, thereby causing a cold and hot temperature difference at both ends of the refrigerator. Moreover, the heat is conducted away from the refrigerator through the heat dissipating device disposed on the second insulator to achieve the purpose of maintaining the temperature difference between the two ends of the refrigerator. In addition, due to the general refrigerator product, the maximum temperature difference (ΔT _max ) can reach 62 ° C, and when the temperature difference between the hot and cold ends is too large or the temperature of the hot end is too high, the refrigerator will collapse. It plays an indispensable role in the application of the refrigerator. However, according to the current design and application, the heat sink of the refrigerator needs to be adjusted according to the strength of the heat source, and an additional fan is needed to help dissipate heat. Therefore, additional power consumption is required, and usually the heat sink has rigidity, large volume, space occupation, and heavy weight loss, thereby causing limitations in the application range of the refrigerator.

The purpose of the present invention is to provide a thermoelectric conversion module that replaces the heat sink of the hot end of the refrigeration unit with a thermoelectric power generation unit for generating a current (according to a Seeb Effect) of the temperature difference across the thermoelectric power generation unit. In turn, the purpose of reducing the temperature of the hot end of the refrigeration unit and dissipating heat is achieved, and waste heat generation can be utilized, and the conventional cooling unit needs to be equipped with a heat dissipating device to derive a large volume, occupy space, heavy weight and limited application.

In order to achieve the above object, a broader embodiment of the present invention provides a thermoelectric conversion module including: a first insulating heat conductor; a second insulating heat conductor; and a cooling unit having a first surface and a second surface, respectively Attached to the first insulating heat conductor and the second insulating heat conductor; the thermoelectric power generation unit has a first surface and a second surface respectively attached to the first insulating heat conductor and the second insulating heat conductor; and a rectifying unit, electrical Connected to the refrigeration unit and the thermoelectric power generation unit; wherein the refrigeration unit is electrically connected to the DC power source and is powered by the DC power source, and the refrigeration unit is firstly connected to the cold end by one of the first insulating heat conductor or the second insulating heat conductor The heat is transferred to a relatively hot end, and the first insulating heat conductor and the second insulating heat conductor generate a temperature difference, and the temperature difference causes the temperature difference power generating unit to return the second heat to the relatively cold end by the opposite hot end, wherein The second heat is less than or equal to the first heat, and the thermoelectric power generating unit generates a current to the refrigeration unit to form a thermoelectric cycle.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and illustration are in the nature of

Please refer to FIG. 2A, which is a schematic diagram of a thermoelectric conversion module according to a first preferred embodiment of the present invention. As shown in FIG. A, the thermoelectric conversion module 2 includes a first insulating heat conductor 21, a second insulating heat conductor 22, a cooling unit 23, a thermoelectric power generation unit 24, and a rectifying unit 25. The cooling unit 23 has a first surface 231 and a second surface 232 which are respectively attached to the first insulating heat conductor 21 and the second insulating heat conductor 22. The thermoelectric power generation unit 24 has a first surface 241 and a second surface 242 which are also attached to the first insulating heat conductor 21 and the second insulating heat conductor 22, respectively. The rectifying unit 25 is electrically connected to the refrigerating unit 23 and the thermoelectric power generating unit 24. In the present embodiment, the cooling unit 23 is electrically connected to the DC power source 20 and is powered by the DC power source 20. The cooling unit 23 is opposite to the cold end of the first insulating heat conductor 21 or the second insulating heat conductor 22 (T _C ) transmitting the first heat H ₁ to a relatively hot end (T _H ), and causing the first insulating heat conductor 21 and the second insulating heat conductor 22 to generate a temperature difference ΔT, and the temperature difference ΔT causes the temperature difference power generating unit 24 The second heat H _{2 is} returned from the opposite hot end (T _H ) to the relatively cold end (T _C ), wherein the second heat H _{2 is} less than or equal to the first heat H ₁ , and the thermoelectric power generation unit 24 generates a current I ₁ to The unit 23 is cooled to form a thermoelectric cycle.

In some embodiments, when the cooling unit 23 is electrically connected to the DC power source 20 and is powered by the DC power source 20, the refrigeration unit 23 will transfer the first heat H ₁ to the second insulation heat conductor by the first insulating heat conductor 21. 22, so that the first insulating heat conductor 21 and the second insulating heat conductor 22 generate a temperature difference ΔT, wherein the first insulating heat conductor 21 and the second insulating heat conductor 22 are opposite cold ends and opposite hot ends, respectively. In addition, since the first surface 241 and the second surface 242 of the thermoelectric power generation unit 24 are respectively attached to the first insulating heat conductor 21 and the second insulating heat conductor 22, the thermoelectric power generation unit 24 can serve as a heat sink for the cooling unit 23. The temperature difference ΔT causes the thermoelectric power generation unit 24 to return the second heat H ₂ to the first insulating heat conductor 21 by the second insulating heat conductor 22, wherein the second heat H _{2 is} less than or equal to the first heat H ₁ , When the thermoelectric power generation unit 23 generates a current I ₂ by using a part of the second heat H ₂ and transmits it to the refrigeration unit 23 through the rectifying unit 25, the remaining heat, that is, the third heat H ₃ , is returned to the first insulation. heat conductor 21, wherein the third heat is less than the second heat H ₃ H _2, thus forming a thermoelectric cycle.

The cooling unit 23 can transfer the first heat H ₁ to the second insulating heat conductor 22 from the first insulating heat conductor 21 due to the external power source. Therefore, the first insulating heat conductor 21 receives the third heat H ₃ flowing back. The insufficient heat can be further obtained from the outside, for example, the fourth heat H ₄ (ie, H ₄ =H ₁ -H ₃ ), so that the thermoelectric conversion module 2 can be applied to reduce the adhesion to the first insulating heat conductor 21. The temperature of or around it. In this embodiment, the material of the first insulating heat conductor 21 and the second insulating heat conductor 22 is an insulating and heat conductive material, such as a ceramic material, but is not limited thereto.

Please refer to the second figure B and cooperate with the second figure A, wherein the second figure B is a schematic diagram of the internal structure and mode of action of the second figure A of the present case. As shown in the second FIGS. A and B, in the present embodiment, the cooling unit 23 includes a first semiconductor 233, such as a P-type semiconductor, and a second semiconductor 234, such as an N-type semiconductor, each having a first connection end 233a. 234a and the second connecting end 233b, 234b, and the first semiconductor 233 and the second semiconductor 234 are respectively disposed between the first insulating heat conductor 21 and the second insulating heat conductor 22; the first conductive element 235 is connected to the first semiconductor a first connecting end 233a of 233 and attached to the first insulating heat conductor 21; a second conductive element 236 connected to the first connecting end 234a of the second semiconductor 234 and attached to the first insulating heat conductor 21; and a third conductive The components 237 are respectively connected to the second connection end 233b of the first semiconductor 233 and the second connection end 234b of the second semiconductor 234, so that the first semiconductor 233 and the second semiconductor 234 are electrically coupled to each other and attached to the second Insulating heat conductor 22.

The thermoelectric power generation unit 24 includes a third semiconductor 243, such as a P-type semiconductor, and a fourth semiconductor 244, such as an N-type semiconductor, having first connection ends 243a, 244a and second connection ends 243b, 244b, respectively, and a third semiconductor 243. The fourth semiconductor 244 is disposed between the first insulating heat conductor 21 and the second insulating heat conductor 22, respectively. The fourth conductive element 245 is connected to the first connecting end 243a of the third semiconductor 243 and attached to the first insulating heat conductor 21; the fifth conductive element 246 is connected to the first connecting end 244a of the fourth semiconductor 244 and attached. The first insulating heat conductor 21; and the sixth conductive element 247 are respectively connected to the second connecting end 243b of the third semiconductor 243 and the second connecting end 244b of the fourth semiconductor 244, so that the third semiconductor 243 and the fourth semiconductor 244 It is connected as an electric coupling pair and attached to the second insulating heat conductor 22.

The rectifying unit 25 includes a first diode D ₁ having a first input pin V ₁₁ and a first output pin V ₁₂ , wherein the first input pin V ₁₁ (connecting the first diode D the positive terminal ₁₎ is connected via a lead L of a thermoelectric power generation unit of the second pin 24246 '(fifth conductive connecting element 246), a first output pin and the V ₁₂ (connected to the negative first terminal of _a diode D Connected to the first pin 235' of the refrigeration unit 23 via the wire L (connecting the first conductive element 235). In the present embodiment, the P-type and N-type semiconductor materials may be bismuth telluride, but not limited thereto.

Referring to FIG. 24 again, when the cooling unit 23 is electrically connected to the DC power source 20, for example, the first pin 235' is connected to the positive electrode (+) of the DC power source 20 via the wire L, and the second pin 236' is connected via the wire L. The wire L is connected to the negative electrode (-) of the DC power source 20 to form a current loop, that is, the current I ₁ flows out from the positive electrode (+) of the DC power source 20, flows into the first conductive element 235 via the wire L, and flows sequentially. The first semiconductor 233, the third conductive element 237, the second semiconductor 234, and the second conductive element 236 are finally returned to the negative electrode (-) of the DC power source 20 via the wire L to form a current loop. Peltier effect, a first current I ₁ through the semiconductor 233 (i.e. P-type semiconductor) semiconductor 234 to the second (i.e., N-type semiconductor) will release heat according to the first insulating heat conductor 21 of the first heat H ₁ is transferred to the second insulating heat conductor 22 via the cooling unit 23, thereby making the first insulating heat conductor 21 a relatively cold end (temperature T _C ), and making the second insulating heat conductor 22 a relatively hot end (temperature T _H ), in turn, causes the first insulating heat conductor 21 and the second insulating heat conductor 22 to generate a temperature difference ΔT. Furthermore, according to the Seebeck effect, when the temperature difference ΔT causes the thermoelectric power generation unit 24 to return the second heat H _{2 of the} second insulating heat conductor 22 to the first insulating heat conductor 21, the thermoelectric power generation unit 23 will partially The second heat H _{2 is} converted into electric energy, that is, a current I ₂ is generated, and flows into the rectifying unit 25 through the first input pin V ₁₁ , is rectified by the rectifying unit 25 , and flows out and flows in from the first output pin V _{12 .} 23, the remaining heat refrigeration unit, i.e. the third heat H _3, then returned to the first heat-conducting insulating member 21, wherein the third heat is less than the second heat H ₃ H _2, to form a thermoelectric cycle. In the present embodiment, the third semiconductor 243 of the thermoelectric power generation unit 24 (that is, the P-type semiconductor) has a majority carrier which is a positively charged hole, and a majority of the fourth semiconductor 244 (ie, an N-type semiconductor) The sub-negative electrons are such that the temperature difference ΔT causes the first surface 241 of the thermoelectric power generation unit 24 and the second surface 242 to generate a terminal voltage having a positive polarity.

In some embodiments, the polarity of the DC power supply 20 is electrically connected to the cooling unit 23, for example, the first pin 235' (connecting the first conductive element 235) is connected to the negative electrode (-) of the DC power source 20 via the wire L. The second pin 236 ′ (connecting the second conductive element 236 ) is connected to the positive electrode (+) of the DC power source 20 via the wire L, so that the cold and hot ends of the cooling unit 23 can be interchanged and the temperature difference ΔT can make the temperature difference power generating unit 24 The first surface 241 and the second surface 242 generate a terminal voltage having a negative polarity. In some embodiments, the first semiconductor 233 and the third semiconductor 243 of the cooling unit 23 and the thermoelectric power generation unit 24 may be N-type semiconductors, and the second semiconductor 234 and the fourth semiconductor 244 may be P-type semiconductors, but This is limited. When the cooling unit 23 is electrically connected to the DC power source 20, the first insulating heat conductor 21 forms a relatively hot end (T _H ) and the second insulating heat conductor 22 forms a relatively cold end (T _C ), and the remaining respective operations The principle is similar and will not be described here.

Please refer to the third figure, which is a schematic diagram of the internal structure and function mode of the thermoelectric conversion module according to the second preferred embodiment of the present invention. As shown in the third figure, the main structure of the thermoelectric conversion module 3 of the present embodiment is substantially the same as that of the first embodiment. In the present embodiment, the cooling unit 33 includes a plurality of first semiconductors 333, such as P-type semiconductors, and a plurality of second semiconductors 334, such as N-type semiconductors, which are arranged in a staggered arrangement and connected to a plurality of pairs of electrical couplings. . The thermoelectric power generation unit 34 includes a plurality of third semiconductors 343, such as a P-type semiconductor, and a plurality of fourth semiconductors 344, such as N-type semiconductors, which are also arranged in a staggered arrangement and connected to a plurality of pairs of electrical couplings. The rectifying unit 35 includes a plurality of diodes, such as a first diode D ₁ and a second diode D ₂ , and a plurality of step-controlled rectifiers, such as a first step-controlled rectifier SCR ₁ and a second step-controlled rectifier SCR ₂ The plurality of diodes and the plurality of step-controlled rectifiers are electrically connected to each other, so that the rectifying unit 35 forms the first input pin V ₁₁ , the second input pin V ₂₁ , the first output pin V _{12 ,} and the first two output pin V _22, wherein the first input pin V ₁₁ and a thermoelectric power generation unit 34, the second pin 346 'is electrically connected; V ₂₁ a second input pin and a thermoelectric power generation unit 34, the first pin 345 'Electrically connected; the first output pin V _{12 is} electrically connected to the first pin 335 ′ of the cooling unit 33 ; and the second output pin V ₂₂ and the second pin 336 ′ of the cooling unit 33 are electrically connected Connection, which is used to achieve the function of rectification.

When the cooling unit 33 is electrically connected to the DC power source 30, for example, the first pin 335' is electrically connected to the positive electrode (+) of the DC power source 30, and the second pin 336' is electrically connected to the negative electrode (-) of the DC power source 30. According to the Peltier effect, a temperature difference ΔT is generated at both ends of the cooling unit 33, and according to the Seebeck effect, the temperature difference ΔT causes the thermoelectric power generation unit 34 to generate a current I ₃ , which is rectified by the rectifying unit 35 and flows in. The refrigeration unit 33 forms a thermoelectric cycle to further achieve heat transfer, reduce the temperature difference ΔT across the refrigeration unit 33, and dissipate heat from the refrigeration unit 33.

Please refer to the second figure. According to the concept of the present invention, the thermoelectric conversion module 2 of the present invention can be applied to, for example, a car seat cushion, a cold and warm mattress, and the like, and is not limited thereto. When the thermoelectric conversion module 2 of the present invention is applied to a car seat cushion, since the hot end (temperature is T _H ) of the refrigeration unit 23 does not need to use a rigid heat sink for heat dissipation, instead of the thermoelectric power generation unit 24, in addition to The thermoelectric conversion module 2 is smaller in size and wider in application, and can also utilize waste heat to generate power for providing the power of the refrigeration unit 23. In addition, although some of the residual heat is returned to the first insulating heat conductor 21, the efficiency of the refrigeration unit 23 is slightly lowered, but the function of the cooling unit 23 to lower the temperature of the relatively cold end (T _C ) can be maintained. The temperature can be lowered or warmed up in the environment where the attached object or the cold end is located without the need for an external fan to assist in heat dissipation.

In some embodiments, the internal structure of any of the existing or to be invented refrigeration unit 33 or thermoelectric power generation unit 34 and the principles of its operation can be incorporated herein by reference.

In summary, the thermoelectric conversion module of the present invention replaces the heat dissipation device of the hot end of the refrigeration unit with a thermoelectric power generation unit, so as to generate a current (according to the Seebeck effect) of the temperature difference between the two ends of the thermoelectric power generation unit, thereby achieving a reduction in refrigeration. The temperature difference between the two ends of the unit and the temperature of the hot end and the purpose of heat dissipation can also utilize waste heat to generate electricity, and solve the problem that the conventional cooling unit needs to be equipped with a heat dissipating device to derive a large volume, occupy space, heavy weight and limited application. In addition, since no external fan is used to assist heat dissipation, no additional power consumption is required, thereby saving power and material costs.

The present invention has been described in detail by the above-described embodiments, and may be modified by those skilled in the art, without departing from the scope of the appended claims.

1‧‧‧ refrigerator
10, 20, 30‧‧‧ DC power supply
101‧‧‧CPU chip
102‧‧‧heating device
11‧‧‧First insulator
12‧‧‧Second insulator
13‧‧‧N-type semiconductor
14‧‧‧P-type semiconductor
15‧‧‧Metal conductor
2, 3‧‧‧ thermoelectric conversion module
21‧‧‧First insulated thermal conductor
22‧‧‧Second Insulation Thermal Conductor
23, 33‧‧‧ Refrigeration unit
231‧‧‧ first surface of the cooling unit
232‧‧‧Second surface of the cooling unit
233, 333‧‧‧ First Semiconductor
233a‧‧‧ First connection of the first semiconductor
233b‧‧‧Second junction of the first semiconductor
234, 334‧‧‧second semiconductor
234a‧‧‧ First connection of the second semiconductor
234b‧‧‧Second junction of the second semiconductor
235‧‧‧First conductive element
235'‧‧‧First pin of the cooling unit
236‧‧‧Second conductive element
236'‧‧‧Second pin of the cooling unit
237‧‧‧ Third conductive element
24, 34‧‧‧ thermoelectric power generation unit
241‧‧‧ first surface of the thermoelectric unit
242‧‧‧ second surface of the thermoelectric unit
243, 343‧‧ Third semiconductor
243a‧‧‧ the first link of the third semiconductor
243b‧‧‧Second junction of the third semiconductor
244, 344‧‧‧ fourth semiconductor
244a‧‧‧The first link of the fourth semiconductor
244b‧‧‧Second junction of the fourth semiconductor
245‧‧‧fourth conductive element
246‧‧‧ fifth conductive element
246'‧‧‧second pin of thermoelectric unit
247‧‧‧ sixth conductive element
25, 35‧‧‧Rectifier unit
335'‧‧‧First pin of the cooling unit
336'‧‧‧second pin of the cooling unit
The first pin of the 345'‧‧‧ thermoelectric unit
346'‧‧‧Second pin of thermoelectric unit
I, I ₁ ~I ₃ ‧‧‧ Current
D ₁ ‧‧‧First Diode
D ₂ ‧‧‧Secondary
SCR ₁ ‧‧‧First Voltage Controlled Rectifier
SCR ₂ ‧‧‧Second voltage controlled rectifier
H- ₁ ‧‧‧First heat
H- ₂ ‧‧‧second heat
H- ₃ ‧‧‧third heat
H- ₄ ‧‧‧ fourth heat
V- ₁₁ ‧‧‧First Input Pin
V- ₁₂ ‧‧‧First output pin
V- ₂₁ ‧‧‧Second input pin
V- ₂₂ ‧‧‧Second output pin
T _H ‧‧‧ hot end
T _C ‧‧‧Cold end ΔT‧‧‧temperature difference
L‧‧‧ wire

The first picture: is a schematic diagram of the internal structure and mode of operation of the refrigerator.

FIG. 2 is a schematic diagram of a thermoelectric conversion module according to a first preferred embodiment of the present invention.

Figure B: This is a schematic diagram of the internal structure and mode of operation of Figure II of this case.

The third figure is a schematic diagram of the internal structure and mode of operation of the thermoelectric conversion module of the second preferred embodiment of the present invention.

2‧‧‧Thermal conversion module

20‧‧‧DC power supply

21‧‧‧First insulated thermal conductor

22‧‧‧Second Insulation Thermal Conductor

23‧‧‧ Refrigeration unit

231‧‧‧ first surface of the cooling unit

232‧‧‧Second surface of the cooling unit

24‧‧‧ thermoelectric power unit

241‧‧‧ first surface of the thermoelectric unit

242‧‧‧ second surface of the thermoelectric unit

25‧‧‧Rectifier unit

I ₂ ‧‧‧current

H- ₁ ‧‧‧First heat

H- ₂ ‧‧‧second heat

H- ₃ ‧‧‧third heat

H- ₄ ‧‧‧ fourth heat

T _H ‧‧‧ hot end

T _C ‧‧‧ cold end

△T‧‧‧temperature difference

Claims (16)

A thermoelectric conversion module comprising:
a first insulating heat conductor;
a second insulating heat conductor;
a uniform cooling unit having a first surface and a second surface, respectively attached to the first insulating heat conductor and the second insulating heat conductor;
a thermoelectric power generation unit having a first surface and a second surface respectively attached to the first insulating heat conductor and the second insulating heat conductor; and a rectifying unit electrically connected to the cooling unit And the thermoelectric power generation unit;
The cooling unit is electrically connected to and supplied by the DC power source, and the cooling unit transmits a first heat to the opposite end of the first insulating heat conductor or the second insulating heat conductor. a temperature difference between the first insulating heat conductor and the second insulating heat conductor, and the temperature difference causes the temperature difference power generating unit to return a second heat to the opposite cold end by the opposite hot end, The second heat is less than or equal to the first heat, and the temperature difference power generating unit generates a current to the refrigeration unit to form a thermoelectric cycle. The thermoelectric conversion module of claim 1, wherein the first insulating heat conductor and the second insulating heat conduction system are opposite cold ends and opposite hot ends or opposite hot ends and opposite cold ends, respectively. The thermoelectric conversion module according to claim 1, wherein the thermoelectric power generation unit is used as a heat dissipation device of the refrigeration unit. The thermoelectric conversion module of claim 1, wherein the thermoelectric power generation unit generates the current by using the second heat, and transmits the current to the refrigeration unit through the rectifying unit, and the remaining heat is formed. a third heat is returned to the first insulated heat conductor, wherein the third heat is less than the second heat. The thermoelectric conversion module of claim 4, wherein the first insulating heat conduction system obtains a fourth heat from the outside, and the magnitude of the fourth heat is a difference between the first heat and the third heat The value is used to apply the thermoelectric conversion module to reduce the temperature of the appendage of the first insulating heat conductor or the environment surrounding the first insulating heat conductor. The thermoelectric conversion module of claim 1, wherein the refrigeration unit comprises:
a first semiconductor and a second semiconductor respectively having a first connecting end and a second connecting end, and the first semiconductor and the second semiconductor are respectively disposed on the first insulating heat conductor and the second Between insulated heat conductors;
a first conductive element is connected to the first connecting end of the first semiconductor and attached to the first insulating heat conductor;
a second conductive element is connected to the first connection end of the second semiconductor and attached to the first insulating heat conductor; and a third conductive element is respectively connected to the second connection of the first semiconductor The second connecting end of the second semiconductor and the second semiconductor are connected to form an electrical coupling pair, and the third conductive element is attached to the second insulating heat conductor. The thermoelectric conversion module according to claim 6, wherein the first semiconductor is a P-type semiconductor or an N-type semiconductor, and the second semiconductor is an N-type semiconductor or a P-type semiconductor opposite to the first semiconductor. The thermoelectric conversion module of claim 6, wherein the refrigeration unit comprises a plurality of first semiconductors and a plurality of second semiconductors, which are respectively arranged in a staggered manner and connected to a plurality of electrical coupling pairs. The thermoelectric conversion module of claim 1, wherein the thermoelectric power generation unit comprises:
a third semiconductor and a fourth semiconductor respectively having a first connecting end and a second connecting end, and the third semiconductor and the fourth semiconductor system are respectively disposed on the first insulating heat conductor and the second Between insulated heat conductors;
a fourth conductive element is connected to the first connecting end of the third semiconductor and attached to the first insulating heat conductor;
a fifth conductive element is connected to the first connection end of the fourth semiconductor and attached to the first insulating heat conductor; and a sixth conductive element is respectively connected to the second connection of the third semiconductor The second connecting end of the fourth semiconductor and the fourth semiconductor are connected to form an electrical coupling pair, and the sixth conductive element is attached to the second insulating heat conductor. The thermoelectric conversion module according to claim 9, wherein the third semiconductor is a P-type semiconductor or an N-type semiconductor, and the fourth semiconductor is an N-type semiconductor or a P-type semiconductor opposite to the third semiconductor. The thermoelectric conversion module of claim 9, wherein the thermoelectric power generation unit comprises a plurality of third semiconductors and a plurality of fourth semiconductors, which are respectively arranged in a staggered manner and connected to a plurality of electrical coupling pairs. The thermoelectric conversion module of claim 1, wherein the rectifying unit comprises a first diode and the rectifying unit has:
a first input pin is connected to the positive end of the first diode; and a first output pin is connected to the negative end of the first diode;
The first input pin is connected to one second pin of the thermoelectric power generation unit via a wire, and the first output pin is connected to one of the first pin of the refrigeration unit via another wire. The thermoelectric conversion module of claim 1, wherein the rectifying unit comprises a plurality of diodes and a plurality of step-controlled rectifiers, and the rectifying unit has: a first input pin and a second input port a first output pin and a second output pin, wherein the first input pin is electrically connected to a second pin of the thermoelectric power generation unit; the second input pin and the thermoelectric power generation unit One of the first pins is electrically connected to the first pin of the cooling unit; and the second pin of the second output pin and the second unit of the cooling unit is electrically connected Sexual connection, which is used to achieve the function of rectification. The thermoelectric conversion module of claim 1, wherein the first pin of the refrigeration unit is connected to one of the DC power sources via a wire, and the second pin of the cooling unit is connected to the second pin via the other The wire is connected to one of the negative poles of the DC power source to form a current loop, and the temperature difference causes the first surface of the thermoelectric power generation unit and the second surface to generate a positive terminal voltage. The thermoelectric conversion module of claim 1, wherein the first pin of the refrigeration unit is connected to one of the DC power sources via a wire, and the second pin of the refrigeration unit is connected to the second pin via the other The wire is connected to one of the positive poles of the DC power source to form a current loop, and the temperature difference causes the first surface of the thermoelectric power generation unit and the second surface to generate a negative terminal voltage. A thermoelectric conversion module comprising:
a first insulating heat conductor;
a second insulating heat conductor;
a uniform cooling unit having a first surface and a second surface, respectively attached to the first insulating heat conductor and the second insulating heat conductor;
a thermoelectric power generation unit having a first surface and a second surface respectively attached to the first insulating heat conductor and the second insulating heat conductor; and a rectifying unit electrically connected to the cooling unit And the thermoelectric power generation unit;
The cooling unit is electrically connected to the power source and is powered by the DC power source. The cooling unit transmits a first heat to the second heat conductor by the first insulating heat conductor, so that the first insulation conducts heat. a temperature difference is generated between the body and the second insulating heat conductor, and the temperature difference causes the temperature difference power generating unit to return a second heat to the first heat insulating body by the second insulating heat conductor, wherein the second heat is less than or equal to The first heat, and the thermoelectric power generation unit generates a current to the refrigeration unit to form a thermoelectric cycle.