TWM546022U - Thermal-electric conversion fluid pipe - Google Patents

Description

Thermoelectric conversion fluid line

This creation is about thermoelectric conversion, especially a thermoelectric conversion fluid line that generates electricity by the water temperature difference of the water supply line.

A thermoelectric module device is an element having a mutual conversion characteristic between heat and electricity. Due to its thermoelectric conversion characteristics, it has two fields of application of refrigeration heating and power generation. If the thermoelectric conversion element is energized to cause endothermic and exothermic phenomena at both ends of the element, it can be applied to the technical field of refrigeration or heating. If the two ends of the thermoelectric conversion element are respectively at different temperatures, the thermoelectric conversion element can output direct current, and thus can be applied to the field of power generation technology.

Although the principle of electric heating or cooling is the same as that of thermoelectric power generation, it is relatively easy to load a stable power supply to achieve a stable heating or cooling effect on the thermoelectric conversion element; a stable temperature difference is applied to the thermoelectric conversion element to generate a stable current. The output is relatively difficult. Therefore, the current thermoelectric conversion technology is still difficult to apply to actual power supply.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

The present invention provides a thermoelectric conversion fluid line that generates electricity by the water temperature difference of the water supply line.

The present invention provides a thermoelectric conversion fluid line comprising a first tube body, a second tube body and a thermoelectric wafer. A hot runner is formed in the first tube body; a cold runner is formed in the second tube body. The thermoelectric wafer is disposed between the first tube body and the second tube body, and the two sides of the thermoelectric wafer are respectively thermally connected to the hot runner and the cold runner.

In the thermoelectric conversion fluid pipeline of the present invention, the diameter of the first pipe body is smaller than the pipe diameter of the second pipe body. The cross-sectional area of the hot runner is smaller than the cross-sectional area of the cold runner. The first tube body and the second tube body are arranged side by side and the thermoelectric wafer is sandwiched between the first tube body and the second tube body. The first tube body can also be disposed within the second tube body.

The thermoelectric conversion fluid pipeline of the present invention further comprises another second tube body and another thermoelectric wafer, the first tube body is sandwiched between the pair of second tube bodies, and each thermoelectric wafer is respectively sandwiched between the second tubes Between the pipe body and the first pipe body. A plurality of thermoelectric wafers are disposed between the first tube body and the second tube body, and the hot runners and the cold runners are thermally connected to the two sides of each of the thermoelectric wafers. A thermoelectric conversion fluid line, wherein the thermoelectric wafers are electrically connected to each other. The thermoelectric wafer includes a pair of thermally conductive substrates and a thermoelectric conversion unit sandwiched between the pair of thermally conductive substrates. The surface of each of the thermally conductive substrates is covered with a type of drilled carbon layer to which the thermoelectric conversion unit is attached.

In the thermoelectric conversion fluid pipeline of the present invention, the hot runner heating fluid passes through, and the cold runner supplies cooling fluid, and the thermoelectric wafer generates direct current by the temperature difference between the hot fluid and the cold fluid.

In the thermoelectric conversion fluid pipeline of the present invention, the thermoelectric wafer can be electrically connected to a load or a battery or a converter for converting direct current into alternating current.

The thermoelectric conversion fluid pipeline of the present invention provides a stable heat source and a cold source through the water supply pipeline to maintain a stable temperature difference on both sides of the thermoelectric wafer, so that the thermoelectric wafer can stably generate electricity.

Referring to FIGS. 1 through 4, a preferred embodiment of the present invention provides a thermoelectric conversion fluid line including at least a first tube body 100, at least one second tube body 200, and at least one thermoelectric wafer 300.

In the present embodiment, the first tube body 100 is preferably a rectangular tube made of metal, whereby a hot runner 101 is formed around the first tube body 100. The second tube body 200 is preferably a rectangular tube made of metal, whereby a cold flow path 201 is formed inside the second tube body 200. The first pipe body 100 and the second pipe body 200 are arranged side by side. The pipe diameter of the first pipe body 100 is smaller than the pipe diameter of the second pipe body 200. Therefore, the cross-sectional area of the hot runner 101 is smaller than the cross-sectional area of the cold runner 201.

The thermoelectric wafer 300 is disposed between the first tube body 100 and the second tube body 200. In the present embodiment, the thermoelectric wafer 300 is preferably interposed between the first tube body 100 and the second tube body 200. In this embodiment, a plurality of thermoelectric wafers 300 are disposed between the first tube body 100 and the second tube body 200. The structures and functions of the thermoelectric wafers 300 are the same, and the thermoelectric wafers 300 are selectively electrically connected to each other. connection. Each of the thermoelectric wafers 300 includes a pair of thermally conductive substrates 310 and a thermoelectric conversion unit 320 sandwiched between the pair of thermally conductive substrates 310. Each of the thermally conductive substrates 310 may be a metal plate, preferably an aluminum plate, but this creation does not For example, each of the heat conductive substrates 310 may be a copper plate or a ceramic plate; the thermoelectric conversion unit 320 is preferably a semiconductor composition. The surface of each of the thermally conductive substrates 310 is covered with a diamond-Like carbon layer (not shown), and the diamond-like carbon layer is attached to the thermoelectric conversion unit 320. The diamond-like carbon heat conduction characteristics are good, and the heat transfer coefficient thereof is about 200 to 900 W/mK, so that the heat exchange efficiency between each of the heat conductive substrates 310 and the thermoelectric conversion unit 320 is good.

The thermoelectric wafer is used to change the temperature difference into a potential difference. Generally, one side of the thermoelectric wafer 300 is a hot surface for contacting the heat source, and the other side is a cold surface, and the working temperature of the cold surface is lower than the hot surface. The heat is transferred from the hot surface to the cold side. The heat-conducting substrate 310 on both sides of the thermoelectric wafer 300 is attached to the outer walls of the first pipe body 100 and the second pipe body 200, respectively, whereby the hot surface and the cold surface are thermally connected to the corresponding hot runner 101 and the cold runner 201, respectively. The hot runner 101 passes through the hot fluid 102, and the cold runner 201 passes the cold fluid 202. Therefore, the thermoelectric wafer 300 can cause a unidirectional migration of electrons in the thermoelectric wafer 300 to generate a voltage difference by the temperature difference between the hot runner 101 and the cold runner 201. The direct current is turned off; in the present embodiment, water is preferably used as the hot fluid 102 and the cold fluid 202, but the creation is not limited to water, and it may be other fluids. When the hot runner 101 exchanges heat with the hot runner 101 of the cold runner 201, the temperature of the hot fluid 103 in the hot runner 101 drops, and the temperature of the cold fluid 203 in the cold runner 201 rises, so that it is adjusted to be suitable for human contact. The water temperature can be exported for living purposes. Since the cross-sectional area of the hot runner 101 is smaller than the cross-sectional area of the cold runner 201, it is possible to prevent the temperature of the cold fluid 203 from rising too fast and the power generation of the thermoelectric wafer 300 from fluctuating too much, so that the thermoelectric wafer 300 can maintain stable power generation.

The direct current generated by the thermoelectric chip 300 can be directly supplied to the load 10, or can be converted into electric energy by the charging module 21 and stored in the battery 20, or can be converted into alternating current by the converter 31 as the commercial power 30.

The first tube body 100 and the second tube body 200 are disposed in a preferred embodiment, but the present invention is not limited thereto. For example, the first tube body 100 may also be disposed in the second tube body 200. A cold runner 201 is disposed between the second tubular body 200 and the first tubular body 100 and the cross-sectional area of the hot runner 101 is smaller than the cross-sectional area of the cold runner 201. The thermoelectric wafer 300 is attached to the outer wall of the first pipe body 100 and disposed between the first pipe body 100 and the second pipe body 200.

Referring to FIGS. 5-7, a second embodiment of the present invention provides a water supply channel thermoelectric conversion structure including a first tube body 100, a pair of second tube bodies 200, and a plurality of thermoelectric wafers 300. The configuration and function of the first tube 100, each of the second tubes 200, and each of the thermoelectric chips 300 are the same as those of the foregoing first embodiment, and details are not described herein again. The first tube body 100 is interposed between the pair of second tube bodies 200, and each thermoelectric wafer 300 is interposed between each of the second tube bodies 200 and the first tube body 100 adjacent thereto. The connection relationship and working principle of each thermoelectric wafer 300 with the first pipe body 100 and the second pipe body 200 are as in the foregoing first embodiment.

Referring to FIG. 8, the unit configuration of the thermoelectric conversion fluid line of the second embodiment of the present invention may be repeatedly stacked and extended. Therefore, it can be applied to a variety of installation spaces, such as houses, public buildings or containers.

Referring to FIG. 9, the thermoelectric conversion fluid line of the present invention provides a stable thermal fluid 102 and a cold fluid 202 by a water supply line to maintain a stable temperature difference on both sides of the thermoelectric wafer 300, so that the thermoelectric wafer 300 can stably generate electricity.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents of the present invention. Other equivalent variations of the patent spirit using the present invention are all within the scope of the patent.

10‧‧‧ load

20‧‧‧Battery

21‧‧‧Charging module

30‧‧‧Power

31‧‧‧ converter

100‧‧‧First tube

101‧‧‧ hot runner

102/103‧‧‧Hot fluid

200‧‧‧Second body

201‧‧‧Cold runner

202/203‧‧‧Cold fluid

300‧‧‧Thermal chip

310‧‧‧thermal substrate

320‧‧‧Thermal conversion unit

1 to 4 are schematic views of a thermoelectric conversion fluid line of the first embodiment of the present invention.

5 to 7 are schematic views of the thermoelectric conversion fluid line of the second embodiment of the present invention.

Fig. 8 is a schematic view showing the thermoelectric conversion fluid line of the second embodiment of the present invention.

Fig. 9 is a schematic view showing the state of use of the thermoelectric conversion fluid line of the present invention.

100‧‧‧First tube

200‧‧‧Second body

300‧‧‧Thermal chip

310‧‧‧thermal substrate

320‧‧‧Thermal conversion unit

Claims (14)

A thermoelectric conversion fluid pipeline comprising: a first tubular body having a hot runner formed therein; a second tubular body having a cold runner formed therein; and a thermoelectric wafer disposed therein The hot runner and the cold runner are thermally connected to each other between the first tube body and the second tube body and the two sides of the thermoelectric wafer. The thermoelectric conversion fluid pipeline of claim 1, wherein the diameter of the first tubular body is smaller than the diameter of the second tubular body. The thermoelectric conversion fluid line according to claim 1, wherein a cross-sectional area of the hot runner is smaller than a cross-sectional area of the cold runner. The thermoelectric conversion fluid line of claim 1, wherein the first tube body and the second tube body are juxtaposed and the thermoelectric wafer is sandwiched between the first tube body and the second tube body. The thermoelectric conversion fluid line of claim 1, wherein the first tube body is disposed within the second tube body. The thermoelectric conversion fluid pipeline of claim 1, further comprising another second tubular body and another thermoelectric wafer, the first tubular body being sandwiched between the pair of second tubular bodies, and each of the thermoelectric wafers The clamping is between each of the second tube bodies and the first tube body. The thermoelectric conversion fluid pipeline of claim 1, wherein a plurality of thermoelectric wafers are disposed between the first tubular body and the second tubular body, and the two sides of the thermoelectric wafer are respectively thermally connected to the hot runner and the cold flow Road. The thermoelectric conversion fluid line of claim 7, wherein the thermoelectric wafers are electrically connected to each other. The thermoelectric conversion fluid line of claim 1, wherein the thermoelectric wafer comprises a pair of thermally conductive substrates and a thermoelectric conversion unit sandwiched between the pair of thermally conductive substrates. The thermoelectric conversion fluid line of claim 9, wherein a surface of each of the thermally conductive substrates is covered with a type of drilled carbon layer to which the thermoelectric conversion unit is attached. The thermoelectric conversion fluid line of claim 1, wherein the hot runner heating fluid passes, the cold runner supplies a cooling fluid, and the thermoelectric wafer generates direct current by a temperature difference between the hot fluid and the cold fluid. The thermoelectric conversion fluid line of claim 1, wherein the thermoelectric chip is electrically connected to a load. The thermoelectric conversion fluid line of claim 1, wherein the thermoelectric chip is electrically connected to a battery. The thermoelectric conversion fluid line of claim 1, wherein the thermoelectric chip is electrically connected to a converter for converting direct current into alternating current.