CN205227913U

CN205227913U - Hot electric refrigeration ware

Info

Publication number: CN205227913U
Application number: CN201520951210.9U
Authority: CN
Inventors: 王赞; 王珂; 全磊; 刘雯; 吕香玲; 王炯
Original assignee: Henan University of Technology
Current assignee: Henan University of Technology
Priority date: 2015-11-25
Filing date: 2015-11-25
Publication date: 2016-05-11
Anticipated expiration: 2025-11-25

Abstract

The utility model discloses a hot electric refrigeration ware, including the electroluminescence of hot arm of semiconductor and the outer fringe body, a DC power supply connects the hot arm of semiconductor and the electroluminescence body, realizes luminous refrigeration, the 2nd DC power supply provides drive current, and current conveyance heat releasing end electrode, the hot arm of semiconductor, heat absorbing end electrode and heat releasing end electrode constitute the return circuit. The heat absorbing end and the heat absorbing end metal electrode of the hot arm of semiconductor are connected, and heat releasing end and heat releasing end metal electrode are connected, and the heat releasing end of the hot arm of semiconductor connects outside radiating metal heat sink through the heat conduction silicone grease. The utility model discloses a hot electric refrigeration ware can effectively reduce the phegmal reflux of hot bizhong phonon through using electroluminescence to absorb the phonon among the pyroelectric material to improve hot electric refrigeration ware's refrigeration efficiency.

Description

A kind of TEC

Technical field

The utility model relates to a kind of TEC, belongs to semiconductor refrigerating technology field.

Background technology

Semiconductor refrigerating, due to without the need to machine assemblies such as the compressors needed for conventional refrigeration structure, obtains certain application in the refrigerating plant of miniaturization.Semiconductor refrigerating make use of the Peltier effect of semi-conducting material, when the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, can absorb heat respectively and release heat, realize the object of refrigeration at the two ends of galvanic couple.

Compared with traditional refrigerating plant, the deficiency that semiconductor cooling device exists is that thermoelectricity conversion ratio is low, and the refrigeration temperature difference of heat absorbing end and release end of heat is less, cannot reach the refrigerating efficiency of conventional refrigeration device.In order to head it off, common mentality of designing improves the thermal conductivity of semi-conducting material hot arm.But due to thermal conductivity and the electrical conductivity positive correlation of semi-conducting material, be difficult to realize improving electrical conductivity while reduction thermal conductivity, this problem hinders the Main Bottleneck of thermoelectric cooling technological break-through.

Utility model content

For the deficiencies in the prior art, the utility model discloses a kind of TEC, use the phonon in electroluminescent absorption thermoelectric material, effectively reduce the capacity of returns of phonon in hot arm, thus improve the refrigerating efficiency of TEC.

Specifically, the utility model is achieved by the following technical solution:

A kind of TEC, comprises the electroluminor of semiconductor hot arm and its outer rim, the first dc source UNICOM semiconductor hot arm and electroluminor; The heat absorbing end of semiconductor hot arm connects heat absorbing end electrode, this heat absorbing end electrode contact waits target of freezing, the bulk storage hot junction of semiconductor hot arm connects the release end of heat electrode of UNICOM second dc source, and this release end of heat electrode connects the metal heat sink of outwards heat radiation by heat-conducting silicone grease.

Improved by said structure, the second dc source provides the energy for TEC work, drives electronics directed movement; First dc source provides power for electroluminescent generation systems, produces a bias voltage, and acceleration electronics enters luminescent layer and compound is carried out in hole, produces photon, takes away heat, realizes refrigeration.

Wherein, electroluminor used is P-N type LED.

Wherein, the voltage of the first dc source and the second dc source can realize the work of related device, and usual first direct current power source voltage is 0.1 ~ 3V, and the second direct current power source voltage is 5V ~ 10V.

In order to improve radiating efficiency, suppress drain conditions, release end of heat electrode is connected with heat conductive insulating potsherd by heat-conducting silicone grease, and heat conductive insulating potsherd is heat sink by heat-conducting silicone grease connection metal.

Under such configuration, potsherd can be good to electric insulation, keeps again good heat-sinking capability (thermal conductivity of common heat conductive insulating potsherd is 30 ~ 200W/ (m.K)) simultaneously.

In above-mentioned, metal heat sink used adopts the good metal material of heat conductivility (usually adopting aluminium or copper product) to make to have larger body surface and compares geometry.

The technical solution of the utility model, electroluminescent is utilized to freeze, phonon is absorbed at emitter stage by electronics, then at luminescent layer generation electron-hole compound release high-energy photon, by light-guide material, heat energy is derived with form of photons again, the heat realizing absorbing is greater than the clean refrigeration of the heat of generation, improves the refrigeration temperature difference of heat absorbing end and release end of heat, thus improves thermoelectric efficiency.

Accompanying drawing explanation

Fig. 1 is TEC line construction schematic diagram of the present utility model.

Fig. 2 a, 2b are the utility model TEC operation principle schematic diagram.

Detailed description of the invention

With reference to accompanying drawing 1, show the circuit structure of TEC of the present utility model, comprise semiconductor hot arm 1, the two ends of semiconductor hot arm are divided into heat absorbing end and release end of heat; Second dc source 8 provides drive current, and connected by release end of heat electrode 3, semiconductor hot arm 1 and heat absorbing end electrode 2 form loop, heat absorbing end electrode 2 absorbs heat becomes heat absorbing end, and release end of heat electrode 3 release heat is formed and puts release end of heat; Heat sink 5 to be connected with release end of heat electrode 3 and to distribute heat in outside air; In order to realize good electric insulation and heat transfer, between metal heat sink and release end of heat electrode, be provided with insulating ceramics 4 isolate, release end of heat electrode is connected by the silicone grease that heat dispersion is good with insulating ceramics, and insulating ceramics by heat dispersion good silicone grease same with metal heat sink connects.

Be electroluminor 6 in the outer rim of semiconductor hot arm, the first dc source 7 is electrically connected electroluminor and semiconductor hot arm, and its operating voltage is 0.1-3v; Second dc source 8 is communicated with the release end of heat electrode of semiconductor hot arm, and its operating voltage is 5-10v.

Wherein, dc source connects wire used is copper or aluminium matter wire.

TEC of the present utility model, the second dc source provides the energy for whole system, thus drives electronics directed movement under the effect of electrical potential difference; First dc source provides power for LED electrical photoluminescence generation systems, produces a bias voltage, and acceleration electronics enters luminescent layer and compound is carried out in hole, produces photon, takes away heat, realizes refrigeration.

Wherein, the utility model semiconductor hot arm used is made up of thermoelectric material, can select the one in PbTe, ZnSb, AgSbTe2, GeTe, CeS.

Wherein, this electroluminor is P-N type LED, under electro ultrafiltration, realize luminescence and the phonon absorbed in semiconductor hot arm, reduces capacity of returns, realizes the raising of thermoelectrical efficiency.

As shown in Fig. 2 a, 2b, show the operation principle of the utility model device, Fig. 2 a shows the state of semiconductor hot arm, thermograde is there is at its two ends, its core layer and outer shell are owing to being connected to dc source thus independently there is certain electrical potential difference, electronics discharges high-energy photon with hole at the luminescent layer recombination luminescence (i.e. exciton compound) of LED under the driving of electrical potential difference, then is derived with form of photons by heat energy by light-guide material; With reference to figure 2b, show and flow to the process of heat absorbing end at the hot-fluid of semiconductor hot arm from release end of heat, the luminescent layer of LED can produce heat-absorbing action, reduces hot-fluid thus reduces phonon capacity of returns, improving the integrally cooling efficiency of TEC.

Claims

1. a TEC, is characterized in that the electroluminor comprising semiconductor hot arm and its outer rim, the first dc source UNICOM semiconductor hot arm and electroluminor; The heat absorbing end of semiconductor hot arm connects heat absorbing end electrode, and this heat absorbing end electrode contact waits target of freezing, and the release end of heat of semiconductor hot arm connects the release end of heat electrode of the second dc source, and this release end of heat electrode connects the metal heat sink of outwards heat radiation by heat-conducting silicone grease.

2. TEC according to claim 1, is characterized in that described electroluminor is P-N type LED.

3. TEC according to claim 1, it is characterized in that the first direct current power source voltage is 0.1 ~ 3V, the second direct current power source voltage is 5V ~ 10V.

4. TEC according to claim 1, is characterized in that release end of heat electrode is connected with heat conductive insulating potsherd by heat-conducting silicone grease, and heat conductive insulating potsherd is heat sink by heat-conducting silicone grease connection metal.