MX2011009327A - Inyeccion digital de calor por medio de dispositivos semiconductores de emision de superficie. - Google Patents
Inyeccion digital de calor por medio de dispositivos semiconductores de emision de superficie.Info
- Publication number
- MX2011009327A MX2011009327A MX2011009327A MX2011009327A MX2011009327A MX 2011009327 A MX2011009327 A MX 2011009327A MX 2011009327 A MX2011009327 A MX 2011009327A MX 2011009327 A MX2011009327 A MX 2011009327A MX 2011009327 A MX2011009327 A MX 2011009327A
- Authority
- MX
- Mexico
- Prior art keywords
- way
- surface emitting
- heat injection
- conductor devices
- emitting semi
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000002347 injection Methods 0.000 title 1
- 239000007924 injection Substances 0.000 title 1
- 238000000034 method Methods 0.000 abstract 3
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23L—FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES, NOT OTHERWISE PROVIDED FOR; PREPARATION OR TREATMENT THEREOF
- A23L5/00—Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
- A23L5/10—General methods of cooking foods, e.g. by roasting or frying
- A23L5/15—General methods of cooking foods, e.g. by roasting or frying using wave energy, irradiation, electrical means or magnetic fields, e.g. oven cooking or roasting using radiant dry heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
- B29C49/42—Component parts, details or accessories; Auxiliary operations
- B29C49/64—Heating or cooling preforms, parisons or blown articles
- B29C49/68—Ovens specially adapted for heating preforms or parisons
- B29C49/6835—Ovens specially adapted for heating preforms or parisons using reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1082—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region with a special facet structure, e.g. structured, non planar, oblique
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1203—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers over only a part of the length of the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4043—Edge-emitting structures with vertically stacked active layers
- H01S5/405—Two-dimensional arrays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0057—Heating devices using lamps for industrial applications for plastic handling and treatment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Food Science & Technology (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Nutrition Science (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Semiconductor Lasers (AREA)
- Radiation-Therapy Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15779909P | 2009-03-05 | 2009-03-05 | |
| US22476509P | 2009-07-10 | 2009-07-10 | |
| PCT/US2010/026447 WO2010102263A1 (en) | 2009-03-05 | 2010-03-05 | Digital heat injection by way of surface emitting semi-conductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2011009327A true MX2011009327A (es) | 2012-01-20 |
Family
ID=42710031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2011009327A MX2011009327A (es) | 2009-03-05 | 2010-03-05 | Inyeccion digital de calor por medio de dispositivos semiconductores de emision de superficie. |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US9282851B2 (enExample) |
| EP (1) | EP2404353A4 (enExample) |
| JP (2) | JP5827569B2 (enExample) |
| KR (1) | KR101769312B1 (enExample) |
| CN (2) | CN104873112A (enExample) |
| AU (1) | AU2010221086A1 (enExample) |
| BR (1) | BRPI1010249A2 (enExample) |
| CA (1) | CA2754572C (enExample) |
| MX (1) | MX2011009327A (enExample) |
| RU (1) | RU2011140351A (enExample) |
| SG (1) | SG174246A1 (enExample) |
| WO (1) | WO2010102263A1 (enExample) |
Families Citing this family (30)
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| US10857722B2 (en) | 2004-12-03 | 2020-12-08 | Pressco Ip Llc | Method and system for laser-based, wavelength specific infrared irradiation treatment |
| US10687391B2 (en) | 2004-12-03 | 2020-06-16 | Pressco Ip Llc | Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing |
| US7425296B2 (en) | 2004-12-03 | 2008-09-16 | Pressco Technology Inc. | Method and system for wavelength specific thermal irradiation and treatment |
| US9282851B2 (en) * | 2009-03-05 | 2016-03-15 | Pressco Ip Llc | Digital heat injection by way of surface emitting semi-conductor devices |
| CA2774523A1 (en) * | 2009-09-18 | 2011-03-24 | Pressco Technology, Inc. | A narrowband de-icing and ice release system and method |
| US8815059B2 (en) * | 2010-08-31 | 2014-08-26 | Guardian Industries Corp. | System and/or method for heat treating conductive coatings using wavelength-tuned infrared radiation |
| US9332877B2 (en) | 2010-06-11 | 2016-05-10 | Pressco Ip Llc | Cookware and cook-packs for narrowband irradiation cooking and systems and methods thereof |
| CN108937609A (zh) | 2010-06-11 | 2018-12-07 | 派拉斯科Ip有限责任公司 | 用于窄带辐射烹饪的烹饪用具及烹饪包装及其系统及方法 |
| GB201114048D0 (en) * | 2011-08-16 | 2011-09-28 | Intrinsiq Materials Ltd | Curing system |
| US9873308B2 (en) * | 2012-01-17 | 2018-01-23 | Koninklijke Philips N.V. | Heating system for heating a living being |
| US10085592B1 (en) | 2015-09-10 | 2018-10-02 | Brava Home, Inc. | Sequential broiling |
| US11388788B2 (en) | 2015-09-10 | 2022-07-12 | Brava Home, Inc. | In-oven camera and computer vision systems and methods |
| US11156366B2 (en) | 2015-09-10 | 2021-10-26 | Brava Home, Inc. | Dynamic heat adjustment of a spectral power distribution configurable cooking instrument |
| US10064244B2 (en) | 2015-09-10 | 2018-08-28 | Brava Home, Inc. | Variable peak wavelength cooking instrument with support tray |
| US10760794B2 (en) | 2015-09-10 | 2020-09-01 | Brava Home, Inc. | In-oven camera |
| WO2017127712A1 (en) | 2016-01-22 | 2017-07-27 | Pressco Ip Llc | A system and method for producing an engineered irradiation pattern in a narrowband system |
| US10465976B2 (en) | 2016-05-19 | 2019-11-05 | Bsh Home Appliances Corporation | Cooking within a refrigeration cavity |
| CN109792802B (zh) * | 2016-08-02 | 2021-08-03 | 布拉瓦家居公司 | 带支撑托盘的可变峰值波长烹饪器具 |
| EP3513631B1 (en) | 2016-09-15 | 2024-05-08 | Google LLC | Multilayer printed circuit board for reducing quantum signal crosstalk |
| US10223933B1 (en) * | 2017-08-09 | 2019-03-05 | Brava Home, Inc. | Multizone cooking utilizing a spectral-configurable cooking instrument |
| CN111527348B (zh) | 2017-08-11 | 2023-03-07 | 布拉瓦家居公司 | 可配置的烹饪系统和方法 |
| US12137510B2 (en) | 2017-11-06 | 2024-11-05 | Brava Home, Inc. | Power density emission manipulation in a cooking instrument |
| US11206949B1 (en) | 2017-11-15 | 2021-12-28 | Brava Home, Inc. | High power density toaster |
| US11422037B2 (en) | 2018-03-15 | 2022-08-23 | Brava Home, Inc. | Temperature probe systems and methods |
| US10502430B1 (en) | 2018-10-10 | 2019-12-10 | Brava Home, Inc. | Particulates detection in a cooking instrument |
| DE102019106805A1 (de) * | 2019-03-18 | 2020-09-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierender halbleiterchip und strahlungsemittierendes halbleiterbauelement |
| US12280396B2 (en) | 2019-04-19 | 2025-04-22 | Photex Inc. | Narrowband can manufacturing |
| EP3956076A4 (en) | 2019-04-19 | 2023-10-04 | Photex Inc. | SYSTEM AND METHOD FOR INSIDE CAN CURING |
| JP7336377B2 (ja) * | 2019-12-12 | 2023-08-31 | シャープ福山レーザー株式会社 | 半導体レーザ素子 |
| DE102021129563A1 (de) | 2021-11-12 | 2023-05-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Bauelement mit integrierter konverterschicht und verfahren zur herstellung eines bauelements |
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| US10857722B2 (en) * | 2004-12-03 | 2020-12-08 | Pressco Ip Llc | Method and system for laser-based, wavelength specific infrared irradiation treatment |
| US7425296B2 (en) | 2004-12-03 | 2008-09-16 | Pressco Technology Inc. | Method and system for wavelength specific thermal irradiation and treatment |
| US10687391B2 (en) | 2004-12-03 | 2020-06-16 | Pressco Ip Llc | Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing |
| DE102005061334B4 (de) * | 2005-12-21 | 2016-12-29 | Khs Corpoplast Gmbh | Streckblasanlage und Verfahren zum Streckblasen |
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| WO2008103188A1 (en) | 2007-02-23 | 2008-08-28 | Alfalight, Inc | High efficiency partial distributed feedback (p-dfb) laser |
| US20090102083A1 (en) * | 2007-06-08 | 2009-04-23 | Cochran Don W | Method and System for Wavelength Specific Thermal Irradiation and Treatment |
| US9282851B2 (en) * | 2009-03-05 | 2016-03-15 | Pressco Ip Llc | Digital heat injection by way of surface emitting semi-conductor devices |
-
2010
- 2010-03-05 US US12/718,919 patent/US9282851B2/en active Active
- 2010-03-05 CN CN201510345447.7A patent/CN104873112A/zh active Pending
- 2010-03-05 RU RU2011140351/28A patent/RU2011140351A/ru unknown
- 2010-03-05 KR KR1020117023214A patent/KR101769312B1/ko active Active
- 2010-03-05 EP EP10749421.3A patent/EP2404353A4/en not_active Ceased
- 2010-03-05 SG SG2011063716A patent/SG174246A1/en unknown
- 2010-03-05 AU AU2010221086A patent/AU2010221086A1/en not_active Abandoned
- 2010-03-05 MX MX2011009327A patent/MX2011009327A/es active IP Right Grant
- 2010-03-05 JP JP2011553159A patent/JP5827569B2/ja active Active
- 2010-03-05 CA CA2754572A patent/CA2754572C/en not_active Expired - Fee Related
- 2010-03-05 WO PCT/US2010/026447 patent/WO2010102263A1/en not_active Ceased
- 2010-03-05 BR BRPI1010249A patent/BRPI1010249A2/pt not_active IP Right Cessation
- 2010-03-05 CN CN2010800172544A patent/CN102405568A/zh active Pending
-
2015
- 2015-05-07 JP JP2015095259A patent/JP2015207766A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN102405568A (zh) | 2012-04-04 |
| JP2015207766A (ja) | 2015-11-19 |
| KR20110126738A (ko) | 2011-11-23 |
| BRPI1010249A2 (pt) | 2016-03-22 |
| JP5827569B2 (ja) | 2015-12-02 |
| EP2404353A4 (en) | 2017-12-13 |
| US9282851B2 (en) | 2016-03-15 |
| AU2010221086A1 (en) | 2011-10-06 |
| JP2012519966A (ja) | 2012-08-30 |
| WO2010102263A1 (en) | 2010-09-10 |
| CN104873112A (zh) | 2015-09-02 |
| CA2754572A1 (en) | 2010-09-10 |
| RU2011140351A (ru) | 2013-04-10 |
| KR101769312B1 (ko) | 2017-08-30 |
| CA2754572C (en) | 2017-10-24 |
| US20110002675A1 (en) | 2011-01-06 |
| EP2404353A1 (en) | 2012-01-11 |
| SG174246A1 (en) | 2011-10-28 |
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