JP5827569B2 - 面発光半導体装置によるデジタル熱注入 - Google Patents

面発光半導体装置によるデジタル熱注入 Download PDF

Info

Publication number
JP5827569B2
JP5827569B2 JP2011553159A JP2011553159A JP5827569B2 JP 5827569 B2 JP5827569 B2 JP 5827569B2 JP 2011553159 A JP2011553159 A JP 2011553159A JP 2011553159 A JP2011553159 A JP 2011553159A JP 5827569 B2 JP5827569 B2 JP 5827569B2
Authority
JP
Japan
Prior art keywords
array
target
radiation
laser diode
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011553159A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012519966A5 (enExample
JP2012519966A (ja
Inventor
コクラン，ドン，ダブリュー．
ジョンソン，ベンジャミン，ディー．
． ジョンソン，ベンジャミン，ディー
カッツ，ジョナサン，エム．
ムーア，マーク，ダブリュー．
モーガン，ノエル，イー．
ロス，デンウッド，エフ．
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pressco Technology Inc
Original Assignee
Pressco Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pressco Technology Inc filed Critical Pressco Technology Inc
Publication of JP2012519966A publication Critical patent/JP2012519966A/ja
Publication of JP2012519966A5 publication Critical patent/JP2012519966A5/ja
Application granted granted Critical
Publication of JP5827569B2 publication Critical patent/JP5827569B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23L—FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES, NOT OTHERWISE PROVIDED FOR; PREPARATION OR TREATMENT THEREOF
    • A23L5/00—Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
    • A23L5/10—General methods of cooking foods, e.g. by roasting or frying
    • A23L5/15—General methods of cooking foods, e.g. by roasting or frying using wave energy, irradiation, electrical means or magnetic fields, e.g. oven cooking or roasting using radiant dry heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
    • B29C49/64—Heating or cooling preforms, parisons or blown articles
    • B29C49/68—Ovens specially adapted for heating preforms or parisons
    • B29C49/6835—Ovens specially adapted for heating preforms or parisons using reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1082—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region with a special facet structure, e.g. structured, non planar, oblique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H01S5/1203—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers over only a part of the length of the active region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4043—Edge-emitting structures with vertically stacked active layers
    • H01S5/405—Two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0057—Heating devices using lamps for industrial applications for plastic handling and treatment

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Food Science & Technology (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Nutrition Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Semiconductor Lasers (AREA)
  • Radiation-Therapy Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2011553159A 2009-03-05 2010-03-05 面発光半導体装置によるデジタル熱注入 Active JP5827569B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15779909P 2009-03-05 2009-03-05
US61/157,799 2009-03-05
US22476509P 2009-07-10 2009-07-10
US61/224,765 2009-07-10
PCT/US2010/026447 WO2010102263A1 (en) 2009-03-05 2010-03-05 Digital heat injection by way of surface emitting semi-conductor devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015095259A Division JP2015207766A (ja) 2009-03-05 2015-05-07 面発光半導体装置によるデジタル熱注入

Publications (3)

Publication Number Publication Date
JP2012519966A JP2012519966A (ja) 2012-08-30
JP2012519966A5 JP2012519966A5 (enExample) 2013-07-04
JP5827569B2 true JP5827569B2 (ja) 2015-12-02

Family

ID=42710031

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011553159A Active JP5827569B2 (ja) 2009-03-05 2010-03-05 面発光半導体装置によるデジタル熱注入
JP2015095259A Pending JP2015207766A (ja) 2009-03-05 2015-05-07 面発光半導体装置によるデジタル熱注入

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015095259A Pending JP2015207766A (ja) 2009-03-05 2015-05-07 面発光半導体装置によるデジタル熱注入

Country Status (12)

Country Link
US (1) US9282851B2 (enExample)
EP (1) EP2404353A4 (enExample)
JP (2) JP5827569B2 (enExample)
KR (1) KR101769312B1 (enExample)
CN (2) CN104873112A (enExample)
AU (1) AU2010221086A1 (enExample)
BR (1) BRPI1010249A2 (enExample)
CA (1) CA2754572C (enExample)
MX (1) MX2011009327A (enExample)
RU (1) RU2011140351A (enExample)
SG (1) SG174246A1 (enExample)
WO (1) WO2010102263A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015207766A (ja) * 2009-03-05 2015-11-19 プレスコ テクノロジー インコーポレーテッドＰｒｅｓｓｃｏ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃ． 面発光半導体装置によるデジタル熱注入

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10857722B2 (en) 2004-12-03 2020-12-08 Pressco Ip Llc Method and system for laser-based, wavelength specific infrared irradiation treatment
US10687391B2 (en) 2004-12-03 2020-06-16 Pressco Ip Llc Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing
US7425296B2 (en) 2004-12-03 2008-09-16 Pressco Technology Inc. Method and system for wavelength specific thermal irradiation and treatment
CA2774523A1 (en) * 2009-09-18 2011-03-24 Pressco Technology, Inc. A narrowband de-icing and ice release system and method
US8815059B2 (en) * 2010-08-31 2014-08-26 Guardian Industries Corp. System and/or method for heat treating conductive coatings using wavelength-tuned infrared radiation
US9332877B2 (en) 2010-06-11 2016-05-10 Pressco Ip Llc Cookware and cook-packs for narrowband irradiation cooking and systems and methods thereof
CN108937609A (zh) 2010-06-11 2018-12-07 派拉斯科Ip有限责任公司 用于窄带辐射烹饪的烹饪用具及烹饪包装及其系统及方法
GB201114048D0 (en) * 2011-08-16 2011-09-28 Intrinsiq Materials Ltd Curing system
US9873308B2 (en) * 2012-01-17 2018-01-23 Koninklijke Philips N.V. Heating system for heating a living being
US10085592B1 (en) 2015-09-10 2018-10-02 Brava Home, Inc. Sequential broiling
US11388788B2 (en) 2015-09-10 2022-07-12 Brava Home, Inc. In-oven camera and computer vision systems and methods
US11156366B2 (en) 2015-09-10 2021-10-26 Brava Home, Inc. Dynamic heat adjustment of a spectral power distribution configurable cooking instrument
US10064244B2 (en) 2015-09-10 2018-08-28 Brava Home, Inc. Variable peak wavelength cooking instrument with support tray
US10760794B2 (en) 2015-09-10 2020-09-01 Brava Home, Inc. In-oven camera
WO2017127712A1 (en) 2016-01-22 2017-07-27 Pressco Ip Llc A system and method for producing an engineered irradiation pattern in a narrowband system
US10465976B2 (en) 2016-05-19 2019-11-05 Bsh Home Appliances Corporation Cooking within a refrigeration cavity
CN109792802B (zh) * 2016-08-02 2021-08-03 布拉瓦家居公司 带支撑托盘的可变峰值波长烹饪器具
EP3513631B1 (en) 2016-09-15 2024-05-08 Google LLC Multilayer printed circuit board for reducing quantum signal crosstalk
US10223933B1 (en) * 2017-08-09 2019-03-05 Brava Home, Inc. Multizone cooking utilizing a spectral-configurable cooking instrument
CN111527348B (zh) 2017-08-11 2023-03-07 布拉瓦家居公司 可配置的烹饪系统和方法
US12137510B2 (en) 2017-11-06 2024-11-05 Brava Home, Inc. Power density emission manipulation in a cooking instrument
US11206949B1 (en) 2017-11-15 2021-12-28 Brava Home, Inc. High power density toaster
US11422037B2 (en) 2018-03-15 2022-08-23 Brava Home, Inc. Temperature probe systems and methods
US10502430B1 (en) 2018-10-10 2019-12-10 Brava Home, Inc. Particulates detection in a cooking instrument
DE102019106805A1 (de) * 2019-03-18 2020-09-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierender halbleiterchip und strahlungsemittierendes halbleiterbauelement
US12280396B2 (en) 2019-04-19 2025-04-22 Photex Inc. Narrowband can manufacturing
EP3956076A4 (en) 2019-04-19 2023-10-04 Photex Inc. SYSTEM AND METHOD FOR INSIDE CAN CURING
JP7336377B2 (ja) * 2019-12-12 2023-08-31 シャープ福山レーザー株式会社 半導体レーザ素子
DE102021129563A1 (de) 2021-11-12 2023-05-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement mit integrierter konverterschicht und verfahren zur herstellung eines bauelements

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128587A (ja) * 1985-11-29 1987-06-10 Matsushita Electric Ind Co Ltd 半導体レ−ザ
FR2639150B1 (fr) * 1988-11-15 1991-01-25 Thomson Hybrides Microondes Dispositif optoelectronique de puissance et son procede de realisation
US5238531A (en) 1992-01-17 1993-08-24 Hughes Aircraft Company Apparatus and method for fabricating a chirped grating in a surface emitting distributed feedback semiconductor laser diode device
US5241556A (en) 1992-01-28 1993-08-31 Hughes Aircraft Company Chirped grating surface emitting distributed feedback semiconductor laser
US5282220A (en) * 1992-04-24 1994-01-25 Hughes Aircraft Company Talbot filtered surface emitting distributed feedback semiconductor laser array
US5867521A (en) * 1992-11-12 1999-02-02 Raytheon Company Curved grating surface-emitting distributed feedback laser
US5345466A (en) 1992-11-12 1994-09-06 Hughes Aircraft Company Curved grating surface emitting distributed feedback semiconductor laser
US5778018A (en) 1994-10-13 1998-07-07 Nec Corporation VCSELs (vertical-cavity surface emitting lasers) and VCSEL-based devices
US6543693B1 (en) * 1995-02-27 2003-04-08 Symbol Technologies, Inc. Bar code readers using surface emitting laser diode
US5610930A (en) 1995-03-02 1997-03-11 Hughes Aircraft Company Voltage adding diode laser array
US6195381B1 (en) 1998-04-27 2001-02-27 Wisconsin Alumni Research Foundation Narrow spectral width high-power distributed feedback semiconductor lasers
US6219365B1 (en) 1998-11-03 2001-04-17 Wisconsin Alumni Research Foundation High performance aluminum free active region semiconductor lasers
DE29900811U1 (de) * 1999-01-19 1999-03-18 Sator Laser GmbH, 22525 Hamburg Vorrichtung zum Verschweißen des Endes von rohrartigen Behältern aus Kunststoff, insbesondere von Tuben
US6810053B1 (en) 1999-08-13 2004-10-26 Wisconsin Alumni Research Foundation Single mode, single lobe surface emitting distributed feedback semiconductor laser
US6953340B2 (en) 1999-09-24 2005-10-11 Cao Group, Inc. Light for use in activating light-activated materials, the light having a detachable light module containing a heat sink and a semiconductor chip
JP3667188B2 (ja) * 2000-03-03 2005-07-06 キヤノン株式会社 電子線励起レーザー装置及びマルチ電子線励起レーザー装置
JP2002026452A (ja) * 2000-07-12 2002-01-25 Toyota Central Res & Dev Lab Inc 面発光型光源及びその製造方法、レーザ加工機用光源
JP2002109769A (ja) * 2000-09-29 2002-04-12 Tokai Univ 半導体レーザを搭載した高機能・高密度光学ヘッド
DE10058950B4 (de) * 2000-10-17 2006-04-06 Advanced Photonics Technologies Ag Erwärmungsstrecke und Verfahren zum Streckblasen
JP2002147762A (ja) 2000-11-14 2002-05-22 Fuji Photo Film Co Ltd 食品調理器
CA2332190A1 (en) 2001-01-25 2002-07-25 Efos Inc. Addressable semiconductor array light source for localized radiation delivery
US7061958B2 (en) 2001-10-23 2006-06-13 Krupke William F Diode-pumped alkali lasers (DPALs) and amplifiers (DPAAs) with reduced buffer gas pressures
US7457340B2 (en) * 2002-01-18 2008-11-25 Wisconsin Alumni Research Foundation High coherent power, two-dimensional surface-emitting semiconductor diode array laser
WO2003092131A1 (en) 2002-04-24 2003-11-06 Alfalight, Inc. Feedback stabilized multi-mode and method of stabilizing a multi-mode laser
DE10233015A1 (de) * 2002-07-20 2004-02-05 Mann + Hummel Gmbh Vorrichtung und Verfahren zur Trocknung eines Gasstromes
US8442084B2 (en) 2002-10-03 2013-05-14 Laser Operations Llc High performance vertically emitting lasers
US6845116B2 (en) 2002-10-24 2005-01-18 Wisconsin Alumni Research Foundation Narrow lateral waveguide laser
JP4058635B2 (ja) * 2003-09-18 2008-03-12 セイコーエプソン株式会社 面発光型半導体レーザおよびその製造方法
US20050180482A1 (en) * 2004-01-23 2005-08-18 Osowski Mark L. Very low cost surface emitting laser diode arrays
US7596159B2 (en) 2004-10-12 2009-09-29 Alfalight Inc. Semiconductor laser diode
FR2878185B1 (fr) * 2004-11-22 2008-11-07 Sidel Sas Procede de fabrication de recipients comprenant une etape de chauffe au moyen d'un faisceau de rayonnement electromagnetique coherent
US10857722B2 (en) * 2004-12-03 2020-12-08 Pressco Ip Llc Method and system for laser-based, wavelength specific infrared irradiation treatment
US7425296B2 (en) 2004-12-03 2008-09-16 Pressco Technology Inc. Method and system for wavelength specific thermal irradiation and treatment
US10687391B2 (en) 2004-12-03 2020-06-16 Pressco Ip Llc Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing
DE102005061334B4 (de) * 2005-12-21 2016-12-29 Khs Corpoplast Gmbh Streckblasanlage und Verfahren zum Streckblasen
US7403552B2 (en) 2006-03-10 2008-07-22 Wisconsin Alumni Research Foundation High efficiency intersubband semiconductor lasers
US7408966B2 (en) 2006-08-18 2008-08-05 Wisconsin Alumni Research Foundation Intersubband quantum box stack lasers
JP2008124358A (ja) * 2006-11-15 2008-05-29 Sumitomo Electric Ind Ltd レーザモジュール
ATE516127T1 (de) * 2006-12-19 2011-07-15 Koninkl Philips Electronics Nv System und verfahren zum erwärmen von objekten in einer produktionslinie
WO2008103188A1 (en) 2007-02-23 2008-08-28 Alfalight, Inc High efficiency partial distributed feedback (p-dfb) laser
US20090102083A1 (en) * 2007-06-08 2009-04-23 Cochran Don W Method and System for Wavelength Specific Thermal Irradiation and Treatment
US9282851B2 (en) * 2009-03-05 2016-03-15 Pressco Ip Llc Digital heat injection by way of surface emitting semi-conductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015207766A (ja) * 2009-03-05 2015-11-19 プレスコ テクノロジー インコーポレーテッドＰｒｅｓｓｃｏ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃ． 面発光半導体装置によるデジタル熱注入

Also Published As

Publication number Publication date
CN102405568A (zh) 2012-04-04
JP2015207766A (ja) 2015-11-19
KR20110126738A (ko) 2011-11-23
BRPI1010249A2 (pt) 2016-03-22
EP2404353A4 (en) 2017-12-13
US9282851B2 (en) 2016-03-15
AU2010221086A1 (en) 2011-10-06
JP2012519966A (ja) 2012-08-30
WO2010102263A1 (en) 2010-09-10
CN104873112A (zh) 2015-09-02
CA2754572A1 (en) 2010-09-10
RU2011140351A (ru) 2013-04-10
MX2011009327A (es) 2012-01-20
KR101769312B1 (ko) 2017-08-30
CA2754572C (en) 2017-10-24
US20110002675A1 (en) 2011-01-06
EP2404353A1 (en) 2012-01-11
SG174246A1 (en) 2011-10-28

Similar Documents

Publication Publication Date Title
JP5827569B2 (ja) 面発光半導体装置によるデジタル熱注入
JP6445213B2 (ja) ラインビーム光源およびラインビーム照射装置ならびにレーザリフトオフ方法
Moench et al. High-power VCSEL systems and applications
JP6461168B2 (ja) 半導体光源を有する加熱システム
JP2012519966A5 (enExample)
CN101466526A (zh) 基于激光的、特定波长的红外辐射处理的方法和系统
JP5907291B1 (ja) 光照射エレメントおよびライン状光照射装置
KR200484992Y1 (ko) 개선되는 균일도 범위를 위한 ｌｅｄ들의 에지 가중 간격
AU2015210477B2 (en) Digital heat injection by way of surface emitting semi-conductor devices
KR200485846Y1 (ko) 조명 모듈을 위한 랩 어라운드 윈도우
CN109073167B (zh) 利用窄宽度辐射进行照射固化的方法和系统
AU2014201999A1 (en) Digital heat injection by way of surface emitting semi-conductor devices
HK1169219A (en) Digital heat injection by way of surface emitting semi-conductor devices
KR102766146B1 (ko) 기판 처리 장치 및 기판 처리 방법
US20250277587A1 (en) Nred oven device
HK1133412A (en) A method and system for laser-based, wavelength specific infrared irradiation treatment
JP2009200223A (ja) 光源及び光源実装方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130305

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130305

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20130305

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130417

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131213

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140107

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140407

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140414

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140502

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140513

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140604

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140611

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140707

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20150106

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150618

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20150706

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150818

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20150916

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151016

R150 Certificate of patent or registration of utility model

Ref document number: 5827569

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250