JP2012519966A - 面発光半導体装置によるデジタル熱注入 - Google Patents
面発光半導体装置によるデジタル熱注入 Download PDFInfo
- Publication number
- JP2012519966A JP2012519966A JP2011553159A JP2011553159A JP2012519966A JP 2012519966 A JP2012519966 A JP 2012519966A JP 2011553159 A JP2011553159 A JP 2011553159A JP 2011553159 A JP2011553159 A JP 2011553159A JP 2012519966 A JP2012519966 A JP 2012519966A
- Authority
- JP
- Japan
- Prior art keywords
- array
- target
- radiation
- narrow
- surface emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23L—FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
- A23L5/00—Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
- A23L5/10—General methods of cooking foods, e.g. by roasting or frying
- A23L5/15—General methods of cooking foods, e.g. by roasting or frying using wave energy, irradiation, electrical means or magnetic fields, e.g. oven cooking or roasting using radiant dry heat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
- B29C49/42—Component parts, details or accessories; Auxiliary operations
- B29C49/64—Heating or cooling preforms, parisons or blown articles
- B29C49/68—Ovens specially adapted for heating preforms or parisons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1082—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region with a special facet structure, e.g. structured, non planar, oblique
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1203—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers over only a part of the length of the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4043—Edge-emitting structures with vertically stacked active layers
- H01S5/405—Two-dimensional arrays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0057—Heating devices using lamps for industrial applications for plastic handling and treatment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Nutrition Science (AREA)
- Semiconductor Lasers (AREA)
- Radiation-Therapy Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (15)
- 放射エネルギーの標的内への非接触注入のためのシステムであって、該システムは、
標的内への放射加熱の印加を容易にする照射区域に前記標的を配置するように動作する手段と、
少なくとも1つの半導体ベースの狭帯域放射線放出装置素子であって、前記少なくとも1つの狭帯域放射線放出装置は、前記標的の所望の吸収特性と一致する放射熱出力の狭波長帯域で放射線を放出するように動作し、
前記少なくとも1つの狭帯域放射線放出装置は実装面発光レーザーダイオード装置であり、
前記少なくとも1つの狭帯域放射線放出装置は、前記少なくとも1つの狭帯域放射線放出装置からの照射パターンの中心軸が実装対象の最大平面に対してほぼ直角に向けられるように、回路基板および冷却基板のうちの少なくとも1つを含む前記実装対象に実装される、狭帯域放射線放出装置と、
そこからの照射が前記照射区域内の標的に向けられるように前記少なくとも1つの狭帯域放射線放出ダイオード装置を位置決めするように構成されている実装配列と、
前記少なくとも1つの狭帯域放射線放出装置に電流を供給するように動作する手段と、を含むシステム。 - 放射エネルギーの標的内への非接触注入のためのシステムであって、該システムは、
少なくとも1つの半導体ベースの狭帯域放射線放出装置素子であって、前記少なくとも1つの狭帯域放射線放出装置は、前記標的の所望の吸収特性と一致する放射熱出力の狭波長帯域で放射線を放出するように動作し、
前記少なくとも1つの狭帯域放射線放出装置は実装面発光レーザーダイオード装置であり、
前記少なくとも1つの狭帯域放射線放出装置は、前記少なくとも1つの狭帯域放射線放出装置からの照射パターンの中心軸が実装対象の最大平面に対してほぼ直角に向けられるように、回路基板および冷却基板のうちの少なくとも1つを含む実装対象に実装される、狭帯域放射線放出装置と、
そこからの照射が前記照射区域内の標的に向けられるように前記少なくとも1つの狭帯域放射線放出ダイオード装置を位置決めするように構成されている実装配列と、
前記少なくとも1つの狭帯域放射線放出装置に電流を供給するように動作する手段と、を含むシステム。 - 前記少なくとも1つの半導体ベースの狭帯域放射線放出装置素子が、2つ以上の面発光レーザーダイオード装置のアレイを形成する、請求項1または2に記載のシステム。
- 前記アレイがX×Yマトリクスの面発光レーザーダイオード装置を含み、XおよびYはいずれも1より大きい、請求項3に記載のシステム。
- 装置が少なくとも2つの異なる装置タイプのアレイに含まれ、
前記装置タイプは、異なる波長を生成すること、異なるウェハー基板の化学的性質から、異なる物理的サイズ、異なる電力出力、および異なる装置出力パターンで製造されることのうちの少なくとも1つによって定義される、請求項4に記載のシステム。 - 前記アレイに含まれる前記異なる装置タイプが少なくとも2つの異なる波長を生成することが可能であり、それらの波長の中心が相互に150nm超離れている、請求項5に記載のシステム。
- 前記少なくとも1つの狭帯域放射線放出装置に電流を供給するように動作する前記手段が、
インテリジェント制御器によって制御され得る少なくとも1つの電流制御電源によって選択的に電流を供給することが可能なシステムを含み、
前記電源を制御する前記インテリジェント制御器が、プログラマブル論理制御器、マイクロプロセッサベースの制御基板、コンピュータ制御システム、および組み込み論理制御器のうちの少なくとも1つからなる、請求項1または2に記載のシステム。 - 前記インテリジェント制御器が、少なくとも2つの異なる装置タイプからの放射線を選択的に制御する能力を有する、請求項5に記載のシステム。
- 各レーザーダイオード装置内のレーザー発振が前記装置の実装平面と平行な方向に発生し、その一方で前記出力照射パターンの前記中心軸はこれに対してほぼ直角である、請求項3に記載のシステム。
- 標的に関連づけられた放射エネルギーの発生のための照射アレイであって、
前記アレイは、実装されている基板のいずれの端とも同一平面になるようには前記装置が実装されていない、半導体照射アレイを含み、
前記実装基板は、熱を伝導する少なくとも1つの層および供給電流を伝導する1つの層を有する高熱伝導基板として構成されており、
前記アレイは面発光半導体レーザー装置を含み、
前記アレイの光学的光子出力の軸は、前記実装基板の大きい平面に対して実質的に直交しており、
前記実装基板は、水ジャケット冷却システム、放熱フィン配列、状態変化冷却器、圧縮媒体冷却器、および熱電冷却器のうちの少なくとも1つと熱的に結合されるように構成されている、照射アレイ。 - 前記アレイがX×Yアレイの面発光装置であり、それによればXおよびYはいずれも1より大きい、請求項10に記載のシステム。
- 前記アレイが面発光装置の配列であり、それによれば前記装置のうちのいくつかは隣接する装置に対して回転する、請求項10に記載のシステム。
- 標的アイテムを照射する方法であって、該方法は、
標的アイテムを照射区域内に導入するステップと、
実装面発光レーザーダイオード装置を使用して前記標的アイテムの所望の吸収特性と一致する放射熱出力の狭波長帯域で放射線を放出するステップであって、前記実装面発光レーザーダイオード装置は、前記装置からの照射パターンの中心軸が実装対象の最大平面に対して実質的に直角に向けられるように、回路基板および冷却基板のうちの少なくとも1つを含む前記実装対象に実装されている、ステップと、
前記照射装置に基づいて前記標的アイテムを照射するステップと、を含む方法。 - 前記標的アイテムが食品アイテムである、請求項13に記載の方法。
- 前記標的アイテムが予備成形プラスチックボトルである、請求項13に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15779909P | 2009-03-05 | 2009-03-05 | |
US61/157,799 | 2009-03-05 | ||
US22476509P | 2009-07-10 | 2009-07-10 | |
US61/224,765 | 2009-07-10 | ||
PCT/US2010/026447 WO2010102263A1 (en) | 2009-03-05 | 2010-03-05 | Digital heat injection by way of surface emitting semi-conductor devices |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015095259A Division JP2015207766A (ja) | 2009-03-05 | 2015-05-07 | 面発光半導体装置によるデジタル熱注入 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012519966A true JP2012519966A (ja) | 2012-08-30 |
JP2012519966A5 JP2012519966A5 (ja) | 2013-07-04 |
JP5827569B2 JP5827569B2 (ja) | 2015-12-02 |
Family
ID=42710031
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011553159A Active JP5827569B2 (ja) | 2009-03-05 | 2010-03-05 | 面発光半導体装置によるデジタル熱注入 |
JP2015095259A Pending JP2015207766A (ja) | 2009-03-05 | 2015-05-07 | 面発光半導体装置によるデジタル熱注入 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015095259A Pending JP2015207766A (ja) | 2009-03-05 | 2015-05-07 | 面発光半導体装置によるデジタル熱注入 |
Country Status (12)
Country | Link |
---|---|
US (1) | US9282851B2 (ja) |
EP (1) | EP2404353A4 (ja) |
JP (2) | JP5827569B2 (ja) |
KR (1) | KR101769312B1 (ja) |
CN (2) | CN102405568A (ja) |
AU (1) | AU2010221086A1 (ja) |
BR (1) | BRPI1010249A2 (ja) |
CA (1) | CA2754572C (ja) |
MX (1) | MX2011009327A (ja) |
RU (1) | RU2011140351A (ja) |
SG (1) | SG174246A1 (ja) |
WO (1) | WO2010102263A1 (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10687391B2 (en) | 2004-12-03 | 2020-06-16 | Pressco Ip Llc | Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing |
US7425296B2 (en) | 2004-12-03 | 2008-09-16 | Pressco Technology Inc. | Method and system for wavelength specific thermal irradiation and treatment |
US10857722B2 (en) | 2004-12-03 | 2020-12-08 | Pressco Ip Llc | Method and system for laser-based, wavelength specific infrared irradiation treatment |
RU2011140351A (ru) * | 2009-03-05 | 2013-04-10 | Пресско Текнолоджи, Инк. | Цифровой подвод тепла посредством полупроводниковых устройств с поверхностным излучением |
CN102574584B (zh) * | 2009-09-18 | 2016-08-31 | 派拉斯科技术公司 | 窄带除冰及释冰系统及方法 |
US8815059B2 (en) * | 2010-08-31 | 2014-08-26 | Guardian Industries Corp. | System and/or method for heat treating conductive coatings using wavelength-tuned infrared radiation |
AU2011265181A1 (en) | 2010-06-11 | 2013-01-10 | Pressco Ip Llc | Cookware and cook-packs for narrowband irradiation cooking and systems and methods thereof |
US9332877B2 (en) | 2010-06-11 | 2016-05-10 | Pressco Ip Llc | Cookware and cook-packs for narrowband irradiation cooking and systems and methods thereof |
GB201114048D0 (en) * | 2011-08-16 | 2011-09-28 | Intrinsiq Materials Ltd | Curing system |
ES2672235T3 (es) | 2012-01-17 | 2018-06-13 | Koninklijke Philips N.V. | Sistema de calefacción para calentar un ser vivo |
US10085592B1 (en) | 2015-09-10 | 2018-10-02 | Brava Home, Inc. | Sequential broiling |
CN108474562B (zh) | 2015-09-10 | 2021-10-29 | 布拉瓦家居公司 | 烤箱内相机 |
US11156366B2 (en) | 2015-09-10 | 2021-10-26 | Brava Home, Inc. | Dynamic heat adjustment of a spectral power distribution configurable cooking instrument |
US10064244B2 (en) | 2015-09-10 | 2018-08-28 | Brava Home, Inc. | Variable peak wavelength cooking instrument with support tray |
US11388788B2 (en) | 2015-09-10 | 2022-07-12 | Brava Home, Inc. | In-oven camera and computer vision systems and methods |
JP7074675B2 (ja) | 2016-01-22 | 2022-05-24 | プレスコ アイピー エルエルシー | 狭帯域システムにおいて工学的照射パターンを生成するための、システム及び方法 |
US10465976B2 (en) | 2016-05-19 | 2019-11-05 | Bsh Home Appliances Corporation | Cooking within a refrigeration cavity |
WO2018026846A1 (en) * | 2016-08-02 | 2018-02-08 | Brava Home, Inc. | Variable peak wavelength cooking instrument with support tray |
JP6771660B2 (ja) | 2016-09-15 | 2020-10-21 | グーグル エルエルシー | 量子信号クロストークを低減させるための多層プリント回路板 |
US10223933B1 (en) * | 2017-08-09 | 2019-03-05 | Brava Home, Inc. | Multizone cooking utilizing a spectral-configurable cooking instrument |
EP3665419A4 (en) | 2017-08-11 | 2021-05-05 | Brava Home, Inc. | CONFIGURABLE COOKING SYSTEMS AND PROCESSES |
US11206949B1 (en) | 2017-11-15 | 2021-12-28 | Brava Home, Inc. | High power density toaster |
US11422037B2 (en) | 2018-03-15 | 2022-08-23 | Brava Home, Inc. | Temperature probe systems and methods |
US10502430B1 (en) | 2018-10-10 | 2019-12-10 | Brava Home, Inc. | Particulates detection in a cooking instrument |
DE102019106805A1 (de) * | 2019-03-18 | 2020-09-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierender halbleiterchip und strahlungsemittierendes halbleiterbauelement |
BR112021020607A2 (pt) | 2019-04-19 | 2022-02-15 | Photex Inc | Sistema e método para curar o interior de uma lata |
JP7336377B2 (ja) * | 2019-12-12 | 2023-08-31 | シャープ福山レーザー株式会社 | 半導体レーザ素子 |
DE102021129563A1 (de) | 2021-11-12 | 2023-05-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Bauelement mit integrierter konverterschicht und verfahren zur herstellung eines bauelements |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002026452A (ja) * | 2000-07-12 | 2002-01-25 | Toyota Central Res & Dev Lab Inc | 面発光型光源及びその製造方法、レーザ加工機用光源 |
JP2002109769A (ja) * | 2000-09-29 | 2002-04-12 | Tokai Univ | 半導体レーザを搭載した高機能・高密度光学ヘッド |
JP2002535159A (ja) * | 1999-01-19 | 2002-10-22 | イー・ベー・カー・アー・パクニオン・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | プラスチックからなる管状の容器、特に管の端を溶接するための装置 |
JP2008124358A (ja) * | 2006-11-15 | 2008-05-29 | Sumitomo Electric Ind Ltd | レーザモジュール |
JP2008521662A (ja) * | 2004-12-03 | 2008-06-26 | プレスコ テクノロジー インコーポレーテッド | 波長特異的な熱放射及び処理を行う方法及びシステム |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5238531A (en) | 1992-01-17 | 1993-08-24 | Hughes Aircraft Company | Apparatus and method for fabricating a chirped grating in a surface emitting distributed feedback semiconductor laser diode device |
US5241556A (en) | 1992-01-28 | 1993-08-31 | Hughes Aircraft Company | Chirped grating surface emitting distributed feedback semiconductor laser |
US5345466A (en) | 1992-11-12 | 1994-09-06 | Hughes Aircraft Company | Curved grating surface emitting distributed feedback semiconductor laser |
US5867521A (en) * | 1992-11-12 | 1999-02-02 | Raytheon Company | Curved grating surface-emitting distributed feedback laser |
US5778018A (en) | 1994-10-13 | 1998-07-07 | Nec Corporation | VCSELs (vertical-cavity surface emitting lasers) and VCSEL-based devices |
US6543693B1 (en) * | 1995-02-27 | 2003-04-08 | Symbol Technologies, Inc. | Bar code readers using surface emitting laser diode |
US5610930A (en) | 1995-03-02 | 1997-03-11 | Hughes Aircraft Company | Voltage adding diode laser array |
US6195381B1 (en) | 1998-04-27 | 2001-02-27 | Wisconsin Alumni Research Foundation | Narrow spectral width high-power distributed feedback semiconductor lasers |
US6219365B1 (en) | 1998-11-03 | 2001-04-17 | Wisconsin Alumni Research Foundation | High performance aluminum free active region semiconductor lasers |
WO2001013480A1 (en) | 1999-08-13 | 2001-02-22 | Wisconsin Alumni Research Foundation | Single mode, single lobe surface emitting distributed feedback semiconductor laser |
US6953340B2 (en) | 1999-09-24 | 2005-10-11 | Cao Group, Inc. | Light for use in activating light-activated materials, the light having a detachable light module containing a heat sink and a semiconductor chip |
JP3667188B2 (ja) * | 2000-03-03 | 2005-07-06 | キヤノン株式会社 | 電子線励起レーザー装置及びマルチ電子線励起レーザー装置 |
JP2002147762A (ja) | 2000-11-14 | 2002-05-22 | Fuji Photo Film Co Ltd | 食品調理器 |
CA2332190A1 (en) * | 2001-01-25 | 2002-07-25 | Efos Inc. | Addressable semiconductor array light source for localized radiation delivery |
US7061958B2 (en) | 2001-10-23 | 2006-06-13 | Krupke William F | Diode-pumped alkali lasers (DPALs) and amplifiers (DPAAs) with reduced buffer gas pressures |
US7457340B2 (en) * | 2002-01-18 | 2008-11-25 | Wisconsin Alumni Research Foundation | High coherent power, two-dimensional surface-emitting semiconductor diode array laser |
EP1502338A1 (en) | 2002-04-24 | 2005-02-02 | Alfalight, Inc. | Feedback stabilized multi-mode laser and method of stabilizing a multi-mode laser |
DE10233015A1 (de) * | 2002-07-20 | 2004-02-05 | Mann + Hummel Gmbh | Vorrichtung und Verfahren zur Trocknung eines Gasstromes |
US8442084B2 (en) | 2002-10-03 | 2013-05-14 | Laser Operations Llc | High performance vertically emitting lasers |
US6845116B2 (en) | 2002-10-24 | 2005-01-18 | Wisconsin Alumni Research Foundation | Narrow lateral waveguide laser |
JP4058635B2 (ja) * | 2003-09-18 | 2008-03-12 | セイコーエプソン株式会社 | 面発光型半導体レーザおよびその製造方法 |
US20050180482A1 (en) * | 2004-01-23 | 2005-08-18 | Osowski Mark L. | Very low cost surface emitting laser diode arrays |
ES2675150T3 (es) | 2004-10-12 | 2018-07-09 | Compound Photonics U.S. Corporation | Diodo láser semiconductor |
US10857722B2 (en) * | 2004-12-03 | 2020-12-08 | Pressco Ip Llc | Method and system for laser-based, wavelength specific infrared irradiation treatment |
US10687391B2 (en) | 2004-12-03 | 2020-06-16 | Pressco Ip Llc | Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing |
US7403552B2 (en) | 2006-03-10 | 2008-07-22 | Wisconsin Alumni Research Foundation | High efficiency intersubband semiconductor lasers |
US7408966B2 (en) | 2006-08-18 | 2008-08-05 | Wisconsin Alumni Research Foundation | Intersubband quantum box stack lasers |
WO2008075280A1 (en) * | 2006-12-19 | 2008-06-26 | Philips Intellectual Property & Standards Gmbh | System for and method of heating objects in a production line |
WO2008103188A1 (en) | 2007-02-23 | 2008-08-28 | Alfalight, Inc | High efficiency partial distributed feedback (p-dfb) laser |
MX2009012601A (es) * | 2007-06-08 | 2010-04-21 | Pressco Tech Inc | Un metodo y sistema para irradiacion y tratamiento termico especifico de longitud de onda. |
RU2011140351A (ru) * | 2009-03-05 | 2013-04-10 | Пресско Текнолоджи, Инк. | Цифровой подвод тепла посредством полупроводниковых устройств с поверхностным излучением |
-
2010
- 2010-03-05 RU RU2011140351/28A patent/RU2011140351A/ru unknown
- 2010-03-05 WO PCT/US2010/026447 patent/WO2010102263A1/en active Application Filing
- 2010-03-05 JP JP2011553159A patent/JP5827569B2/ja active Active
- 2010-03-05 SG SG2011063716A patent/SG174246A1/en unknown
- 2010-03-05 CN CN2010800172544A patent/CN102405568A/zh active Pending
- 2010-03-05 EP EP10749421.3A patent/EP2404353A4/en active Pending
- 2010-03-05 US US12/718,919 patent/US9282851B2/en active Active
- 2010-03-05 CA CA2754572A patent/CA2754572C/en not_active Expired - Fee Related
- 2010-03-05 CN CN201510345447.7A patent/CN104873112A/zh active Pending
- 2010-03-05 AU AU2010221086A patent/AU2010221086A1/en not_active Abandoned
- 2010-03-05 KR KR1020117023214A patent/KR101769312B1/ko active IP Right Grant
- 2010-03-05 MX MX2011009327A patent/MX2011009327A/es active IP Right Grant
- 2010-03-05 BR BRPI1010249A patent/BRPI1010249A2/pt not_active IP Right Cessation
-
2015
- 2015-05-07 JP JP2015095259A patent/JP2015207766A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002535159A (ja) * | 1999-01-19 | 2002-10-22 | イー・ベー・カー・アー・パクニオン・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | プラスチックからなる管状の容器、特に管の端を溶接するための装置 |
JP2002026452A (ja) * | 2000-07-12 | 2002-01-25 | Toyota Central Res & Dev Lab Inc | 面発光型光源及びその製造方法、レーザ加工機用光源 |
JP2002109769A (ja) * | 2000-09-29 | 2002-04-12 | Tokai Univ | 半導体レーザを搭載した高機能・高密度光学ヘッド |
JP2008521662A (ja) * | 2004-12-03 | 2008-06-26 | プレスコ テクノロジー インコーポレーテッド | 波長特異的な熱放射及び処理を行う方法及びシステム |
JP2008124358A (ja) * | 2006-11-15 | 2008-05-29 | Sumitomo Electric Ind Ltd | レーザモジュール |
Also Published As
Publication number | Publication date |
---|---|
BRPI1010249A2 (pt) | 2016-03-22 |
KR20110126738A (ko) | 2011-11-23 |
CN102405568A (zh) | 2012-04-04 |
AU2010221086A1 (en) | 2011-10-06 |
RU2011140351A (ru) | 2013-04-10 |
EP2404353A1 (en) | 2012-01-11 |
CA2754572A1 (en) | 2010-09-10 |
JP5827569B2 (ja) | 2015-12-02 |
CA2754572C (en) | 2017-10-24 |
CN104873112A (zh) | 2015-09-02 |
US20110002675A1 (en) | 2011-01-06 |
WO2010102263A1 (en) | 2010-09-10 |
US9282851B2 (en) | 2016-03-15 |
JP2015207766A (ja) | 2015-11-19 |
MX2011009327A (es) | 2012-01-20 |
KR101769312B1 (ko) | 2017-08-30 |
EP2404353A4 (en) | 2017-12-13 |
SG174246A1 (en) | 2011-10-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5827569B2 (ja) | 面発光半導体装置によるデジタル熱注入 | |
JP6445213B2 (ja) | ラインビーム光源およびラインビーム照射装置ならびにレーザリフトオフ方法 | |
Moench et al. | High-power VCSEL systems and applications | |
JP2012519966A5 (ja) | ||
US10857722B2 (en) | Method and system for laser-based, wavelength specific infrared irradiation treatment | |
KR200484992Y1 (ko) | 개선되는 균일도 범위를 위한 led들의 에지 가중 간격 | |
Moench et al. | Modular VCSEL solution for uniform line illumination in the kW range | |
KR200485846Y1 (ko) | 조명 모듈을 위한 랩 어라운드 윈도우 | |
AU2015210477B2 (en) | Digital heat injection by way of surface emitting semi-conductor devices | |
JP2007088266A (ja) | レーザ光源装置及び光学装置 | |
AU2014201999A1 (en) | Digital heat injection by way of surface emitting semi-conductor devices | |
JP2007063606A (ja) | 半導体レーザを用いた焼入れ方法および焼入れ装置 | |
CN109073167B (zh) | 利用窄宽度辐射进行照射固化的方法和系统 | |
TW202331961A (zh) | 處理基底之裝置以及方法 | |
CN114025939A (zh) | 用于塑料容器制造机的中空体加热单元 | |
JP2009200223A (ja) | 光源及び光源実装方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130305 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130305 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20130305 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130417 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20131213 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140107 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140407 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140414 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140502 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140513 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140604 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140611 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140707 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150106 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150507 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150618 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150706 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150818 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150916 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151016 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5827569 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |