JP2012510162A5 - - Google Patents

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Publication number
JP2012510162A5
JP2012510162A5 JP2011537626A JP2011537626A JP2012510162A5 JP 2012510162 A5 JP2012510162 A5 JP 2012510162A5 JP 2011537626 A JP2011537626 A JP 2011537626A JP 2011537626 A JP2011537626 A JP 2011537626A JP 2012510162 A5 JP2012510162 A5 JP 2012510162A5
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JP
Japan
Prior art keywords
substrate
passivation film
seed layer
via structure
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011537626A
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English (en)
Japanese (ja)
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JP5409801B2 (ja
JP2012510162A (ja
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Priority claimed from US12/620,818 external-priority patent/US8293647B2/en
Application filed filed Critical
Publication of JP2012510162A publication Critical patent/JP2012510162A/ja
Publication of JP2012510162A5 publication Critical patent/JP2012510162A5/ja
Application granted granted Critical
Publication of JP5409801B2 publication Critical patent/JP5409801B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011537626A 2008-11-24 2009-11-19 有機表面パッシベーションでめっきの進行に差を付けて遅らせることによるボトムアップめっき Expired - Fee Related JP5409801B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11754008P 2008-11-24 2008-11-24
US61/117,540 2008-11-24
US12/620,818 US8293647B2 (en) 2008-11-24 2009-11-18 Bottom up plating by organic surface passivation and differential plating retardation
US12/620,818 2009-11-18
PCT/US2009/065193 WO2010059857A2 (en) 2008-11-24 2009-11-19 Bottom up plating by organic surface passivation and differential plating retardation

Publications (3)

Publication Number Publication Date
JP2012510162A JP2012510162A (ja) 2012-04-26
JP2012510162A5 true JP2012510162A5 (cg-RX-API-DMAC10.html) 2013-01-17
JP5409801B2 JP5409801B2 (ja) 2014-02-05

Family

ID=42196702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011537626A Expired - Fee Related JP5409801B2 (ja) 2008-11-24 2009-11-19 有機表面パッシベーションでめっきの進行に差を付けて遅らせることによるボトムアップめっき

Country Status (6)

Country Link
US (1) US8293647B2 (cg-RX-API-DMAC10.html)
JP (1) JP5409801B2 (cg-RX-API-DMAC10.html)
KR (1) KR101368308B1 (cg-RX-API-DMAC10.html)
CN (1) CN102224574B (cg-RX-API-DMAC10.html)
TW (1) TWI397616B (cg-RX-API-DMAC10.html)
WO (1) WO2010059857A2 (cg-RX-API-DMAC10.html)

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US12444651B2 (en) 2009-08-04 2025-10-14 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US9653353B2 (en) 2009-08-04 2017-05-16 Novellus Systems, Inc. Tungsten feature fill
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US20130051530A1 (en) * 2011-08-30 2013-02-28 Fujifilm Corporation High Aspect Ratio Grid for Phase Contrast X-ray Imaging and Method of Making the Same
CN102798471B (zh) * 2011-10-19 2015-08-12 清华大学 一种红外探测器及其制备方法
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US11437269B2 (en) 2012-03-27 2022-09-06 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
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US9899234B2 (en) 2014-06-30 2018-02-20 Lam Research Corporation Liner and barrier applications for subtractive metal integration
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US9859124B2 (en) * 2015-04-17 2018-01-02 Taiwan Semiconductor Manufacturing Company Ltd Method of manufacturing semiconductor device with recess
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WO2020255772A1 (ja) * 2019-06-18 2020-12-24 東京エレクトロン株式会社 基板処理方法および基板処理装置

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