JP2012509965A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012509965A5 JP2012509965A5 JP2011537679A JP2011537679A JP2012509965A5 JP 2012509965 A5 JP2012509965 A5 JP 2012509965A5 JP 2011537679 A JP2011537679 A JP 2011537679A JP 2011537679 A JP2011537679 A JP 2011537679A JP 2012509965 A5 JP2012509965 A5 JP 2012509965A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- microns
- silver
- thick film
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 10
- 239000003960 organic solvent Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920006163 vinyl copolymer Polymers 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 235000021355 Stearic acid Nutrition 0.000 claims description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000008117 stearic acid Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- RUJPNZNXGCHGID-UHFFFAOYSA-N (Z)-beta-Terpineol Natural products CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- -1 alcohol ester Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 150000003505 terpenes Chemical group 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/276,662 | 2008-11-24 | ||
| US12/276,662 US7857998B2 (en) | 2008-11-24 | 2008-11-24 | High conductivity polymer thick film silver conductor composition for use in RFID and other applications |
| PCT/US2009/065494 WO2010060024A1 (en) | 2008-11-24 | 2009-11-23 | High conductivity polymer thick film silver conductor composition for use in rfid and other applications |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012509965A JP2012509965A (ja) | 2012-04-26 |
| JP2012509965A5 true JP2012509965A5 (https=) | 2013-01-24 |
| JP5462274B2 JP5462274B2 (ja) | 2014-04-02 |
Family
ID=41665084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011537679A Active JP5462274B2 (ja) | 2008-11-24 | 2009-11-23 | Ｒｆｉｄおよび他の用途に使用するための高導電率ポリマー厚膜銀導体組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7857998B2 (https=) |
| EP (1) | EP2350176B1 (https=) |
| JP (1) | JP5462274B2 (https=) |
| KR (1) | KR20110088593A (https=) |
| CN (1) | CN102224190B (https=) |
| TW (1) | TW201030768A (https=) |
| WO (1) | WO2010060024A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PL218232B1 (pl) | 2010-09-16 | 2014-10-31 | Inst Technologii Materiałów Elektronicznych | Pasta przewodząca nanosrebrowa, zwłaszcza do zastosowań wysokoprądowych i wysokotemperaturowych |
| US8551367B2 (en) * | 2012-01-19 | 2013-10-08 | E I Du Pont De Nemours And Company | Polymer thick film solder alloy conductor composition |
| US8557146B1 (en) * | 2012-03-26 | 2013-10-15 | E I Du Pont De Nemours And Company | Polymer thick film solder alloy/metal conductor compositions |
| CN103578598B (zh) * | 2012-07-28 | 2016-01-13 | 比亚迪股份有限公司 | 晶体硅se太阳电池向光面种子层浆料及其制备方法、晶体硅se太阳电池片及其制备方法 |
| US9034417B2 (en) * | 2012-08-20 | 2015-05-19 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film conductor compositions |
| US8696860B1 (en) * | 2012-10-10 | 2014-04-15 | E I Du Pont De Nemours And Company | Lamination of polymer thick film conductor compositions |
| US8986579B2 (en) * | 2012-10-10 | 2015-03-24 | E I Du Pont De Nemours And Company | Lamination of polymer thick film conductor compositions |
| WO2014168761A1 (en) | 2013-04-10 | 2014-10-16 | Honeywell International Inc. | High temperature tolerant rfid tag |
| CN105579533B (zh) * | 2013-08-16 | 2020-04-14 | 汉高知识产权控股有限责任公司 | 亚微米银颗粒油墨组合物、方法和用途 |
| RU2664719C2 (ru) * | 2013-11-01 | 2018-08-23 | Ппг Индастриз Огайо, Инк. | Способы переноса электропроводящих материалов |
| CN107250292B (zh) * | 2015-02-19 | 2020-09-22 | 株式会社大赛璐 | 银粒子涂料组合物 |
| DE102016125465B4 (de) | 2016-12-22 | 2022-08-11 | Pas Deutschland Gmbh | Siebdruckpaste, Verfahren zur Herstellung der Siebdruckpaste, Verwendung der Siebdruckpaste und elektrisch leitfähige Struktur |
| EP3630376B1 (en) * | 2017-05-23 | 2024-03-27 | Alpha Assembly Solutions Inc. | Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures |
| EP3808826B1 (en) * | 2018-06-12 | 2025-12-31 | DIC Corporation | Composition of highly electrically conductive silver ink and wiring obtained using the latter |
| DE102020211183A1 (de) | 2020-09-04 | 2022-03-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Druckbare paste, verfahren zu ihrer herstellung sowie verfahren zum ausstatten eines substrats mit einer elektrisch leitfähigen struktur |
| KR20230145159A (ko) | 2021-03-08 | 2023-10-17 | 도와 일렉트로닉스 가부시키가이샤 | 플레이크상 은 분말 및 그 제조 방법, 그리고 도전성 페이스트 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1984002423A1 (en) | 1982-12-11 | 1984-06-21 | Kennedy John W | Formable polymer composition |
| US5141777A (en) * | 1990-05-02 | 1992-08-25 | Advanced Products, Inc. | Highly conductive polymer thick film compositions |
| US5141177A (en) | 1991-08-28 | 1992-08-25 | United Technologies Corporation | Model following control system |
| US5756008A (en) * | 1996-08-14 | 1998-05-26 | E. I. Du Pont De Nemours And Company | Water cleanable silver composition |
| US5855820A (en) * | 1997-11-13 | 1999-01-05 | E. I. Du Pont De Nemours And Company | Water based thick film conductive compositions |
| US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
| US20030108664A1 (en) * | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
| US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
| US6994948B2 (en) * | 2001-10-12 | 2006-02-07 | E.I. Du Pont De Nemours And Company, Inc. | Aqueous developable photoimageable thick film compositions |
| JP3955805B2 (ja) * | 2002-09-13 | 2007-08-08 | ペルノックス株式会社 | 導電性ペースト組成物 |
| US7338622B2 (en) | 2003-12-04 | 2008-03-04 | E.I. Du Pont De Nemours And Company | Thick film compositions for use in electroluminescent applications |
| US6939484B2 (en) * | 2003-12-04 | 2005-09-06 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions for use in membrane switch applications |
| TW200640596A (en) * | 2005-01-14 | 2006-12-01 | Cabot Corp | Production of metal nanoparticles |
| US7412765B2 (en) * | 2006-07-14 | 2008-08-19 | Auden Techno Corp. | Method of manufacturing a sticker type antenna |
| JP5550904B2 (ja) * | 2006-08-07 | 2014-07-16 | インクテック カンパニー リミテッド | 銀ナノ粒子の製造方法、及び薄膜形成方法 |
| KR101434256B1 (ko) * | 2006-12-22 | 2014-08-27 | 헨켈 아게 운트 코. 카게아아 | 수계 전도성 조성물 |
| US7789935B2 (en) * | 2008-05-23 | 2010-09-07 | Xerox Corporation | Photochemical synthesis of metallic nanoparticles for ink applications |
-
2008
- 2008-11-24 US US12/276,662 patent/US7857998B2/en active Active
-
2009
- 2009-11-23 WO PCT/US2009/065494 patent/WO2010060024A1/en not_active Ceased
- 2009-11-23 JP JP2011537679A patent/JP5462274B2/ja active Active
- 2009-11-23 CN CN200980147766XA patent/CN102224190B/zh active Active
- 2009-11-23 KR KR1020117014486A patent/KR20110088593A/ko not_active Ceased
- 2009-11-23 EP EP09760418A patent/EP2350176B1/en active Active
- 2009-11-24 TW TW098139948A patent/TW201030768A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012509965A5 (https=) | ||
| JP6050365B2 (ja) | 熱成形可能なポリマー厚膜銀導体と容量性スイッチ回路においてのその使用 | |
| CN107001686B (zh) | 用于热塑性基材和可穿戴电子产品的可拉伸聚合物厚膜组合物 | |
| JP5462274B2 (ja) | Ｒｆｉｄおよび他の用途に使用するための高導電率ポリマー厚膜銀導体組成物 | |
| JP6772326B2 (ja) | 高透過性基材のための伸縮性ポリマー厚膜銀導体 | |
| JP6535081B2 (ja) | 熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 | |
| US8692131B2 (en) | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits | |
| US9245666B2 (en) | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits | |
| JP6592080B2 (ja) | 熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 | |
| CN103219062B (zh) | 聚合物厚膜焊料合金导体组合物 | |
| EP3170188B1 (en) | Polymer thick film silver conductor with inverted cure profile behavior | |
| JP6568100B2 (ja) | 触覚応答を有する熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 |