CN102224190B - 应用于rfid和其他应用的高导电性聚合物厚膜银导体组合物 - Google Patents

应用于rfid和其他应用的高导电性聚合物厚膜银导体组合物 Download PDF

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Publication number
CN102224190B
CN102224190B CN200980147766XA CN200980147766A CN102224190B CN 102224190 B CN102224190 B CN 102224190B CN 200980147766X A CN200980147766X A CN 200980147766XA CN 200980147766 A CN200980147766 A CN 200980147766A CN 102224190 B CN102224190 B CN 102224190B
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CN
China
Prior art keywords
composition
silver
weight
thick film
polymer thick
Prior art date
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Active
Application number
CN200980147766XA
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English (en)
Chinese (zh)
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CN102224190A (zh
Inventor
J·R·多尔夫曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celanese Mercury Holdings Inc
Original Assignee
EI Du Pont de Nemours and Co
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Publication of CN102224190A publication Critical patent/CN102224190A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C08L27/06—Homopolymers or copolymers of vinyl chloride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Details Of Aerials (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
CN200980147766XA 2008-11-24 2009-11-23 应用于rfid和其他应用的高导电性聚合物厚膜银导体组合物 Active CN102224190B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/276,662 2008-11-24
US12/276,662 US7857998B2 (en) 2008-11-24 2008-11-24 High conductivity polymer thick film silver conductor composition for use in RFID and other applications
PCT/US2009/065494 WO2010060024A1 (en) 2008-11-24 2009-11-23 High conductivity polymer thick film silver conductor composition for use in rfid and other applications

Publications (2)

Publication Number Publication Date
CN102224190A CN102224190A (zh) 2011-10-19
CN102224190B true CN102224190B (zh) 2013-08-21

Family

ID=41665084

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980147766XA Active CN102224190B (zh) 2008-11-24 2009-11-23 应用于rfid和其他应用的高导电性聚合物厚膜银导体组合物

Country Status (7)

Country Link
US (1) US7857998B2 (https=)
EP (1) EP2350176B1 (https=)
JP (1) JP5462274B2 (https=)
KR (1) KR20110088593A (https=)
CN (1) CN102224190B (https=)
TW (1) TW201030768A (https=)
WO (1) WO2010060024A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL218232B1 (pl) 2010-09-16 2014-10-31 Inst Technologii Materiałów Elektronicznych Pasta przewodząca nanosrebrowa, zwłaszcza do zastosowań wysokoprądowych i wysokotemperaturowych
US8551367B2 (en) * 2012-01-19 2013-10-08 E I Du Pont De Nemours And Company Polymer thick film solder alloy conductor composition
US8557146B1 (en) * 2012-03-26 2013-10-15 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions
CN103578598B (zh) * 2012-07-28 2016-01-13 比亚迪股份有限公司 晶体硅se太阳电池向光面种子层浆料及其制备方法、晶体硅se太阳电池片及其制备方法
US9034417B2 (en) * 2012-08-20 2015-05-19 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film conductor compositions
US8696860B1 (en) * 2012-10-10 2014-04-15 E I Du Pont De Nemours And Company Lamination of polymer thick film conductor compositions
US8986579B2 (en) * 2012-10-10 2015-03-24 E I Du Pont De Nemours And Company Lamination of polymer thick film conductor compositions
WO2014168761A1 (en) 2013-04-10 2014-10-16 Honeywell International Inc. High temperature tolerant rfid tag
CN105579533B (zh) * 2013-08-16 2020-04-14 汉高知识产权控股有限责任公司 亚微米银颗粒油墨组合物、方法和用途
RU2664719C2 (ru) * 2013-11-01 2018-08-23 Ппг Индастриз Огайо, Инк. Способы переноса электропроводящих материалов
CN107250292B (zh) * 2015-02-19 2020-09-22 株式会社大赛璐 银粒子涂料组合物
DE102016125465B4 (de) 2016-12-22 2022-08-11 Pas Deutschland Gmbh Siebdruckpaste, Verfahren zur Herstellung der Siebdruckpaste, Verwendung der Siebdruckpaste und elektrisch leitfähige Struktur
EP3630376B1 (en) * 2017-05-23 2024-03-27 Alpha Assembly Solutions Inc. Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures
EP3808826B1 (en) * 2018-06-12 2025-12-31 DIC Corporation Composition of highly electrically conductive silver ink and wiring obtained using the latter
DE102020211183A1 (de) 2020-09-04 2022-03-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Druckbare paste, verfahren zu ihrer herstellung sowie verfahren zum ausstatten eines substrats mit einer elektrisch leitfähigen struktur
KR20230145159A (ko) 2021-03-08 2023-10-17 도와 일렉트로닉스 가부시키가이샤 플레이크상 은 분말 및 그 제조 방법, 그리고 도전성 페이스트

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5141777A (en) * 1990-05-02 1992-08-25 Advanced Products, Inc. Highly conductive polymer thick film compositions
CN1637059A (zh) * 2003-12-04 2005-07-13 E.I.内穆尔杜邦公司 用在场致发光用途上的厚膜组合物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1984002423A1 (en) 1982-12-11 1984-06-21 Kennedy John W Formable polymer composition
US5141177A (en) 1991-08-28 1992-08-25 United Technologies Corporation Model following control system
US5756008A (en) * 1996-08-14 1998-05-26 E. I. Du Pont De Nemours And Company Water cleanable silver composition
US5855820A (en) * 1997-11-13 1999-01-05 E. I. Du Pont De Nemours And Company Water based thick film conductive compositions
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US6994948B2 (en) * 2001-10-12 2006-02-07 E.I. Du Pont De Nemours And Company, Inc. Aqueous developable photoimageable thick film compositions
JP3955805B2 (ja) * 2002-09-13 2007-08-08 ペルノックス株式会社 導電性ペースト組成物
US6939484B2 (en) * 2003-12-04 2005-09-06 E. I. Du Pont De Nemours And Company Thick film conductor compositions for use in membrane switch applications
TW200640596A (en) * 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
US7412765B2 (en) * 2006-07-14 2008-08-19 Auden Techno Corp. Method of manufacturing a sticker type antenna
JP5550904B2 (ja) * 2006-08-07 2014-07-16 インクテック カンパニー リミテッド 銀ナノ粒子の製造方法、及び薄膜形成方法
KR101434256B1 (ko) * 2006-12-22 2014-08-27 헨켈 아게 운트 코. 카게아아 수계 전도성 조성물
US7789935B2 (en) * 2008-05-23 2010-09-07 Xerox Corporation Photochemical synthesis of metallic nanoparticles for ink applications

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5141777A (en) * 1990-05-02 1992-08-25 Advanced Products, Inc. Highly conductive polymer thick film compositions
CN1637059A (zh) * 2003-12-04 2005-07-13 E.I.内穆尔杜邦公司 用在场致发光用途上的厚膜组合物

Also Published As

Publication number Publication date
JP2012509965A (ja) 2012-04-26
US20100127223A1 (en) 2010-05-27
CN102224190A (zh) 2011-10-19
EP2350176A1 (en) 2011-08-03
WO2010060024A1 (en) 2010-05-27
US7857998B2 (en) 2010-12-28
JP5462274B2 (ja) 2014-04-02
EP2350176B1 (en) 2012-09-19
KR20110088593A (ko) 2011-08-03
TW201030768A (en) 2010-08-16

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Effective date of registration: 20221118

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Patentee before: DuPont Electronics

Country or region before: U.S.A.