JP2012508984A5 - - Google Patents

Download PDF

Info

Publication number
JP2012508984A5
JP2012508984A5 JP2011536465A JP2011536465A JP2012508984A5 JP 2012508984 A5 JP2012508984 A5 JP 2012508984A5 JP 2011536465 A JP2011536465 A JP 2011536465A JP 2011536465 A JP2011536465 A JP 2011536465A JP 2012508984 A5 JP2012508984 A5 JP 2012508984A5
Authority
JP
Japan
Prior art keywords
islands
electrical interconnect
electrical
isolated
elastomeric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011536465A
Other languages
English (en)
Japanese (ja)
Other versions
JP5689066B2 (ja
JP2012508984A (ja
Filing date
Publication date
Priority claimed from US12/575,008 external-priority patent/US9289132B2/en
Application filed filed Critical
Priority claimed from PCT/US2009/064199 external-priority patent/WO2010056857A2/en
Publication of JP2012508984A publication Critical patent/JP2012508984A/ja
Publication of JP2012508984A5 publication Critical patent/JP2012508984A5/ja
Application granted granted Critical
Publication of JP5689066B2 publication Critical patent/JP5689066B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011536465A 2008-11-12 2009-11-12 高度に伸縮可能な電子部品 Active JP5689066B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11362208P 2008-11-12 2008-11-12
US61/113,622 2008-11-12
US12/575,008 US9289132B2 (en) 2008-10-07 2009-10-07 Catheter balloon having stretchable integrated circuitry and sensor array
US12/575,008 2009-10-07
PCT/US2009/064199 WO2010056857A2 (en) 2008-11-12 2009-11-12 Extremely stretchable electronics

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2015013538A Division JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013537A Division JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品

Publications (3)

Publication Number Publication Date
JP2012508984A JP2012508984A (ja) 2012-04-12
JP2012508984A5 true JP2012508984A5 (cg-RX-API-DMAC7.html) 2012-12-27
JP5689066B2 JP5689066B2 (ja) 2015-03-25

Family

ID=44279922

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2011536465A Active JP5689066B2 (ja) 2008-11-12 2009-11-12 高度に伸縮可能な電子部品
JP2015013537A Active JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013538A Active JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2016185527A Active JP6411423B2 (ja) 2008-11-12 2016-09-23 高度に伸縮可能な電子部品
JP2018112663A Pending JP2018174335A (ja) 2008-11-12 2018-06-13 高度に伸縮可能な電子部品

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2015013537A Active JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013538A Active JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2016185527A Active JP6411423B2 (ja) 2008-11-12 2016-09-23 高度に伸縮可能な電子部品
JP2018112663A Pending JP2018174335A (ja) 2008-11-12 2018-06-13 高度に伸縮可能な電子部品

Country Status (3)

Country Link
EP (2) EP2356680B1 (cg-RX-API-DMAC7.html)
JP (5) JP5689066B2 (cg-RX-API-DMAC7.html)
WO (1) WO2010056857A2 (cg-RX-API-DMAC7.html)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9545285B2 (en) 2011-10-05 2017-01-17 Mc10, Inc. Cardiac catheter employing conformal electronics for mapping
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
JP5646492B2 (ja) 2008-10-07 2014-12-24 エムシー10 インコーポレイテッドMc10,Inc. 伸縮可能な集積回路およびセンサアレイを有する装置
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
WO2012125494A2 (en) 2011-03-11 2012-09-20 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
EP2712491B1 (en) 2011-05-27 2019-12-04 Mc10, Inc. Flexible electronic structure
JP6320920B2 (ja) 2011-08-05 2018-05-09 エムシーテン、インコーポレイテッド センシング素子を利用したバルーン・カテーテルの装置及び製造方法
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
EP2786131B1 (en) 2011-09-01 2018-11-07 Mc10, Inc. Electronics for detection of a condition of tissue
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
WO2014007871A1 (en) 2012-07-05 2014-01-09 Mc10, Inc. Catheter device including flow sensing
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
KR20150072415A (ko) 2012-10-09 2015-06-29 엠씨10, 인크 의류에 집적되는 컨포멀 전자기기
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
KR20160040670A (ko) 2013-08-05 2016-04-14 엠씨10, 인크 곡면부착형 전자기기를 포함하는 유연한 온도 센서
KR20160065948A (ko) 2013-10-07 2016-06-09 엠씨10, 인크 감지 및 분석용 등각 센서 시스템
US9949691B2 (en) 2013-11-22 2018-04-24 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
KR102396850B1 (ko) 2014-01-06 2022-05-11 메디데이타 솔루션즈, 인코포레이티드 봉지형 컨포멀 전자 시스템 및 디바이스, 및 이의 제조 및 사용 방법
US9380697B2 (en) * 2014-01-28 2016-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic device and manufacturing method for same
JP6637896B2 (ja) 2014-03-04 2020-01-29 エムシー10 インコーポレイテッドMc10,Inc. 電子デバイス用の可撓性を有するマルチパート封止ハウジングを備えるコンフォーマルなicデバイス
EP3117206A4 (en) 2014-03-12 2017-11-15 Mc10, Inc. Quantification of a change in assay
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) * 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
US9380698B1 (en) * 2014-12-05 2016-06-28 VivaLnk, Inc. Stretchable electronic patch having a foldable circuit layer
TWI593327B (zh) * 2014-12-08 2017-07-21 Fujikura Ltd 伸縮性基板
WO2016134306A1 (en) 2015-02-20 2016-08-25 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
WO2016140961A1 (en) 2015-03-02 2016-09-09 Mc10, Inc. Perspiration sensor
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
WO2017031129A1 (en) 2015-08-19 2017-02-23 Mc10, Inc. Wearable heat flux devices and methods of use
US10300371B2 (en) 2015-10-01 2019-05-28 Mc10, Inc. Method and system for interacting with a virtual environment
CN108289630A (zh) 2015-10-05 2018-07-17 Mc10股份有限公司 用于神经调节和刺激的方法和系统
WO2017147052A1 (en) 2016-02-22 2017-08-31 Mc10, Inc. System, devices, and method for on-body data and power transmission
WO2017147053A1 (en) 2016-02-22 2017-08-31 Mc10, Inc. System, device, and method for coupled hub and sensor node on-body acquisition of sensor information
CN109310340A (zh) 2016-04-19 2019-02-05 Mc10股份有限公司 用于测量汗液的方法和系统
JP6682633B2 (ja) * 2016-07-12 2020-04-15 株式会社フジクラ 伸縮性基板
FR3054640B1 (fr) * 2016-07-28 2020-06-12 Linxens Holding Dispositif emetteur de lumiere
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
JP6920040B2 (ja) 2016-09-15 2021-08-18 日東電工株式会社 生体貼付用積層体
JP2020107660A (ja) * 2018-12-26 2020-07-09 ソニー株式会社 フレキシブル配線基板及び電子機器
GB201907270D0 (en) * 2019-03-14 2019-07-10 Imp College Innovations Ltd Component for a stretchable electronic device
JP7316538B2 (ja) * 2019-03-20 2023-07-28 大日本印刷株式会社 配線基板及び配線基板の製造方法
CA3166764A1 (en) 2019-12-23 2021-07-01 Alimetry Limited Electrode patch and connection system
US11123011B1 (en) 2020-03-23 2021-09-21 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
DE102020120642A1 (de) 2020-08-05 2022-02-10 peptech GmbH Funktionseinheit, elektronisches Bauteil und Verfahren zur Herstellung einer Funktionseinheit

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5686697A (en) * 1995-01-06 1997-11-11 Metatech Corporation Electrical circuit suspension system
JP3359910B2 (ja) * 1998-01-22 2002-12-24 フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン マイクロシステム及びマイクロシステムを製造する方法
US6360615B1 (en) * 2000-06-06 2002-03-26 Technoskin, Llc Wearable effect-emitting strain gauge device
US6775906B1 (en) * 2000-10-20 2004-08-17 Silverbrook Research Pty Ltd Method of manufacturing an integrated circuit carrier
US6743982B2 (en) * 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
AU2002330718A1 (en) * 2001-09-03 2003-03-18 National Microelectronic Research Centre University College Cork - National University Of Ireland Co Integrated circuit structure and a method of making an integrated circuit structure
US7491892B2 (en) * 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
CN1910810B (zh) * 2004-02-05 2010-04-21 松下电器产业株式会社 促动器及促动器用平板状电极支撑体的制造方法
JP2006108431A (ja) * 2004-10-06 2006-04-20 Sharp Corp 半導体装置
JP2009533839A (ja) * 2006-04-07 2009-09-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 弾性変形可能な集積回路装置
CN103213935B (zh) * 2006-09-06 2017-03-01 伊利诺伊大学评议会 二维器件阵列

Similar Documents

Publication Publication Date Title
JP2012508984A5 (cg-RX-API-DMAC7.html)
US10297572B2 (en) Discrete flexible interconnects for modules of integrated circuits
JP6411423B2 (ja) 高度に伸縮可能な電子部品
US10470304B2 (en) Flexible electronics apparatus and associated methods
TWI541968B (zh) 晶片封裝體
US20180308799A1 (en) Flexible electronic circuits with embedded integrated circuit die and methods of making and using the same
JP2009130104A5 (cg-RX-API-DMAC7.html)
WO2012071487A3 (en) Integrated circuit device with die bonded to polymer substrate
GB2521619A (en) An apparatus and associated methods for flexible carrier substrates
RU2015136239A (ru) Архитектура создания гибких корпусов
JP2009105297A5 (cg-RX-API-DMAC7.html)
JP2009110983A5 (cg-RX-API-DMAC7.html)
JP2010192747A5 (cg-RX-API-DMAC7.html)
CN105705328A (zh) 电互连薄片
JP2012015504A5 (cg-RX-API-DMAC7.html)
JP2018515918A5 (cg-RX-API-DMAC7.html)
WO2009095486A3 (en) Semiconductor package
JP2014165238A5 (cg-RX-API-DMAC7.html)
JP2011176340A5 (cg-RX-API-DMAC7.html)
KR101784192B1 (ko) 플렉서블 기판 상의 전기 회로
EP1780791A3 (en) Power circuit package and fabrication method
WO2011141886A3 (en) Pressure sensor
JP2007073976A5 (cg-RX-API-DMAC7.html)
JP2011005556A5 (cg-RX-API-DMAC7.html)
TWI277190B (en) Package structure for electronic device