JP2012508977A5 - - Google Patents

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Publication number
JP2012508977A5
JP2012508977A5 JP2011536307A JP2011536307A JP2012508977A5 JP 2012508977 A5 JP2012508977 A5 JP 2012508977A5 JP 2011536307 A JP2011536307 A JP 2011536307A JP 2011536307 A JP2011536307 A JP 2011536307A JP 2012508977 A5 JP2012508977 A5 JP 2012508977A5
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image sensor
sensor according
layer
different
charge collection
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JP2011536307A
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Japanese (ja)
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JP5676462B2 (ja
JP2012508977A (ja
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Priority claimed from US12/269,907 external-priority patent/US8400537B2/en
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JP2011536307A 2008-11-13 2009-10-30 色分解用の格子を有するイメージセンサ Active JP5676462B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/269,907 US8400537B2 (en) 2008-11-13 2008-11-13 Image sensors having gratings for color separation
US12/269,907 2008-11-13
PCT/US2009/005915 WO2010056285A1 (en) 2008-11-13 2009-10-30 Image sensors having gratings for color separation

Publications (3)

Publication Number Publication Date
JP2012508977A JP2012508977A (ja) 2012-04-12
JP2012508977A5 true JP2012508977A5 (enrdf_load_stackoverflow) 2012-08-02
JP5676462B2 JP5676462B2 (ja) 2015-02-25

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JP2011536307A Active JP5676462B2 (ja) 2008-11-13 2009-10-30 色分解用の格子を有するイメージセンサ

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US (1) US8400537B2 (enrdf_load_stackoverflow)
EP (1) EP2347443B1 (enrdf_load_stackoverflow)
JP (1) JP5676462B2 (enrdf_load_stackoverflow)
KR (1) KR101593258B1 (enrdf_load_stackoverflow)
CN (1) CN102197486B (enrdf_load_stackoverflow)
TW (1) TWI476908B (enrdf_load_stackoverflow)
WO (1) WO2010056285A1 (enrdf_load_stackoverflow)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
EP2583312A2 (en) 2010-06-18 2013-04-24 Sionyx, Inc. High speed photosensitive devices and associated methods
US9496308B2 (en) * 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
US9419161B2 (en) * 2011-06-24 2016-08-16 Boly Media Communications (Shenzhen) Co., Ltd. Hybrid multi-spectrum photosensitive pixel group, photosensitive device, and photosensitive system
EP2732402A2 (en) 2011-07-13 2014-05-21 Sionyx, Inc. Biometric imaging devices and associated methods
JP5864990B2 (ja) 2011-10-03 2016-02-17 キヤノン株式会社 固体撮像装置およびカメラ
KR20140112012A (ko) * 2012-01-12 2014-09-22 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 집적된 서브-파장 격자 시스템
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
JP6231741B2 (ja) 2012-12-10 2017-11-15 キヤノン株式会社 固体撮像装置およびその製造方法
US9762830B2 (en) 2013-02-15 2017-09-12 Sionyx, Llc High dynamic range CMOS image sensor having anti-blooming properties and associated methods
US9971078B2 (en) * 2013-03-05 2018-05-15 Rambus Inc. Phase gratings with odd symmetry for high-resolution lensless optical sensing
US9110240B2 (en) * 2013-03-05 2015-08-18 Rambus Inc. Phase gratings with odd symmetry for high-resolution lensed and lensless optical sensing
WO2014151093A1 (en) 2013-03-15 2014-09-25 Sionyx, Inc. Three dimensional imaging utilizing stacked imager devices and associated methods
US9209345B2 (en) 2013-06-29 2015-12-08 Sionyx, Inc. Shallow trench textured regions and associated methods
US9515113B2 (en) * 2013-08-27 2016-12-06 Rambus Inc. Optical sensing of nearby scenes with tessellated phase anti-symmetric gratings
WO2015157097A1 (en) * 2014-04-09 2015-10-15 Rambus Inc. Low-power image change detector
KR102219704B1 (ko) 2014-06-13 2021-02-24 삼성전자주식회사 색분리 소자 어레이, 상기 색분리 소자 어레이를 포함하는 이미지 센서, 및 상기 색분리 소자 어레이를 포함하는 촬상 장치
US9761730B2 (en) 2014-10-29 2017-09-12 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
WO2016118968A1 (en) * 2015-01-23 2016-07-28 Dartmouth College Multi-junction pixel image sensor with dielectric reflector between photo detection layers
US10761323B2 (en) 2015-03-04 2020-09-01 Nippon Seiki Co., Ltd. Lens array and image projection device
CN104867951B (zh) * 2015-04-23 2018-05-04 豪威科技(上海)有限公司 一种背照式传感器芯片及其制造方法
US10284825B2 (en) 2015-09-08 2019-05-07 Rambus Inc. Systems with integrated refractive and diffractive optics
KR102465995B1 (ko) * 2015-09-30 2022-11-25 삼성전자주식회사 색분할기 구조와 그 제조방법, 색분할기 구조를 포함하는 이미지센서 및 이미지센서를 포함하는 광학장치
FR3043495A1 (fr) * 2015-11-09 2017-05-12 St Microelectronics Crolles 2 Sas Capteur d'images a obturation globale
CN105428377A (zh) * 2015-11-11 2016-03-23 武汉新芯集成电路制造有限公司 一种cmos影像传感器
KR102524400B1 (ko) * 2016-07-04 2023-04-24 에스케이하이닉스 주식회사 하나의 컬러 필터 및 하나의 마이크로렌즈를 공유하는 다수 개의 포토다이오드들을 갖는 이미지 센서
CN108174059B (zh) * 2016-12-08 2021-04-13 松下知识产权经营株式会社 摄像装置
JP6975897B2 (ja) * 2016-12-27 2021-12-01 パナソニックＩｐマネジメント株式会社 画像生成装置及び撮像装置
US10578870B2 (en) 2017-07-26 2020-03-03 Magic Leap, Inc. Exit pupil expander
US10468448B2 (en) * 2017-11-30 2019-11-05 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor image sensor and method for forming the same
CN112930490A (zh) * 2018-10-22 2021-06-08 ams传感器亚洲私人有限公司 结构化照明装置
EP3981143A4 (en) 2019-06-05 2023-07-26 Airy3d Inc. ILLUMINATED FIELD IMAGING DEVICE AND METHOD FOR 3D SCANNING
CN111427107B (zh) * 2020-04-07 2022-02-15 上海冠众光学科技有限公司 一种衍射光学元件取值模型、衍射光学元件及其制作方法
CN112616008B (zh) * 2020-12-31 2022-08-30 维沃移动通信有限公司 电子设备及其摄像模组
CN113554578B (zh) * 2021-07-23 2024-05-31 奥比中光科技集团股份有限公司 一种光谱图像的确定方法、装置、终端和存储介质
WO2024147826A1 (en) * 2023-01-05 2024-07-11 Transformative Optics Corporation Color image sensors, methods and systems
WO2024182612A1 (en) * 2023-03-02 2024-09-06 Transformative Optics Corporation Color image sensors, methods and systems

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506949A (en) * 1983-05-27 1985-03-26 Rca Corporation Diffractive color separation filter
US5164831A (en) * 1990-03-15 1992-11-17 Eastman Kodak Company Electronic still camera providing multi-format storage of full and reduced resolution images
JP2601148B2 (ja) * 1993-07-23 1997-04-16 日本電気株式会社 固体撮像装置
JP3620237B2 (ja) * 1997-09-29 2005-02-16 ソニー株式会社 固体撮像素子
US6300612B1 (en) * 1998-02-02 2001-10-09 Uniax Corporation Image sensors made from organic semiconductors
JPH11284158A (ja) * 1998-03-27 1999-10-15 Sony Corp 固体撮像素子と固体撮像素子の製造方法
FR2781929B1 (fr) * 1998-07-28 2002-08-30 St Microelectronics Sa Capteur d'image a reseau de photodiodes
JP2001309395A (ja) * 2000-04-21 2001-11-02 Sony Corp 固体撮像素子及びその製造方法
US6556349B2 (en) 2000-12-27 2003-04-29 Honeywell International Inc. Variable focal length micro lens array field curvature corrector
JP3759435B2 (ja) * 2001-07-11 2006-03-22 ソニー株式会社 Ｘ−ｙアドレス型固体撮像素子
US7199931B2 (en) * 2003-10-09 2007-04-03 Micron Technology, Inc. Gapless microlens array and method of fabrication
CN100449764C (zh) * 2003-11-18 2009-01-07 松下电器产业株式会社 光电探测器
JP4181487B2 (ja) * 2003-11-28 2008-11-12 松下電器産業株式会社 固体撮像装置とその製造方法
KR100680386B1 (ko) 2004-01-15 2007-02-08 마츠시타 덴끼 산교 가부시키가이샤 고체촬상장치, 고체촬상장치의 제조방법 및 이를 이용한카메라
US7068432B2 (en) * 2004-07-27 2006-06-27 Micron Technology, Inc. Controlling lens shape in a microlens array
JP4507769B2 (ja) * 2004-08-31 2010-07-21 ソニー株式会社 固体撮像素子、カメラモジュール及び電子機器モジュール
KR100672699B1 (ko) * 2004-12-29 2007-01-22 동부일렉트로닉스 주식회사 씨모스 이미지 센서의 제조방법
KR100658930B1 (ko) * 2004-12-30 2006-12-15 매그나칩 반도체 유한회사 칼라별 초점 거리 조절이 가능한 이미지센서 및 그 제조방법
US7560684B2 (en) * 2005-03-23 2009-07-14 Panasonic Corporation On-vehicle imaging device
JP4456040B2 (ja) * 2005-06-17 2010-04-28 パナソニック株式会社 固体撮像素子
US7736939B2 (en) * 2005-07-07 2010-06-15 United Microelectronics Corp. Method for forming microlenses of different curvatures and fabricating process of solid-state image sensor
US7522341B2 (en) * 2005-07-12 2009-04-21 Micron Technology, Inc. Sharing of microlenses among pixels in image sensors
JP2007103401A (ja) * 2005-09-30 2007-04-19 Matsushita Electric Ind Co Ltd 撮像装置及び画像処理装置
JP2007109801A (ja) * 2005-10-12 2007-04-26 Sumitomo Electric Ind Ltd 固体撮像装置とその製造方法
JP2008005383A (ja) * 2006-06-26 2008-01-10 Matsushita Electric Ind Co Ltd 撮像装置及びイメージセンサ
US7505206B2 (en) * 2006-07-10 2009-03-17 Taiwan Semiconductor Manufacturing Company Microlens structure for improved CMOS image sensor sensitivity
FR2904432B1 (fr) 2006-07-25 2008-10-24 Commissariat Energie Atomique Structure matricielle de filtrage optique et capteur d'images associe
JP2008041779A (ja) * 2006-08-02 2008-02-21 Matsushita Electric Ind Co Ltd 固体撮像装置
US8629986B2 (en) 2006-08-09 2014-01-14 Biozoom Technologies, Inc. Optical filter and method for the production of the same, and device for the examination of electromagnetic radiation
US8610806B2 (en) * 2006-08-28 2013-12-17 Micron Technology, Inc. Color filter array, imagers and systems having same, and methods of fabrication and use thereof
KR20080049186A (ko) * 2006-11-30 2008-06-04 동부일렉트로닉스 주식회사 이미지 센서 및 그 제조방법
CN102007593B (zh) 2008-04-18 2013-01-02 Nxp股份有限公司 集成电路制造方法

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