JP2012501093A - アルミニウムがドープされた金属炭窒化物ゲート電極の作製方法 - Google Patents
アルミニウムがドープされた金属炭窒化物ゲート電極の作製方法 Download PDFInfo
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 113
- 239000002184 metal Substances 0.000 title claims abstract description 113
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 106
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 103
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims abstract description 86
- 239000002243 precursor Substances 0.000 claims abstract description 85
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 60
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims abstract description 58
- 238000000151 deposition Methods 0.000 claims abstract description 56
- 230000008021 deposition Effects 0.000 claims abstract description 45
- 239000010936 titanium Substances 0.000 claims abstract description 31
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 24
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000001179 sorption measurement Methods 0.000 claims abstract description 19
- 230000008569 process Effects 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 239000007789 gas Substances 0.000 claims description 88
- 239000000463 material Substances 0.000 claims description 42
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 21
- 238000000197 pyrolysis Methods 0.000 claims description 12
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 9
- 229910052801 chlorine Inorganic materials 0.000 claims description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 3
- 229910011208 Ti—N Inorganic materials 0.000 claims description 3
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 claims description 3
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 claims description 3
- MNWRORMXBIWXCI-UHFFFAOYSA-N tetrakis(dimethylamido)titanium Chemical compound CN(C)[Ti](N(C)C)(N(C)C)N(C)C MNWRORMXBIWXCI-UHFFFAOYSA-N 0.000 claims description 2
- 230000002123 temporal effect Effects 0.000 claims 4
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- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052735 hafnium Inorganic materials 0.000 description 4
- 239000003446 ligand Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
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- INIGCWGJTZDVRY-UHFFFAOYSA-N hafnium zirconium Chemical compound [Zr].[Hf] INIGCWGJTZDVRY-UHFFFAOYSA-N 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 229910052914 metal silicate Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- 101100521334 Mus musculus Prom1 gene Proteins 0.000 description 1
- 229910006501 ZrSiO Inorganic materials 0.000 description 1
- RQMIWLMVTCKXAQ-UHFFFAOYSA-N [AlH3].[C] Chemical compound [AlH3].[C] RQMIWLMVTCKXAQ-UHFFFAOYSA-N 0.000 description 1
- RFBRDHGMLHXGOB-UHFFFAOYSA-N [Si].[Zr].[Hf] Chemical compound [Si].[Zr].[Hf] RFBRDHGMLHXGOB-UHFFFAOYSA-N 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- -1 allyloxide Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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- 230000033228 biological regulation Effects 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
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- 239000013078 crystal Substances 0.000 description 1
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- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
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- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- KQHQLIAOAVMAOW-UHFFFAOYSA-N hafnium(4+) oxygen(2-) zirconium(4+) Chemical compound [O--].[O--].[O--].[O--].[Zr+4].[Hf+4] KQHQLIAOAVMAOW-UHFFFAOYSA-N 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical group O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- UVGLBOPDEUYYCS-UHFFFAOYSA-N silicon zirconium Chemical compound [Si].[Zr] UVGLBOPDEUYYCS-UHFFFAOYSA-N 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000004846 x-ray emission Methods 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/808—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a PN junction gate, e.g. PN homojunction gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28088—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a composite, e.g. TiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
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Abstract
Description
さらに処理チャンバ10はさらに、ダクト38を介して、真空排気システム34とバルブ36を有する圧力制御システム32と結合する。圧力制御システム32は、処理チャンバ10を、基板25上での薄膜作製及び第1処理材料、第2処理材料、及び第3処理材料の使用に適した圧力にまで制御可能なように排気するように備えられている。真空排気システム34は最大5000リットル/秒(以上)の排気能力を有するターボ分子ポンプ(TMP)又はクライオポンプを有して良い。バルブ36はチャンバ圧力を絞るゲートバルブを有して良い。しかもチャンバ圧力を監視する装置(図示されていない)が処理チャンバ10と結合して良い。圧力測定装置は絶対キャパシタンスマノメータであって良い。
Claims (20)
- 半導体デバイスの作製方法であって、
当該方法は:
上に誘電層を有する基板を供する提供工程;及び
プラズマが存在しない状態で前記誘電層上にアルミニウムがドープされた金属炭窒化物ゲート電極を作製する作製工程;
を有し、
前記作製工程は:
タンタル炭窒化物膜及び/又はチタン炭窒化物膜を含む金属炭窒化物前駆体の気体パルスへ前記基板を曝露することにより金属炭窒化物膜を堆積する堆積工程;
アルミニウム前駆体の気体パルスへ前記基板を曝露することにより前記金属炭窒化物上に前記アルミニウム前駆体の原子層を吸着させる吸着工程であって、前記堆積工程及び吸着工程中、前記基板は、前記金属炭窒化物前駆体の熱分解温度よりも高く、かつ前記アルミニウム前駆体の熱分解温度よりも低い温度に維持される、吸着工程;
前記堆積工程及び前記吸着工程を必要な回数繰り返す繰り返し工程;
により行われる、
方法。 - 前記堆積工程と前記吸着工程が時間的な重なりを有していない、請求項1に記載の方法。
- 前記堆積工程が、追加の窒素気体源を有する気体パルスに前記基板を曝露することなく実行される、請求項1に記載の方法。
- 前記堆積工程の前に前記誘電層上に第1の追加金属炭窒化物膜を堆積する第1追加堆積工程及び前記アルミニウムがドープされた金属炭窒化物ゲート電極上に第2の追加金属炭窒化物膜を堆積する第2追加堆積工程をさらに有する請求項3に記載の方法であって、
前記第1追加堆積工程及び/又は前記第2追加堆積工程は、タンタル、チタン、又は上記の混合物を有する追加の金属炭窒化物前駆体、及び、NH3、NH(CH3)2、N2H4、又はN2H3CH3を有する追加の窒素気体源の気体パルスに、前記基板を曝露する工程を有する、
方法。 - 前記堆積工程が、金属炭窒化物前駆体の気体パルスと少なくとも部分的な時間的重なりを有する、追加の窒素気体源を含む気体パルスに、前記基板を曝露する工程をさらに有する、請求項1に記載の方法。
- 前記追加の窒素気体源を含む気体パルスが、NH3、NH(CH3)2、N2H4、又はN2H3CH3を有する、請求項5に記載の方法。
- 前記作製工程が、前記追加の窒素気体源の第2気体パルスに前記基板を曝露する工程をさらに有し、
前記追加の窒素気体源の第2気体パルスは、前記金属炭窒化物前駆体の気体パルス又は前記アルミニウム前駆体の気体パルスとは時間的な重なりを有していない、
請求項5に記載の方法。 - 前記堆積工程が、前記金属炭窒化物前駆体の気体パルス又は前記アルミニウム前駆体の気体パルスとは時間的な重なりを有していない前記金属炭窒化物前駆体の追加気体パルスに前記基板を曝露する工程をさらに有する、請求項5に記載の方法。
- 前記アルミニウムがドープされた金属炭窒化物ゲート電極上に追加の金属炭窒化物膜を堆積する工程をさらに有する請求項5に記載の方法であって、
前記の追加の金属炭窒化物膜を堆積する工程は、タンタル、チタン、又はタンタルとチタンの混合物を有する追加の金属炭窒化物前駆体と追加の窒素気体源に前記基板を曝露する工程を有する、
方法。 - 前記金属炭窒化物前駆体が、Ta-N分子内結合を有するタンタル炭窒化物前駆体を有する、請求項1に記載の方法。
- 前記タンタル炭窒化物前駆体が、Ta(NMe2)3(NCMe2Et)(TAIMATA)、Ta(NEt2)5(PDEAT)、Ta(NMe2)5(PDMAT)、Ta(NEtMe)5(PEMAT)、(tBuN)Ta(NMe2)3(TBTDMT)、(tBuN)Ta(NEt2)3(TBTDET)、(tBuN)Ta(NEtMe)3(TBTEMT)、及び(iPrN)Ta(NEt2)3(IPTDET)を有する、請求項10に記載の方法。
- 前記金属炭窒化物前駆体が、Ti-N分子内結合を有するチタン炭窒化物前駆体を有する、請求項1に記載の方法。
- 前記チタン炭窒化物前駆体が、Ti(NEt2)4(TDEAT)、Ti(NMeEt)4(TEMAT)、又はTi(NMe2)4(TDMAT)を有する、請求項12に記載の方法。
- 前記アルミニウム前駆体が、AlMe3、AlEt3、AIMe2H、[Al(OsBu)3]4、 Al(CH3COCHCOCH3)3、AlCl3、AlBr3、AlI3、Al(OiPr)3、[Al(NMe2)3]2、Al(iBu)2Cl、Al(ZBu)3、 Al(iBu)2H、AlEt2Cl、Et3Al2(OsBu)3、Al(THD)3、H3AlNMe3、H3AlNEt3、H3AlNMe2Et、又はH3AlMeEt2を有する、請求項1に記載の方法。
- 前記アルミニウムがドープされた金属炭窒化物ゲート電極が、5〜50原子%のアルミニウムを有する、請求項1に記載の方法。
- 半導体デバイスの作製方法であって、
当該方法は:
上にhigh-k膜を有する基板を供する提供工程;及び
プラズマが存在しない状態で前記high-k膜上にアルミニウムがドープされた金属炭窒化物ゲート電極を作製する作製工程;
を有し、
前記作製工程は:
Ta-N分子内結合を有するタンタル炭窒化物前駆体又はTi-N分子内結合を有するチタン炭窒化物前駆体を有する金属炭窒化物膜を含む金属炭窒化物前駆体の気体パルスへ前記基板を曝露し、かつ前記金属炭窒化物前駆体の気体パルスとは少なくとも部分的な時間的重なりを有する追加の窒素気体源を有する気体パルスへ前記基板を曝露することにより金属炭窒化物膜を堆積する堆積工程;
アルミニウム前駆体の気体パルスを前記基板へ曝露することにより前記金属炭窒化物上に前記アルミニウム前駆体の原子層を吸着させる吸着工程であって、前記堆積工程と吸着工程とは時間的な重なりを有さず、前記堆積工程及び吸着工程中、前記基板は、前記金属炭窒化物前駆体の熱分解温度よりも高く、かつ前記アルミニウム前駆体の熱分解温度よりも低い温度に維持される、吸着工程;並びに、
前記堆積工程及び前記吸着工程を必要な回数繰り返す繰り返し工程;
を有する、
方法。 - 前記追加の窒素気体源を含む気体パルスが、NH3、NH(CH3)2、N2H4、又はN2H3CH3を有する、請求項16に記載の方法。
- 前記タンタル炭窒化物前駆体が、Ta(NMe2)3(NCMe2Et)(TAIMATA)、Ta(NEt2)5(PDEAT)、Ta(NMe2)5(PDMAT)、Ta(NEtMe)5(PEMAT)、(tBuN)Ta(NMe2)3(TBTDMT)、(tBuN)Ta(NEt2)3(TBTDET)、(tBuN)Ta(NEtMe)3(TBTEMT)、及び(iPrN)Ta(NEt2)3(IPTDET)を有し、
前記アルミニウム前駆体が、AlMe3、AlEt3、AIMe2H、[Al(OsBu)3]4、 Al(CH3COCHCOCH3)3、AlCl3、AlBr3、AlI3、Al(OiPr)3、[Al(NMe2)3]2、Al(iBu)2Cl、Al(ZBu)3、 Al(iBu)2H、AlEt2Cl、Et3Al2(OsBu)3、Al(THD)3、H3AlNMe3、H3AlNEt3、H3AlNMe2Et、又はH3AlMeEt2を有する、
請求項16に記載の方法。 - 前記アルミニウムがドープされた金属炭窒化物ゲート電極が、5〜50原子%のアルミニウムを有する、請求項16に記載の方法。
- 半導体デバイスの作製方法であって、
当該方法は:
上にhigh-k膜を有する基板を供する提供工程;及び
プラズマが存在しない状態で前記high-k膜上にアルミニウムがドープされた金属炭窒化物ゲート電極を作製する作製工程;
を有し、
前記作製工程は:
(tBuN)Ta(NEtMe)3(TBTEMT)前駆体の気体パルスへ前記基板を曝露することによりタンタル炭窒化物膜を堆積する堆積工程;
AlMe3前駆体の気体パルスを前記基板へ曝露することにより前記金属炭窒化物上に前記アルミニウム前駆体の原子層を吸着させる吸着工程であって、前記堆積工程及び吸着工程中、前記基板は、前記(tBuN)Ta(NEtMe)3(TBTEMT)前駆体の熱分解温度よりも高く、かつ前記AlMe3前駆体の熱分解温度よりも低い温度に維持される、吸着工程;並びに、
前記堆積工程及び前記吸着工程を必要な回数繰り返す繰り返し工程;
を有し、
前記アルミニウムがドープされた金属炭窒化物ゲート電極は5〜50%原子%のアルミニウムを有する、
方法。
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