JP2012256769A - Semiconductor device and manufacturing the same - Google Patents

Semiconductor device and manufacturing the same Download PDF

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JP2012256769A
JP2012256769A JP2011129751A JP2011129751A JP2012256769A JP 2012256769 A JP2012256769 A JP 2012256769A JP 2011129751 A JP2011129751 A JP 2011129751A JP 2011129751 A JP2011129751 A JP 2011129751A JP 2012256769 A JP2012256769 A JP 2012256769A
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semiconductor element
electrode portion
wiring
height position
mounting member
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JP5748336B2 (en
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Masato Suzuki
雅登 鈴木
Masatoshi Fujita
政利 藤田
Kenji Tsukada
謙磁 塚田
Akihiro Kawajiri
明宏 川尻
Kazuhiro Sugiyama
和裕 杉山
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
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    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/7615—Means for depositing
    • H01L2224/76151—Means for direct writing
    • H01L2224/76155—Jetting means, e.g. ink jet
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/821—Forming a build-up interconnect
    • H01L2224/82101—Forming a build-up interconnect by additive methods, e.g. direct writing
    • H01L2224/82102—Forming a build-up interconnect by additive methods, e.g. direct writing using jetting, e.g. ink jet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Abstract

PROBLEM TO BE SOLVED: To achieve commonality of mounting members for mounting different semiconductor elements having different dimensions in a semiconductor device in which semiconductor elements are mounted in element mounting recess parts of mounting members.SOLUTION: Liquid insulation resin 16 less by a volume of an LED element 13 than that of an element mounting recess part 12 of a mounting member 11, is injected into the element mounting recess part 12. Then the LED element 13 absorbed to a suction nozzle 21 is descended to be immersed into the liquid insulation resin 16 in the element mounting recess part 12, the liquid insulation resin 16 in the element mounting recess part 12 is cured to hold the LED element 13 by the insulation resin 16 and to planarize a wiring path between an electrode part 14 on the LED element 13 and an electrode part 15 on the mounting element 11 by the insulation resin 16 in the state of making height positions of the electrode part 14 on the LED element 13 and the electrode part 15 on the mounting member 11 correspond to each other. A wiring 17 is formed on the wiring path by using the droplet discharge method or the printing method.

Description

本発明は、搭載部材に形成した素子搭載凹部内に半導体素子を搭載し、該半導体素子上面の電極部と該搭載部材上面の電極部とを配線で接続した半導体装置及びその製造方法に関する発明である。   The present invention relates to a semiconductor device in which a semiconductor element is mounted in an element mounting recess formed in a mounting member, and an electrode portion on the upper surface of the semiconductor element and an electrode portion on the upper surface of the mounting member are connected by wiring, and a manufacturing method thereof. is there.

従来より、半導体素子の実装工程では、半導体素子を搭載部材（回路基板、リードフレーム等）にダイボンドした後に、該半導体素子の電極部と搭載部材の電極部との間をワイヤボンディングで配線するのが一般的である。   Conventionally, in the mounting process of a semiconductor element, after the semiconductor element is die-bonded to a mounting member (circuit board, lead frame, etc.), wiring between the electrode part of the semiconductor element and the electrode part of the mounting member is performed by wire bonding. Is common.

しかし、特許文献１（特許第３９９２０３８号公報）に記載されているように、ワイヤボンディングを行うときの機械的なストレスによって不良が発生する可能性があるため、ワイヤボンディングに代わる接続信頼性の高い実装構造を低コストで実現することを目的として、配線基板上に搭載した半導体素子の周囲に流動性の樹脂材料をディスペンサで吐出して、半導体素子の上面と配線基板の表面との間を傾斜面でつなぐ樹脂スロープを形成した後、半導体素子上面の電極部と配線基板の電極部との間を接続する配線パターンを、インクジェット等の液滴吐出法により樹脂スロープ上に形成する配線技術が提案されている。   However, as described in Patent Document 1 (Japanese Patent No. 3992038), there is a possibility that defects may occur due to mechanical stress when wire bonding is performed. Therefore, connection reliability that replaces wire bonding is high. In order to realize the mounting structure at a low cost, a fluid resin material is discharged around the semiconductor element mounted on the wiring board with a dispenser, and the upper surface of the semiconductor element and the surface of the wiring board are inclined. Proposed wiring technology to form a wiring pattern that connects the electrode part on the upper surface of the semiconductor element and the electrode part of the wiring board on the resin slope by the droplet discharge method such as inkjet after forming the resin slope connecting the surfaces Has been.

上記特許文献１の実装構造では、半導体素子上面の電極部と配線基板の電極部との間の配線経路に半導体素子の高さ相当分の段差ができるため、配線パターンを液滴吐出法で形成するには、半導体素子の側面上端から配線基板上面に跨がる樹脂スロープを形成して、半導体素子上面の電極部と配線基板の電極部との間を、段差のない傾斜面で結ぶ必要がある。   In the mounting structure disclosed in Patent Document 1, since a step corresponding to the height of the semiconductor element is formed in the wiring path between the electrode part on the upper surface of the semiconductor element and the electrode part of the wiring substrate, the wiring pattern is formed by a droplet discharge method. In order to achieve this, it is necessary to form a resin slope that extends from the upper end of the side surface of the semiconductor element to the upper surface of the wiring board, and connect the electrode part on the upper surface of the semiconductor element and the electrode part of the wiring board with an inclined surface having no step is there.

そこで、搭載部材に形成した素子搭載凹部内に半導体素子を搭載することで、半導体素子上面の電極部と該搭載部材の素子搭載凹部の外側に設けた電極部とを同一高さとしたものがある。このような構造に対しては、特許文献２（特開２００５−５０９１１号公報）に記載されているように、搭載部材の素子搭載凹部の内周側面と半導体素子の外周側面との間の隙間（溝）に絶縁体を埋め込むことで、半導体素子上面の電極部と搭載部材の電極部との間の配線経路を平坦化して、該配線経路にインクジェット等の液滴吐出法で導電性のインクを吐出して配線を形成することが提案されている。   Therefore, there is one in which the semiconductor element is mounted in the element mounting recess formed in the mounting member, so that the electrode portion on the upper surface of the semiconductor element and the electrode portion provided outside the element mounting recess of the mounting member have the same height. . For such a structure, as described in Patent Document 2 (Japanese Patent Laid-Open No. 2005-50911), a gap between the inner peripheral side surface of the element mounting recess of the mounting member and the outer peripheral side surface of the semiconductor element. By embedding an insulator in the (groove), the wiring path between the electrode part on the upper surface of the semiconductor element and the electrode part of the mounting member is flattened, and conductive ink is applied to the wiring path by a droplet discharge method such as inkjet. It has been proposed to form a wiring by discharging the liquid.

特許第３９９２０３８号公報Japanese Patent No. 3992038 特開２００５−５０９１１号公報JP 2005-50911 A

搭載部材の素子搭載凹部内に搭載する半導体素子は、少し寸法が異なっても、機能的に同等の半導体素子であれば、同じ仕様の搭載部材の素子搭載凹部内に搭載可能であり、搭載部材を共通化してコストダウンが可能である。   A semiconductor element to be mounted in the element mounting recess of the mounting member can be mounted in the element mounting recess of the mounting member of the same specification as long as it is a functionally equivalent semiconductor element even if the dimensions are slightly different. It is possible to reduce the cost by sharing the.

しかし、上記特許文献２の配線技術では、半導体素子上面の電極部と搭載部材の電極部の高さ位置が同一である必要があるため、高さ寸法が異なる半導体素子に対しては、その高さ寸法に応じて素子搭載凹部の高さ寸法（搭載部材の電極部の高さ位置）が異なる搭載部材を使用する必要があり、搭載部材を共通化できない。   However, in the wiring technique disclosed in Patent Document 2, the height positions of the electrode portion on the upper surface of the semiconductor element and the electrode portion of the mounting member need to be the same. It is necessary to use a mounting member in which the height dimension of the element mounting recess (the height position of the electrode portion of the mounting member) differs according to the height dimension, and the mounting member cannot be shared.

そこで、本発明が解決しようとする課題は、搭載部材の素子搭載凹部内に半導体素子を搭載した半導体装置において、高さ寸法の異なる半導体素子を搭載する搭載部材を共通化することが可能となり、搭載部材の共通化によるコストダウンを実現できる半導体装置及びその製造方法を提供することである。   Therefore, the problem to be solved by the present invention is that in a semiconductor device in which a semiconductor element is mounted in an element mounting recess of a mounting member, it is possible to share a mounting member on which semiconductor elements having different height dimensions are mounted, It is an object to provide a semiconductor device and a method for manufacturing the same that can realize cost reduction by using a common mounting member.

上記課題を解決するために、請求項１に係る発明は、搭載部材に形成した素子搭載凹部内に半導体素子を搭載し、該半導体素子上面の電極部と該搭載部材上面の電極部とを配線で接続した半導体装置において、前記素子搭載凹部内に搭載する前記半導体素子の高さ位置を該半導体素子上面の電極部の高さ位置が該搭載部材上面の電極部の高さ位置と一致するように調整する素子高さ位置調整手段を備え、前記素子搭載凹部内の前記半導体素子の周囲の隙間に絶縁性樹脂を充填して該半導体素子上面の電極部と前記搭載部材上面の電極部との間の配線経路を該絶縁性樹脂で平坦化して、該配線経路に前記配線を形成したものである。   In order to solve the above-mentioned problem, the invention according to claim 1 is directed to mounting a semiconductor element in an element mounting recess formed in the mounting member, and wiring the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member. In the semiconductor device connected in the above, the height position of the semiconductor element mounted in the element mounting recess is set so that the height position of the electrode part on the upper surface of the semiconductor element matches the height position of the electrode part on the upper surface of the mounting member. An element height position adjusting means for adjusting the gap between the semiconductor element in the element mounting recess and filling the insulating resin with a gap between the electrode part on the upper surface of the semiconductor element and the electrode part on the upper surface of the mounting member. The wiring path between them is flattened with the insulating resin, and the wiring is formed in the wiring path.

この構成では、素子搭載凹部内に搭載する半導体素子の高さ位置を該半導体素子上面の電極部の高さ位置が該搭載部材上面の電極部の高さ位置と一致するように調整する素子高さ位置調整手段を備えているため、半導体素子の高さ寸法が異なっていても、素子高さ位置調整手段によって半導体素子上面の電極部の高さ位置を搭載部材上面の電極部の高さ位置と一致させて、該半導体素子上面の電極部と該搭載部材上面の電極部との間の配線経路を該絶縁性樹脂で平坦化して配線することができる。これにより、高さ寸法の異なる半導体素子を搭載する搭載部材を共通化することが可能となり、搭載部材の共通化によるコストダウンを実現できる。   In this configuration, the height of the semiconductor element mounted in the element mounting recess is adjusted so that the height position of the electrode portion on the upper surface of the semiconductor element coincides with the height position of the electrode portion on the upper surface of the mounting member. The height position of the electrode part on the upper surface of the semiconductor element is adjusted by the element height position adjusting means even if the height dimension of the semiconductor element is different. The wiring path between the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member can be flattened with the insulating resin for wiring. As a result, it is possible to share the mounting member on which the semiconductor elements having different height dimensions are mounted, and it is possible to reduce the cost by sharing the mounting member.

この場合、素子高さ位置調整手段として、別体のスペーサを用いても良いが、厚みの異なる複数のスペーサを用意しなければならない。   In this case, a separate spacer may be used as the element height position adjusting means, but a plurality of spacers having different thicknesses must be prepared.

そこで、請求項２のように、素子高さ位置調整手段は、配線経路を平坦化する絶縁性樹脂を素子搭載凹部の底面と半導体素子の下面との間にも充填して形成するようにしても良い。この請求項２の構成は、後述する請求項５，６の製造方法により能率良く製造することができる。   Therefore, as described in claim 2, the element height position adjusting means is formed by filling the insulating resin for flattening the wiring path between the bottom surface of the element mounting recess and the lower surface of the semiconductor element. Also good. The structure of claim 2 can be efficiently manufactured by the manufacturing method of claims 5 and 6 described later.

或は、請求項３のように、素子高さ位置調整手段は、予め素子搭載凹部内に半導体素子の高さ位置の調整に必要な量の樹脂を注入して形成し、該素子高さ位置調整手段上に該半導体素子を搭載するようにしても良い。この請求項３の構成は、後述する請求項８の製造方法により能率良く製造することができる。   Alternatively, the element height position adjusting means is formed by injecting an amount of resin necessary for adjusting the height position of the semiconductor element into the element mounting recess in advance. The semiconductor element may be mounted on the adjusting means. The structure of claim 3 can be efficiently manufactured by the manufacturing method of claim 8 described later.

この場合、半導体素子上面の電極部と該搭載部材上面の電極部との間の配線経路が絶縁性樹脂で平坦化されているため、請求項４のように、半導体素子上面の電極部と搭載部材上面の電極部との間を接続する配線は、液滴吐出法又は印刷法により形成すると良い。ここで、液滴吐出法では、インクジェット、ディスペンサ等により導電材料を配線経路上に吐出して配線パターンを形成する。印刷法では、スクリーン印刷等により配線パターンを形成する。   In this case, since the wiring path between the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member is flattened with an insulating resin, the electrode portion on the upper surface of the semiconductor element and the mounting are mounted. The wiring connecting between the electrode portions on the upper surface of the member is preferably formed by a droplet discharge method or a printing method. Here, in the droplet discharge method, a conductive material is discharged onto a wiring path by an ink jet, a dispenser or the like to form a wiring pattern. In the printing method, a wiring pattern is formed by screen printing or the like.

前述した請求項２の半導体装置を製造する場合は、請求項５のように、素子搭載凹部の容積より半導体素子の体積分だけ少ない量の液状の絶縁性樹脂を該素子搭載凹部内に注入する工程と、吸着ノズルに半導体素子を吸着して該半導体素子を前記素子搭載凹部内の絶縁性樹脂の液中に浸すように下降させて該半導体素子上面の電極部の高さ位置が前記搭載部材上面の電極部の高さ位置と一致したときに該半導体素子の下降をストップさせる素子セット工程と、前記素子搭載凹部内の絶縁性樹脂を硬化させて前記半導体素子を該絶縁性樹脂で固定すると共に、該半導体素子上面の電極部と前記搭載部材上面の電極部との間の配線経路を該絶縁性樹脂で平坦化し、前記吸着ノズルによる該半導体素子の吸着を解除して該吸着ノズルを元の位置へ戻す工程と、前記配線経路に配線を形成する配線形成工程とを行うようにすれば良い。   When manufacturing the semiconductor device according to claim 2 described above, as in claim 5, a liquid insulating resin in an amount smaller than the volume of the element mounting recess by the volume of the semiconductor element is injected into the element mounting recess. And a step of adsorbing the semiconductor element to the adsorption nozzle and lowering the semiconductor element so as to be immersed in the liquid of the insulating resin in the element mounting recess, and the height position of the electrode portion on the upper surface of the semiconductor element is the mounting member An element setting step for stopping the lowering of the semiconductor element when it coincides with the height position of the electrode portion on the upper surface, and the insulating resin in the element mounting recess is cured to fix the semiconductor element with the insulating resin In addition, the wiring path between the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member is flattened with the insulating resin, and the suction of the semiconductor element by the suction nozzle is released to return the suction nozzle to the original position. Return to position A step, may be performed and a wiring forming step of forming a wiring on the wiring path.

或は、請求項６のように、吸着ノズルに半導体素子を吸着して該半導体素子を前記素子搭載凹部内に下降させて該半導体素子上面の電極部の高さ位置が搭載部材上面の電極部の高さ位置と一致したときに該半導体素子の下降をストップさせる素子セット工程と、前記素子搭載凹部内の半導体素子の周囲の隙間に液状の絶縁性樹脂を注入して該絶縁性樹脂の液面が該半導体素子上面の電極部と同一高さになったときに該絶縁性樹脂の注入を停止する工程と、前記素子搭載凹部内の絶縁性樹脂を硬化させて前記半導体素子を該絶縁性樹脂で固定すると共に、該半導体素子上面の電極部と前記搭載部材上面の電極部との間の配線経路を該絶縁性樹脂で平坦化して、前記吸着ノズルによる該半導体素子の吸着を解除して該吸着ノズルを元の位置へ戻す工程と、前記配線経路に配線を形成する配線形成工程とを行うようにしても良い。   Alternatively, the semiconductor element is adsorbed by the adsorption nozzle and the semiconductor element is lowered into the element mounting recess so that the height position of the electrode portion on the upper surface of the semiconductor element is the electrode portion on the upper surface of the mounting member. An element setting step for stopping the lowering of the semiconductor element when it coincides with the height position of the semiconductor element, and injecting a liquid insulating resin into a gap around the semiconductor element in the element mounting recess, Stopping the injection of the insulating resin when the surface is flush with the electrode portion on the upper surface of the semiconductor element; and curing the insulating resin in the element mounting recess to make the insulating element While fixing with resin, the wiring path between the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member is flattened with the insulating resin, and the suction of the semiconductor element by the suction nozzle is released. Return the suction nozzle to its original position And extent, may be performed and a wiring forming step of forming a wiring on the wiring path.

上記請求項５の製造方法と請求項６の製造方法との相違は、請求項５では、素子搭載凹部内に絶縁性樹脂を注入した後に、半導体素子を素子搭載凹部内にセットするのに対して、請求項６では、半導体素子を素子搭載凹部内にセットした後に、素子搭載凹部内の半導体素子の周囲の隙間に絶縁性樹脂を注入するようにしている。請求項５，６のいずれの製造方法でも、請求項２の半導体装置を能率良く製造することができる。   The difference between the manufacturing method of claim 5 and the manufacturing method of claim 6 is that, in claim 5, the semiconductor element is set in the element mounting recess after the insulating resin is injected into the element mounting recess. According to the sixth aspect of the present invention, after the semiconductor element is set in the element mounting recess, the insulating resin is injected into the gap around the semiconductor element in the element mounting recess. According to any of the manufacturing methods of claims 5 and 6, the semiconductor device of claim 2 can be efficiently manufactured.

上記請求項５，６の製造方法において、素子搭載凹部内にセットする半導体素子の高さ位置の管理は、吸着ノズルの高さ位置（Ｚ方向位置）を制御する機能を用いれば良いが、吸着ノズルの高さ位置の制御誤差や各部の寸法ばらつきによって半導体素子の高さ位置のずれが生じてしまう可能性がある。   In the manufacturing method according to claims 5 and 6, the height position of the semiconductor element set in the element mounting recess may be managed by using a function for controlling the height position (Z-direction position) of the suction nozzle. There is a possibility that a deviation in the height position of the semiconductor element may occur due to a control error in the height position of the nozzle and a dimensional variation in each part.

この対策として、請求項７のように、吸着ノズルには、素子セット工程で該吸着ノズルに吸着した半導体素子上面の電極部の高さ位置が搭載部材上面の電極部の高さ位置と一致したときに該搭載部材上面に当接して該吸着ノズルの下降をストップさせるストッパーを設けるようにすると良い。このようにすれば、吸着ノズルに吸着した半導体素子を素子搭載凹部内に下降させる際に、吸着ノズルに設けたストッパーが搭載部材上面に当接したときに、半導体素子上面の電極部の高さ位置が搭載部材上面の電極部の高さ位置と一致して、それ以上の吸着ノズルの下降（半導体素子の下降）がストップされた状態となるため、吸着ノズルの高さ位置の制御誤差や各部の寸法ばらつきがあったとしても、確実に半導体素子上面の電極部の高さ位置を搭載部材上面の電極部の高さ位置と一致させることができる。   As a countermeasure against this, as in claim 7, in the suction nozzle, the height position of the electrode portion on the upper surface of the semiconductor element sucked by the suction nozzle in the element setting step coincides with the height position of the electrode portion on the upper surface of the mounting member. Sometimes, it is preferable to provide a stopper that comes into contact with the upper surface of the mounting member to stop the lowering of the suction nozzle. In this way, when the semiconductor element adsorbed by the adsorption nozzle is lowered into the element mounting recess, the height of the electrode portion on the upper surface of the semiconductor element when the stopper provided on the adsorption nozzle comes into contact with the upper surface of the mounting member. Since the position coincides with the height position of the electrode part on the upper surface of the mounting member and the further lowering of the suction nozzle (semiconductor element lowering) is stopped, the control error of the height position of the suction nozzle and each part Even if there is a dimensional variation, the height position of the electrode portion on the upper surface of the semiconductor element can be surely matched with the height position of the electrode portion on the upper surface of the mounting member.

また、前述した請求項３の半導体装置を製造する場合は、請求項８のように、素子搭載凹部内に液状の樹脂を注入して該樹脂の液面と搭載部材上面の電極部との高低差が半導体素子の高さ相当になったときに該樹脂の注入を停止して該樹脂を硬化させて素子高さ位置調整樹脂層（素子高さ位置調整手段）を形成する工程と、前記素子高さ位置調整樹脂層上に前記半導体素子を搭載する工程と、前記素子搭載凹部内の前記半導体素子の周囲の隙間に液状の絶縁性樹脂を注入して該絶縁性樹脂の液面が前記半導体素子上面の電極部の高さ位置と一致したときに該絶縁性樹脂の注入を停止する工程と、前記素子搭載凹部内の絶縁性樹脂を硬化させて前記半導体素子を該絶縁性樹脂で固定すると共に、該半導体素子上面の電極部と前記搭載部材上面の電極部との間の配線経路を該絶縁性樹脂で平坦化する工程と、前記配線経路に配線を形成する配線形成工程とを行うようにしても良い。このようにすれば、半導体素子を搭載する素子高さ位置調整樹脂層の厚み寸法を、素子搭載凹部内に注入する樹脂量によって調整できるため、素子高さ位置調整樹脂層の厚み調整（ひいては半導体素子の高さ位置調整）が容易である。   When manufacturing the semiconductor device of claim 3 described above, as in claim 8, liquid resin is injected into the element mounting recess, and the height of the liquid surface of the resin and the electrode portion on the top surface of the mounting member is increased. Stopping the injection of the resin when the difference is equivalent to the height of the semiconductor element and curing the resin to form an element height position adjusting resin layer (element height position adjusting means); A step of mounting the semiconductor element on a height position adjustment resin layer; and a liquid insulating resin is injected into a gap around the semiconductor element in the element mounting recess, and the liquid level of the insulating resin is the semiconductor surface A step of stopping the injection of the insulating resin when it coincides with the height position of the electrode portion on the upper surface of the element; and the insulating resin in the element mounting recess is cured to fix the semiconductor element with the insulating resin. And an electrode portion on the upper surface of the semiconductor element and Planarizing by insulating resin wiring path between the electrode portion, it may be performed and a wiring forming step of forming a wiring on the wiring path. In this way, since the thickness dimension of the element height position adjusting resin layer for mounting the semiconductor element can be adjusted by the amount of resin injected into the element mounting recess, the thickness adjustment of the element height position adjusting resin layer (and thus the semiconductor) The adjustment of the height position of the element is easy.

また、半導体素子上面の電極部と該搭載部材上面の電極部との間の配線経路が絶縁性樹脂で平坦化されているため、請求項９のように、配線形成工程で、液滴吐出法又は印刷法により前記配線経路に配線を形成するようにすると良い。これにより、平坦な配線経路に配線を能率良く形成することができる。   In addition, since the wiring path between the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member is flattened with an insulating resin, a droplet discharge method is performed in the wiring forming step as in claim 9. Alternatively, the wiring may be formed in the wiring path by a printing method. Thereby, wiring can be efficiently formed in a flat wiring path.

図１（ａ）〜（ｄ）は本発明の実施例１のＬＥＤパッケージの製造工程を説明する工程図である。FIGS. 1A to 1D are process diagrams for explaining a manufacturing process of an LED package of Example 1 of the present invention. 図２は素子セット工程を説明する主要部の斜視図である。FIG. 2 is a perspective view of the main part for explaining the element setting step. 図３（ａ）〜（ｄ）は本発明の実施例２のＬＥＤパッケージの製造工程を説明する工程図である。3A to 3D are process diagrams for explaining a manufacturing process of the LED package of Example 2 of the present invention. 図４（ａ）〜（ｄ）は本発明の実施例３のＬＥＤパッケージの製造工程を説明する工程図である。4A to 4D are process diagrams for explaining a manufacturing process of the LED package of Example 3 of the present invention.

以下、本発明を実施するための形態をＬＥＤパッケージに適用して具体化した３つの実施例１〜３を説明する。   Hereinafter, three Examples 1 to 3 in which the mode for carrying out the present invention is applied to an LED package will be described.

本発明の実施例１を図１及び図２に基づいて説明する。
まず、図１（ｄ）に基づいてＬＥＤパッケージの構成を説明する。 A first embodiment of the present invention will be described with reference to FIGS.
First, the configuration of the LED package will be described with reference to FIG.

搭載部材１１は、リードフレーム、回路基板等で形成され、その中央部分に素子搭載凹部１２が形成され、この素子搭載凹部１２内に、半導体素子であるＬＥＤ素子１３（発光素子）が搭載されている。ＬＥＤ素子１３の上面には、プラスとマイナスの２つの電極部１４が形成され、搭載部材１１の上面には、ＬＥＤ素子１３上面の２つの電極部１４と接続する２つの電極部１５が形成されている。   The mounting member 11 is formed of a lead frame, a circuit board, and the like, and an element mounting recess 12 is formed in the central portion thereof, and an LED element 13 (light emitting element) that is a semiconductor element is mounted in the element mounting recess 12. Yes. Two electrode portions 14, plus and minus, are formed on the upper surface of the LED element 13, and two electrode portions 15 connected to the two electrode portions 14 on the upper surface of the LED element 13 are formed on the upper surface of the mounting member 11. ing.

この場合、素子搭載凹部１２の深さ寸法（高さ寸法）は、搭載するＬＥＤ素子１３の高さ寸法よりも大きくなっており、ＬＥＤ素子１３の高さ寸法が素子搭載凹部１２の深さ寸法（高さ寸法）以下であれば、高さ寸法が異なるＬＥＤ素子１３であっても、共通の搭載部材１１の素子搭載凹部１２内に搭載可能となっている。   In this case, the depth dimension (height dimension) of the element mounting recess 12 is larger than the height dimension of the LED element 13 to be mounted, and the height dimension of the LED element 13 is the depth dimension of the element mounting recess 12. (Height dimension) Below, even LED elements 13 having different height dimensions can be mounted in the element mounting recess 12 of the common mounting member 11.

後述する製造方法により、素子搭載凹部１２内に搭載するＬＥＤ素子１３の高さ位置を調整して、該ＬＥＤ素子１３上面の電極部１４の高さ位置を搭載部材１１上面の電極部１５の高さ位置と一致させる。この状態で、素子搭載凹部１２内のＬＥＤ素子１３の周囲の隙間に絶縁性樹脂１６を注入して硬化させて、該ＬＥＤ素子１３を該絶縁性樹脂１６で固定すると共に、該絶縁性樹脂１６の上面の高さ位置を該ＬＥＤ素子１３上面の電極部１４や搭載部材１１上面の電極部１５の高さ位置と一致させることで、該ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間の配線経路を該絶縁性樹脂１６で平坦化している。   The height position of the LED element 13 mounted in the element mounting recess 12 is adjusted by the manufacturing method described later, and the height position of the electrode part 14 on the upper surface of the LED element 13 is set to the height of the electrode part 15 on the upper surface of the mounting member 11. Match the position. In this state, the insulating resin 16 is injected into the gap around the LED element 13 in the element mounting recess 12 and cured to fix the LED element 13 with the insulating resin 16 and the insulating resin 16. The height position of the upper surface of the LED element 13 is made to coincide with the height position of the electrode portion 14 on the upper surface of the LED element 13 and the electrode portion 15 on the upper surface of the mounting member 11. The wiring path between the electrode portions 15 is flattened with the insulating resin 16.

この平坦な配線経路に配線１７を形成して、ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間を配線１７で接続している。この配線１７は、液滴吐出法又は印刷法等で形成している。ここで、液滴吐出法では、例えばインクジェット、ディスペンサ等で導電材料を配線経路上に吐出して配線パターンを形成する。印刷法では、スクリーン印刷等により配線パターンを形成する。その他、めっき法や導電板の貼付により配線１７を形成しても良い。   A wiring 17 is formed in this flat wiring path, and the electrode portion 14 on the upper surface of the LED element 13 and the electrode portion 15 on the upper surface of the mounting member 11 are connected by the wiring 17. The wiring 17 is formed by a droplet discharge method or a printing method. Here, in the droplet discharging method, a wiring pattern is formed by discharging a conductive material onto a wiring path using, for example, an inkjet or a dispenser. In the printing method, a wiring pattern is formed by screen printing or the like. In addition, the wiring 17 may be formed by plating or pasting a conductive plate.

次に、上記構成のＬＥＤパッケージの製造工程を説明する。
まず、絶縁性樹脂注入工程で、図１（ａ）に示すように、ディスペンサ２０（又はインクジェット装置）によって紫外線硬化型又は熱硬化型の液状の絶縁性樹脂１６を素子搭載凹部１２内に注入する。この際、絶縁性樹脂１６の注入量は、素子搭載凹部１２の容積よりＬＥＤ素子１３の体積分だけ少ない量に設定する。 Next, the manufacturing process of the LED package having the above configuration will be described.
First, in the insulating resin injection step, as shown in FIG. 1A, an ultraviolet curable or thermosetting liquid insulating resin 16 is injected into the element mounting recess 12 by a dispenser 20 (or an ink jet apparatus). . At this time, the injection amount of the insulating resin 16 is set to an amount smaller than the volume of the element mounting recess 12 by the volume of the LED element 13.

この後、素子搭載凹部１２内の液状の絶縁性樹脂１６を硬化させる前に、素子セット工程に進み、図１（ｂ）に示すように、ダイボンダ（又は部品実装機）の吸着ノズル２１にＬＥＤ素子１３を吸着して該ＬＥＤ素子１３を素子搭載凹部１２内の絶縁性樹脂１６の液中に浸すように下降させて、図１（ｃ）に示すように、ＬＥＤ素子１３上面の電極部１４の高さ位置が搭載部材１１上面の電極部１５の高さ位置と一致したときに吸着ノズル２１の下降（ＬＥＤ素子１３の下降）をストップさせる。この時点で、素子搭載凹部１２内の絶縁性樹脂１６の液面がＬＥＤ素子１３上面の電極部１４や搭載部材１１上面の電極部１５と同一高さまで上昇した状態となる。   Thereafter, before the liquid insulating resin 16 in the element mounting recess 12 is cured, the process proceeds to an element setting process, and as shown in FIG. 1B, an LED is connected to the suction nozzle 21 of the die bonder (or component mounting machine). The element 13 is adsorbed and lowered so that the LED element 13 is immersed in the liquid of the insulating resin 16 in the element mounting recess 12, and as shown in FIG. When the height position coincides with the height position of the electrode portion 15 on the upper surface of the mounting member 11, the lowering of the suction nozzle 21 (lowering of the LED element 13) is stopped. At this time, the liquid level of the insulating resin 16 in the element mounting recess 12 rises to the same height as the electrode portion 14 on the upper surface of the LED element 13 and the electrode portion 15 on the upper surface of the mounting member 11.

この際、素子搭載凹部１２内にセットするＬＥＤ素子１３の高さ位置の管理は、吸着ノズル２１の高さ位置（Ｚ方向位置）を制御する機能を用いれば良いが、吸着ノズル２１の高さ位置の制御誤差や各部の寸法ばらつきによってＬＥＤ素子１３の高さ位置のずれが生じてしまう可能性がある。   At this time, the height position of the LED element 13 set in the element mounting recess 12 may be managed by using a function for controlling the height position (Z-direction position) of the suction nozzle 21. There is a possibility that a deviation of the height position of the LED element 13 may occur due to a position control error or a dimensional variation of each part.

この対策として、本実施例１では、図１（ｃ）及び図２に示すように、吸着ノズル２１に、該吸着ノズル２１の下降停止位置を決めるストッパー２２を設け、素子セット工程で、吸着ノズル２１に吸着したＬＥＤ素子１３上面の電極部１４の高さ位置が搭載部材１１上面の電極部１５の高さ位置と一致したときに、該吸着ノズル２１のストッパー２２が該搭載部材１１上面に当接して該吸着ノズル２１の下降（ＬＥＤ素子１３の下降）をストップさせる。   As a countermeasure against this, in the first embodiment, as shown in FIGS. 1C and 2, the suction nozzle 21 is provided with a stopper 22 that determines the lowering stop position of the suction nozzle 21. When the height position of the electrode portion 14 on the upper surface of the LED element 13 adsorbed by the 21 coincides with the height position of the electrode portion 15 on the upper surface of the mounting member 11, the stopper 22 of the adsorption nozzle 21 contacts the upper surface of the mounting member 11. In contact therewith, the lowering of the suction nozzle 21 (the lowering of the LED element 13) is stopped.

更に、本実施例１では、吸着ノズル２１の高さ位置の制御誤差や各部の寸法ばらつきを機械的に吸収するために、図２に示すように、ノズルホルダ２３に吸着ノズル２１を上下動可能に支持させ、ノズルホルダ２３内に設けたスプリング等の付勢手段により吸着ノズル２１を下方に付勢している。素子セット工程では、吸着ノズル２１の高さ位置の制御誤差や各部の寸法ばらつきを見込んで、ノズルホルダ２３を余分に下降させて、吸着ノズル２１のストッパー２２が搭載部材１１上面に当接した後は、ノズルホルダ２３の下降に応じて吸着ノズル２１がノズルホルダ２３内の付勢手段を押し上げる。これにより、吸着ノズル２１のストッパー２２を搭載部材１１上面に確実に当接させて、吸着ノズル２１に吸着したＬＥＤ素子１３上面の電極部１４の高さ位置を搭載部材１１上面の電極部１５の高さ位置に確実に一致させる。   Further, in the first embodiment, the suction nozzle 21 can be moved up and down on the nozzle holder 23 as shown in FIG. 2 in order to mechanically absorb the control error of the height position of the suction nozzle 21 and the dimensional variation of each part. The suction nozzle 21 is urged downward by an urging means such as a spring provided in the nozzle holder 23. In the element setting process, after the control error of the height position of the suction nozzle 21 and the dimensional variation of each part are anticipated, the nozzle holder 23 is lowered further and the stopper 22 of the suction nozzle 21 comes into contact with the upper surface of the mounting member 11. The suction nozzle 21 pushes up the urging means in the nozzle holder 23 as the nozzle holder 23 descends. Thus, the stopper 22 of the suction nozzle 21 is securely brought into contact with the upper surface of the mounting member 11, and the height position of the electrode portion 14 on the upper surface of the LED element 13 sucked by the suction nozzle 21 is set to the height of the electrode portion 15 on the upper surface of the mounting member 11. Make sure it matches the height position.

この後、樹脂硬化工程に進み、樹脂硬化装置（図示せず）により素子搭載凹部１２内の絶縁性樹脂１６を紫外線照射又は加熱して硬化させて、ＬＥＤ素子１３を該絶縁性樹脂１６で固定すると共に、該ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間の配線経路を該絶縁性樹脂１６で平坦化する。この後、吸着ノズル２１によるＬＥＤ素子１３の吸着を解除して該吸着ノズル２１を元の位置へ戻す。本実施例１では、素子搭載凹部１２の底面とＬＥＤ素子１３の下面との間に充填した絶縁性樹脂１６の硬化層が特許請求の範囲でいう素子高さ位置調整手段として機能する。   Thereafter, the process proceeds to a resin curing step, and a resin curing device (not shown) cures the insulating resin 16 in the element mounting recess 12 by ultraviolet irradiation or heating to fix the LED element 13 with the insulating resin 16. At the same time, the wiring path between the electrode portion 14 on the upper surface of the LED element 13 and the electrode portion 15 on the upper surface of the mounting member 11 is flattened by the insulating resin 16. Thereafter, the suction of the LED element 13 by the suction nozzle 21 is canceled and the suction nozzle 21 is returned to the original position. In the first embodiment, the hardened layer of the insulating resin 16 filled between the bottom surface of the element mounting recess 12 and the lower surface of the LED element 13 functions as an element height position adjusting means in the claims.

この後、配線形成工程に進み、図１（ｄ）に示すように、液滴吐出法又は印刷法等で配線経路に配線１７を形成して、ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間を配線１７で接続する。   Thereafter, the process proceeds to a wiring forming process, and as shown in FIG. 1D, a wiring 17 is formed in the wiring path by a droplet discharge method or a printing method, and the electrode portion 14 on the upper surface of the LED element 13 and the mounting member 11 are formed. A wiring 17 connects the electrode unit 15 on the upper surface.

以上説明した本実施例１では、素子搭載凹部１２の容積よりＬＥＤ素子１３の体積分だけ少ない量の液状の絶縁性樹脂１６を素子搭載凹部１２内に注入し、ＬＥＤ素子１３を素子搭載凹部１２内の絶縁性樹脂１６の液中に浸すように下降させて該ＬＥＤ素子１３上面の電極部１４の高さ位置を搭載部材１１上面の電極部１５の高さ位置と一致させた状態で、素子搭載凹部１２内の絶縁性樹脂１６を硬化させてＬＥＤ素子１３を該絶縁性樹脂１６で固定すると共に、該ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間の配線経路を該絶縁性樹脂１６で平坦化して、この配線経路に配線１７を液滴吐出法又は印刷法等で形成するようにしたので、ＬＥＤ素子１３の高さ寸法が異なっていても、ＬＥＤ素子１３上面の電極部１４の高さ位置を搭載部材１１上面の電極部１５の高さ位置と一致させて、該ＬＥＤ素子１３上面の電極部１４と該搭載部材１１上面の電極部１５との間の配線経路を該絶縁性樹脂１６で平坦化して配線１７を形成することができる。これにより、高さ寸法の異なるＬＥＤ素子１３を搭載する搭載部材１１を共通化することが可能となり、搭載部材１１の共通化によるコストダウンを実現できる。   In the first embodiment described above, a liquid insulating resin 16 having a volume less than the volume of the LED element 13 than the volume of the element mounting recess 12 is injected into the element mounting recess 12, and the LED element 13 is inserted into the element mounting recess 12. The element is lowered so as to be immersed in the liquid of the insulating resin 16 and the height position of the electrode part 14 on the upper surface of the LED element 13 is made to coincide with the height position of the electrode part 15 on the upper surface of the mounting member 11. The insulating resin 16 in the mounting recess 12 is cured to fix the LED element 13 with the insulating resin 16, and wiring between the electrode portion 14 on the upper surface of the LED element 13 and the electrode portion 15 on the upper surface of the mounting member 11. Since the path is flattened with the insulating resin 16 and the wiring 17 is formed in the wiring path by the droplet discharge method or the printing method, the LED element 13 can be formed even if the height dimension of the LED element 13 is different. 13 Electrode on top surface 4 is made to coincide with the height position of the electrode portion 15 on the upper surface of the mounting member 11, and a wiring path between the electrode portion 14 on the upper surface of the LED element 13 and the electrode portion 15 on the upper surface of the mounting member 11 is The wiring 17 can be formed by planarization with the insulating resin 16. As a result, it is possible to share the mounting member 11 on which the LED elements 13 having different height dimensions are mounted, and it is possible to reduce the cost by sharing the mounting member 11.

しかも、素子搭載凹部１２内にセットするＬＥＤ素子１３の高さ位置を調整する手段として、別体のスペーサを用意する必要がなく、部品点数削減の要求も満たすことができる。   Moreover, it is not necessary to prepare a separate spacer as means for adjusting the height position of the LED element 13 set in the element mounting recess 12, and the requirement for reducing the number of parts can be satisfied.

更に、本実施例１では、吸着ノズル２１に、該吸着ノズル２１の下降停止位置を決めるストッパー２２を設け、素子セット工程で、吸着ノズル２１に吸着したＬＥＤ素子１３上面の電極部１４の高さ位置が搭載部材１１上面の電極部１５の高さ位置と一致したときに、該吸着ノズル２１のストッパー２２が該搭載部材１１上面に当接して該吸着ノズル２１の下降（ＬＥＤ素子１３の下降）をストップさせるようにしたので、吸着ノズル２１の高さ位置の制御誤差や各部の寸法ばらつきがあったとしても、確実にＬＥＤ素子１３上面の電極部１４の高さ位置を搭載部材１１上面の電極部１５の高さ位置と一致させることができ、安定した高品質のＬＥＤパッケージを製造できる。   Furthermore, in the first embodiment, the suction nozzle 21 is provided with a stopper 22 that determines the lowering stop position of the suction nozzle 21, and the height of the electrode portion 14 on the upper surface of the LED element 13 sucked by the suction nozzle 21 in the element setting step. When the position coincides with the height position of the electrode portion 15 on the upper surface of the mounting member 11, the stopper 22 of the suction nozzle 21 comes into contact with the upper surface of the mounting member 11 and the suction nozzle 21 is lowered (lowering of the LED element 13). Therefore, the height position of the electrode portion 14 on the upper surface of the LED element 13 is surely set to the electrode on the upper surface of the mounting member 11 even if there is a control error in the height position of the suction nozzle 21 or a dimensional variation in each portion. It can be made to correspond with the height position of the part 15, and a stable high quality LED package can be manufactured.

次に、図３を用いて本発明の実施例２を説明する。但し、前記実施例１と実質的に同一部分については同一符号を付して説明を省略又は簡略化する。   Next, Embodiment 2 of the present invention will be described with reference to FIG. However, substantially the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

前記実施例１では、素子搭載凹部１２内に絶縁性樹脂１６を注入した後に、ＬＥＤ素子１３を素子搭載凹部１２内にセットするようにしたが、本実施例２では、ＬＥＤ素子１３を素子搭載凹部１２内にセットした後に、素子搭載凹部１２内のＬＥＤ素子１３の周囲の隙間に絶縁性樹脂１６を注入するようにしている。   In the first embodiment, the LED element 13 is set in the element mounting recess 12 after injecting the insulating resin 16 into the element mounting recess 12. However, in the second embodiment, the LED element 13 is mounted in the element mounting recess 12. After setting in the recess 12, the insulating resin 16 is injected into the gap around the LED element 13 in the element mounting recess 12.

本実施例２では、まず、図３（ａ）に示すように、ダイボンダ（又は部品実装機）の吸着ノズル２１にＬＥＤ素子１３を吸着して該ＬＥＤ素子１３を素子搭載凹部１２内に下降させて、図３（ｂ）に示すように、ＬＥＤ素子１３上面の電極部１４の高さ位置が搭載部材１１上面の電極部１５の高さ位置と一致したときに、該吸着ノズル２１のストッパー２２が該搭載部材１１上面に当接して該吸着ノズル２１の下降（ＬＥＤ素子１３の下降）をストップさせる。   In the second embodiment, first, as shown in FIG. 3A, the LED element 13 is attracted to the suction nozzle 21 of the die bonder (or component mounting machine), and the LED element 13 is lowered into the element mounting recess 12. As shown in FIG. 3B, when the height position of the electrode portion 14 on the upper surface of the LED element 13 matches the height position of the electrode portion 15 on the upper surface of the mounting member 11, the stopper 22 of the suction nozzle 21. Comes into contact with the upper surface of the mounting member 11 and stops the lowering of the suction nozzle 21 (lowering of the LED element 13).

この後、絶縁性樹脂注入工程に進み、図３（ｃ）に示すように、ディスペンサ２０（又はインクジェット装置）によって紫外線硬化型又は熱硬化型の液状の絶縁性樹脂１６を素子搭載凹部１２内のＬＥＤ素子１３の周囲の隙間に注入し、該絶縁性樹脂１６の液面がＬＥＤ素子１３上面の電極部１４や搭載部材１１上面の電極部１５と同一高さになったときに、該絶縁性樹脂１６の注入を停止する。   Thereafter, the process proceeds to an insulating resin injecting step, and as shown in FIG. 3C, the dispenser 20 (or an ink jet device) is used to dispose the ultraviolet curable or thermosetting liquid insulating resin 16 in the element mounting recess 12. When the liquid surface of the insulating resin 16 is flush with the electrode part 14 on the upper surface of the LED element 13 and the electrode part 15 on the upper surface of the mounting member 11, the insulating property is injected. The injection of the resin 16 is stopped.

この後、樹脂硬化工程に進み、樹脂硬化装置（図示せず）により素子搭載凹部１２内の絶縁性樹脂１６を紫外線照射又は加熱して硬化させて、ＬＥＤ素子１３を該絶縁性樹脂１６で固定すると共に、該ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間の配線経路を該絶縁性樹脂１６で平坦化する。この後、吸着ノズル２１によるＬＥＤ素子１３の吸着を解除して該吸着ノズル２１を元の位置へ戻す。本実施例２では、素子搭載凹部１２の底面とＬＥＤ素子１３の下面との間に充填した絶縁性樹脂１６の硬化層が特許請求の範囲でいう素子高さ位置調整手段として機能する。   Thereafter, the process proceeds to a resin curing step, and a resin curing device (not shown) cures the insulating resin 16 in the element mounting recess 12 by ultraviolet irradiation or heating to fix the LED element 13 with the insulating resin 16. At the same time, the wiring path between the electrode portion 14 on the upper surface of the LED element 13 and the electrode portion 15 on the upper surface of the mounting member 11 is flattened by the insulating resin 16. Thereafter, the suction of the LED element 13 by the suction nozzle 21 is canceled and the suction nozzle 21 is returned to the original position. In the second embodiment, the hardened layer of the insulating resin 16 filled between the bottom surface of the element mounting recess 12 and the lower surface of the LED element 13 functions as an element height position adjusting means in the claims.

この後、配線形成工程に進み、図３（ｄ）に示すように、液滴吐出法又は印刷法等で配線経路に配線１７を形成して、ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間を配線１７で接続する。   Thereafter, the process proceeds to a wiring formation process, and as shown in FIG. 3D, the wiring 17 is formed in the wiring path by a droplet discharge method or a printing method, and the electrode portion 14 on the upper surface of the LED element 13 and the mounting member 11 are formed. A wiring 17 connects the electrode unit 15 on the upper surface.

以上説明した本実施例２でも、前記実施例１と同様の効果を得ることができる。   In the second embodiment described above, the same effect as that of the first embodiment can be obtained.

次に、図４を用いて本発明の実施例３を説明する。但し、前記実施例１と実質的に同一部分については同一符号を付して説明を省略又は簡略化する。   Next, Embodiment 3 of the present invention will be described with reference to FIG. However, substantially the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

本実施例３では、素子搭載凹部１２内への絶縁性樹脂の注入を２工程に分け、１回目の絶縁性樹脂注入工程で、図４（ａ）に示すように、ディスペンサ２０（又はインクジェット装置）によって素子搭載凹部１２内にＬＥＤ素子１３の高さ位置の調整に必要な量の液状の絶縁性樹脂１６ａを注入する。具体的には、素子搭載凹部１２内の絶縁性樹脂１６ａの液面と搭載部材１１上面の電極部１５との高低差がＬＥＤ素子１３の高さ相当になったときに、該絶縁性樹脂１６ａの注入を停止する。尚、１回目の絶縁性樹脂注入工程で注入する絶縁性樹脂１６ａは、電気伝導性のある材料、例えば金属ペーストとしても良く、特に熱伝導性の高い材料が望ましい。   In this third embodiment, the injection of the insulating resin into the element mounting recess 12 is divided into two steps, and in the first insulating resin injection step, as shown in FIG. ) To inject the liquid insulating resin 16a in an amount necessary for adjusting the height position of the LED element 13 into the element mounting recess 12. Specifically, when the height difference between the liquid level of the insulating resin 16a in the element mounting recess 12 and the electrode portion 15 on the upper surface of the mounting member 11 becomes equivalent to the height of the LED element 13, the insulating resin 16a. Stop the injection. The insulating resin 16a injected in the first insulating resin injection step may be an electrically conductive material, for example, a metal paste, and is particularly preferably a material having a high thermal conductivity.

この後、素子搭載凹部１２内の絶縁性樹脂１６ａを硬化させて、素子高さ位置調整樹脂層１６ａ（素子高さ位置調整手段）を形成する。   Thereafter, the insulating resin 16a in the element mounting recess 12 is cured to form the element height position adjusting resin layer 16a (element height position adjusting means).

この後、素子搭載工程に進み、図４（ｂ）に示すように、ダイボンダ（又は部品実装機）の吸着ノズル２５にＬＥＤ素子１３を吸着して該ＬＥＤ素子１３を素子搭載凹部１２内の素子高さ位置調整樹脂層１６ａ上に搭載する。これにより、ＬＥＤ素子１３上面の電極部１４の高さ位置が搭載部材１１上面の電極部１５の高さ位置と一致した状態となる。   Thereafter, the process proceeds to an element mounting step, and as shown in FIG. 4B, the LED element 13 is adsorbed to the adsorption nozzle 25 of the die bonder (or component mounting machine) to place the LED element 13 in the element mounting recess 12. It is mounted on the height position adjusting resin layer 16a. As a result, the height position of the electrode portion 14 on the upper surface of the LED element 13 coincides with the height position of the electrode portion 15 on the upper surface of the mounting member 11.

この後、２回目の絶縁性樹脂注入工程に進み、図４（ｃ）に示すように、ディスペンサ２０（又はインクジェット装置）によって素子搭載凹部１２内のＬＥＤ素子１３の周囲の隙間に液状の絶縁性樹脂１６ｂを注入して該絶縁性樹脂１６ｂの液面がＬＥＤ素子１３上面の電極部１４の高さ位置まで上昇したときに該絶縁性樹脂１６ｂの注入を停止する。   Thereafter, the process proceeds to the second insulating resin injection step, and as shown in FIG. 4C, a liquid insulating property is formed in the gap around the LED element 13 in the element mounting recess 12 by the dispenser 20 (or an ink jet apparatus). When the resin 16b is injected and the liquid level of the insulating resin 16b rises to the height position of the electrode portion 14 on the upper surface of the LED element 13, the injection of the insulating resin 16b is stopped.

この後、樹脂硬化工程に進み、素子搭載凹部１２内の絶縁性樹脂１６ｂを硬化させて、ＬＥＤ素子１３を該絶縁性樹脂１６ｂで固定すると共に、該ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間の配線経路を該絶縁性樹脂１６ｂで平坦化する。   Thereafter, the process proceeds to a resin curing step, the insulating resin 16b in the element mounting recess 12 is cured, the LED element 13 is fixed with the insulating resin 16b, and the electrode part 14 and the mounting member on the upper surface of the LED element 13 are fixed. 11, the wiring path between the upper surface electrode portion 15 is flattened by the insulating resin 16b.

この後、配線形成工程に進み、図４（ｄ）に示すように、液滴吐出法又は印刷法等で配線経路に配線１７を形成して、ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間を配線１７で接続する。   Thereafter, the process proceeds to a wiring forming process, and as shown in FIG. 4D, the wiring 17 is formed in the wiring path by a droplet discharge method or a printing method, and the electrode portion 14 on the upper surface of the LED element 13 and the mounting member 11 are formed. A wiring 17 connects the electrode unit 15 on the upper surface.

以上説明した本実施例３でも、前記実施例１と同様の効果を得ることができる。
尚、本発明は、上記各実施例１〜３のようなＬＥＤ素子等の発光素子の搭載構造に限定されず、上面に電極部が設けられた様々な半導体素子の搭載構造に適用可能である等、要旨を逸脱しない範囲内で種々変更して実施できる。 Also in the third embodiment described above, the same effect as in the first embodiment can be obtained.
In addition, this invention is not limited to the mounting structure of light emitting elements, such as LED element like said each Examples 1-3, It is applicable to the mounting structure of various semiconductor elements with which the electrode part was provided in the upper surface. Various modifications can be made without departing from the scope of the invention.

１１…搭載部材、１２…素子搭載凹部、１３…ＬＥＤ素子（半導体素子）、１４，１５…電極部、１６…絶縁性樹脂（素子高さ位置調整手段），１６ａ…素子高さ位置調整樹脂層（素子高さ位置調整手段）、１６ｂ…絶縁性樹脂、１７…配線、２０…ディスペンサ、２１…吸着ノズル、２２…ストッパー、２３…ノズルホルダ、２５…吸着ノズル   DESCRIPTION OF SYMBOLS 11 ... Mounting member, 12 ... Element mounting recessed part, 13 ... LED element (semiconductor element), 14, 15 ... Electrode part, 16 ... Insulating resin (element height position adjustment means), 16a ... Element height position adjustment resin layer (Element height position adjusting means), 16b ... insulating resin, 17 ... wiring, 20 ... dispenser, 21 ... suction nozzle, 22 ... stopper, 23 ... nozzle holder, 25 ... suction nozzle

Claims (9)

搭載部材に形成した素子搭載凹部内に半導体素子を搭載し、該半導体素子上面の電極部と該搭載部材上面の電極部とを配線で接続した半導体装置において、
前記素子搭載凹部内に搭載する前記半導体素子の高さ位置を該半導体素子上面の電極部の高さ位置が該搭載部材上面の電極部の高さ位置と一致するように調整する素子高さ位置調整手段を備え、
前記素子搭載凹部内の前記半導体素子の周囲の隙間に絶縁性樹脂を充填して該半導体素子上面の電極部と前記搭載部材上面の電極部との間の配線経路を該絶縁性樹脂で平坦化して、該配線経路に前記配線を形成したことを特徴とする半導体装置。 In a semiconductor device in which a semiconductor element is mounted in an element mounting recess formed in a mounting member, and an electrode portion on the upper surface of the semiconductor element and an electrode portion on the upper surface of the mounting member are connected by wiring.
An element height position for adjusting the height position of the semiconductor element mounted in the element mounting recess so that the height position of the electrode portion on the upper surface of the semiconductor element coincides with the height position of the electrode portion on the upper surface of the mounting member Adjusting means,
A gap around the semiconductor element in the element mounting recess is filled with an insulating resin, and a wiring path between the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member is flattened with the insulating resin. A semiconductor device characterized in that the wiring is formed in the wiring path. 前記素子高さ位置調整手段は、前記配線経路を平坦化する絶縁性樹脂が前記素子搭載凹部の底面と前記半導体素子の下面との間にも充填されて形成されていることを特徴とする請求項１に記載の半導体装置。   The element height position adjusting means is formed by filling an insulating resin for flattening the wiring path between a bottom surface of the element mounting recess and a lower surface of the semiconductor element. Item 14. The semiconductor device according to Item 1. 前記素子高さ位置調整手段は、予め前記素子搭載凹部内に前記半導体素子の高さ位置の調整に必要な量の樹脂を注入して形成され、該素子高さ位置調整手段上に該半導体素子が搭載されていることを特徴とする請求項１に記載の半導体装置。   The element height position adjusting means is formed by previously injecting an amount of resin necessary for adjusting the height position of the semiconductor element into the element mounting recess, and the semiconductor element is positioned on the element height position adjusting means. The semiconductor device according to claim 1, wherein the semiconductor device is mounted. 前記配線は、液滴吐出法又は印刷法により形成されていることを特徴とする請求項１乃至３のいずれかに記載の半導体装置。   The semiconductor device according to claim 1, wherein the wiring is formed by a droplet discharge method or a printing method. 搭載部材に形成した素子搭載凹部内に半導体素子を搭載し、該半導体素子上面の電極部と該搭載部材上面の電極部とを配線で接続した半導体装置の製造方法において、
前記素子搭載凹部の容積より前記半導体素子の体積分だけ少ない量の液状の絶縁性樹脂を該素子搭載凹部内に注入する工程と、
吸着ノズルに前記半導体素子を吸着して該半導体素子を前記素子搭載凹部内の絶縁性樹脂の液中に浸すように下降させて該半導体素子上面の電極部の高さ位置が前記搭載部材上面の電極部の高さ位置と一致したときに該半導体素子の下降をストップさせる素子セット工程と、
前記素子搭載凹部内の絶縁性樹脂を硬化させて前記半導体素子を該絶縁性樹脂で固定すると共に、該半導体素子上面の電極部と前記搭載部材上面の電極部との間の配線経路を該絶縁性樹脂で平坦化し、前記吸着ノズルによる該半導体素子の吸着を解除して該吸着ノズルを元の位置へ戻す工程と、
前記配線経路に前記配線を形成する配線形成工程と
を含むことを特徴とする半導体装置の製造方法。 In a method for manufacturing a semiconductor device in which a semiconductor element is mounted in an element mounting recess formed in a mounting member, and the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member are connected by wiring.
Injecting into the element mounting recess a liquid insulating resin in an amount less than the volume of the semiconductor element than the volume of the element mounting recess;
The semiconductor element is adsorbed by the suction nozzle and lowered so that the semiconductor element is immersed in the liquid of the insulating resin in the element mounting recess, so that the height position of the electrode portion on the upper surface of the semiconductor element is on the upper surface of the mounting member. An element setting step for stopping the descent of the semiconductor element when it coincides with the height position of the electrode part;
The insulating resin in the element mounting recess is cured to fix the semiconductor element with the insulating resin, and the wiring path between the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member is insulated. Flattening with a functional resin, releasing the suction of the semiconductor element by the suction nozzle and returning the suction nozzle to the original position;
And a wiring forming step of forming the wiring in the wiring path. 搭載部材に形成した素子搭載凹部内に半導体素子を搭載し、該半導体素子上面の電極部と該搭載部材上面の電極部とを配線で接続した半導体装置の製造方法において、
吸着ノズルに前記半導体素子を吸着して該半導体素子を前記素子搭載凹部内に下降させて該半導体素子上面の電極部の高さ位置が前記搭載部材上面の電極部の高さ位置と一致したときに該半導体素子の下降をストップさせる素子セット工程と、
前記素子搭載凹部内の前記半導体素子の周囲の隙間に液状の絶縁性樹脂を注入して該絶縁性樹脂の液面が該半導体素子上面の電極部と同一高さになったときに該絶縁性樹脂の注入を停止する工程と、
前記素子搭載凹部内の絶縁性樹脂を硬化させて前記半導体素子を該絶縁性樹脂で固定すると共に、該半導体素子上面の電極部と前記搭載部材上面の電極部との間の配線経路を該絶縁性樹脂で平坦化して、前記吸着ノズルによる該半導体素子の吸着を解除して該吸着ノズルを元の位置へ戻す工程と、
前記配線経路に前記配線を形成する配線形成工程と
を含むことを特徴とする半導体装置の製造方法。 In a method for manufacturing a semiconductor device in which a semiconductor element is mounted in an element mounting recess formed in a mounting member, and the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member are connected by wiring.
When the semiconductor element is attracted to the suction nozzle and the semiconductor element is lowered into the element mounting recess, and the height position of the electrode portion on the upper surface of the semiconductor element matches the height position of the electrode portion on the upper surface of the mounting member An element setting step for stopping the lowering of the semiconductor element;
When the liquid insulating resin is injected into the gap around the semiconductor element in the element mounting recess and the liquid level of the insulating resin is flush with the electrode part on the upper surface of the semiconductor element, the insulating property Stopping the resin injection;
The insulating resin in the element mounting recess is cured to fix the semiconductor element with the insulating resin, and the wiring path between the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member is insulated. Flattening with a functional resin, releasing the suction of the semiconductor element by the suction nozzle and returning the suction nozzle to its original position;
And a wiring forming step of forming the wiring in the wiring path. 前記吸着ノズルには、前記素子セット工程で該吸着ノズルに吸着した半導体素子上面の電極部の高さ位置が前記搭載部材上面の電極部の高さ位置と一致したときに該搭載部材上面に当接して該吸着ノズルの下降をストップさせるストッパーが設けられていることを特徴とする請求項５又は６に記載の半導体装置の製造方法。   The suction nozzle contacts the upper surface of the mounting member when the height position of the electrode portion on the upper surface of the semiconductor element attracted to the suction nozzle in the element setting step coincides with the height position of the electrode portion on the upper surface of the mounting member. 7. The method for manufacturing a semiconductor device according to claim 5, further comprising a stopper that contacts and stops the lowering of the suction nozzle. 搭載部材に形成した素子搭載凹部内に半導体素子を搭載し、該半導体素子上面の電極部と該搭載部材上面の電極部とを配線で接続した半導体装置の製造方法において、
前記素子搭載凹部内に樹脂を注入して該樹脂の上面と前記搭載部材上面の電極部との高低差が前記半導体素子の高さ相当になったときに該樹脂の注入を停止して該樹脂を硬化させて素子高さ位置調整樹脂層を形成する工程と、
前記素子高さ位置調整樹脂層上に前記半導体素子を搭載する工程と、
前記素子搭載凹部内の前記半導体素子の周囲の隙間に液状の絶縁性樹脂を注入して該絶縁性樹脂の液面が前記半導体素子上面の電極部の高さ位置と一致したときに該絶縁性樹脂の注入を停止する工程と、
前記素子搭載凹部内の絶縁性樹脂を硬化させて前記半導体素子を該絶縁性樹脂で固定すると共に、該半導体素子上面の電極部と前記搭載部材上面の電極部との間の配線経路を該絶縁性樹脂で平坦化する工程と、
前記配線経路に前記配線を形成する配線形成工程と
を含むことを特徴とする半導体装置の製造方法。 In a method for manufacturing a semiconductor device in which a semiconductor element is mounted in an element mounting recess formed in a mounting member, and the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member are connected by wiring.
Resin is injected into the element mounting recess and injection of the resin is stopped when the height difference between the upper surface of the resin and the electrode portion on the upper surface of the mounting member corresponds to the height of the semiconductor element. Forming a device height position adjusting resin layer by curing
Mounting the semiconductor element on the element height position adjusting resin layer;
When a liquid insulating resin is injected into a gap around the semiconductor element in the element mounting recess, and the liquid level of the insulating resin coincides with the height position of the electrode part on the upper surface of the semiconductor element, the insulating property Stopping the resin injection;
The insulating resin in the element mounting recess is cured to fix the semiconductor element with the insulating resin, and the wiring path between the electrode portion on the upper surface of the semiconductor element and the electrode portion on the upper surface of the mounting member is insulated. A step of flattening with a conductive resin;
And a wiring forming step of forming the wiring in the wiring path. 前記配線形成工程で、液滴吐出法又は印刷法により前記配線経路に前記配線を形成することを特徴とする請求項５乃至８のいずれかに記載の半導体装置の製造方法。   9. The method of manufacturing a semiconductor device according to claim 5, wherein in the wiring formation step, the wiring is formed in the wiring path by a droplet discharge method or a printing method.
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