KR101638124B1 - Semiconductor light emitting device and method of manufacturing the same - Google Patents
Semiconductor light emitting device and method of manufacturing the same Download PDFInfo
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- KR101638124B1 KR101638124B1 KR1020140144087A KR20140144087A KR101638124B1 KR 101638124 B1 KR101638124 B1 KR 101638124B1 KR 1020140144087 A KR1020140144087 A KR 1020140144087A KR 20140144087 A KR20140144087 A KR 20140144087A KR 101638124 B1 KR101638124 B1 KR 101638124B1
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- light emitting
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- dam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
Abstract
The present disclosure relates to a method of manufacturing a semiconductor light emitting device, comprising: providing a first dam having an opening formed on a first base; A semiconductor light emitting device comprising: a first semiconductor layer having a first conductivity; a second semiconductor layer having a second conductivity different from the first conductivity; and a second semiconductor layer having a first conductivity type, A plurality of semiconductor layers interposed between the first and second semiconductor layers and having an active layer which generates light by recombination of electrons and holes, at least one electrode for supplying current to the plurality of semiconductor layers, and a plurality Placing a semiconductor light emitting portion on a first base such that the first encapsulation material faces the first base and the at least one electrode faces upward; Forming a second encapsulant between the first dam and the semiconductor light emitting portion; And forming at least one conductive portion to cover at least one of the exposed upper electrode and a portion of the second encapsulant.
Description
The present disclosure relates generally to a semiconductor light emitting device and a manufacturing method thereof, and more particularly to a semiconductor light emitting device having a chip scale and a manufacturing method thereof.
As the semiconductor light emitting element, a Group III nitride semiconductor light emitting element is exemplified. The Group III nitride semiconductor is made of a compound of Al (x) Ga (y) In (1-x-y) N (0? X? 1, 0? Y? 1, 0? X + y? A GaAs-based semiconductor light-emitting element used for red light emission, and the like.
Herein, the background art relating to the present disclosure is provided, and these are not necessarily meant to be known arts.
BACKGROUND ART Semiconductor light emitting devices are manufactured through an EPI process, a chip forming process, and a package process. In each manufacturing process, defective products are generated due to various unexpected causes. If defects generated in each manufacturing process can not be appropriately removed, defective products are unnecessarily subjected to a subsequent process, and production efficiency is lowered.
FIG. 1 is a view for explaining an example of a process of producing a semiconductor light emitting chip from a wafer, in which a raw wafer is produced by using a raw material such as silicon or sapphire and a plurality of The semiconductor layer is grown. Thereafter, an epitaxial wafer 1 having a semiconductor light emitting chip formed thereon is formed by an electrode forming process, an etching process, a protective film forming process and the like (see FIG. 1A). Thereafter, as shown in FIGS. 1B and 1C, Is attached to the
FIG. 2 is a view for explaining an example of a process of manufacturing a semiconductor light emitting device package using a semiconductor light emitting chip. In the package process, for example, a
FIG. 3 is a view for explaining an example of a semiconductor light emitting chip arranged on a tape by a projector. As illustrated in FIG. 1F, the semiconductor
If the accuracy of row and column arrangement by the
4 is a view showing an example of a semiconductor light emitting device shown in U.S. Patent No. 6,650,044. The semiconductor light emitting device includes a
FIG. 5 is a view showing an example of a method of manufacturing a semiconductor light emitting device shown in U.S. Patent No. 6,650,044. First, a plurality of
6 is a view for explaining a problem when the sealing material is formed on a plurality of semiconductor light emitting chips at one time, in which a
On the other hand, due to such a problem, a process of repositioning the semiconductor
On the other hand, after the sealing
This will be described later in the Specification for Implementation of the Invention.
SUMMARY OF THE INVENTION Herein, a general summary of the present disclosure is provided, which should not be construed as limiting the scope of the present disclosure. of its features).
According to one aspect of the present disclosure, there is provided a method of fabricating a semiconductor light emitting device, comprising: providing a first encapsulant on a base exposed through a dam and an opening formed in the base; And placing a semiconductor light emitting chip on a first encapsulant, the method comprising: forming a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity, A semiconductor light emitting chip including a plurality of semiconductor layers interposed between the plurality of semiconductor layers and having an active layer that generates light by recombination of electrons and holes and at least one electrode for supplying current to the plurality of semiconductor layers, And placing the semiconductor light emitting chip on the first encapsulant so that the plurality of semiconductor layers on the opposite side of the at least one electrode are in contact with the first encapsulant. / RTI >
According to another aspect of the present disclosure, in a semiconductor light emitting device, a first semiconductor layer having a first conductivity, a second semiconductor having a second conductivity different from the first conductivity, A plurality of semiconductor layers interposed between the first semiconductor layer and the second semiconductor layer and having an active layer that generates light by recombination of electrons and holes; At least one electrode formed on one side of the plurality of semiconductor layers to supply current to the plurality of semiconductor layers; And a plurality of semiconductor layers formed on opposite sides of at least one of the plurality of semiconductor layers so as to expose a part of the side surfaces of the plurality of semiconductor layers between the at least one electrode side and the opposite side of the at least one electrode, And an encapsulant (1).
According to still another aspect of the present disclosure, there is provided a method of manufacturing a semiconductor light emitting device, comprising: providing a first dam having an opening formed on a first base; A semiconductor light emitting device comprising: a first semiconductor layer having a first conductivity; a second semiconductor layer having a second conductivity different from the first conductivity; and a second semiconductor layer having a first conductivity type, A plurality of semiconductor layers interposed between the first and second semiconductor layers and having an active layer which generates light by recombination of electrons and holes, at least one electrode for supplying current to the plurality of semiconductor layers, and a plurality Placing a semiconductor light emitting portion on a first base such that the first encapsulation material faces the first base and the at least one electrode faces upward; Forming a second encapsulant between the first dam and the semiconductor light emitting portion; And forming at least one conductive portion to cover at least one of the exposed upper electrode and a portion of the second encapsulant.
According to yet another aspect of the present disclosure, there is provided a semiconductor light emitting device comprising a first semiconductor layer having a first conductivity, a second semiconductor layer having a first conductivity different from the first conductivity, A plurality of semiconductor layers interposed between the first semiconductor layer and the second semiconductor layer and having an active layer that generates light by recombination of electrons and holes; At least one electrode formed on one side of the plurality of semiconductor layers to supply current to the plurality of semiconductor layers; A first encapsulant surrounding the plurality of semiconductor layers to expose at least one electrode; A second encapsulant wrapping the first encapsulant such that at least one electrode is exposed and the first encapsulant is exposed to the opposite side of the at least one electrode; And at least one conductive part formed on at least one electrode and a part of the second encapsulant exposed to at least one electrode side.
This will be described later in the Specification for Implementation of the Invention.
1 is a view for explaining an example of a process of producing a semiconductor light emitting chip from a wafer,
2 is a view for explaining an example of a process of manufacturing a semiconductor light emitting device package using a semiconductor light emitting chip,
3 is a view for explaining an example of a semiconductor light emitting chip arranged on a tape by a sorter,
4 is a view showing an example of a semiconductor light emitting device shown in U.S. Patent No. 6,650,044,
5 is a view showing an example of a method of manufacturing a semiconductor light emitting device shown in U.S. Patent No. 6,650,044,
6 is a view for explaining a problem when a sealing material is formed all over a plurality of semiconductor light emitting chips,
7 is a view for explaining an example of a method of manufacturing a semiconductor light emitting device according to the present disclosure,
8 is a view for explaining an example of a semiconductor light emitting device according to the present disclosure,
9 is a view for explaining an example of a process of placing a semiconductor light emitting chip on a first encapsulant formed in an opening,
10 is a view for explaining an example of correcting the angle and position by recognizing the shape or pattern of the mask,
11 is a view for explaining an example of a dam provided on a base in the method of manufacturing a semiconductor light emitting device according to the present disclosure,
12 is a view for explaining an example of a method of providing a dam and a
13 is a view for explaining another example of a manufacturing method of a semiconductor light emitting device according to the present disclosure,
14 is a view for explaining an example of a semiconductor light emitting device according to the present disclosure,
15 is a view for explaining still another example of the semiconductor light emitting device according to the present disclosure,
16 is a view for explaining another example of a semiconductor light emitting device according to the present disclosure and a method of manufacturing the same,
17 is a view for explaining an example of a process of forming the conductive parts described in FIG. 16,
18 is a view for explaining another example of a method for manufacturing a semiconductor light emitting device according to the present disclosure,
19 is a view for explaining still another example of the semiconductor light emitting device according to the present disclosure,
20 and 21 are views showing an example of a method of inspecting a semiconductor light emitting device according to the present disclosure,
22 is a view for explaining examples of a method of separating a semiconductor light emitting element from a base and a dam,
23 is a view for explaining another example of a semiconductor light emitting device according to the present disclosure and a method for manufacturing the same,
24 is a view for explaining still another example of a semiconductor light emitting device according to the present disclosure and a method of manufacturing the same,
25 is a view for explaining another example of a semiconductor light emitting device according to the present disclosure and a method of manufacturing the same.
The present disclosure will now be described in detail with reference to the accompanying drawings.
7 is a view for explaining an example of a method of manufacturing a semiconductor light emitting device according to the present disclosure. First, a
In this example, the semiconductor
For example, after the mask or
As an example of the method of forming the
At least a portion of the plurality of semiconductor layers 30, 40, 50 may be buried in the
Thereafter, the semiconductor light emitting device including the semiconductor
According to this example, preferably, the
FIG. 8 is a view for explaining an example of a semiconductor light emitting device according to the present disclosure, in which the semiconductor light emitting device includes a semiconductor
In this example, the semiconductor
The
9 is a view for explaining an example of a process of placing a semiconductor light emitting chip on a first encapsulation member formed in an opening. The
9B, the
Since the
As an example of the
10 is a view for explaining an example of correcting the angle and position by recognizing the shape or the pattern of the dam. In the process of arranging the
Therefore, compared with the case where elements are arranged at predetermined intervals based on the semiconductor
11 is a view for explaining an example of a dam provided on a base in the method of manufacturing a semiconductor light emitting device according to the present disclosure, in which a mask or a
The
On the other hand, preferably, the semiconductor
12 is a view for explaining an example of a method of providing the dam and the
Thereafter, the semiconductor light emitting device including the semiconductor
13 is a view for explaining another example of a method of manufacturing a semiconductor light emitting device according to the present disclosure. In the method of manufacturing a semiconductor light emitting device, first, a
Thereafter, as shown in FIG. 13A, the exposed portion of the plurality of semiconductor layers 30, 40, 50 is sandwiched between the
On the other hand, the
Next, as shown in Fig. 13C, the semiconductor light emitting element composed of the semiconductor
FIG. 15 is a view for explaining still another example of the semiconductor light emitting device according to the present disclosure. As shown in FIG. 15A, the semiconductor light emitting device includes a plurality of semiconductor layers 30, And the
16A and 16B are diagrams for explaining another example of a semiconductor light emitting device according to the present disclosure and a method for manufacturing the same. In the method for manufacturing a semiconductor light emitting device, first, as shown in FIG. 16A, The semiconductor
Thereafter, as shown in FIG. 16B, a
The
Next, as shown in FIG. 16C, the first
Thereafter, the semiconductor light emitting device including the semiconductor
The manufacturing method of the semiconductor light emitting device of this embodiment may include a process of preparing the semiconductor
17A and 17B are views for explaining an example of a process of forming the conductive portion described in FIG. 16, wherein FIG. 17A is a top view of the semiconductor light emitting device, and FIG. 17B is a view (bottom view). The semiconductor
The semiconductor light emitting device is formed in a chip scale without encapsulating
18 is a view for explaining another example of the method of manufacturing the semiconductor light emitting device according to the present disclosure. The semiconductor
FIG. 19 is a view for explaining still another example of the semiconductor light emitting device according to the present disclosure, and can be manufactured by the manufacturing method of the semiconductor light emitting device described in FIGS. The example shown in Fig. 19A is an example using the device shown in Fig. 8 as the semiconductor
20 and 21 are views showing an example of a method of inspecting a semiconductor light emitting device according to the present disclosure. In the method of inspecting a semiconductor light emitting device, as shown in FIG. 20A, A semiconductor
20B, the
In order for the light measurement of the semiconductor light emitting element to be accurate, it is preferable to measure the light emitted from the semiconductor light emitting element as much as possible and measure without any peripheral interference. 20, the
An integrating sphere may be used as the
20 shows an example in which the
Referring to FIG. 21, according to the inspection method of the semiconductor light emitting device according to the present example, when the semiconductor light emitting device on the inner side of the
According to the inspection method of the semiconductor light emitting device according to this example, since the
22 is a view for explaining examples of a method of separating a semiconductor light emitting element from a base and a dam, and can be applied to the semiconductor light emitting element described in Figs. 7 to 19 and the manufacturing method thereof.
For example, referring to FIG. 22A, the semiconductor light emitting device including the sealing
Referring to FIG. 22B, each semiconductor light emitting element can be taken out of the
Referring to FIG. 22C, since the bonding force between the
Referring again to FIG. 6, when cutting the sealing
22C, since the sealing
23A and 23B are diagrams for explaining still another example of a semiconductor light emitting device according to the present disclosure and a method of manufacturing the same. First, as shown in FIG. 23A, a
Next, the
Next, the
FIG. 24 is a view for explaining still another example of the semiconductor light emitting device according to the present invention and the method for manufacturing the same, wherein the shape of the semiconductor light emitting device is formed according to the shape of the
25 is a view for explaining another example of the semiconductor light emitting device and the method for manufacturing the same according to the present disclosure, wherein the
Various embodiments of the present disclosure will be described below.
(1) A method of manufacturing a semiconductor light emitting device, comprising: providing a first dam having an opening formed on a first base; A semiconductor light emitting device comprising: a first semiconductor layer having a first conductivity; a second semiconductor layer having a second conductivity different from the first conductivity; and a second semiconductor layer having a first conductivity type, A plurality of semiconductor layers interposed between the first and second semiconductor layers and having an active layer which generates light by recombination of electrons and holes, at least one electrode for supplying current to the plurality of semiconductor layers, and a plurality Placing a semiconductor light emitting portion on a first base such that the first encapsulation material faces the first base and the at least one electrode faces upward; Forming a second encapsulant between the first dam and the semiconductor light emitting portion; And forming at least one conductive portion to cover at least one of the exposed upper electrode and a portion of the second encapsulant.
(2) The semiconductor light emitting portion is a flip chip having a first electrode electrically connected to the first semiconductor layer on one side of the plurality of semiconductor layers, and a second electrode electrically connected to the second semiconductor layer, Wherein a first conductive portion covering a portion of the first electrode and the second encapsulant and a second conductive portion covering the other portion of the second encapsulant and the second encapsulant are formed in the step of forming the conductive portion Gt;
(3) The method of manufacturing a semiconductor light emitting device according to (3), wherein the first encapsulant contains a phosphor and the second encapsulant comprises at least one of an opaque material and an EMC (electro-magnetic compatibility) material for reflecting light.
(4) exposing the first electrode and the second electrode by removing a part of the second encapsulant before the step of forming the conductive part.
(5) separating the semiconductor light emitting device including the semiconductor light emitting portion, the first sealing material, the second sealing material, and the conductive portion from the first base and the first dam after the step of forming the conductive portion .
(6) preparing a semiconductor light emitting portion before the step of placing the semiconductor light emitting portion on the first base, the step of preparing the semiconductor light emitting portion includes: a step of providing a second dam having an opening on the second base; Forming a first encapsulant on a second base exposed through the opening; A method for manufacturing a semiconductor light emitting chip, comprising the steps of: placing a semiconductor light emitting chip on a first encapsulant, the first encapsulant comprising a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity, A semiconductor light emitting chip including a plurality of semiconductor layers interposed between the plurality of semiconductor layers and having an active layer that generates light by recombination of electrons and holes and an electrode for supplying current to the plurality of semiconductor layers, Placing the semiconductor light emitting chip on the first encapsulant so that at least a portion of the layer is buried in the first encapsulant; And separating the semiconductor light emitting portion including the semiconductor light emitting chip and the first sealing material from the second base and the second dam.
(7) a step of forming a second encapsulation material between the first dam and the semiconductor light emitting portion, wherein a part of the side surfaces of the plurality of semiconductor layers is exposed from the first encapsulation material in the process of placing the semiconductor light emitting chip on the first encapsulation material Wherein the second encapsulant is in contact with the exposed side of the first encapsulant and the plurality of semiconductor layers.
(8) In the process of placing the semiconductor light emitting chip on the first encapsulation material, the first encapsulation material covers the side surfaces of the plurality of semiconductor layers and the plurality of semiconductor layers on the opposite side of the electrode, Wherein in the step of forming the sealing material, the second sealing material is in contact with the first sealing material.
(9) In the process of placing the semiconductor light emitting chip on the first encapsulation material, a part of the plurality of semiconductor layers on the opposite side of the electrode is buried in the first encapsulation material, a part of the side faces of the plurality of semiconductor layers are exposed, Preparing a third encapsulation material between the second dam and the exposed side surfaces of the plurality of semiconductor layers.
(10) The method for manufacturing a semiconductor light emitting device according to (10), wherein the first encapsulant comprises a phosphor, and the second encapsulant and the third encapsulant are made of at least one of a material opaque to reflect light and an EMC .
(11) preparing a semiconductor light emitting portion before the step of placing the semiconductor light emitting portion on the first base, the step of preparing the semiconductor light emitting portion includes: a step of providing a second dam having an opening on the second base; A first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity, and a second semiconductor layer having a second conductivity different from the first conductivity, A semiconductor light emitting chip including a plurality of semiconductor layers interposed between the semiconductor layers and having an active layer that generates light by recombination of electrons and holes and an electrode for supplying current to the plurality of semiconductor layers, Placing the semiconductor light emitting chip in contact with the semiconductor light emitting chip; Forming a first encapsulation material on the opening to cover the semiconductor light emitting chip; And separating the semiconductor light emitting portion including the semiconductor light emitting chip and the first sealing material from the second base and the second dam.
(12) A semiconductor light emitting device comprising: a first semiconductor layer having a first conductivity; a second semiconductor layer having a second conductivity different from the first conductivity; and a second semiconductor layer interposed between the first and second semiconductor layers, A plurality of semiconductor layers each having an active layer that generates light by recombination of holes; At least one electrode formed on one side of the plurality of semiconductor layers to supply current to the plurality of semiconductor layers; A first encapsulant surrounding the plurality of semiconductor layers to expose at least one electrode; A second encapsulant wrapping the first encapsulant such that at least one electrode is exposed and the first encapsulant is exposed to the opposite side of the at least one electrode; And at least one conductive part formed on at least one electrode and a part of the second encapsulant exposed to at least one electrode side.
(13) The semiconductor light emitting device according to (13), wherein the first encapsulant comprises a phosphor and the second encapsulant comprises at least one of an opaque material and an EMC (electro-magnetic compatibility) material for reflecting light.
(14) A semiconductor light emitting unit is a flip chip having a first electrode electrically connected to a first semiconductor layer on one side of a plurality of semiconductor layers, and a second electrode electrically connected to a second semiconductor layer, An insulating reflecting layer formed between the plurality of semiconductor layers and the first and second electrodes and reflecting light from the active layer; A first electrical connection through the insulating reflective layer and electrically connecting the first semiconductor layer and the first electrode; And a second electrical connection through the insulating reflection layer and electrically connecting the second semiconductor layer and the second electrode, wherein the conductive part includes: a first conductive part integrated with the first electrode and the second sealing material; And a second conductive part spaced apart from the first conductive part and integrated with the second electrode and the second encapsulant.
(15) The first encapsulant surrounds a plurality of semiconductor layers on the opposite side of the electrode and a part of the side faces of the plurality of semiconductor layers, and covers the side faces of the plurality of semiconductor layers exposed from the first encapsulant And a third encapsulation material covered by the second encapsulation material.
According to the semiconductor light emitting device and the method of manufacturing the same according to the present disclosure, the first encapsulant containing the fluorescent material can be formed thinly on the surface of the semiconductor light emitting chip, and the semiconductor light emitting device has a size substantially along the outline of the encapsulant, It is possible to provide a semiconductor light emitting device and / or a light emitting device package formed on a chip scale.
In addition, the first encapsulant formed in the opening can be used in a required amount by adjusting the height, and the first encapsulant is prevented from flowing into the electrode. Further, since the first encapsulant has a bonding force, it is convenient to place the semiconductor light emitting chip.
Further, the accuracy of alignment of the semiconductor light emitting chip is improved by using the mask or the dam as a guide pattern of the element transfer device for alignment of the semiconductor light emitting chip and by using it as a dam of the sealing material.
This also reduces the occurrence of defects due to the misalignment of the semiconductor light emitting chips in the separation process (e.g., sawing, etc.) into individual devices.
Compared with the method in which the dam is disposed on the tape on which the semiconductor light emitting chips are arranged and the sealing material is supplied after an additional process of filling the tape with an empty space or correcting the angle of the broken semiconductor light emitting chip, Is efficient because the above-mentioned additional process is unnecessary.
Further, since the sealing material is well pulled out from the dam where the release coating layer is formed, the surface of the sealing material is scraped and the light output efficiency is prevented from being lowered.
Further, since the mask or the dam reflects light toward the optical measuring instrument, the semiconductor light emitting element can be inspected more accurately and quickly.
70, 80: electrode 101: semiconductor light emitting chip 201: base
301: dam 305: opening 180: first sealant
170: second sealing material 190: third sealing material 701: optical measuring instrument
Claims (15)
Comprising: a first dam having an opening formed in a first base;
A semiconductor light emitting device comprising: a first semiconductor layer having a first conductivity; a second semiconductor layer having a second conductivity different from the first conductivity; and a second semiconductor layer having a first conductivity type, A plurality of semiconductor layers interposed between the first and second semiconductor layers and having an active layer which generates light by recombination of electrons and holes, at least one electrode for supplying current to the plurality of semiconductor layers, and a plurality Placing a semiconductor light emitting portion on a first base such that the first encapsulation material faces the first base and the at least one electrode faces upward;
Forming a second encapsulant between the first dam and the semiconductor light emitting portion including the first encapsulant; And
And forming at least one conductive part to cover at least one of the exposed electrodes and a part of the second encapsulant.
The semiconductor light emitting portion is a flip chip having a first electrode electrically connected to the first semiconductor layer on one side of the plurality of semiconductor layers and a second electrode electrically connected to the second semiconductor layer,
In the step of forming the conductive portion,
Wherein a first conductive portion covering a portion of the first electrode and the second encapsulant and a second conductive portion covering the other portion of the second encapsulant and the second encapsulant are formed.
The first encapsulant contains a phosphor,
Wherein the second encapsulant comprises at least one of an opaque material and an electro-magnetic compatibility material to reflect light.
Before the step of forming the conductive part,
And exposing the first electrode and the second electrode by removing a part of the second encapsulant.
After forming the conductive portion,
And separating the semiconductor light emitting device including the semiconductor light emitting portion, the first sealing material, the second sealing material, and the conductive portion from the first base and the first dam.
Preparing a semiconductor light emitting portion before placing the semiconductor light emitting portion on the first base,
Preparing the semiconductor light emitting portion comprises:
And a second dam having an opening formed on the second base;
Forming a first encapsulant on a second base exposed through the opening;
A method for manufacturing a semiconductor light emitting chip, comprising the steps of: placing a semiconductor light emitting chip on a first encapsulant, the first encapsulant comprising a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity, A semiconductor light emitting chip including a plurality of semiconductor layers interposed between the plurality of semiconductor layers and having an active layer that generates light by recombination of electrons and holes and an electrode for supplying current to the plurality of semiconductor layers, Placing the semiconductor light emitting chip on the first encapsulant so that at least a portion of the layer is buried in the first encapsulant; And
And separating the semiconductor light emitting portion including the first sealing material from the second base and the second dam.
In the process of placing the semiconductor light emitting chip on the first encapsulation material,
A part of the side surface of the plurality of semiconductor layers is exposed from the first encapsulant,
In the step of forming the second sealing material between the first dam and the semiconductor light emitting portion,
And the second encapsulant is in contact with the exposed side of the first encapsulant and the plurality of semiconductor layers.
In the process of placing the semiconductor light emitting chip on the first encapsulation material,
The first encapsulant covers the side surfaces of the plurality of semiconductor layers and the plurality of semiconductor layers opposite to the electrodes,
In the step of forming the second sealing material between the first dam and the semiconductor light emitting portion,
And the second encapsulant is in contact with the first encapsulant.
In the process of placing the semiconductor light emitting chip on the first encapsulation material,
A part of the plurality of semiconductor layers on the opposite side of the electrode is buried in the first encapsulation material, a part of the side surfaces of the plurality of semiconductor layers is exposed,
Preparing the semiconductor light emitting portion comprises:
And forming a third encapsulant between the second dam and the exposed side surfaces of the plurality of semiconductor layers.
The first encapsulant contains a phosphor,
Wherein the second encapsulant and the third encapsulant are made of at least one of an opaque material and an electro-magnetic compatibility material to reflect light.
Preparing a semiconductor light emitting portion before placing the semiconductor light emitting portion on the first base,
Preparing the semiconductor light emitting portion comprises:
And a second dam having an opening formed on the second base;
A first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity, and a second semiconductor layer having a second conductivity different from the first conductivity, A semiconductor light emitting chip including a plurality of semiconductor layers interposed between the semiconductor layers and having an active layer that generates light by recombination of electrons and holes and an electrode for supplying current to the plurality of semiconductor layers, Placing the semiconductor light emitting chip in contact with the semiconductor light emitting chip;
Forming a first encapsulation material on the opening to cover the semiconductor light emitting chip; And
And separating the semiconductor light emitting portion including the first sealing material from the second base and the second dam.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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KR1020140144087A KR101638124B1 (en) | 2014-10-23 | 2014-10-23 | Semiconductor light emitting device and method of manufacturing the same |
PCT/KR2015/009619 WO2016039593A1 (en) | 2014-09-12 | 2015-09-14 | Method for manufacturing semiconductor light-emitting device |
CN201580048716.1A CN106688115B (en) | 2014-09-12 | 2015-09-14 | The manufacturing method of semiconductor light-emitting elements |
US15/510,585 US10411176B2 (en) | 2014-09-12 | 2015-09-14 | Method for manufacturing semiconductor light-emitting device |
US16/519,546 US10930832B2 (en) | 2014-09-12 | 2019-07-23 | Method for manufacturing semiconductor light emitting device |
US16/519,467 US10763415B2 (en) | 2014-09-12 | 2019-07-23 | Method for manufacturing semiconductor light-emitting device |
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KR1020140144087A KR101638124B1 (en) | 2014-10-23 | 2014-10-23 | Semiconductor light emitting device and method of manufacturing the same |
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KR101877743B1 (en) * | 2016-09-26 | 2018-07-13 | 주식회사 세미콘라이트 | Semiconductor light emitting device and method of manufacturing the same |
WO2018056788A1 (en) * | 2016-09-26 | 2018-03-29 | 주식회사 세미콘라이트 | Semiconductor light-emitting element and method for manufacturing same |
KR101877237B1 (en) * | 2017-05-23 | 2018-08-09 | 주식회사 세미콘라이트 | Semiconductor light emitting device and method of manufacturing the same |
KR102035043B1 (en) * | 2017-11-28 | 2019-10-22 | (주)라이타이저 | Chip scale package of three plane light emitting and method for manufacturing thereof |
KR102140993B1 (en) * | 2019-04-01 | 2020-08-05 | (주)라이타이저 | Light Emitting Diode Chip Scale Package and method for manufacturing thereof |
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