JP2012238812A - 受光デバイス - Google Patents

受光デバイス Download PDF

Info

Publication number
JP2012238812A
JP2012238812A JP2011108519A JP2011108519A JP2012238812A JP 2012238812 A JP2012238812 A JP 2012238812A JP 2011108519 A JP2011108519 A JP 2011108519A JP 2011108519 A JP2011108519 A JP 2011108519A JP 2012238812 A JP2012238812 A JP 2012238812A
Authority
JP
Japan
Prior art keywords
glass substrate
light receiving
receiving device
depression
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011108519A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012238812A5 (https=
Inventor
Sadao Oku
定夫 奥
Hitoshi Kamamori
均 釜森
Hiroyuki Fujita
宏之 藤田
Koji Tsukagoshi
功二 塚越
Keiichiro Hayashi
恵一郎 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP2011108519A priority Critical patent/JP2012238812A/ja
Publication of JP2012238812A publication Critical patent/JP2012238812A/ja
Publication of JP2012238812A5 publication Critical patent/JP2012238812A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Light Receiving Elements (AREA)
JP2011108519A 2011-05-13 2011-05-13 受光デバイス Withdrawn JP2012238812A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011108519A JP2012238812A (ja) 2011-05-13 2011-05-13 受光デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011108519A JP2012238812A (ja) 2011-05-13 2011-05-13 受光デバイス

Publications (2)

Publication Number Publication Date
JP2012238812A true JP2012238812A (ja) 2012-12-06
JP2012238812A5 JP2012238812A5 (https=) 2014-04-24

Family

ID=47461437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011108519A Withdrawn JP2012238812A (ja) 2011-05-13 2011-05-13 受光デバイス

Country Status (1)

Country Link
JP (1) JP2012238812A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015125565A1 (ja) * 2014-02-18 2015-08-27 セイコーインスツル株式会社 光センサ装置
WO2015125564A1 (ja) * 2014-02-18 2015-08-27 セイコーインスツル株式会社 光センサ装置
JP2019085313A (ja) * 2017-11-09 2019-06-06 日本電気硝子株式会社 ガラス板及びこれを用いた波長変換パッケージ
WO2022059261A1 (ja) * 2020-09-16 2022-03-24 浜松ホトニクス株式会社 光検出モジュール及びビート分光装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145489A (ja) * 1997-11-07 1999-05-28 Matsushita Electric Ind Co Ltd 赤外線センサーおよびその製造方法
JP2002141432A (ja) * 2000-11-06 2002-05-17 Nikon Corp 半導体光センサパッケージおよびその製造方法
JP2005116600A (ja) * 2003-10-03 2005-04-28 Toko Inc カメラモジュール
JP2006013264A (ja) * 2004-06-28 2006-01-12 Kyocera Corp 光半導体素子収納用パッケージおよび光半導体装置
WO2010095367A1 (ja) * 2009-02-19 2010-08-26 日本電気株式会社 真空封止パッケージ、真空封止パッケージを有するプリント回路基板、電子機器、及び真空封止パッケージの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145489A (ja) * 1997-11-07 1999-05-28 Matsushita Electric Ind Co Ltd 赤外線センサーおよびその製造方法
JP2002141432A (ja) * 2000-11-06 2002-05-17 Nikon Corp 半導体光センサパッケージおよびその製造方法
JP2005116600A (ja) * 2003-10-03 2005-04-28 Toko Inc カメラモジュール
JP2006013264A (ja) * 2004-06-28 2006-01-12 Kyocera Corp 光半導体素子収納用パッケージおよび光半導体装置
WO2010095367A1 (ja) * 2009-02-19 2010-08-26 日本電気株式会社 真空封止パッケージ、真空封止パッケージを有するプリント回路基板、電子機器、及び真空封止パッケージの製造方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9773926B2 (en) 2014-02-18 2017-09-26 Sii Semiconductor Corporation Optical sensor device
CN106062969B (zh) * 2014-02-18 2017-12-08 精工半导体有限公司 光传感器装置
JP2015172567A (ja) * 2014-02-18 2015-10-01 セイコーインスツル株式会社 光センサ装置
JP2015173254A (ja) * 2014-02-18 2015-10-01 セイコーインスツル株式会社 光センサ装置
KR20160122136A (ko) * 2014-02-18 2016-10-21 에스아이아이 세미컨덕터 가부시키가이샤 광센서 장치
CN106062969A (zh) * 2014-02-18 2016-10-26 精工半导体有限公司 光传感器装置
CN106165108A (zh) * 2014-02-18 2016-11-23 精工半导体有限公司 光传感器装置
US9691914B2 (en) 2014-02-18 2017-06-27 Sii Semiconductor Corporation Optical sensor device
WO2015125564A1 (ja) * 2014-02-18 2015-08-27 セイコーインスツル株式会社 光センサ装置
WO2015125565A1 (ja) * 2014-02-18 2015-08-27 セイコーインスツル株式会社 光センサ装置
CN106165108B (zh) * 2014-02-18 2017-11-24 精工半导体有限公司 光传感器装置
TWI642198B (zh) * 2014-02-18 2018-11-21 Ablic Inc. 光感測器裝置
KR102313269B1 (ko) * 2014-02-18 2021-10-15 에이블릭 가부시키가이샤 광센서 장치
JP2019085313A (ja) * 2017-11-09 2019-06-06 日本電気硝子株式会社 ガラス板及びこれを用いた波長変換パッケージ
JP7280546B2 (ja) 2017-11-09 2023-05-24 日本電気硝子株式会社 ガラス板及びこれを用いた波長変換パッケージ
WO2022059261A1 (ja) * 2020-09-16 2022-03-24 浜松ホトニクス株式会社 光検出モジュール及びビート分光装置
JP7569646B2 (ja) 2020-09-16 2024-10-18 浜松ホトニクス株式会社 光検出モジュール及びビート分光装置
US12520615B2 (en) 2020-09-16 2026-01-06 Hamamatsu Photonics K.K. Light detection module and beat spectrometer

Similar Documents

Publication Publication Date Title
CN106299084B (zh) Led封装结构
US10340397B2 (en) Optical sensor device
JP5198394B2 (ja) 近接照度センサおよびその製造方法
JP6281858B2 (ja) 光学デバイス
US8363189B2 (en) Alkali silicate glass for displays
US20140160374A1 (en) Capacitive touch panel and method of making the same
JP2002076154A (ja) 半導体装置
JP2012238812A (ja) 受光デバイス
US20130134300A1 (en) Optical sensor device and method of manufacturing the same
CN103069563A (zh) 用于制造至少一个光电子半导体器件的方法
CN108496179A (zh) 光学指纹传感器和光学指纹传感器的封装方法
CN206931604U (zh) 光学指纹传感器
CN101764140A (zh) 覆晶式影像感测模块及其制作方法
CN109686749A (zh) 图像传感器芯片封装结构以及其制备方法
CN106129027B (zh) 生物识别封装结构与制作方法
CN115803188A (zh) 功能性层压玻璃制品及其制造方法
JP2002016194A (ja) 半導体装置
TWI597867B (zh) Led倒裝晶片封裝基板和led封裝結構
JPH0793390B2 (ja) Ｉｃカード等のための薄型構造の紫外線透過型半導体装置パッケージ
TW201409672A (zh) 半導體器件
JP2002164524A (ja) 半導体装置
US20050023489A1 (en) Chip type photo coupler
CN100466277C (zh) 光感测芯片的封装结构
JP2002100692A (ja) 半導体装置
JP4606007B2 (ja) 光学装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140304

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140304

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150203

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20150326