JP2012209598A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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Abstract
【解決手段】半導体装置は、板状導体で形成されるとともに複数の端子部27a,28aを有する正極用配線部材27及び負極用配線部材28が相互に電気的に絶縁された状態で近接して平行に配置されている。端子部27a,28aは、本体部27A,28Aに対してアングル状となるように屈曲形成された屈曲部27c,28cを有するとともに先端側に本体部27A,28Aに対して平行に延びる接合部27b,28bを有し、かつ厚みが本体部27A,28Aの厚みより薄く形成されている。屈曲部27c,28cは、板厚の薄い部分に形成されている。正極用配線部材27及び負極用配線部材28は、段差のない面が対向するように配置されている。接合部27b,28bは、回路パターンに超音波接合で接合されている。
【選択図】図4
Description
先ずインバータ装置の回路構成を説明する。図1(a)に示すように、インバータ装置11は、6個の半導体チップとしてのスイッチング素子Q1〜Q6を有するインバータ回路12を備えている。各スイッチング素子Q1〜Q6には、MOSFET(metal oxide semiconductor 電界効果トランジスタ)が使用されている。インバータ回路12は、第1及び第2のスイッチング素子Q1,Q2、第3及び第4のスイッチング素子Q3,Q4、第5及び第6のスイッチング素子Q5,Q6がそれぞれ直列に接続されている。各スイッチング素子Q1〜Q6のドレインとソース間には、ダイオードD1〜D6が、逆並列に接続されている。第1、第3及び第5のスイッチング素子Q1,Q3,Q5及び各第1、第3及び第5のスイッチング素子Q1,Q3,Q5に接続されたダイオードD1,D3,D5の組はそれぞれ上アームと呼ばれる。また、第2、第4及び第6のスイッチング素子Q2,Q4,Q6及び第2、第4及び第6のスイッチング素子Q2,Q4,Q6に接続されたダイオードD2,D4,D6の組はそれぞれ下アームと呼ばれる。
図2〜図4に示すように、インバータ装置11は、銅製の金属ベース20と、絶縁基板としてのセラミック基板21とで構成された基板22上に半導体チップ23が実装されている。半導体チップ23は、1個のスイッチング素子(MOSFET)及び1個のダイオードが一つのデバイスとして組み込まれている。即ち、半導体チップ23は、図1(b)に示される一つのスイッチング素子Q及び一つのダイオードDを備えたデバイスとなる。
インバータ装置11は、例えば、車両の電源装置の一部を構成するものとして使用される。インバータ装置11は、プラス入力端子14及びマイナス入力端子16が直流電源(図示せず)に接続され、U相端子U、V相端子V及びW相端子Wがモータ(図示せず)に接続され、駆動信号入力端子G1〜G6及び信号端子S1〜S6が制御装置(図示せず)に接続された状態で使用される。
(1)半導体装置は、板状導体で形成されるとともに複数の端子部27a,28aを有する正極用配線部材27及び負極用配線部材28が相互に電気的に絶縁された状態で近接して平行に配置されている。したがって、配線のインダクタンスを低減することができる。
○ 図6に示すように、正極用配線部材27及び負極用配線部材28は、段差のない面と段差のある面とが対向するように配置してもよい。正極用配線部材27及び負極用配線部材28を段差のない面同士が対向するように配置する構成では、端子部27a,28aの屈曲部27c,28cの曲げ方向を異なるように加工する必要があるため、曲げ加工に使用する金型が2種類必要になり、加工に手間がかかりコストも高くなる。これに対して、段差のない面と段差のある面とが対向するように配置する構成では、端子部27a,28aの屈曲部27c,28cの曲げ方向が正極用配線部材27及び負極用配線部材28で同じに形成されるため、屈曲部27c,28cの曲げ方向を異なるように加工する場合に比べて加工が容易になる。
○ 半導体チップ23はMOSFETに限らず、他のパワートランジスタ(例えば、IGBT(絶縁ゲートバイポーラ型トランジスタ))やサイリスタを使用してもよい。
○ インバータ装置11は、3相交流を出力する構成に限らず、単相交流を出力する構成としてもよい。単相交流を出力する構成では上アーム及び下アームの組が2組存在する。
○ 半導体装置は、板状導体で形成されるとともに複数の端子部を有する正極用配線部材及び負極用配線部材が相互に電気的に絶縁された状態で近接して平行に配置された構成を備えた物であれば適用することができ、コンデンサ17のない半導体装置であってもよい。
(1)前記半導体装置はインバータ装置であり、前記正極用配線部材は前記インバータ装置を構成するスイッチング素子に電力を供給するコンデンサの正極端子に電気的に接続され、前記負極用配線部材は、前記インバータ装置を構成するスイッチング素子に電力を供給するコンデンサの負極端子に電気的に接続されている。
Claims (3)
- 板状導体で形成されるとともに複数の端子部を有する正極用配線部材及び負極用配線部材が相互に電気的に絶縁された状態で近接して平行に配置された半導体装置であって、前記端子部は、本体部に対してアングル状となるように屈曲形成された屈曲部を有するとともに先端側に前記本体部に対して平行に延びる接合部を有し、かつ厚みが前記本体部の厚みより薄く形成されており、
前記正極用配線部材及び前記負極用配線部材は、段差のない面と段差のある面とが対向するように配置されている半導体装置。 - 前記屈曲部は、板厚の薄い部分に形成されている請求項1に記載の半導体装置。
- 前記接合部は、回路パターンに超音波接合で接合されている請求項1又は請求項2に記載の半導体装置。
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2016084180A1 (ja) * | 2014-11-27 | 2016-06-02 | 三菱電機株式会社 | 半導体モジュールおよび半導体駆動装置 |
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JP2002044964A (ja) * | 2000-07-21 | 2002-02-08 | Hitachi Ltd | 半導体装置,電力変換装置及び自動車 |
JP2002368191A (ja) * | 2001-06-07 | 2002-12-20 | Hitachi Ltd | 電気車用制御装置 |
JP2006245362A (ja) * | 2005-03-04 | 2006-09-14 | Mitsubishi Electric Corp | 半導体装置およびこれに用いられる電極端子 |
JP2007143272A (ja) * | 2005-11-17 | 2007-06-07 | Hitachi Ltd | コンデンサモジュール,電力変換装置及び車載用電機システム |
JP2008103502A (ja) * | 2006-10-18 | 2008-05-01 | Toyota Motor Corp | 回路体 |
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JP2002044964A (ja) * | 2000-07-21 | 2002-02-08 | Hitachi Ltd | 半導体装置,電力変換装置及び自動車 |
JP2002368191A (ja) * | 2001-06-07 | 2002-12-20 | Hitachi Ltd | 電気車用制御装置 |
JP2006245362A (ja) * | 2005-03-04 | 2006-09-14 | Mitsubishi Electric Corp | 半導体装置およびこれに用いられる電極端子 |
JP2007143272A (ja) * | 2005-11-17 | 2007-06-07 | Hitachi Ltd | コンデンサモジュール,電力変換装置及び車載用電機システム |
JP2008103502A (ja) * | 2006-10-18 | 2008-05-01 | Toyota Motor Corp | 回路体 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2016084180A1 (ja) * | 2014-11-27 | 2016-06-02 | 三菱電機株式会社 | 半導体モジュールおよび半導体駆動装置 |
US9978670B2 (en) | 2014-11-27 | 2018-05-22 | Mitsubishi Electric Corporation | Semiconductor module and semiconductor driving device |
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