JP2012195390A5 - - Google Patents
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- Publication number
- JP2012195390A5 JP2012195390A5 JP2011057317A JP2011057317A JP2012195390A5 JP 2012195390 A5 JP2012195390 A5 JP 2012195390A5 JP 2011057317 A JP2011057317 A JP 2011057317A JP 2011057317 A JP2011057317 A JP 2011057317A JP 2012195390 A5 JP2012195390 A5 JP 2012195390A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- ground
- multilayer circuit
- extends
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011057317A JP2012195390A (ja) | 2011-03-16 | 2011-03-16 | 積層型回路基板およびこれを搭載した電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011057317A JP2012195390A (ja) | 2011-03-16 | 2011-03-16 | 積層型回路基板およびこれを搭載した電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012195390A JP2012195390A (ja) | 2012-10-11 |
| JP2012195390A5 true JP2012195390A5 (enExample) | 2014-05-15 |
Family
ID=47087029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011057317A Pending JP2012195390A (ja) | 2011-03-16 | 2011-03-16 | 積層型回路基板およびこれを搭載した電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012195390A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7100487B2 (ja) * | 2018-04-27 | 2022-07-13 | 京セラ株式会社 | 印刷配線板 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6227882B1 (en) * | 1997-10-01 | 2001-05-08 | Berg Technology, Inc. | Connector for electrical isolation in a condensed area |
| JP4838006B2 (ja) * | 2006-02-21 | 2011-12-14 | 株式会社フジクラ | フレキシブルプリント配線板 |
| JP2007288180A (ja) * | 2006-03-24 | 2007-11-01 | Kyocera Corp | 配線構造、多層配線基板および電子装置 |
| JP5019174B2 (ja) * | 2007-08-03 | 2012-09-05 | 山一電機株式会社 | 高速伝送用コネクタ |
| JP2011023547A (ja) * | 2009-07-16 | 2011-02-03 | Sumitomo Bakelite Co Ltd | 回路基板 |
-
2011
- 2011-03-16 JP JP2011057317A patent/JP2012195390A/ja active Pending
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