JP2012195390A - 積層型回路基板およびこれを搭載した電子機器 - Google Patents

積層型回路基板およびこれを搭載した電子機器 Download PDF

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Publication number
JP2012195390A
JP2012195390A JP2011057317A JP2011057317A JP2012195390A JP 2012195390 A JP2012195390 A JP 2012195390A JP 2011057317 A JP2011057317 A JP 2011057317A JP 2011057317 A JP2011057317 A JP 2011057317A JP 2012195390 A JP2012195390 A JP 2012195390A
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Japan
Prior art keywords
layer
circuit board
ground
multilayer circuit
signal wiring
Prior art date
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Pending
Application number
JP2011057317A
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English (en)
Japanese (ja)
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JP2012195390A5 (enExample
Inventor
Kunihiko Tabei
邦彦 田部井
Yoshikazu Inagaki
善計 稲垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2011057317A priority Critical patent/JP2012195390A/ja
Publication of JP2012195390A publication Critical patent/JP2012195390A/ja
Publication of JP2012195390A5 publication Critical patent/JP2012195390A5/ja
Pending legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2011057317A 2011-03-16 2011-03-16 積層型回路基板およびこれを搭載した電子機器 Pending JP2012195390A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011057317A JP2012195390A (ja) 2011-03-16 2011-03-16 積層型回路基板およびこれを搭載した電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011057317A JP2012195390A (ja) 2011-03-16 2011-03-16 積層型回路基板およびこれを搭載した電子機器

Publications (2)

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JP2012195390A true JP2012195390A (ja) 2012-10-11
JP2012195390A5 JP2012195390A5 (enExample) 2014-05-15

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JP2011057317A Pending JP2012195390A (ja) 2011-03-16 2011-03-16 積層型回路基板およびこれを搭載した電子機器

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JP (1) JP2012195390A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019192844A (ja) * 2018-04-27 2019-10-31 京セラ株式会社 印刷配線板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11195462A (ja) * 1997-10-01 1999-07-21 Berg Technol Inc 集中領域における電気絶縁のためのコネクタ
JP2007227469A (ja) * 2006-02-21 2007-09-06 Fujikura Ltd フレキシブルプリント配線板
JP2007288180A (ja) * 2006-03-24 2007-11-01 Kyocera Corp 配線構造、多層配線基板および電子装置
JP2009037972A (ja) * 2007-08-03 2009-02-19 Yamaichi Electronics Co Ltd 高速伝送用コネクタ
JP2011023547A (ja) * 2009-07-16 2011-02-03 Sumitomo Bakelite Co Ltd 回路基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11195462A (ja) * 1997-10-01 1999-07-21 Berg Technol Inc 集中領域における電気絶縁のためのコネクタ
JP2007227469A (ja) * 2006-02-21 2007-09-06 Fujikura Ltd フレキシブルプリント配線板
JP2007288180A (ja) * 2006-03-24 2007-11-01 Kyocera Corp 配線構造、多層配線基板および電子装置
JP2009037972A (ja) * 2007-08-03 2009-02-19 Yamaichi Electronics Co Ltd 高速伝送用コネクタ
JP2011023547A (ja) * 2009-07-16 2011-02-03 Sumitomo Bakelite Co Ltd 回路基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019192844A (ja) * 2018-04-27 2019-10-31 京セラ株式会社 印刷配線板
JP7100487B2 (ja) 2018-04-27 2022-07-13 京セラ株式会社 印刷配線板

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