JP2012181521A - プリント回路基板に対するレンズ装置の取り付け - Google Patents

プリント回路基板に対するレンズ装置の取り付け Download PDF

Info

Publication number
JP2012181521A
JP2012181521A JP2012030563A JP2012030563A JP2012181521A JP 2012181521 A JP2012181521 A JP 2012181521A JP 2012030563 A JP2012030563 A JP 2012030563A JP 2012030563 A JP2012030563 A JP 2012030563A JP 2012181521 A JP2012181521 A JP 2012181521A
Authority
JP
Japan
Prior art keywords
frame
lens device
printed circuit
lens
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012030563A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012181521A5 (enExample
Inventor
J K David Meadowcroft
ケイ デイビッド ミードウクロフト，ジェイ
Paul Yu
ユー，ポール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies Fiber IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies Fiber IP Singapore Pte Ltd filed Critical Avago Technologies Fiber IP Singapore Pte Ltd
Publication of JP2012181521A publication Critical patent/JP2012181521A/ja
Publication of JP2012181521A5 publication Critical patent/JP2012181521A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
JP2012030563A 2011-02-28 2012-02-15 プリント回路基板に対するレンズ装置の取り付け Pending JP2012181521A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/036572 2011-02-28
US13/036,572 US9066456B2 (en) 2011-02-28 2011-02-28 Lens device attachment to printed circuit board

Publications (2)

Publication Number Publication Date
JP2012181521A true JP2012181521A (ja) 2012-09-20
JP2012181521A5 JP2012181521A5 (enExample) 2015-04-02

Family

ID=46719044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012030563A Pending JP2012181521A (ja) 2011-02-28 2012-02-15 プリント回路基板に対するレンズ装置の取り付け

Country Status (2)

Country Link
US (2) US9066456B2 (enExample)
JP (1) JP2012181521A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022027481A (ja) * 2020-07-31 2022-02-10 ジュニパー ネットワークス， インコーポレーテッド ピックアンドプレースマシンを使用した光学部品の光ベースの配置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9494178B2 (en) 2013-03-01 2016-11-15 Apple Inc. Methods for bonding substrates using liquid adhesive
CN104730651B (zh) * 2013-12-20 2018-07-06 台达电子工业股份有限公司 光连接器
CN105137554A (zh) * 2015-09-24 2015-12-09 青岛海信宽带多媒体技术有限公司 一种光模块
US10073227B1 (en) * 2017-06-05 2018-09-11 Mellanox Technologies, Ltd. System and method for characterizing the location of optical components in an optical module
USD877732S1 (en) 2018-05-31 2020-03-10 Sensus Spectrum, Llc Potting cup
US10694617B2 (en) * 2018-07-31 2020-06-23 Sensus Spectrum, Llc Plastic injection molded potting cups and related methods
US11025807B1 (en) 2019-12-02 2021-06-01 Adasky, Ltd. System and method for optical alignment and calibration of an infrared camera lens
US11582372B2 (en) * 2019-12-02 2023-02-14 Adasky, Ltd. System and method for lens alignment and bonding
KR20230052288A (ko) * 2020-08-21 2023-04-19 아이피지 포토닉스 코포레이션 콤팩트한 레이저 헤드

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09197197A (ja) * 1996-01-16 1997-07-31 Furukawa Electric Co Ltd:The 光モジュールの組立装置
JP2001174671A (ja) * 1999-12-16 2001-06-29 Japan Aviation Electronics Industry Ltd 光素子モジュール
JP2004086136A (ja) * 2002-07-01 2004-03-18 Seiko Epson Corp 光トランシーバの製造方法及び調整装置
US20040264887A1 (en) * 2003-06-30 2004-12-30 Rosenberg Paul K. Optical transceiver having a single optical subassembly
JP2006128694A (ja) * 2004-10-29 2006-05-18 Agilent Technol Inc 電子・光学サブアセンブリ及びその製造方法
JP2007534988A (ja) * 2004-04-28 2007-11-29 フィニサー コーポレイション モジュラー光デバイス・パッケージ
JP2008107760A (ja) * 2006-09-28 2008-05-08 Kyocera Corp 光アイソレータ機能付き光フィルタ及びそれを備えた光送受信モジュール
WO2010143175A1 (en) * 2009-06-12 2010-12-16 Firecomms Limited An optical device module and production method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0397197A (ja) 1989-09-08 1991-04-23 Kawasaki Steel Corp メモリセル
US6896422B2 (en) * 2003-02-04 2005-05-24 Intel Corporation Optoelectronic modules and methods of manufacturing the same
US7066661B2 (en) 2004-03-30 2006-06-27 Stefano Therisod Small footprint optical fiber transceiver
US7306377B2 (en) 2004-04-30 2007-12-11 Finisar Corporation Integrated optical sub-assembly having epoxy chip package
US7334948B2 (en) * 2004-05-21 2008-02-26 Finisar Corporation Modular optical device with component insert
US20060045436A1 (en) 2004-08-26 2006-03-02 Wang Charlie X Low electromagnetic interference (EMI) shielded assemblies for electro-optical devices
US20060049154A1 (en) * 2004-09-09 2006-03-09 Clifford George M Jr System and method for bonding camera components after adjustment
JP4705432B2 (ja) * 2005-03-28 2011-06-22 富士通コンポーネント株式会社 コネクタ
US7203426B2 (en) * 2005-06-04 2007-04-10 National Taiwan University Optical subassembly of optical transceiver
US7534988B2 (en) 2005-11-08 2009-05-19 Microsoft Corporation Method and system for optical tracking of a pointing object
US20100098374A1 (en) 2008-10-20 2010-04-22 Avago Technologies Fiber Ip (Signgapore) Pte. Ltd. Optoelectronic component based on premold technology
US8260097B2 (en) * 2010-06-16 2012-09-04 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Opto-electronic alignment system and method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09197197A (ja) * 1996-01-16 1997-07-31 Furukawa Electric Co Ltd:The 光モジュールの組立装置
JP2001174671A (ja) * 1999-12-16 2001-06-29 Japan Aviation Electronics Industry Ltd 光素子モジュール
JP2004086136A (ja) * 2002-07-01 2004-03-18 Seiko Epson Corp 光トランシーバの製造方法及び調整装置
US20040264887A1 (en) * 2003-06-30 2004-12-30 Rosenberg Paul K. Optical transceiver having a single optical subassembly
JP2007534988A (ja) * 2004-04-28 2007-11-29 フィニサー コーポレイション モジュラー光デバイス・パッケージ
JP2006128694A (ja) * 2004-10-29 2006-05-18 Agilent Technol Inc 電子・光学サブアセンブリ及びその製造方法
JP2008107760A (ja) * 2006-09-28 2008-05-08 Kyocera Corp 光アイソレータ機能付き光フィルタ及びそれを備えた光送受信モジュール
WO2010143175A1 (en) * 2009-06-12 2010-12-16 Firecomms Limited An optical device module and production method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022027481A (ja) * 2020-07-31 2022-02-10 ジュニパー ネットワークス， インコーポレーテッド ピックアンドプレースマシンを使用した光学部品の光ベースの配置
JP7631111B2 (ja) 2020-07-31 2025-02-18 オープンライト フォトニクス インコーポレイテッド ピックアンドプレースマシンを使用した光学部品の光ベースの配置

Also Published As

Publication number Publication date
US9066456B2 (en) 2015-06-23
US20150253522A1 (en) 2015-09-10
US20120219257A1 (en) 2012-08-30
US9435966B2 (en) 2016-09-06

Similar Documents

Publication Publication Date Title
JP2012181521A (ja) プリント回路基板に対するレンズ装置の取り付け
JP5385336B2 (ja) 光電子位置合わせシステム及び方法
US7104703B2 (en) Optical transceiver and method for producing the same
TWI509303B (zh) 光電收發器模組系統及操作ㄧ光電模組系統之方法
US20110170831A1 (en) Optical module and manufacturing method of the module
WO2013053708A1 (en) Optical connector with alignment element, optical unit and assembly method
CN103038685A (zh) 具有用于对对齐特征进行成像的专用透镜的本体
CN103091799A (zh) 供在并行光学通信模块中使用的设备及方法
US20170068056A1 (en) Device mounting apparatus and device mounting method
CN101441298A (zh) 光波导路装置及其制造方法、以及光波导路连接结构
US20200041734A1 (en) Optical module
US20090297103A1 (en) Optical subassembly for an electro-optical assembly
US7149405B2 (en) Electro-optical subassemblies and method for assembly thereof
US9285560B2 (en) Method and device for manufacturing optical transmission device, and optical transmission device
KR101256814B1 (ko) 완전 수동정렬 패키징된 광모듈 및 그 제조방법
US20190086622A1 (en) Method for manufacturing optical module, apparatus for manufacturing optical module, and optical module
US11719903B2 (en) Systems, methods, and devices for assembling lenses and waveguides
WO2004114475A2 (en) Packaging and passive alignment of microlens and molded receptacle
TWM562984U (zh) 光通訊模組
JP5823419B2 (ja) 光モジュールの製造方法
JPH04165313A (ja) 光半導体素子モジュール
CN105353476A (zh) 用于制作光学通信模块的电光组合件的方法
US20150362675A1 (en) Optical waveguide sheet, optical unit, and method for manufacturing the same
JPH11168233A (ja) 光モジュール及び光トランシーバ
JP6360233B1 (ja) 光電変換ユニット、光ファイバガイド、コネクタ及び光電変換ユニットの製造方法

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20130718

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150213

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150213

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150915

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150929

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160531

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20170124