JP2012172245A5 - - Google Patents

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JP2012172245A5
JP2012172245A5 JP2011038171A JP2011038171A JP2012172245A5 JP 2012172245 A5 JP2012172245 A5 JP 2012172245A5 JP 2011038171 A JP2011038171 A JP 2011038171A JP 2011038171 A JP2011038171 A JP 2011038171A JP 2012172245 A5 JP2012172245 A5 JP 2012172245A5
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JP
Japan
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plating
current density
range
property
plated
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JP2011038171A
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JP5631775B2 (ja
JP2012172245A (ja
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Priority to JP2011038171A priority Critical patent/JP5631775B2/ja
Priority claimed from JP2011038171A external-priority patent/JP5631775B2/ja
Priority to US13/403,331 priority patent/US9476138B2/en
Priority to TW101106180A priority patent/TWI570278B/zh
Priority to CN201210045704.1A priority patent/CN102650072B/zh
Publication of JP2012172245A publication Critical patent/JP2012172245A/ja
Publication of JP2012172245A5 publication Critical patent/JP2012172245A5/ja
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本発明のめっき方法を実施するための好ましい電流密度、めっき時間についても特に制限はなく、被めっき物のサイズ、形状、めっき液の成分、望ましいめっき品質（めっき膜厚、レベリング性、均一電着性など）に応じて適宜選択することが可能である。本発明の方法において電流密度は例えば、０．１Ａ/ｄｍ２〜１０Ａ/ｄｍ２の範囲が可能である。高い均一電着性の観点からは、１〜５Ａ／ｄｍ２の範囲が好ましい。


JP2011038171A 2011-02-24 2011-02-24 複合めっき液 Active JP5631775B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011038171A JP5631775B2 (ja) 2011-02-24 2011-02-24 複合めっき液
US13/403,331 US9476138B2 (en) 2011-02-24 2012-02-23 Composite plating liquid
TW101106180A TWI570278B (zh) 2011-02-24 2012-02-24 複合電鍍液
CN201210045704.1A CN102650072B (zh) 2011-02-24 2012-02-24 复合电镀液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011038171A JP5631775B2 (ja) 2011-02-24 2011-02-24 複合めっき液

Publications (3)

Publication Number Publication Date
JP2012172245A JP2012172245A (ja) 2012-09-10
JP2012172245A5 true JP2012172245A5 (ja) 2013-12-19
JP5631775B2 JP5631775B2 (ja) 2014-11-26

Family

ID=46692194

Family Applications (1)

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JP2011038171A Active JP5631775B2 (ja) 2011-02-24 2011-02-24 複合めっき液

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US (1) US9476138B2 (ja)
JP (1) JP5631775B2 (ja)
CN (1) CN102650072B (ja)
TW (1) TWI570278B (ja)

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* Cited by examiner, † Cited by third party
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CN104195619A (zh) * 2014-09-17 2014-12-10 朱忠良 一种复合电镀液及使用所述复合电镀液进行电镀的方法
JP6435546B2 (ja) * 2014-10-17 2018-12-12 ディップソール株式会社 銅−ニッケル合金電気めっき装置
JP6531277B2 (ja) * 2015-03-30 2019-06-19 株式会社 コーア 無電解めっき液及び無電解めっき方法
CN104928732A (zh) * 2015-05-13 2015-09-23 中国石油天然气股份有限公司西南油气田分公司重庆天然气净化总厂 一种镍钨单壁碳纳米管复合镀液、镀膜及其制备方法
US10316424B2 (en) 2016-02-23 2019-06-11 Samsung Electronics Co., Ltd. Flexible electrically conductive structure, flexible wiring board, production method thereof, and electronic device includng the same
US11091847B2 (en) * 2016-10-28 2021-08-17 Unison Industries Llc Method of manufacturing aircraft engine parts utilizing reusable and reconfigurable smart memory polymer mandrel
JP2019002034A (ja) * 2017-06-13 2019-01-10 国立大学法人信州大学 銅・単層カーボンナノチューブ複合めっき方法
CN109537030B (zh) * 2018-11-26 2020-12-15 江苏科技大学 一种碳纳米颗粒溶液的制备方法及其在镍涂层中的应用
CN111041540A (zh) * 2019-12-24 2020-04-21 托伦斯半导体设备启东有限公司 一种半导体硅片耐磨处理工艺

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FR813548A (fr) * 1936-11-16 1937-06-03 Mond Nickel Co Ltd Procédé pour l'obtention de dépôts brillants ou semi-brillants de nickel
US3860949A (en) * 1973-09-12 1975-01-14 Rca Corp Semiconductor mounting devices made by soldering flat surfaces to each other
JPS62109991A (ja) * 1985-07-29 1987-05-21 C Uyemura & Co Ltd 電気めつき液
US5051814A (en) * 1987-04-15 1991-09-24 The Board Of Trustees Of The Leland Stanford Junior University Method of providing stress-free thermally-conducting attachment of two bodies
JPH04116191A (ja) * 1990-09-04 1992-04-16 C Uyemura & Co Ltd 電気めっき方法
CN1265028C (zh) * 2001-10-29 2006-07-19 株式会社新王磁材 在物品表面形成电镀膜的方法
JP4032116B2 (ja) * 2002-11-01 2008-01-16 国立大学法人信州大学 電子部品およびその製造方法
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JP5544527B2 (ja) * 2009-03-02 2014-07-09 国立大学法人信州大学 複合めっき皮膜及びその形成方法並びに電解めっき液
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