IT1397144B1 - Substrato placcato non elettricamente con composto di nickel e metodo. - Google Patents

Substrato placcato non elettricamente con composto di nickel e metodo.

Info

Publication number
IT1397144B1
IT1397144B1 ITCO2009A000056A ITCO20090056A IT1397144B1 IT 1397144 B1 IT1397144 B1 IT 1397144B1 IT CO2009A000056 A ITCO2009A000056 A IT CO2009A000056A IT CO20090056 A ITCO20090056 A IT CO20090056A IT 1397144 B1 IT1397144 B1 IT 1397144B1
Authority
IT
Italy
Prior art keywords
nickel
plated substrate
electrically composed
electrically
plated
Prior art date
Application number
ITCO2009A000056A
Other languages
English (en)
Inventor
Eugenio Giorni
Massimo Giannozzi
Original Assignee
Nuovo Pignone Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to ITCO2009A000056A priority Critical patent/IT1397144B1/it
Application filed by Nuovo Pignone Spa filed Critical Nuovo Pignone Spa
Priority to RU2012122109/02A priority patent/RU2012122109A/ru
Priority to AU2010323163A priority patent/AU2010323163A1/en
Priority to EP10782605A priority patent/EP2507406A2/en
Priority to CN201080062744.6A priority patent/CN102713003B/zh
Priority to KR1020127016829A priority patent/KR20120101476A/ko
Priority to BR112012012830A priority patent/BR112012012830A2/pt
Priority to JP2012540423A priority patent/JP2013512335A/ja
Priority to MX2012006235A priority patent/MX2012006235A/es
Priority to PCT/EP2010/068163 priority patent/WO2011064276A2/en
Priority to CA2782421A priority patent/CA2782421A1/en
Priority to US13/512,813 priority patent/US20130143031A1/en
Publication of ITCO20090056A1 publication Critical patent/ITCO20090056A1/it
Application granted granted Critical
Publication of IT1397144B1 publication Critical patent/IT1397144B1/it

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1655Process features
    • C23C18/1662Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemically Coating (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
ITCO2009A000056A 2009-11-30 2009-11-30 Substrato placcato non elettricamente con composto di nickel e metodo. IT1397144B1 (it)

Priority Applications (12)

Application Number Priority Date Filing Date Title
ITCO2009A000056A IT1397144B1 (it) 2009-11-30 2009-11-30 Substrato placcato non elettricamente con composto di nickel e metodo.
MX2012006235A MX2012006235A (es) 2009-11-30 2010-11-24 Substrato niquelado por reduccion quimica compuesto y metodo.
EP10782605A EP2507406A2 (en) 2009-11-30 2010-11-24 Electroless ni-composite plated substrate and method
CN201080062744.6A CN102713003B (zh) 2009-11-30 2010-11-24 无电镀Ni-复合材料的基材和方法
KR1020127016829A KR20120101476A (ko) 2009-11-30 2010-11-24 무전해 니켈-복합물 도금된 기판 및 제조 방법
BR112012012830A BR112012012830A2 (pt) 2009-11-30 2010-11-24 método para cobrir um substrato e substrato
RU2012122109/02A RU2012122109A (ru) 2009-11-30 2010-11-24 Основа, покрытая композитом на основе химически осажденного никеля, и способ ее получения
AU2010323163A AU2010323163A1 (en) 2009-11-30 2010-11-24 Electroless Ni-composite plated substrate and method
PCT/EP2010/068163 WO2011064276A2 (en) 2009-11-30 2010-11-24 Electroless ni-composite plated substrate and method
CA2782421A CA2782421A1 (en) 2009-11-30 2010-11-24 Electroless ni-composite plated substrate and method
US13/512,813 US20130143031A1 (en) 2009-11-30 2010-11-24 Electroless ni-composite plated substrate and method
JP2012540423A JP2013512335A (ja) 2009-11-30 2010-11-24 無電解Ni複合材料でめっきされた基材および方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITCO2009A000056A IT1397144B1 (it) 2009-11-30 2009-11-30 Substrato placcato non elettricamente con composto di nickel e metodo.

Publications (2)

Publication Number Publication Date
ITCO20090056A1 ITCO20090056A1 (it) 2011-06-01
IT1397144B1 true IT1397144B1 (it) 2013-01-04

Family

ID=42289621

Family Applications (1)

Application Number Title Priority Date Filing Date
ITCO2009A000056A IT1397144B1 (it) 2009-11-30 2009-11-30 Substrato placcato non elettricamente con composto di nickel e metodo.

Country Status (12)

Country Link
US (1) US20130143031A1 (it)
EP (1) EP2507406A2 (it)
JP (1) JP2013512335A (it)
KR (1) KR20120101476A (it)
CN (1) CN102713003B (it)
AU (1) AU2010323163A1 (it)
BR (1) BR112012012830A2 (it)
CA (1) CA2782421A1 (it)
IT (1) IT1397144B1 (it)
MX (1) MX2012006235A (it)
RU (1) RU2012122109A (it)
WO (1) WO2011064276A2 (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5465168B2 (ja) * 2010-12-27 2014-04-09 日本発條株式会社 粘性液体供給ノズルへの潤滑性メッキ層の形成方法及び粘性液体供給ノズル
US9885347B2 (en) 2013-10-30 2018-02-06 Emerson Climate Technologies, Inc. Components for compressors having electroless coatings on wear surfaces
CN105132895B (zh) * 2015-09-22 2017-09-22 富耐克超硬材料股份有限公司 一种Ni‑P化学镀液及Ni‑P纳米立方氮化硼复合镀层的制备方法
RU176890U1 (ru) * 2017-10-19 2018-02-01 Общество С Ограниченной Ответственностью "Технологии Минеральных Покрытий - Тюмень" Ротор винтового забойного двигателя
EP4004256B1 (en) 2019-07-26 2024-01-17 ENI S.p.A. Multilayered nickel-phosphorus composite
CN111455357A (zh) * 2020-04-02 2020-07-28 西京学院 一种高温稳定和高温自润滑化学共沉积复合镀层的制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3853094A (en) * 1971-01-25 1974-12-10 Du Pont Electroless plating apparatus
DE10301135B4 (de) * 2003-01-14 2006-08-31 AHC-Oberflächentechnik GmbH & Co. OHG Gegenstand mit einer Verschleißschutzschicht
CN1747798B (zh) * 2003-02-07 2010-04-07 戴蒙得创新股份有限公司 具有扩大抵抗能力的纤维和薄板设备磨损表面及其加工方法
US20050112399A1 (en) * 2003-11-21 2005-05-26 Gray Dennis M. Erosion resistant coatings and methods thereof
CN1976801A (zh) * 2004-02-11 2007-06-06 戴蒙得创新股份有限公司 产品成型模及其制造方法

Also Published As

Publication number Publication date
US20130143031A1 (en) 2013-06-06
AU2010323163A1 (en) 2012-06-21
KR20120101476A (ko) 2012-09-13
ITCO20090056A1 (it) 2011-06-01
MX2012006235A (es) 2012-09-07
CA2782421A1 (en) 2011-06-03
WO2011064276A2 (en) 2011-06-03
BR112012012830A2 (pt) 2016-08-16
RU2012122109A (ru) 2014-01-10
CN102713003B (zh) 2014-10-08
EP2507406A2 (en) 2012-10-10
JP2013512335A (ja) 2013-04-11
WO2011064276A3 (en) 2011-07-21
CN102713003A (zh) 2012-10-03

Similar Documents

Publication Publication Date Title
ZA201106693B (en) Electrical functional layer,production method and use thereof
DK2324533T3 (da) Elektrisk tilslutningsklemme
DK2316150T3 (da) Elektrisk forbindelsesklemme
EP2352165A4 (en) NITRID BASE SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR
EP2521177A4 (en) SOS SUBSTRATE WITH REDUCED LOAD
DE112010003316A5 (de) Messinglegierung
EP2552124A4 (en) SUBSTRATE CARRYING AN ELECTROACOUSTIC CONVERSION ELEMENT, MICROPHONE UNIT AND METHODS FOR THEIR MANUFACTURE
IT1398147B1 (it) Morsetto per connessioni elettriche
EP2486532A4 (en) CONTEXT-RELATED TELEPHONE MESSAGE MANAGEMENT
IT1397144B1 (it) Substrato placcato non elettricamente con composto di nickel e metodo.
BRPI1014506A2 (pt) conector elétrico
BRPI1006482A2 (pt) interface elétrica
FI20115787A (fi) Sähköliitin
DK2394487T3 (da) Fælles uplink-notifikationsbursts (sunb)
FI20095085A0 (fi) Moniresonanssiantenni
ITMI20111040A1 (it) Disposizione di collegamento elettrica
FR2972082B1 (fr) Balai de contact
FR2952761B1 (fr) Connecteur multicontact
FR2945308B1 (fr) Serrure electronique
EP2511400A4 (en) ELECTROLYTIC HARD GOLD PLATTING SOLUTION AND PLATING METHOD THEREWITH
DK2325963T3 (da) Elektrisk stikdåse omfattende en informationsbærer
IT1400588B1 (it) Componente con un contatto passante elettrico, procedimento per produrre un componente e sistema di componenti
BRPI1007967A2 (pt) célula galvânica e elemento de contato.
SM200900033A (it) Dispositivo fotovoltaico e metodo di realizzazione.
GB0906283D0 (en) Terminal positioning technique