EP2511400A4 - Electrolytic hard gold plating solution and plating method using same - Google Patents

Electrolytic hard gold plating solution and plating method using same

Info

Publication number
EP2511400A4
EP2511400A4 EP10835855.7A EP10835855A EP2511400A4 EP 2511400 A4 EP2511400 A4 EP 2511400A4 EP 10835855 A EP10835855 A EP 10835855A EP 2511400 A4 EP2511400 A4 EP 2511400A4
Authority
EP
European Patent Office
Prior art keywords
same
hard gold
electrolytic hard
plating solution
plating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10835855.7A
Other languages
German (de)
French (fr)
Other versions
EP2511400A1 (en
Inventor
Masato Furukawa
Injoon Son
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METALOR TECHNOLOGIES (JAPAN) Corp
METALOR TECHNOLOGIES JAPAN CORP
Original Assignee
METALOR TECHNOLOGIES (JAPAN) Corp
METALOR TECHNOLOGIES JAPAN CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by METALOR TECHNOLOGIES (JAPAN) Corp, METALOR TECHNOLOGIES JAPAN CORP filed Critical METALOR TECHNOLOGIES (JAPAN) Corp
Publication of EP2511400A1 publication Critical patent/EP2511400A1/en
Publication of EP2511400A4 publication Critical patent/EP2511400A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP10835855.7A 2009-12-09 2010-11-30 Electrolytic hard gold plating solution and plating method using same Withdrawn EP2511400A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009279409A JP2011122192A (en) 2009-12-09 2009-12-09 Electrolytic hard gold plating liquid and plating method using the same
PCT/JP2010/071304 WO2011070933A1 (en) 2009-12-09 2010-11-30 Electrolytic hard gold plating solution and plating method using same

Publications (2)

Publication Number Publication Date
EP2511400A1 EP2511400A1 (en) 2012-10-17
EP2511400A4 true EP2511400A4 (en) 2013-07-24

Family

ID=44145478

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10835855.7A Withdrawn EP2511400A4 (en) 2009-12-09 2010-11-30 Electrolytic hard gold plating solution and plating method using same

Country Status (7)

Country Link
EP (1) EP2511400A4 (en)
JP (1) JP2011122192A (en)
KR (1) KR20120120134A (en)
CN (1) CN102695819A (en)
SG (1) SG181529A1 (en)
TW (1) TW201137184A (en)
WO (1) WO2011070933A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5025815B1 (en) * 2011-08-10 2012-09-12 小島化学薬品株式会社 Hard gold plating solution
JP5758361B2 (en) * 2012-08-31 2015-08-05 日本エレクトロプレイテイング・エンジニヤース株式会社 Non-cyanide gold-palladium alloy plating solution and plating method
JP5152943B1 (en) * 2012-09-19 2013-02-27 小島化学薬品株式会社 Method for producing low free cyanogen gold salt
JP7219120B2 (en) * 2019-03-04 2023-02-07 Ｅｅｊａ株式会社 Electrolytic gold plating solution and its manufacturing method, gold plating method and gold complex
CN118352327A (en) * 2024-01-10 2024-07-16 深圳市联合蓝海应用材料科技股份有限公司 Gold-silver alloy bump for replacing pure gold bump packaging flip chip and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6814850B1 (en) * 1999-06-17 2004-11-09 Umicore Galvanotechnik Gmbh Acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for same
EP1728898A2 (en) * 2005-06-02 2006-12-06 Rohm and Haas Electronic Materials LLC Electrolytes for the deposition of gold alloys
JP2009007656A (en) * 2007-06-29 2009-01-15 Japan Pure Chemical Co Ltd Electrolytic gold-plating solution and gold plated film obtained using the same
EP2103716A1 (en) * 2008-03-19 2009-09-23 Rohm and Haas Electronic Materials LLC Method for Inhibiting Background Plating

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2355581C3 (en) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanic bright gold bath with high deposition rate
GB8501245D0 (en) * 1985-01-18 1985-02-20 Engelhard Corp Gold electroplating bath
JPS637390A (en) * 1986-06-26 1988-01-13 Nippon Engeruharudo Kk Gold-cobalt alloy plating liquid
FR2828889B1 (en) * 2001-08-24 2004-05-07 Engelhard Clal Sas ELECTROLYTIC BATH FOR THE ELECTROCHEMICAL DEPOSITION OF GOLD AND ITS ALLOYS
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
JP4320606B2 (en) * 2004-03-15 2009-08-26 上村工業株式会社 Gold plating bath
JP2009165730A (en) 2008-01-18 2009-07-30 Kozo Motoki Cleaning brush
CN101550571A (en) * 2008-03-31 2009-10-07 恩伊凯慕凯特股份有限公司 Electroplating solution containing gold for partly electroplating
WO2009150915A1 (en) * 2008-06-11 2009-12-17 日本高純度化学株式会社 Electrolytic gold plating solution and gold film obtained using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6814850B1 (en) * 1999-06-17 2004-11-09 Umicore Galvanotechnik Gmbh Acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for same
EP1728898A2 (en) * 2005-06-02 2006-12-06 Rohm and Haas Electronic Materials LLC Electrolytes for the deposition of gold alloys
JP2009007656A (en) * 2007-06-29 2009-01-15 Japan Pure Chemical Co Ltd Electrolytic gold-plating solution and gold plated film obtained using the same
EP2103716A1 (en) * 2008-03-19 2009-09-23 Rohm and Haas Electronic Materials LLC Method for Inhibiting Background Plating

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011070933A1 *

Also Published As

Publication number Publication date
SG181529A1 (en) 2012-07-30
TW201137184A (en) 2011-11-01
CN102695819A (en) 2012-09-26
KR20120120134A (en) 2012-11-01
WO2011070933A1 (en) 2011-06-16
JP2011122192A (en) 2011-06-23
EP2511400A1 (en) 2012-10-17

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Legal Events

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