JP2012118074A - 力補償プローブ - Google Patents
力補償プローブ Download PDFInfo
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- JP2012118074A JP2012118074A JP2011259729A JP2011259729A JP2012118074A JP 2012118074 A JP2012118074 A JP 2012118074A JP 2011259729 A JP2011259729 A JP 2011259729A JP 2011259729 A JP2011259729 A JP 2011259729A JP 2012118074 A JP2012118074 A JP 2012118074A
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/048—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance for determining moisture content of the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
- G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
- G01R31/1263—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
- G01R31/1272—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation of cable, line or wire insulation, e.g. using partial discharge measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/045—Circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06788—Hand-held or hand-manipulated probes, e.g. for oscilloscopes or for portable test instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
【解決手段】力補償プローブ10は、背面プレート21および側壁22を有する支持構造と、物品の電気的測定用のプローブ30と、プローブ30を背面プレート21に支持可能に連結するように配置された弾性基部40とを備え、プローブ30は通常は背面プレート21から離れる方向で側壁22の遠位側縁部を越えて突出し、支持構造の構成要素が物品に接触するようにしてプローブ30が電気的測定のために物品に当てられると、所定の負荷が弾性基部40に一貫して加えられる。
【選択図】図1
Description
20 エンクロージャ
21 背面プレート
22 側壁
23 エンクロージャ
24 遠位側縁部
30 プローブ
31 金属ストリップ
32 金属ストリップ
40 弾性基部
41 案内プレート
42 弾性要素
43 絶縁要素
50 ハンドル
60 電気的コネクタ
250 ねじ頭
302 カバー
411 前面
412 背面
413 突出部
414 突起
421 キャビティ
430 第1の層
431 第2の層
440 補助プレート
3020 末端部分
4131 案内スロット
Claims (10)
- 背面プレート(21)および側壁(22)を有する支持構造と、
物品の電気的測定用のプローブ(30)と、
前記プローブ(30)を前記背面プレート(21)に支持可能に連結するように配置された弾性基部(40)とを備え、
前記プローブ(30)が通常は前記背面プレート(21)から離れる方向で前記側壁(22)の遠位側縁部(24)を越えて突出し、
前記支持構造の構成要素が前記物品に接触するようにして前記プローブ(30)が電気的測定のために前記物品に当てられると、所定の負荷が前記弾性基部(40)に一貫して加えられる、電気的測定用の力補償プローブ(10)。 - 前記背面プレート(21)および前記側壁(22)がほぼ長方形の形状を有する、請求項1記載の力補償プローブ(10)。
- 背面プレート(21)および前記背面プレート(21)の周りに延在する側壁(22)を有して、前記背面プレート(21)から前記側壁(22)の遠位側縁部(24)までで画定されるエンクロージャを形成するエンクロージャ(20)と、
物品の電気的測定用のプローブ(30)と、
前記プローブ(30)を前記背面プレート(21)に支持可能に連結するように前記エンクロージャ(20)内に配置された弾性基部(40)とを備え、
前記プローブ(30)が通常は前記背面プレート(21)から離れる方向で前記側壁(22)の前記遠位側縁部(24)を越えて突出し、
前記エンクロージャ(20)および前記プローブ(30)が電気的測定のために前記物品に当てられると、所定の負荷が前記弾性基部(40)に一貫して加えられる、電気的測定用の力補償プローブ(10)。 - 前記エンクロージャに連結されたハンドル(50)をさらに備える、請求項3記載の力補償プローブ(10)。
- 前記側壁(22)のうち1つに画定された貫通穴を介して前記プローブ(30)に電気的に連結された電気的コネクタ(60)をさらに備える、請求項3記載の力補償プローブ(10)。
- 前記プローブ(30)が前記物品の電気インピーダンスを測定する、請求項3記載の力補償プローブ(10)。
- 前記弾性基部(40)が、
案内プレート(41)と、
前記案内プレート(41)と前記背面プレート(21)の間で支持可能に介在する弾性要素(42)とを備える、請求項3記載の力補償プローブ(10)。 - 前記弾性基部(40)の荷重負荷および荷重除去と関連した前記案内プレート(41)の移動を抑制するため、前記案内プレート(41)が、前記背面プレート(21)に画定された案内スロット(4131)を通して延在可能な突出部(413)を備える、請求項7記載の力補償プローブ(10)。
- 前記案内プレート(41)がキャビティ(421)を画定するように形成され、前記プローブ(30)の部分が前記キャビティ(421)を通して露出するように支持される補助プレート(440)を含む、請求項7記載の力補償プローブ(10)。
- 前記プローブ(30)を保護するように覆うカバー(302)をさらに備える、請求項3記載の力補償プローブ(10)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/957,798 US8680844B2 (en) | 2010-12-01 | 2010-12-01 | Force compensated probe |
US12/957,798 | 2010-12-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012118074A true JP2012118074A (ja) | 2012-06-21 |
JP2012118074A5 JP2012118074A5 (ja) | 2015-01-15 |
Family
ID=45475627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011259729A Pending JP2012118074A (ja) | 2010-12-01 | 2011-11-29 | 力補償プローブ |
Country Status (5)
Country | Link |
---|---|
US (1) | US8680844B2 (ja) |
JP (1) | JP2012118074A (ja) |
KR (1) | KR101795062B1 (ja) |
DE (1) | DE102011055824A1 (ja) |
GB (1) | GB2486058A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9128121B2 (en) * | 2012-09-28 | 2015-09-08 | Intel Corporation | Mechanism for facilitating a dynamic electro-mechanical interconnect having a cavity for embedding electrical components and isolating electrical paths |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63253271A (ja) * | 1987-04-10 | 1988-10-20 | Nec Corp | コンタクトブロツク |
JPWO2006064546A1 (ja) * | 2004-12-14 | 2008-06-12 | 株式会社アドバンテスト | コンタクトピン、それを用いたプローブカード及び電子部品試験装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2582629A (en) * | 1949-01-05 | 1952-01-15 | Grady Tant | Moisture tester |
DE2912349A1 (de) | 1979-03-29 | 1980-10-16 | Liebisch Geb | Verfahren und vorrichtung zur bestimmung des feuchtigkeitszustandes der menschlichen haut |
US6114863A (en) * | 1998-04-29 | 2000-09-05 | General Electric Company | Method for determining the presence of water in materials |
DE60031661D1 (de) | 1999-04-20 | 2006-12-14 | Nova Technology Corp | Verfahren und vorrichtung zur messung des wasseranteils in einem substrat |
JP2000321001A (ja) * | 1999-05-11 | 2000-11-24 | Mitsutoyo Corp | 接触子の定圧力機構 |
JP2002014115A (ja) | 2000-06-28 | 2002-01-18 | Mitsubishi Materials Corp | コンタクトプローブ及びプローブ装置 |
US6906530B2 (en) * | 2002-05-30 | 2005-06-14 | D.J. Geisel Technology, Inc. | Apparatus and method to detect moisture |
US7087019B2 (en) * | 2004-01-16 | 2006-08-08 | Han-Chin Kao | Apparatus for testing skin moisture |
JP2006258687A (ja) | 2005-03-18 | 2006-09-28 | Koyo Technos:Kk | 検査装置 |
US7362112B2 (en) * | 2005-05-27 | 2008-04-22 | Tektronix, Inc. | Signal acquisition probe having a retractable double cushioned probing tip assembly |
US8297119B2 (en) * | 2005-06-16 | 2012-10-30 | Multitrode Pty Ltd | Liquid level monitoring apparatus and methods |
US7148712B1 (en) * | 2005-06-24 | 2006-12-12 | Oxford Instruments Measurement Systems Llc | Probe for use in determining an attribute of a coating on a substrate |
US20070179353A1 (en) * | 2005-10-19 | 2007-08-02 | Jacob Fraden | Medical probe with consistent action |
JP2008008659A (ja) * | 2006-06-27 | 2008-01-17 | Chugoku Electric Power Co Inc:The | 計測器のための検電装置 |
JP2009130114A (ja) | 2007-11-22 | 2009-06-11 | Tokyo Electron Ltd | 検査装置 |
US20100109651A1 (en) * | 2008-07-11 | 2010-05-06 | Tolmachev Yuriy V | Device for conductivity measurement in a controlled environment and method thereof |
US8011931B2 (en) * | 2008-10-14 | 2011-09-06 | Cheng Uei Precision Industry Co., Ltd. | Probe connector |
JP6004546B2 (ja) | 2014-10-29 | 2016-10-12 | 株式会社オーディオテクニカ | 米飯撹拌装置および米飯撹拌方法 |
-
2010
- 2010-12-01 US US12/957,798 patent/US8680844B2/en not_active Expired - Fee Related
-
2011
- 2011-11-24 GB GB1120251.2A patent/GB2486058A/en not_active Withdrawn
- 2011-11-29 DE DE102011055824A patent/DE102011055824A1/de not_active Withdrawn
- 2011-11-29 JP JP2011259729A patent/JP2012118074A/ja active Pending
- 2011-11-30 KR KR1020110126957A patent/KR101795062B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63253271A (ja) * | 1987-04-10 | 1988-10-20 | Nec Corp | コンタクトブロツク |
JPWO2006064546A1 (ja) * | 2004-12-14 | 2008-06-12 | 株式会社アドバンテスト | コンタクトピン、それを用いたプローブカード及び電子部品試験装置 |
Also Published As
Publication number | Publication date |
---|---|
US8680844B2 (en) | 2014-03-25 |
GB201120251D0 (en) | 2012-01-04 |
GB2486058A (en) | 2012-06-06 |
KR101795062B1 (ko) | 2017-12-01 |
US20120139528A1 (en) | 2012-06-07 |
KR20120060163A (ko) | 2012-06-11 |
DE102011055824A1 (de) | 2012-06-06 |
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