JP2012092195A - 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板 - Google Patents

樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板 Download PDF

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Publication number
JP2012092195A
JP2012092195A JP2010239501A JP2010239501A JP2012092195A JP 2012092195 A JP2012092195 A JP 2012092195A JP 2010239501 A JP2010239501 A JP 2010239501A JP 2010239501 A JP2010239501 A JP 2010239501A JP 2012092195 A JP2012092195 A JP 2012092195A
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Japan
Prior art keywords
mass
resin
resin composition
toluene
solubility
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Pending
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JP2010239501A
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Japanese (ja)
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JP2012092195A5 (enExample
Inventor
Yuki Kitai
佑季 北井
Hiroaki Fujiwara
弘明 藤原
Hironori Saito
宏典 齋藤
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Panasonic Corp
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Panasonic Corp
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Priority to JP2010239501A priority Critical patent/JP2012092195A/ja
Publication of JP2012092195A publication Critical patent/JP2012092195A/ja
Publication of JP2012092195A5 publication Critical patent/JP2012092195A5/ja
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP2010239501A 2010-10-26 2010-10-26 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板 Pending JP2012092195A (ja)

Priority Applications (1)

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JP2010239501A JP2012092195A (ja) 2010-10-26 2010-10-26 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板

Applications Claiming Priority (1)

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JP2010239501A JP2012092195A (ja) 2010-10-26 2010-10-26 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板

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JP2012092195A true JP2012092195A (ja) 2012-05-17
JP2012092195A5 JP2012092195A5 (enExample) 2012-08-02

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JP2010239501A Pending JP2012092195A (ja) 2010-10-26 2010-10-26 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10279781A (ja) * 1997-04-01 1998-10-20 Matsushita Electric Works Ltd エポキシ樹脂組成物
JP2001261791A (ja) * 2000-03-23 2001-09-26 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ及び積層板
JP2004059703A (ja) * 2002-07-26 2004-02-26 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ及び積層板
JP2006059999A (ja) * 2004-08-19 2006-03-02 Tdk Corp プリント配線板および電子部品
WO2009041137A1 (ja) * 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10279781A (ja) * 1997-04-01 1998-10-20 Matsushita Electric Works Ltd エポキシ樹脂組成物
JP2001261791A (ja) * 2000-03-23 2001-09-26 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ及び積層板
JP2004059703A (ja) * 2002-07-26 2004-02-26 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ及び積層板
JP2006059999A (ja) * 2004-08-19 2006-03-02 Tdk Corp プリント配線板および電子部品
WO2009041137A1 (ja) * 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板
WO2009040921A1 (ja) * 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound

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