JP2012089537A5 - - Google Patents

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Publication number
JP2012089537A5
JP2012089537A5 JP2010232147A JP2010232147A JP2012089537A5 JP 2012089537 A5 JP2012089537 A5 JP 2012089537A5 JP 2010232147 A JP2010232147 A JP 2010232147A JP 2010232147 A JP2010232147 A JP 2010232147A JP 2012089537 A5 JP2012089537 A5 JP 2012089537A5
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JP
Japan
Prior art keywords
substrate
stage
induction heating
bonding apparatus
disposed
Prior art date
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Pending
Application number
JP2010232147A
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English (en)
Japanese (ja)
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JP2012089537A (ja
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Publication date
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Priority to JP2010232147A priority Critical patent/JP2012089537A/ja
Priority claimed from JP2010232147A external-priority patent/JP2012089537A/ja
Publication of JP2012089537A publication Critical patent/JP2012089537A/ja
Publication of JP2012089537A5 publication Critical patent/JP2012089537A5/ja
Pending legal-status Critical Current

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JP2010232147A 2010-10-15 2010-10-15 ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置 Pending JP2012089537A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010232147A JP2012089537A (ja) 2010-10-15 2010-10-15 ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010232147A JP2012089537A (ja) 2010-10-15 2010-10-15 ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置

Publications (2)

Publication Number Publication Date
JP2012089537A JP2012089537A (ja) 2012-05-10
JP2012089537A5 true JP2012089537A5 (enExample) 2013-12-05

Family

ID=46260885

Family Applications (1)

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JP2010232147A Pending JP2012089537A (ja) 2010-10-15 2010-10-15 ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置

Country Status (1)

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JP (1) JP2012089537A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101320064B1 (ko) * 2012-06-29 2013-10-18 주식회사 휴템 듀얼 쿨링을 이용한 웨이퍼 본더 및 웨이퍼 본딩 방법
JP2016207756A (ja) * 2015-04-17 2016-12-08 株式会社ニコン ステージ装置及び露光装置
JP6689719B2 (ja) 2016-09-23 2020-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6854551B1 (ja) * 2020-11-26 2021-04-07 ハイソル株式会社 半導体用チャック及びプローバ装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2984441B2 (ja) * 1991-12-06 1999-11-29 光正 小柳 三次元ｌｓｉ積層装置
JP3516523B2 (ja) * 1995-05-30 2004-04-05 アネルバ株式会社 プラズマ処理装置
JP2000267589A (ja) * 1999-03-18 2000-09-29 Seiko Epson Corp 電気光学装置の製造装置および製造方法
JP2002144026A (ja) * 2000-11-06 2002-05-21 Fuji Electric Co Ltd ろう付け装置
JP3826087B2 (ja) * 2002-08-30 2006-09-27 キヤノン株式会社 位置決め装置、荷電粒子線露光装置
JP2008229709A (ja) * 2007-03-23 2008-10-02 Toyota Industries Corp 半田付け装置、半田付け方法及び電子機器の製造方法
TWI471971B (zh) * 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method
JP2010153645A (ja) * 2008-12-25 2010-07-08 Nikon Corp 積層半導体装置の製造方法
US8659746B2 (en) * 2009-03-04 2014-02-25 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method

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