JP2012068249A5 - - Google Patents

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Publication number
JP2012068249A5
JP2012068249A5 JP2011207768A JP2011207768A JP2012068249A5 JP 2012068249 A5 JP2012068249 A5 JP 2012068249A5 JP 2011207768 A JP2011207768 A JP 2011207768A JP 2011207768 A JP2011207768 A JP 2011207768A JP 2012068249 A5 JP2012068249 A5 JP 2012068249A5
Authority
JP
Japan
Prior art keywords
fine spring
substrate
laminated structure
fine
embedded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011207768A
Other languages
English (en)
Other versions
JP2012068249A (ja
Filing date
Publication date
Priority claimed from US12/887,775 external-priority patent/US8519534B2/en
Application filed filed Critical
Publication of JP2012068249A publication Critical patent/JP2012068249A/ja
Publication of JP2012068249A5 publication Critical patent/JP2012068249A5/ja
Pending legal-status Critical Current

Links

Claims (5)

  1. 基板と、
    前記基板上に形成された少なくとも1つの微細ばねと、
    前記基板上に形成された複数の層を備える積層構造とを含み、前記微細ばねが前記積層構造内に少なくとも部分的に埋設されている、微細ばね構造。
  2. 前記微細ばねは、固定部分および遊離部分を含み、前記固定部分は、前記基板上に貼り付けられており、さらに、前記固定部分は、前記積層構造内に埋設されており、前記遊離部分の少なくとも一部が、前記積層構造から伸びており、前記基板上で自由にたわむことができる、請求項1に記載の微細ばね構造。
  3. 前記微細ばねは、前記積層構造内に完全に埋設されている、請求項1に記載の微細ばね構造。
  4. 前記微細ばねは、先端部分を含んでおり、少なくとも、はんだを有する前記先端部分は、前記微細ばねに設けられており、前記積層構造内に埋設された前記微細ばねの前記部分は、はんだを含んでいない、請求項1に記載の微細ばね構造。
  5. 前記積層構造は、フォトリソグラフィによってパターン形成可能な材料の少なくとも一部を含んでいる、請求項1に記載の微細ばね構造。
JP2011207768A 2010-09-22 2011-09-22 積層構造に少なくとも部分的に埋設された微細ばね、および、その製造方法 Pending JP2012068249A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/887,775 2010-09-22
US12/887,775 US8519534B2 (en) 2010-09-22 2010-09-22 Microsprings partially embedded in a laminate structure and methods for producing same

Publications (2)

Publication Number Publication Date
JP2012068249A JP2012068249A (ja) 2012-04-05
JP2012068249A5 true JP2012068249A5 (ja) 2014-11-06

Family

ID=45817009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011207768A Pending JP2012068249A (ja) 2010-09-22 2011-09-22 積層構造に少なくとも部分的に埋設された微細ばね、および、その製造方法

Country Status (4)

Country Link
US (1) US8519534B2 (ja)
JP (1) JP2012068249A (ja)
KR (1) KR20120031141A (ja)
TW (1) TWI553800B (ja)

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KR101877861B1 (ko) * 2017-01-23 2018-08-09 (주)다람기술 검사프로브 제조방법 및 제조장치, 그리고 이에 의해 제조된 검사프로브
US11289443B2 (en) 2017-04-20 2022-03-29 Palo Alto Research Center Incorporated Microspring structure for hardware trusted platform module
TWI706139B (zh) * 2019-10-25 2020-10-01 巨擘科技股份有限公司 金屬探針結構及其製造方法
US11054593B1 (en) 2020-03-11 2021-07-06 Palo Alto Research Center Incorporated Chip-scale optoelectronic transceiver with microspringed interposer
KR102409029B1 (ko) * 2022-04-12 2022-06-14 이시훈 프로브 핀

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