AU2001268630A1 - Systems for testing integraged circuits during burn-in - Google Patents
Systems for testing integraged circuits during burn-inInfo
- Publication number
- AU2001268630A1 AU2001268630A1 AU2001268630A AU6863001A AU2001268630A1 AU 2001268630 A1 AU2001268630 A1 AU 2001268630A1 AU 2001268630 A AU2001268630 A AU 2001268630A AU 6863001 A AU6863001 A AU 6863001A AU 2001268630 A1 AU2001268630 A1 AU 2001268630A1
- Authority
- AU
- Australia
- Prior art keywords
- stress metal
- springs
- substrate
- several embodiments
- disclosed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
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Abstract
Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in the formed stress metal springs, defining a looped spring structure. The formed springs provide high pitch compliant electrical contacts for a wide variety of interconnection systems, including chip scale semiconductor packages, high density interposer connectors, and probe contactors. Several embodiments of massively parallel interface integrated circuit test assemblies are also disclosed, comprising one or more substrates having stress metal spring contacts, to establish connections between one or more separated integrated circuits on a compliant wafer carrier.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21292300P | 2000-06-20 | 2000-06-20 | |
US60/212,923 | 2000-06-20 | ||
US21372900P | 2000-06-22 | 2000-06-22 | |
US60/213,729 | 2000-06-22 | ||
PCT/US2001/019792 WO2001098793A2 (en) | 2000-06-20 | 2001-06-20 | Systems for testing integraged circuits during burn-in |
Publications (1)
Publication Number | Publication Date |
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AU2001268630A1 true AU2001268630A1 (en) | 2002-01-02 |
Family
ID=26907616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001268630A Abandoned AU2001268630A1 (en) | 2000-06-20 | 2001-06-20 | Systems for testing integraged circuits during burn-in |
Country Status (8)
Country | Link |
---|---|
US (1) | US6791171B2 (en) |
EP (1) | EP1292834B1 (en) |
JP (1) | JP2004501517A (en) |
KR (1) | KR20020026585A (en) |
AT (1) | ATE311604T1 (en) |
AU (1) | AU2001268630A1 (en) |
DE (1) | DE60115437T2 (en) |
WO (1) | WO2001098793A2 (en) |
Families Citing this family (93)
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US6331763B1 (en) * | 1998-04-15 | 2001-12-18 | Tyco Electronics Corporation | Devices and methods for protection of rechargeable elements |
US7126220B2 (en) * | 2002-03-18 | 2006-10-24 | Nanonexus, Inc. | Miniaturized contact spring |
US6917525B2 (en) * | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
US6812718B1 (en) * | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
US7952373B2 (en) * | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7132841B1 (en) * | 2000-06-06 | 2006-11-07 | International Business Machines Corporation | Carrier for test, burn-in, and first level packaging |
US6690184B1 (en) * | 2000-08-31 | 2004-02-10 | Micron Technology, Inc. | Air socket for testing integrated circuits |
US6564986B1 (en) * | 2001-03-08 | 2003-05-20 | Xilinx, Inc. | Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit board |
JP2005518630A (en) * | 2002-02-26 | 2005-06-23 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Nonvolatile memory test structure and method |
US7694246B2 (en) * | 2002-06-19 | 2010-04-06 | Formfactor, Inc. | Test method for yielding a known good die |
US8198576B2 (en) | 2003-03-28 | 2012-06-12 | Aprolase Development Co., Llc | Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structure |
US7436494B1 (en) | 2003-03-28 | 2008-10-14 | Irvine Sensors Corp. | Three-dimensional ladar module with alignment reference insert circuitry |
US20070052084A1 (en) * | 2005-08-26 | 2007-03-08 | Kennedy John V | High density interconnect assembly comprising stacked electronic module |
US7113408B2 (en) * | 2003-06-11 | 2006-09-26 | Neoconix, Inc. | Contact grid array formed on a printed circuit board |
US7114961B2 (en) | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
US7056131B1 (en) | 2003-04-11 | 2006-06-06 | Neoconix, Inc. | Contact grid array system |
US7244125B2 (en) | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
US7758351B2 (en) | 2003-04-11 | 2010-07-20 | Neoconix, Inc. | Method and system for batch manufacturing of spring elements |
US20050120553A1 (en) * | 2003-12-08 | 2005-06-09 | Brown Dirk D. | Method for forming MEMS grid array connector |
US8584353B2 (en) | 2003-04-11 | 2013-11-19 | Neoconix, Inc. | Method for fabricating a contact grid array |
JP4062168B2 (en) * | 2003-05-19 | 2008-03-19 | ソニー株式会社 | Terminal member structure |
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- 2001-06-20 EP EP01946604A patent/EP1292834B1/en not_active Expired - Lifetime
- 2001-06-20 DE DE60115437T patent/DE60115437T2/en not_active Expired - Fee Related
- 2001-06-20 WO PCT/US2001/019792 patent/WO2001098793A2/en active IP Right Grant
- 2001-06-20 AU AU2001268630A patent/AU2001268630A1/en not_active Abandoned
- 2001-06-20 JP JP2002504502A patent/JP2004501517A/en active Pending
- 2001-06-20 KR KR1020027002170A patent/KR20020026585A/en not_active Application Discontinuation
- 2001-06-20 AT AT01946604T patent/ATE311604T1/en not_active IP Right Cessation
- 2001-06-20 US US10/069,902 patent/US6791171B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20020171133A1 (en) | 2002-11-21 |
KR20020026585A (en) | 2002-04-10 |
ATE311604T1 (en) | 2005-12-15 |
JP2004501517A (en) | 2004-01-15 |
EP1292834B1 (en) | 2005-11-30 |
US6791171B2 (en) | 2004-09-14 |
WO2001098793A2 (en) | 2001-12-27 |
WO2001098793A3 (en) | 2002-07-25 |
DE60115437T2 (en) | 2006-07-27 |
EP1292834A2 (en) | 2003-03-19 |
DE60115437D1 (en) | 2006-01-05 |
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