WO2000073905A3 - Test interface for electronic circuits - Google Patents

Test interface for electronic circuits Download PDF

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Publication number
WO2000073905A3
WO2000073905A3 PCT/US2000/014768 US0014768W WO0073905A3 WO 2000073905 A3 WO2000073905 A3 WO 2000073905A3 US 0014768 W US0014768 W US 0014768W WO 0073905 A3 WO0073905 A3 WO 0073905A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
parallel interface
interconnecting
structures
massively parallel
assemblies
Prior art date
Application number
PCT/US2000/014768
Other languages
French (fr)
Other versions
WO2000073905A2 (en )
Inventor
Fu Chiung Chong
Sammy Mok
Original Assignee
Fu Chiung Chong
Sammy Mok
Nanonexus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Abstract

Several embodiments of massively parallel interface structures are disclosed, which may be used in a wide variety of permanent or temporary applications, such as for interconnecting integrated circuits (ICs) to test and burn-in equipment, for interconnecting modules within electronic devices, for interconnecting computers and other peripheral devices within a network, or for interconnecting other electronic circuitry. Preferred embodiments of the massively parallel interface structures provide massively parallel integrated circuit test assemblies. The massively parallel interface structures preferably use one or more substrates to establish connections between one or more integrated circuits on a semiconductor wafer, and one or more test modules. One or more layers on the intermediate substrates preferably include MEMS and/or thin-film fabricated spring probes. The parallel interface assemblies provide tight signal pad pitch and compliance, and preferably enable the parallel testing or burn-in of multiple ICs, using commercial wafer probing equipment. In some preferred embodiments, the parallel interface assembly structures include separable standard electrical connector components, which reduces assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form.
PCT/US2000/014768 1999-05-27 2000-05-26 Test interface for electronic circuits WO2000073905A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13663799 true 1999-05-27 1999-05-27
US60/136,637 1999-05-27

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2001500957A JP2003501819A (en) 1999-05-27 2000-05-26 Massively parallel interface for electronic
AU5171800A AU5171800A (en) 1999-05-27 2000-05-26 Massively parallel interface for electronic circuit
US09979551 US6812718B1 (en) 1999-05-27 2000-05-26 Massively parallel interface for electronic circuits
EP20000936397 EP1183604A2 (en) 1999-05-27 2000-05-26 Test interface for electronic circuirts
US10918511 US7009412B2 (en) 1999-05-27 2004-08-12 Massively parallel interface for electronic circuit
US11327728 US7138818B2 (en) 1999-05-27 2006-01-05 Massively parallel interface for electronic circuit
US11555603 US7403029B2 (en) 1999-05-27 2006-11-01 Massively parallel interface for electronic circuit
US11692138 US20070245553A1 (en) 1999-05-27 2007-03-27 Fine pitch microfabricated spring contact structure & method
US12175393 US7772860B2 (en) 1999-05-27 2008-07-17 Massively parallel interface for electronic circuit

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10918511 Division US7009412B2 (en) 1999-05-27 2004-08-12 Massively parallel interface for electronic circuit

Publications (2)

Publication Number Publication Date
WO2000073905A2 true WO2000073905A2 (en) 2000-12-07
WO2000073905A3 true true WO2000073905A3 (en) 2001-09-07

Family

ID=22473706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/014768 WO2000073905A3 (en) 1999-05-27 2000-05-26 Test interface for electronic circuits

Country Status (3)

Country Link
EP (1) EP1183604A2 (en)
JP (1) JP2003501819A (en)
WO (1) WO2000073905A3 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US9429638B2 (en) 2008-11-21 2016-08-30 Cascade Microtech, Inc. Method of replacing an existing contact of a wafer probing assembly

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6578264B1 (en) * 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
DE60115437D1 (en) * 2000-06-20 2006-01-05 Nanonexus Inc Test system of integrated circuits
US7102367B2 (en) 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
US6835589B2 (en) * 2002-11-14 2004-12-28 International Business Machines Corporation Three-dimensional integrated CMOS-MEMS device and process for making the same
JP4727948B2 (en) 2004-05-24 2011-07-20 東京エレクトロン株式会社 Laminated substrate for use in a probe card
US7375542B2 (en) * 2004-06-30 2008-05-20 Teradyne, Inc. Automated test equipment with DIB mounted three dimensional tester electronics bricks
US7782072B2 (en) * 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
DE102006059429A1 (en) * 2006-12-15 2008-06-26 Atg Luther & Maelzer Gmbh Module for a tester for the testing of circuit boards
WO2008126173A1 (en) * 2007-03-13 2008-10-23 Advantest Corporation Tcp handling device
JP5258395B2 (en) * 2008-06-03 2013-08-07 株式会社日本マイクロニクス Probing equipment
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3630548A1 (en) * 1986-09-08 1988-03-10 Mania Gmbh Apparatus for electronically testing circuit boards with contact points in the 1/20 inch pitch
US4924589A (en) * 1988-05-16 1990-05-15 Leedy Glenn J Method of making and testing an integrated circuit
EP0369112A1 (en) * 1988-11-12 1990-05-23 MANIA GmbH & Co. Adapter for electronic test devices for printed-circuit boards and the like
US5144228A (en) * 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
EP0623826A1 (en) * 1993-04-29 1994-11-09 Hughes Aircraft Company Membrane connector with stretch induced micro scrub
WO1996015458A1 (en) * 1994-11-15 1996-05-23 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US5848685A (en) * 1995-06-07 1998-12-15 Xerox Corporation Photolithographically patterned spring contact

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59187144U (en) * 1983-05-31 1984-12-12
JPH06151532A (en) * 1992-11-13 1994-05-31 Tokyo Electron Yamanashi Kk Prober
JP2995134B2 (en) * 1993-09-24 1999-12-27 東京エレクトロン株式会社 Probe device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3630548A1 (en) * 1986-09-08 1988-03-10 Mania Gmbh Apparatus for electronically testing circuit boards with contact points in the 1/20 inch pitch
US4924589A (en) * 1988-05-16 1990-05-15 Leedy Glenn J Method of making and testing an integrated circuit
EP0369112A1 (en) * 1988-11-12 1990-05-23 MANIA GmbH & Co. Adapter for electronic test devices for printed-circuit boards and the like
US5144228A (en) * 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
EP0623826A1 (en) * 1993-04-29 1994-11-09 Hughes Aircraft Company Membrane connector with stretch induced micro scrub
WO1996015458A1 (en) * 1994-11-15 1996-05-23 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US5848685A (en) * 1995-06-07 1998-12-15 Xerox Corporation Photolithographically patterned spring contact
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US8013623B2 (en) 2004-09-13 2011-09-06 Cascade Microtech, Inc. Double sided probing structures
US9429638B2 (en) 2008-11-21 2016-08-30 Cascade Microtech, Inc. Method of replacing an existing contact of a wafer probing assembly

Also Published As

Publication number Publication date Type
JP2003501819A (en) 2003-01-14 application
WO2000073905A2 (en) 2000-12-07 application
EP1183604A2 (en) 2002-03-06 application

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