JP2011063849A5 - - Google Patents
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- Publication number
- JP2011063849A5 JP2011063849A5 JP2009215415A JP2009215415A JP2011063849A5 JP 2011063849 A5 JP2011063849 A5 JP 2011063849A5 JP 2009215415 A JP2009215415 A JP 2009215415A JP 2009215415 A JP2009215415 A JP 2009215415A JP 2011063849 A5 JP2011063849 A5 JP 2011063849A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- thickness
- forming method
- film forming
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Claims (2)
- 前記Ｃｏ膜の厚さは、１．５〜５ｎｍであることを特徴とする請求項１または請求項２に記載の成膜方法。
- 前記Ｃｏ膜の厚さは、１．５〜５ｎｍであることを特徴とする請求項５に記載の成膜方法。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009215415A JP2011063849A (ja) | 2009-09-17 | 2009-09-17 | 成膜方法および記憶媒体 |
| US13/054,331 US20110174630A1 (en) | 2009-09-17 | 2010-08-27 | Film formation method and storage medium |
| KR1020107026850A KR20110056455A (ko) | 2009-09-17 | 2010-08-27 | 성막 방법 및 기억 매체 |
| PCT/JP2010/064572 WO2011033916A1 (ja) | 2009-09-17 | 2010-08-27 | 成膜方法および記憶媒体 |
| TW099131353A TW201124564A (en) | 2009-09-17 | 2010-09-16 | Film-forming method and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009215415A JP2011063849A (ja) | 2009-09-17 | 2009-09-17 | 成膜方法および記憶媒体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011063849A JP2011063849A (ja) | 2011-03-31 |
| JP2011063849A5 true JP2011063849A5 (ja) | 2011-05-19 |
Family
ID=43758525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009215415A Withdrawn JP2011063849A (ja) | 2009-09-17 | 2009-09-17 | 成膜方法および記憶媒体 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20110174630A1 (ja) |
| JP (1) | JP2011063849A (ja) |
| KR (1) | KR20110056455A (ja) |
| TW (1) | TW201124564A (ja) |
| WO (1) | WO2011033916A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8858774B2 (en) | 2008-11-07 | 2014-10-14 | Novellus Systems, Inc. | Electroplating apparatus for tailored uniformity profile |
| JP5225957B2 (ja) * | 2009-09-17 | 2013-07-03 | 東京エレクトロン株式会社 | 成膜方法および記憶媒体 |
| JP5659041B2 (ja) * | 2011-02-24 | 2015-01-28 | 東京エレクトロン株式会社 | 成膜方法および記憶媒体 |
| US9909228B2 (en) | 2012-11-27 | 2018-03-06 | Lam Research Corporation | Method and apparatus for dynamic current distribution control during electroplating |
| JP6678490B2 (ja) * | 2016-03-28 | 2020-04-08 | 株式会社荏原製作所 | めっき方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3856986B2 (ja) * | 1999-06-15 | 2006-12-13 | 大日本スクリーン製造株式会社 | 基板メッキ装置 |
| JP3984767B2 (ja) * | 1999-10-25 | 2007-10-03 | 株式会社日立製作所 | めっき装置 |
| US20050006245A1 (en) * | 2003-07-08 | 2005-01-13 | Applied Materials, Inc. | Multiple-step electrodeposition process for direct copper plating on barrier metals |
| US20040245107A1 (en) * | 2003-06-03 | 2004-12-09 | Guangli Che | Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditions |
| US7344972B2 (en) * | 2004-04-21 | 2008-03-18 | Intel Corporation | Photosensitive dielectric layer |
| JP2008007830A (ja) * | 2006-06-30 | 2008-01-17 | Fujitsu Ltd | めっき方法 |
-
2009
- 2009-09-17 JP JP2009215415A patent/JP2011063849A/ja not_active Withdrawn
-
2010
- 2010-08-27 US US13/054,331 patent/US20110174630A1/en not_active Abandoned
- 2010-08-27 WO PCT/JP2010/064572 patent/WO2011033916A1/ja active Application Filing
- 2010-08-27 KR KR1020107026850A patent/KR20110056455A/ko not_active Application Discontinuation
- 2010-09-16 TW TW099131353A patent/TW201124564A/zh unknown