JP2012044091A - 撮像装置、撮像モジュール及びカメラ - Google Patents

撮像装置、撮像モジュール及びカメラ Download PDF

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Publication number
JP2012044091A
JP2012044091A JP2010186070A JP2010186070A JP2012044091A JP 2012044091 A JP2012044091 A JP 2012044091A JP 2010186070 A JP2010186070 A JP 2010186070A JP 2010186070 A JP2010186070 A JP 2010186070A JP 2012044091 A JP2012044091 A JP 2012044091A
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JP
Japan
Prior art keywords
region
thickness
imaging device
imaging
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010186070A
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English (en)
Japanese (ja)
Other versions
JP2012044091A5 (enExample
Inventor
Makoto Hasegawa
真 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010186070A priority Critical patent/JP2012044091A/ja
Priority to US13/817,755 priority patent/US9111826B2/en
Priority to CN201180040856.6A priority patent/CN103081105B/zh
Priority to PCT/JP2011/004452 priority patent/WO2012026074A1/en
Publication of JP2012044091A publication Critical patent/JP2012044091A/ja
Publication of JP2012044091A5 publication Critical patent/JP2012044091A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2010186070A 2010-08-23 2010-08-23 撮像装置、撮像モジュール及びカメラ Pending JP2012044091A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010186070A JP2012044091A (ja) 2010-08-23 2010-08-23 撮像装置、撮像モジュール及びカメラ
US13/817,755 US9111826B2 (en) 2010-08-23 2011-08-05 Image pickup device, image pickup module, and camera
CN201180040856.6A CN103081105B (zh) 2010-08-23 2011-08-05 图像拾取装置、图像拾取模块和照相机
PCT/JP2011/004452 WO2012026074A1 (en) 2010-08-23 2011-08-05 Image pickup device, image pickup module, and camera

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010186070A JP2012044091A (ja) 2010-08-23 2010-08-23 撮像装置、撮像モジュール及びカメラ

Publications (2)

Publication Number Publication Date
JP2012044091A true JP2012044091A (ja) 2012-03-01
JP2012044091A5 JP2012044091A5 (enExample) 2013-10-10

Family

ID=45723098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010186070A Pending JP2012044091A (ja) 2010-08-23 2010-08-23 撮像装置、撮像モジュール及びカメラ

Country Status (4)

Country Link
US (1) US9111826B2 (enExample)
JP (1) JP2012044091A (enExample)
CN (1) CN103081105B (enExample)
WO (1) WO2012026074A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216476A (ja) * 2013-04-25 2014-11-17 凸版印刷株式会社 固体撮像装置及びその製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229675A (ja) * 2012-04-24 2013-11-07 Sony Corp 撮像ユニット及び撮像装置
US20140326856A1 (en) * 2013-05-06 2014-11-06 Omnivision Technologies, Inc. Integrated circuit stack with low profile contacts
US10186539B2 (en) * 2014-10-13 2019-01-22 Bio-Rad Laboratories, Inc. Heated image sensor window
CN105467638A (zh) * 2016-01-08 2016-04-06 豪威半导体（上海）有限责任公司 一种lcos结构及制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001351997A (ja) * 2000-06-09 2001-12-21 Canon Inc 受光センサーの実装構造体およびその使用方法
JP2007305804A (ja) * 2006-05-11 2007-11-22 Olympus Corp 半導体装置、該半導体装置の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6943423B2 (en) * 2003-10-01 2005-09-13 Optopac, Inc. Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
JP4198072B2 (ja) * 2004-01-23 2008-12-17 シャープ株式会社 半導体装置、光学装置用モジュール及び半導体装置の製造方法
JP4344759B2 (ja) * 2007-06-15 2009-10-14 シャープ株式会社 固体撮像素子およびその製造方法、固体撮像装置、電子情報機器
JP2009099591A (ja) * 2007-10-12 2009-05-07 Toshiba Corp 固体撮像素子及びその製造方法
JP4799543B2 (ja) * 2007-12-27 2011-10-26 株式会社東芝 半導体パッケージ及びカメラモジュール
JP4799542B2 (ja) * 2007-12-27 2011-10-26 株式会社東芝 半導体パッケージ
JP5690466B2 (ja) * 2008-01-31 2015-03-25 インヴェンサス・コーポレイション 半導体チップパッケージの製造方法
JP5009209B2 (ja) * 2008-03-21 2012-08-22 シャープ株式会社 ウエハ状光学装置およびその製造方法、電子素子ウエハモジュール、センサウエハモジュール、電子素子モジュール、センサモジュール、電子情報機器
JP5198150B2 (ja) * 2008-05-29 2013-05-15 株式会社東芝 固体撮像装置
JP5392458B2 (ja) 2008-08-21 2014-01-22 株式会社ザイキューブ 半導体イメージセンサ
JP2010067872A (ja) * 2008-09-12 2010-03-25 Nikon Corp パッケージ及びそれを用いた光電変換装置
JP5178569B2 (ja) * 2009-02-13 2013-04-10 株式会社東芝 固体撮像装置
US8355628B2 (en) * 2009-03-06 2013-01-15 Visera Technologies Company Limited Compact camera module
KR20100130423A (ko) * 2009-06-03 2010-12-13 삼성전자주식회사 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 모듈
JP5709435B2 (ja) * 2010-08-23 2015-04-30 キヤノン株式会社 撮像モジュール及びカメラ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001351997A (ja) * 2000-06-09 2001-12-21 Canon Inc 受光センサーの実装構造体およびその使用方法
JP2007305804A (ja) * 2006-05-11 2007-11-22 Olympus Corp 半導体装置、該半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216476A (ja) * 2013-04-25 2014-11-17 凸版印刷株式会社 固体撮像装置及びその製造方法

Also Published As

Publication number Publication date
US9111826B2 (en) 2015-08-18
US20130141626A1 (en) 2013-06-06
CN103081105B (zh) 2016-02-10
WO2012026074A1 (en) 2012-03-01
CN103081105A (zh) 2013-05-01

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