JP2012043875A5 - - Google Patents

Download PDF

Info

Publication number
JP2012043875A5
JP2012043875A5 JP2010182086A JP2010182086A JP2012043875A5 JP 2012043875 A5 JP2012043875 A5 JP 2012043875A5 JP 2010182086 A JP2010182086 A JP 2010182086A JP 2010182086 A JP2010182086 A JP 2010182086A JP 2012043875 A5 JP2012043875 A5 JP 2012043875A5
Authority
JP
Japan
Prior art keywords
semiconductor device
power semiconductor
package
insulating substrate
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010182086A
Other languages
English (en)
Japanese (ja)
Other versions
JP5391162B2 (ja
JP2012043875A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010182086A priority Critical patent/JP5391162B2/ja
Priority claimed from JP2010182086A external-priority patent/JP5391162B2/ja
Publication of JP2012043875A publication Critical patent/JP2012043875A/ja
Publication of JP2012043875A5 publication Critical patent/JP2012043875A5/ja
Application granted granted Critical
Publication of JP5391162B2 publication Critical patent/JP5391162B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2010182086A 2010-08-17 2010-08-17 電力用半導体装置 Active JP5391162B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010182086A JP5391162B2 (ja) 2010-08-17 2010-08-17 電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010182086A JP5391162B2 (ja) 2010-08-17 2010-08-17 電力用半導体装置

Publications (3)

Publication Number Publication Date
JP2012043875A JP2012043875A (ja) 2012-03-01
JP2012043875A5 true JP2012043875A5 (OSRAM) 2012-11-29
JP5391162B2 JP5391162B2 (ja) 2014-01-15

Family

ID=45899873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010182086A Active JP5391162B2 (ja) 2010-08-17 2010-08-17 電力用半導体装置

Country Status (1)

Country Link
JP (1) JP5391162B2 (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112014006826T5 (de) 2014-07-18 2017-03-30 Mitsubishi Electric Corporation Fahrzeughilfsleistungsversorgungsvorrichtung
JP6381453B2 (ja) * 2015-01-27 2018-08-29 三菱電機株式会社 半導体装置
JP6849660B2 (ja) * 2016-04-01 2021-03-24 三菱電機株式会社 半導体装置
JP6852513B2 (ja) * 2017-03-30 2021-03-31 株式会社オートネットワーク技術研究所 回路装置
JP6877600B1 (ja) * 2020-01-16 2021-05-26 三菱電機株式会社 半導体装置
CN115103929A (zh) * 2020-02-18 2022-09-23 朗姆研究公司 具有散热器的高温衬底支撑件
JP2023183301A (ja) * 2022-06-15 2023-12-27 日立Astemo株式会社 電力変換装置
WO2024018810A1 (ja) * 2022-07-21 2024-01-25 ローム株式会社 半導体装置
JP7675786B1 (ja) * 2023-11-24 2025-05-13 株式会社東芝 半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03126055U (OSRAM) * 1990-03-30 1991-12-19
JP3130239B2 (ja) * 1995-08-02 2001-01-31 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
JP2004095670A (ja) * 2002-08-29 2004-03-25 Toshiba Corp 半導体装置
KR100713979B1 (ko) * 2003-09-04 2007-05-04 마츠시타 덴끼 산교 가부시키가이샤 반도체장치
JP2008060430A (ja) * 2006-08-31 2008-03-13 Daikin Ind Ltd 電力変換装置
CN109166833B (zh) * 2010-01-15 2022-04-08 三菱电机株式会社 电力用半导体模块

Similar Documents

Publication Publication Date Title
JP2012043875A5 (OSRAM)
JP2011134956A5 (OSRAM)
JP6217756B2 (ja) 半導体モジュール
KR101388737B1 (ko) 반도체 패키지, 반도체 모듈, 및 그 실장 구조
JP2005117041A5 (OSRAM)
JP2009513026A5 (OSRAM)
EP2669942A3 (en) Integrated circuit die assembly with heat spreader
JP2013080923A5 (OSRAM)
JP2013219267A5 (OSRAM)
JP2009512999A5 (OSRAM)
JP6448418B2 (ja) 電力用半導体装置
JP5391162B2 (ja) 電力用半導体装置
TW201513301A (zh) 功率模組
CN105814682B (zh) 半导体装置
JP6124810B2 (ja) パワーモジュール
CN103779290B (zh) 连接基板及层叠封装结构
JP2015115471A (ja) 電力用半導体装置
CN108369933A (zh) 半导体装置及其制造方法
JP2010287737A5 (OSRAM)
JP6248803B2 (ja) パワー半導体モジュール
CN106252332B (zh) 热敏电阻搭载装置及热敏电阻部件
CN103779282B (zh) 一种便于安装的功率半导体模块
JP2008519453A5 (OSRAM)
CN108292642B (zh) 电力用半导体装置
JP2009231685A (ja) パワー半導体装置