JP2012038596A5 - - Google Patents

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Publication number
JP2012038596A5
JP2012038596A5 JP2010178108A JP2010178108A JP2012038596A5 JP 2012038596 A5 JP2012038596 A5 JP 2012038596A5 JP 2010178108 A JP2010178108 A JP 2010178108A JP 2010178108 A JP2010178108 A JP 2010178108A JP 2012038596 A5 JP2012038596 A5 JP 2012038596A5
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JP
Japan
Prior art keywords
ridge
exhaust
electrode
substrate
electrodes
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Application number
JP2010178108A
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English (en)
Japanese (ja)
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JP5622477B2 (ja
JP2012038596A (ja
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Application filed filed Critical
Priority claimed from JP2010178108A external-priority patent/JP5622477B2/ja
Priority to JP2010178108A priority Critical patent/JP5622477B2/ja
Priority to CN201180030847.9A priority patent/CN102959125B/zh
Priority to PCT/JP2011/060625 priority patent/WO2012017717A1/ja
Priority to US13/703,694 priority patent/US20130084408A1/en
Priority to EP11814348.6A priority patent/EP2602356A1/en
Priority to TW100118133A priority patent/TWI442458B/zh
Publication of JP2012038596A publication Critical patent/JP2012038596A/ja
Publication of JP2012038596A5 publication Critical patent/JP2012038596A5/ja
Publication of JP5622477B2 publication Critical patent/JP5622477B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010178108A 2010-08-06 2010-08-06 真空処理装置 Expired - Fee Related JP5622477B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2010178108A JP5622477B2 (ja) 2010-08-06 2010-08-06 真空処理装置
EP11814348.6A EP2602356A1 (en) 2010-08-06 2011-05-09 Vacuum processing apparatus and plasma processing method
PCT/JP2011/060625 WO2012017717A1 (ja) 2010-08-06 2011-05-09 真空処理装置及びプラズマ処理方法
US13/703,694 US20130084408A1 (en) 2010-08-06 2011-05-09 Vacuum processing apparatus and plasma processing method
CN201180030847.9A CN102959125B (zh) 2010-08-06 2011-05-09 真空处理装置及等离子体处理方法
TW100118133A TWI442458B (zh) 2010-08-06 2011-05-24 Vacuum processing device and plasma processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010178108A JP5622477B2 (ja) 2010-08-06 2010-08-06 真空処理装置

Publications (3)

Publication Number Publication Date
JP2012038596A JP2012038596A (ja) 2012-02-23
JP2012038596A5 true JP2012038596A5 (enExample) 2013-08-29
JP5622477B2 JP5622477B2 (ja) 2014-11-12

Family

ID=45850384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010178108A Expired - Fee Related JP5622477B2 (ja) 2010-08-06 2010-08-06 真空処理装置

Country Status (1)

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JP (1) JP5622477B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6134522B2 (ja) * 2013-01-30 2017-05-24 株式会社ニューフレアテクノロジー 気相成長装置および気相成長方法
JP6285411B2 (ja) * 2015-12-25 2018-02-28 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3912569A1 (de) * 1989-04-17 1990-10-18 Siemens Ag Verfahren und vorrichtung zur erzeugung eines elektrischen hochfrequenzfeldes in einem nutzraum
JP3249356B2 (ja) * 1995-10-26 2002-01-21 三菱重工業株式会社 プラズマ化学蒸着装置
DE19540543A1 (de) * 1995-10-31 1997-05-07 Leybold Ag Vorrichtung zum Beschichten eines Substrats mit Hilfe des Chemical-Vapor-Deposition-Verfahrens
JP4082720B2 (ja) * 2001-09-10 2008-04-30 キヤノンアネルバ株式会社 基板表面処理装置
JP2007221156A (ja) * 2003-10-22 2007-08-30 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2006019593A (ja) * 2004-07-02 2006-01-19 Mitsubishi Heavy Ind Ltd アモルファス太陽電池の成膜装置、及び、その製造方法
JP4859472B2 (ja) * 2006-02-08 2012-01-25 独立行政法人物質・材料研究機構 プラズマプロセス装置

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