JP2012033592A - Electronic component conveying device and mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting machine which can suppress the deviation of relative positional relationship between a wafer housing device and a component supplying device in a coupled state from being parallel, even when the flatness of a floor surface is not satisfactory.SOLUTION: In a mounting machine, a mounting machine body 100 is provided with guide rails 14 and 15, and a wafer housing device 200 is provided with guide rollers 205 and 206. When the guide rollers 205 and 206 ride on the respective guide rails 14 and 15 while the mounting machine body 100 and the wafer housing device 200 are in a coupled state, a support portion of the wafer housing device 200 to a floor surface on the mounting machine body 100 side is spaced away from the floor surface.

Description

  The present invention relates to an electronic component transfer device and a mounting machine, and in particular, an electronic component including a wafer storage device that is movable with respect to a floor surface, and a component supply device that is installed on the floor surface and can be connected to the wafer storage device. The present invention relates to a transfer device and a mounting machine.

  2. Description of the Related Art Conventionally, there is known a transfer / transfer apparatus including a transfer carriage that stores a liquid crystal panel and is movable relative to a floor surface, and a liquid crystal panel manufacturing apparatus that is installed on the floor surface and that can be connected to the transfer carriage ( For example, see Patent Document 1).

  Patent Document 1 discloses a structure for connecting a transport carriage to a liquid crystal panel manufacturing apparatus. The liquid crystal panel manufacturing apparatus of Patent Document 1 is provided with a pair of guide rails that guide the movement of the transport carriage when connected, and a pair of bush holes. The conveyance carriage is provided with a pair of guide blocks at positions corresponding to the pair of guide rails, and a pair of positioning pins at positions corresponding to the pair of bush holes.

  In the above Patent Document 1, as the operation when connecting the transport carriage and the liquid crystal panel manufacturing apparatus, when the transport carriage is moved toward the liquid crystal panel manufacturing apparatus, the pair of guide blocks of the transport carriage is the liquid crystal panel. Guided along a pair of guide rails of the manufacturing apparatus. When the transport carriage is further moved, the pair of positioning pins of the transport carriage is inserted into the pair of bush holes of the liquid crystal panel manufacturing apparatus, and the connection is completed. The positional relationship between the transport carriage and the liquid crystal panel manufacturing apparatus in the connected state is configured to be determined by a bush hole and a positioning pin. Here, in Patent Document 1, the size of the bushing hole has a margin (play) with respect to the positioning pin so that the positioning pin is inserted into the bushing hole even when the flatness of the floor surface is not good. It is thought that.

  Conventionally, there has been known an electronic component transfer device that includes a wafer storage device that is movable with respect to a floor surface, and a component supply device that is installed on the floor surface and can be connected to the wafer storage device. In such an electronic component transfer device, the wafer is transferred from the wafer storage device to the component supply device while the wafer storage device is connected to the component supply device. Then, in a state where the wafer is held in a predetermined posture in the component supply apparatus, the electronic components constituting the wafer are supplied to a mounting mechanism for mounting the electronic components on the substrate.

JP 2003-176021 A

  However, in Patent Document 1, since the bush hole size that defines the positional relationship between the transport carriage and the liquid crystal panel manufacturing apparatus has a margin (play) with respect to the positioning pin, the flatness of the floor surface is not good. However, there is an inconvenience that the relative positional relationship between the transport carriage and the liquid crystal panel manufacturing apparatus may deviate from parallel in the connected state. Further, when the configuration relating to the connection between the devices of Patent Document 1 is applied to a conventional electronic component transfer device including the wafer storage device and the component supply device described above, the same inconvenience occurs. That is, when the flatness of the floor surface is not good, the relative positional relationship between the wafer storage device and the component supply device is deviated from parallel, and the wafer is transferred from the wafer storage device to the component supply device side. Then, the wafer is transferred while being tilted with respect to the component supply apparatus. For this reason, there is a problem that the component supply apparatus and the wafer may interfere with each other during transfer, or the wafer may not be held in an appropriate posture in the component supply apparatus.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a wafer storage device and a component supply device in a connected state even when the flatness of the floor surface is not good. It is providing the electronic component conveyance apparatus and mounting machine which can suppress that the relative positional relationship with is shifted from parallel.

Means for Solving the Problems and Effects of the Invention

  In order to achieve the above object, an electronic component transfer apparatus according to a first aspect of the present invention stores a wafer containing electronic components and mounts the electronic components on a substrate, a wafer storage device that can move relative to the floor surface An electronic component transfer device provided to supply an electronic component to a mounting mechanism, and provided with a component supply device that can be connected to a wafer storage device and is installed on a floor surface, the component supply device and the wafer storage device A guide rail is provided on one side, and a guide for moving the wafer storage device along the guide rail when the wafer storage device is connected to or separated from the component supply device on the other of the component supply device and the wafer storage device. One of the guide rails or the guide member provided in the wafer storage device in a state where the component supply device and the wafer storage device are connected to each other. By runs onto the other provided guide rails or guide members to article feeder, the supporting portion relative to the floor surface of the component supplying device side of the wafer storage device is configured so as to be separated from the floor surface.

  In the electronic component transport apparatus according to the first aspect, as described above, in a state where the component supply device and the wafer storage device are connected, one of the guide rail or the guide member provided in the wafer storage device is the component supply device. The support portion for the floor surface on the component supply device side of the wafer storage device is configured to be separated from the floor surface by riding on the other of the guide rail or the guide member provided in the guide rail and the guide member, The relative positional relationship between the wafer storage device and the component supply device in the connected state can be determined without depending on the flatness of the floor surface. Accordingly, by appropriately setting the positions of the guide rail and the guide member, even when the flatness of the floor surface is not good, the relative positional relationship of the wafer storage apparatus with respect to the component supply apparatus in the connected state is shifted from parallel. This can be suppressed. For this reason, when the wafer is transferred from the wafer storage device to the component supply device side, it is possible to prevent the wafer from being transferred in a tilted state with respect to the component supply device. As a result, it is possible to prevent the component supply apparatus and the wafer from interfering during the transfer or the wafer from being held in an appropriate posture in the component supply apparatus. In addition, when a plurality of guide rails and guide members are provided, the wafer storage device can be supported at two or more points with respect to the component supply device. It is possible to prevent the positional relationship (particularly, the right and left inclination of the wafer storage device when viewed from the front) from deviating from parallel.

  In the electronic component transport device according to the first aspect, preferably, the support portion includes a caster that supports the wafer storage device with respect to the floor surface in a rollable manner, and the guide rail is provided in the component supply device. The guide member is provided in the wafer storage device, and the caster on the component supply device side of the wafer storage device is formed by the guide member riding on the upper surface of the guide rail in a state where the component supply device and the wafer storage device are connected. Is configured to be separated from the floor surface. According to this structure, a guide member that is fixedly installed and has a guide rail that requires a relatively large space in a relatively large size component supply device, and that requires a relatively small space in a relatively small wafer storage device that moves. Therefore, unlike the case where guide rails are provided in the wafer storage device, the wafer storage device can be prevented from becoming large. In addition, since the casters of the wafer storage device are configured to be separated from the floor surface, even when the flatness of the floor surface in contact with the casters is not good, the component supply device and the wafer storage device can be easily relative to each other. The positional relationship can be kept parallel.

  In the electronic component transport apparatus according to the first aspect, preferably, the guide member includes a rolling element that rolls on a contact surface with the guide rail. With this configuration, since the contact resistance between the guide rail and the guide member can be reduced, the guide rail and the guide member are brought into contact when the component supply device and the wafer storage device are connected or separated. The wafer storage apparatus can be smoothly moved while the operation is being performed.

  In the electronic component transfer apparatus according to the first aspect, preferably, the wafer supply device and the wafer storage device are connected to the portion opposite to the component supply device of the wafer storage device with respect to the floor surface with the component supply device and the wafer storage device connected to each other. A support mechanism capable of supporting the storage device is provided, and the support mechanism is configured to be able to adjust the height position of the portion of the wafer storage device opposite to the component supply device. If comprised in this way, the height position of the part on the opposite side to the component supply apparatus of a wafer storage apparatus can be adjusted with a support mechanism in the state with which the wafer storage apparatus and the component supply apparatus were connected. Thereby, the relative positional relationship (particularly, the inclination in the front-rear direction) of the wafer storage device with respect to the component supply device in the connected state can be determined without depending on the flatness of the floor surface. Thereby, even when the flatness of the floor surface is not good, it is possible to further suppress the relative positional relationship of the wafer storage device with respect to the component supply device in the connected state from deviating from parallel.

  In the electronic component transport device according to the first aspect, preferably, at least one of the component supply device and the wafer storage device has the wafer storage device directed toward the component supply device in order to connect the wafer storage device to the component supply device. A stopper is provided for restricting the movement of the wafer storage device in the connection direction when the component supply device side portion of the wafer storage device is separated from the floor surface when moving in the connection direction. With this configuration, the user can move the wafer storage device in the connecting direction until it stops by the stopper and stops moving, and the component supply device while separating the part on the component supply device side of the wafer storage device from the floor surface. And the wafer storage device can be connected. By appropriately setting the position of the stopper, it is possible to suppress the relative displacement of the wafer storage device with respect to the component supply device in the connected state. In addition, when a plurality of stoppers are provided, the movement of the wafer storage device relative to the component supply device can be regulated at two or more points, so that the relative positional relationship of the wafer storage device relative to the component supply device (particularly, particularly , When viewed from above, it is possible to prevent the shift in the planar rotational direction) from deviating from parallel.

  In the electronic component transport device according to the first aspect, preferably, the component supply device includes a base, and the base includes a wafer storage device fitted with the wafer storage device coupled thereto. A concave connecting portion is provided. According to this configuration, at least a part of the wafer storage device fits into the component supply device in the connected state, so that the overall size of the electronic component transfer device in the connected state can be reduced. In addition, since the distance between the component supply device and the wafer storage device in the connected state can be reduced, the wafer can be smoothly transferred from the wafer storage device to the component supply device.

  In the configuration in which the base of the component supply device is provided with a concave connecting portion when seen in a plan view, preferably, the base includes a first portion that constitutes a front wall portion of the connecting portion and both sides of the connecting portion. And a second portion constituting the side wall portion, and the electrical component of the component supply device is accommodated in the second portion. If comprised in this way, an electrical component can be arrange | positioned effectively using the space of the 2nd part of the base for inserting a wafer storage apparatus.

  In the configuration in which the base of the component supply device is provided with a concave connecting portion when seen in a plan view, preferably, the base includes a first portion that constitutes a front wall portion of the connecting portion and both sides of the connecting portion. The guide rail or the guide member provided in the component supply device is fixed to the side wall portion of the second portion. If comprised in this way, since a guide rail or a guide member is provided in the base which is a strong member, the intensity | strength of the guide rail or guide member for supporting a wafer storage apparatus at the time of a connection can be enlarged.

  A mounting machine according to a second aspect of the present invention includes a mounting mechanism for mounting an electronic component on a substrate, and the electronic component transport apparatus according to the first aspect, provided to supply the electronic component to the mounting mechanism. Yes.

  In the mounting machine according to the second aspect, by providing the electronic component transfer device according to the first aspect, even when the flatness of the floor surface is not good, the wafer storage device in the connected state is relative to the component supply device. Can be prevented from shifting from parallel.

It is a front view which shows the whole structure of the mounting machine (state which has not connected the wafer storage apparatus) by one Embodiment of this invention. It is a top view which shows the whole structure (state which has not connected the wafer storage apparatus) of the mounting machine by one Embodiment of this invention. It is a front view which shows the whole structure of the mounting machine (state with which the wafer storage apparatus was connected) by one Embodiment of this invention. It is a top view which shows the whole structure (state in which the wafer storage apparatus was connected) of the mounting machine by one Embodiment of this invention. It is a perspective view which shows roughly the main component of the mounting machine by one Embodiment of this invention. It is a perspective view which shows the guide rail provided in the base of the mounting machine by one Embodiment of this invention. It is a perspective view which shows the wafer storage apparatus of the mounting machine by one Embodiment of this invention. It is a perspective view which shows the side part of the wafer storage apparatus of the mounting machine by one Embodiment of this invention. It is sectional drawing which shows the support mechanism of the wafer storage apparatus of the mounting machine by one Embodiment of this invention. It is a block diagram which shows the control system of the mounting machine by one Embodiment of this invention. It is sectional drawing which shows the inside of the base of the mounting machine by one Embodiment of this invention. It is a bottom view for demonstrating the connection operation | movement (before connection) of the wafer storage apparatus of the mounting machine by one Embodiment of this invention. It is the fragmentary sectional view seen from the side for demonstrating the connection operation | movement (before connection) of the wafer storage apparatus of the mounting machine by one Embodiment of this invention. It is the fragmentary sectional view seen from the side for demonstrating the connection operation | movement (in the middle of connection) of the wafer storage apparatus of the mounting machine by one Embodiment of this invention. It is a bottom view for demonstrating the connection operation | movement (after connection) of the wafer storage apparatus of the mounting machine by one Embodiment of this invention. It is the fragmentary sectional view seen from the side for demonstrating the connection operation | movement (after connection) of the wafer storage apparatus of the mounting machine by one Embodiment of this invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  Hereinafter, a structure of a mounting machine according to an embodiment of the present invention will be described with reference to FIGS. In order to clarify the directional relationship, XYZ rectangular coordinate axes are appropriately shown in the drawing. The X-axis direction is a direction parallel to the horizontal plane, the Y-axis direction is a direction orthogonal to the X-axis direction on the horizontal plane, and the Z-axis direction is a direction orthogonal to the X-axis and the Y-axis.

  The mounting machine can take out the bare chip from the diced wafer W and mount (mount) it on the printed circuit board P, and can mount a package component supplied by the component supply device 300 on the printed circuit board P. It is a complex type mounting machine. As shown in FIGS. 1 to 4, the mounting machine is mounted on the mounting machine body 100 fixed to the floor surface F, is movable with respect to the floor surface F, and is connected to the mounting machine body 100. And a possible wafer storage device 200. The mounting machine is an example of the “electronic component transport apparatus” in the present invention, and the mounting machine body 100 is an example of the “component supply apparatus” in the present invention.

  As shown in FIGS. 1 to 4, the mounting machine main body 100 includes a base 1, a conveyor 2 for loading and unloading the printed circuit board P to and from a predetermined mounting work position, and a chip for supplying chip components. And a component supply unit 3. As shown in FIGS. 1, 3, and 5, the mounting machine body 100 is pulled out from the mounting unit 4 for mounting components (bare chips or chip components) on the printed circuit board P and the wafer storage device 200. A wafer holding table 5 for supporting the wafer W, a take-out device 6 for taking out the bare chip from the wafer W supported by the wafer holding table 5 and delivering it to the mounting unit 4, and the bare chip at the bottom when the take-out device 6 takes out the bare chip. And a movable device 8 for recognizing a part position that images the bare chip before the bare chip is taken out by the take-out device 6. The bare chip is an example of the “electronic component” in the present invention.

  The base 1 is composed of a strong metal member, for example, and supports a conveyor 2, a chip component supply unit 3, a mounting unit 4, a wafer holding table 5, and the like. The base 1 is fixedly installed on the floor surface F by a plurality of legs 11. As shown in FIGS. 1 and 2, a connecting portion 1 a having a concave shape as viewed in a plan view is provided in the central portion on the front side of the base 1 of the mounting machine body 100. The wafer storage device 200 can be fixed to the mounting machine main body 100 in a state where the wafer storage device 200 is fitted into the connecting portion 1a. Hereinafter, the movement direction (Y1 direction) of the wafer storage apparatus 200 during connection is referred to as a connection direction, and the movement direction (Y2 direction) of the wafer storage apparatus 200 during separation is referred to as a separation direction.

  The concave connecting portion 1a in plan view includes a front wall portion 12 facing the front as viewed from the wafer storage device 200, and a pair of side wall portions 13 respectively facing both side surfaces of the wafer storage device 200. Have. The second portion 1c protrudes toward the wafer storage apparatus 200 (on the separation direction (Y2 direction) side) with respect to the first portion 1b when viewed in a plan view.

  In addition, a guide rail 14 and a guide rail 15 are provided on the pair of side wall portions 13, respectively. The guide rails 14 and 15 are provided to support the front side (mounting machine main body 100 side) portion of the wafer storage device 200 in a state where the wafer storage device 200 is connected to the mounting machine main body 100.

  As shown in FIGS. 1 and 6, the guide rail 14 is a block-like member that protrudes inward from the side wall portion 13. The guide rail 14 is formed to extend in the Y direction. In the guide rail 14, the upper surface 14 a of the front side (separation direction (Y2 direction in FIG. 6) side) is an inclined surface that becomes higher as it goes in the connection direction (Y1 direction in FIG. 6). The upper surface 14b of the rear side (connection direction (Y1 direction) side) portion of the guide rail 14 is a horizontal plane. The guide rail 14 includes a protrusion 14c as a stopper protruding downward from the lower surface. Further, a screw hole 14d is provided on the side surface on the front side (Y2 direction side) of the guide rail 14. Similarly, the guide rail 15 is formed so as to correspond in size and position to the guide rail 14, and has an upper surface 15a made of an inclined surface, an upper surface 15b made of a horizontal surface, a protruding portion 15c, and a screw hole 15d. Yes.

  The conveyor 2 includes a conveyor main body that extends in the X direction that conveys the printed circuit board P, and a positioning mechanism (not shown) that lifts and positions the printed circuit board P on the conveyor main body. The conveyor 2 conveys the printed circuit board P in the X-axis direction in a substantially horizontal posture from the right side to the left side in FIGS. 1 to 4, and positions and fixes the printed circuit board P at a predetermined mounting work position. In the present embodiment, the positions (positions of the printed circuit boards P in FIGS. 2 and 4) that are separated by a predetermined interval in the X-axis direction on the conveyance path by the conveyor 2 are set as the mounting work positions. In the following description, a position on the upstream side in the transport direction of the printed circuit board P among the mounting work positions is referred to as a first work position S1, and a position on the downstream side is referred to as a second work position S2.

  The chip component supply unit 3 is provided at both ends on the near side of the mounting machine body 100. The chip component supply unit 3 is provided to supply chip components such as transistors, resistors, and capacitors. In the chip component supply unit 3, for example, a component supply device 300 such as a tape feeder is arranged along the conveyor 2. Each tape feeder includes a reel on which a tape holding a chip component such as a transistor is wound, a holding member that holds the reel, and a chip component at a component supply position at the tip of the tape feeder while pulling out the tape from the reel. And a parts feeding mechanism for feeding out. The tape feeder is configured to perform a chip component feeding operation in conjunction with the mounter main body 100 in a state of being attached to the chip component supply unit 3. That is, the mounting part 4 of the mounting machine main body 100 is configured to pick up a chip component at the component supply position and to feed the next chip component to the component supply position along with this pickup. Note that the chip component supply unit 3 may be provided with a tray (not shown) on which a large package component such as a semiconductor package is placed instead of the tape feeder. In this case, the package part is picked up directly from the tray by the mounting unit 4.

  The mounting unit 4 mounts a bare chip or a chip component on the printed circuit board P, and has two head units (first head unit) that can move in the horizontal direction (XY direction) above the conveyor 2. 41, the second head unit 42) and driving means for individually driving them. The mounting unit 4 is an example of the “mounting mechanism” in the present invention.

  The first head unit 41 can be moved only within this area, with the upstream area on the base 1 mainly including the first work position S1 as a movable area. On the other hand, the second head unit 42 is A downstream area on the table 1 that mainly includes the second work position S2 is set as a movable area and can move only within this area. The first head unit 41 (second head unit 42) includes two component mounting heads 41a and one camera 41b (two component mounting heads 42a and one camera 42b) arranged in the X-axis direction.

  The first head unit 41 (second head unit 42) mounts the chip component supplied by the component supply device 300 (tape feeder) on the printed circuit board P by the component mounting head 41a (42a). The bare chip taken out from the wafer W by the take-out device 6 is sucked by the component mounting head 41a (42a) and mounted on the printed board P. As a result, both chip components such as transistors and capacitors and bare chips (bare chips) are mounted on the printed circuit board P. Further, the first head unit 41 (second head unit 42) has a fiducial mark (not shown) attached to the printed circuit board P by the camera 41b (42b) prior to mounting of the components on the printed circuit board P. By recognizing, the positional deviation of the printed circuit board P is recognized, and the positional deviation is corrected at the time of mounting.

  As shown in FIG. 1, the driving means of the first head units 41 and 42 includes support members 43 and 44 that support the first head unit 41 and the second head unit 42 so as to be movable in the X-axis direction, and a mounting machine. Fixed rails 45 and 46 provided on the ceiling 100a of the main body 100 and separately supporting the support members 43 and 44 so as to be movable in the Y-axis direction, and the first head unit 41 and the second head with respect to the support members 43 and 44 A moving mechanism (not shown) composed of a linear motor for moving the unit 42 in the X-axis direction, and a linear for moving the support members 43 and 44 separately in the Y-axis direction along the fixed rails 45 and 46, respectively. And a moving mechanism (not shown) including a motor.

  As shown in FIGS. 2 and 4, fixed cameras 9a and 9b for component recognition are installed on the base 1 and in the movable regions of the first head unit 41 and the second head unit 42, respectively. Has been. The fixed cameras 9a and 9b are cameras including an image sensor such as a CCD or a CMOS. The fixed cameras 9a and 9b take images of components sucked by the component mounting head 41a of the first head unit 41 and the component mounting head 42a of the second head unit 42 from below, and the image signals will be described later. This is output to the control device 110.

  As shown in FIG. 7, the wafer storage device 200 stores a plurality of diced wafers W. The wafer storage apparatus 200 supports a rack 201 that stores a substantially annular holder Wh that holds a wafer W in a plurality of upper and lower stages, a box-shaped main body 202 that holds the rack 201 to be movable up and down, and a main body 202. A bottom plate 203 and four casters 204 attached to the bottom plate 203 are included. The main body 202 is provided with driving means such as a motor for driving the rack 201 up and down. The wafer storage device 200 is arranged at a predetermined loading / unloading height position where a desired wafer W can be loaded / unloaded with respect to the wafer holding table 5 by raising / lowering the rack 201.

  Each wafer W accommodated in the wafer storage apparatus 200 is stuck on a film-like wafer sheet so that the bare chip is face-up state (circuit formation surface (mounting surface with respect to the printed circuit board P) is upward). It is held by a holder Wh through this wafer sheet.

  A pair of casters 204 are attached to the end of the wafer storage apparatus 200 on the connection direction side and the end of the separation direction side. Thus, the wafer storage device 200 is supported at four points so as to be movable with respect to the floor surface F.

  Further, in the present embodiment, a wheel-shaped guide roller 205 corresponding to the guide rail 14 is provided in the vicinity of an end portion on one side of the main body 202 in the separation direction (Y2 direction) side. A wheel-shaped guide roller 206 corresponding to the guide rail 15 is provided in the vicinity of the end portion of the other side portion in the separation direction (Y2 direction) side. The guide rollers 205 and 206 are rotatably attached to the side surfaces of the fixing blocks 207 and 208 (see FIG. 7) that protrude outward from the side of the main body 202, respectively. When the wafer storage device 200 is moved in the connecting direction (Y1 direction), the guide rollers 205 and 206 are configured to ride on the guide rails 14 and 15, respectively. Thereby, in the connected state, the portion of the wafer storage device 200 on the connection direction (Y1 direction) side is supported by the pair of guide rails 14 and 15 and the pair of guide rollers 205 and 206, and the wafer storage device 200 is connected. A pair of casters 204 on the direction (Y1 direction) side is configured to be separated from the floor surface F. The guide rollers 205 and 206 are examples of the “guide member” and the “rolling element” in the present invention.

  The guide roller 206 is directly attached to the fixed block 208, while the guide roller 205 is attached to a movable block 209 that is movable in the vertical direction (Z direction) with respect to the fixed block 207, as shown in FIG. ing. The movable block 209 is formed in an L shape so as to cover the upper surface of the fixed block 207 and the side surface on the X1 direction side. A pair of elongated holes 209a extending in the vertical direction is formed on the side surface of the movable block 209, and a screw hole (not shown) is formed on the side surface of the fixed block 207 on the X1 direction side. The elongated holes 209 a of the movable block 209 and the screw holes (not shown) of the fixed block 207 are fastened by screws 210. The movable block 209 is movable in the vertical direction by the length of the long hole 209a. As described above, the height position of one guide roller 205 of the pair of guide rollers 205 and 206 can be adjusted.

  As shown in FIGS. 2, 7, and 8, a flat plate projecting outward is provided at a position on the front side (separation direction (Y2 direction) side) of the guide roller 205 on one side of the main body 202. The abutting member 211 is provided. A contact portion 211a formed of an end surface on the connection direction (Y1 direction) side of the contact member 211 is formed in a straight line shape (see FIG. 2) extending in the X direction when seen in a plan view. When the wafer storage device 200 is moved in the connecting direction (Y1 direction), the abutting portion 211a is in a state where the guide roller 205 rides on the upper surface 14b of the guide rail 14, and the protruding portion 14c of the guide rail 14 (FIG. 6). The movement in the connecting direction (Y1 direction) beyond that is regulated by abutting on the reference). The protrusion 14c and the contact portion 211a of the guide rail 14 are an example of the “stopper” in the present invention.

  As shown in FIG. 8, a plate member 212 is fixed to the contact member 211. A screw insertion hole is formed in the plate member 212, and a screw 213 is rotatably attached to the screw insertion hole. The screw insertion hole and the screw 213 are arranged so that their positions are aligned with the screw hole 14d of the guide rail 14 when connected.

  Further, as shown in FIGS. 2 and 7, a flat plate-like contact projecting outward is provided at the front side (separation direction (Y2 direction) side) of the guide roller 206 on the other side of the main body 202. A member 214 is provided. An abutting portion 214a formed of an end surface on the connecting direction (Y1 direction) side of the abutting member 214 has a concave shape (notch shape) when seen in a plan view. When the wafer storage device 200 is moved in the connecting direction (Y1 direction), the back portion of the notch-shaped contact portion 214a is located on the guide rail 15 with the guide roller 206 riding on the upper surface 15b of the guide rail 15. By contacting the projection 15c, further movement in the connecting direction (Y1 direction) is restricted. The protrusion 15c and the contact portion 214a of the guide rail 15 are examples of the “stopper” in the present invention.

  As indicated by line E in FIG. 2, the position in the Y direction of the back portion of the concave portion of the contact portion 214 a is equal to the position in the Y direction of the contact portion 211 a of the contact member 211. Further, the positions in the Y direction of the protrusions 14c of the guide rail 14 and the protrusions 15c of the guide rail 15 are also equal. Accordingly, the planar rotation of the wafer storage device 200 with respect to the mounting machine main body 100 in a state where the contact portion 211a and the contact portion 214a are in contact with the protrusion portion 14c of the guide rail 14 and the protrusion portion 15c of the guide rail 15, respectively. Directional deviation is regulated.

  Further, the notch width (width D in the X direction shown in FIG. 2) of the contact member 214 is substantially equal to the diameter of the protrusion 15 c of the guide rail 15. Thereby, in the connected state, the wafer storage device 200 is prevented from moving (displaced) in the lateral direction (X direction) with respect to the mounting apparatus main body 100.

  A plate member 215 is fixed to the contact member 214. A screw insertion hole is formed in the plate member 215, and a screw 216 is rotatably attached to the screw insertion hole. The screw insertion hole and the screw 216 are arranged so as to be aligned with the screw hole 15d of the guide rail 15 at the time of connection. At the time of connection, the plate member 212 provided with the screw insertion hole and the screw hole 14d of the guide rail 14 are fastened by the screw 213, and the plate member 215 provided with the screw insertion hole and the screw hole 15d of the guide rail 15 are provided. Are fastened with screws 216, so that the wafer storage device 200 and the mounting machine main body 100 can be fixed in a connected state.

  Further, as shown in FIG. 7, the wafer storage apparatus 200 can be supported with respect to the floor F separately from the casters 204 on the front side (separation direction (Y2 direction) side) of the wafer storage apparatus 200. A support mechanism 220 is provided. One support mechanism 220 is provided at the center in the X direction. The support mechanism 220 is connected to the wafer storage device 200 in a connected state (a state in which the casters 204 on the connection direction side of the wafer storage device 200 are separated from the floor surface F by the guide rollers 205 and 206 riding on the guide rails 14 and 15). The height position of the rear portion is configured to be adjustable.

  Specifically, as shown in FIGS. 7 and 9, the support mechanism 220 includes a first leg 221 including a grounding part 221 a that contacts the floor F, and a second leg connected to the first leg 221. A portion 222, a handle 223 for the user to rotate the second leg 222, and a frame 224 that is fixed to the bottom 202 a of the main body 202 and supports the second leg 222.

  The second leg part 222 integrally includes an upper part 222 a inserted into the frame 224, a body part 222 b located in the frame 224, and a lower part 222 c that projects downward from the bottom part 202 a of the main body 202. The upper part 222a is fixed to the handle 223, and the entire second leg 222 is rotated by the rotation of the handle 223. A male screw is formed on the outer surface of the upper portion 222a of the second leg 222, and a female screw corresponding to the male screw of the upper portion 222a of the second leg 222 is formed on the upper portion 224a of the frame 224. As a result, the user can rotate the handle 223 so that the entire second leg 222 can be moved up and down with respect to the frame 224 in the vertical direction (Z direction). When the handle 223 is rotated in the direction in which the second leg 222 is lowered, the lower surface of the body 222b of the second leg 222 comes into contact with the upper surface of the bottom 224b of the frame 224, so that the handle 223 is The (second leg 222) is configured not to rotate any further. Therefore, the lowest position of the second leg 222 can be easily reproduced by the user.

  In addition, a female screw is formed on the lower portion 222c of the second leg portion 222, and a male screw corresponding to the female screw on the lower portion 222c of the second leg portion 222 is formed on the outer surface of the first leg portion 221. . Accordingly, the first leg 221 can be moved up and down with respect to the lower part 222 c of the second leg 222 by rotating the first leg 221 by the user. A nut 225 is screwed into the male screw of the first leg 221. By tightening the nut 225 to the second leg 222 side, the first leg 221 is prevented from rotating with respect to the lower part 222c of the second leg 222. Thereby, while the nut 225 is loosened, the protruding length of the first leg portion 221 relative to the lower portion 222c of the second leg portion 222 can be adjusted, and by tightening the nut 225 after the adjustment, the first leg portion 221 is tightened. It is possible to fix the protruding length to an adjusted length.

  As shown in FIG. 7, a pin 226 that can be inserted and removed toward the body 222 b is provided on the front side of the body 222 b of the second leg 222. The pin 226 is attached to a pin support member 227 fixed to the bottom 224b of the frame 224. The body 222b of the second leg 222 is provided with a pin insertion hole 222d. By inserting the pin 226 into the pin insertion hole 222d of the body 222b with the second leg 222 positioned at the lowest position, rotation of the second leg 222 (rotation of the handle 223) can be prevented. Is possible. Further, the second leg 222 can be lifted together with the first leg 221 by rotating the handle 223 while the pin 226 is extracted from the pin insertion hole 222d.

  As shown in FIGS. 1 and 2, the wafer holding table 5 includes a wafer W loading / unloading mechanism 5 a. The loading / unloading mechanism 5a is configured to be movable back and forth (Y direction) with respect to the wafer holding table 5, and is an arm having a holder gripping mechanism 5b at the tip. The loading / unloading mechanism 5a is configured such that the wafer W (holder Wh) in the rack 201 disposed at the loading / unloading height position in a state where the wafer holding table 5 is disposed at the wafer receiving position (position closest to the front (Y2 direction side)). Is pulled out from the wafer storage device 200 onto the wafer holding table 5, and the holder Wh on the wafer holding table 5 can be stored (returned) in the rack 201 after the wafer parts are extracted and mounted. Yes.

  The wafer holding table 5 has a circular opening at the center, and can hold the holder Wh so that the opening of the holder Wh that holds the wafer W and the opening of the wafer holding table 5 overlap. . Accordingly, it is possible to push up the bare chip from below the wafer holding table 5 by the push-up device 7 to be described later while the wafer W (holder Wh) is held on the wafer holding table 5.

  The wafer holding table 5 is configured to be movable in the Y direction on the base 1 between the component picking work position (the position on the farthest side (Y1 direction side, see FIG. 2)) and the wafer receiving position. . Specifically, the wafer holding table 5 is movably supported by a pair of fixed rails 51 provided on the base 1 so as to extend in the Y-axis direction, and along the fixed rails 51 by a predetermined driving means. Moved. The drive means includes a ball screw shaft 52 extending in parallel with the fixed rail 51 and screwed into the nut portion of the wafer holding table 5, and a drive motor 53 for driving the ball screw shaft 52 to rotate. As shown in FIG. 1, the wafer holding table 5 moves through a position below the conveyor 2, and moves between a predetermined part picking work position and a wafer receiving position in the vicinity of the wafer storage device 200.

  The push-up device 7 lifts the bare chip to be picked up from the lower side of the wafer W on the wafer holding table 5 arranged at the component picking work position, thereby lifting the bare chip from the wafer sheet. It is.

  As shown in FIG. 5, the push-up device 7 includes a pair of small-diameter push-up rods (referred to as a first push-up rod 71a and a second push-up rod 71b) each containing a push-up pin (not shown). And a fixed rail 72 that supports the push-up head 71 so as to be movable in the X-axis direction on the base 1, and driving means for moving the push-up head 71 along the fixed rail 72. The drive means includes a ball screw shaft (not shown) that extends in parallel with the fixed rail 72 and is screwed into the push-up head 71, and a push-up head drive motor (not shown) for rotationally driving the shaft. . By configuring the push-up device 7 to be movable in the X direction, the push-up head 71 can push up an arbitrary bare chip with respect to the wafer W supported on the wafer holding table 5 movable only in the Y direction. It is possible.

  The first push-up rod 71a and the second push-up rod 71b of the push-up head 71 extend in the vertical direction and are individually driven up and down by an actuator (such as an air cylinder) not shown. That is, in a state where the first push-up rod 71a or the second push-up rod 71b is arranged inside the opening of the wafer holding table 5, the first push-up rod 71a or the second push-up rod 71b is the wafer sheet. After being driven up to a substantially contacting position on the lower side and then positioned at the desired position in the XY direction of the bare chip, a push-up pin is driven by a drive motor (not shown) from the first push-up rod 71a or the second push-up rod 71b. ) To lift the bare chip. The first push-up rod 71a and the second push-up rod 71b can change the thickness of the push-up pin in accordance with the size of the part to be pushed up. For example, by attaching different push-up pins to the first push-up rod 71a and the second push-up rod 71b, the first push-up rod 71a or the second push-up rod 71b is selectively used depending on the size of the parts. It is possible to use.

  The first push-up rod 71a and the second push-up rod 71b can be driven up and down to a two-stage height position. That is, when the wafer holding table 5 is moved between the part picking work position and the wafer receiving position in the vicinity of the wafer storage device 200, the lowest position for avoiding interference with the wafer holding table 5, and the wafer holding table 5 Can be driven up and down with the push-up standby position located in the vicinity of the lower surface of the wafer W inside the opening of the holder Wh, with the push-up pin being in the standby position. It can be driven up and down between a position built in the first push-up rod 71a or the second push-up rod 71b and a component push-up position located above the upper surface of the wafer holding table 5.

  The take-out device 6 sucks the bare chip pushed up by the push-up device 7 and delivers it to the first head unit 41 and the second head unit 42.

  The take-out device 6 is moved in the horizontal direction (XY direction) at a position above the part take-out work position by a predetermined driving means. This driving means has the following configuration.

  That is, a pair of elevated fixed rails 61 arranged at predetermined intervals in the X-axis direction and extending in parallel with each other in the Y-axis direction, and both ends thereof are movably supported on the fixed rails 61 at the part extraction work position. A frame member 62 extending in the X-axis direction, and a pair of balls that are disposed at positions close to the fixed rail 61 and extend in the Y-axis direction and screwed into nut members (not shown) at both ends of the frame member 62. A screw shaft 63 and a pair of frame drive motors 64 that rotationally drive the ball screw shaft 63 are provided.

  The frame member 62 is provided with a first rail (not shown) fixed to the front side and extending in the X-axis direction, and a second rail (not shown) fixed to the rear side and extending in the X-axis direction. Yes. The take-out device 6 is movably supported on the first rail, and the camera 8 is movably supported on the second rail. A ball screw shaft (not shown) extending in the X-axis direction and screwed into the nut member (not shown) of the take-out device 6 is inserted into the frame member 62, and a drive motor 65 that rotationally drives the ball screw shaft. A ball screw shaft (not shown) that extends in the X-axis direction and is screwed into a nut member (not shown) of the camera 8 and a drive motor 66 that rotationally drives the ball screw shaft are provided. That is, the frame member 62 is moved along the fixed rail 61 by the operation of each frame drive motor 64, and the take-out device 6 and the camera 8 are integrally moved in the Y-axis direction as the frame member 62 moves.

  The take-out device 6 is moved in the X-axis direction at a position on the front side in the Y direction of the frame member 62 by the operation of the drive motor 65, and the camera is moved at the position on the rear side in the Y direction of the frame member 62 by the operation of the drive motor 66. 8 is moved in the X-axis direction. As a result, the take-out device 6 and the camera 8 can be independently moved in the horizontal direction (XY direction) at a position above the part take-out work position.

  The movable area in the XY direction of the take-out device 6 and the movable areas in the XY direction of the first head unit 41 and the second head unit 42 partially overlap. As a result, the bare chip can be delivered from the take-out device 6 to the first head unit 41 and the second head unit 42 as will be described later. As shown in FIG. 1, the take-out device 6, the camera 8, and the driving means described above are located below the first head unit 41, the second head unit 42, and the driving means. Accordingly, the movable area of the take-out device 6 and the movable areas of the first head unit 41 and the second head unit 42 partially overlap as described above, but the take-out apparatus 6, the first head unit 41, and the second head. The units 42 do not interfere with each other.

  The take-out device 6 includes a pair of wafer heads (referred to as a first wafer head 6a and a second wafer head 6b).

  As shown in FIG. 5, the first wafer head 6a and the second wafer head 6b are drum-type heads. That is, the first wafer head 6a and the second wafer head 6b can be rotated about an axis parallel to the X-axis direction, and can be moved in the vertical direction (lifted / lowered). A bracket member 6d that is supported by the member 6c so as to be movable up and down, and a pair of nozzles 6e that are supported by the bracket member 6d so as to be rotatable about the X axis and that are provided inside the bracket members 6d. Have.

  The pair of nozzles 6e of the first wafer head 6a are provided at positions that are exactly upside down, and are provided so that the nozzle 6e on the other side faces directly above when the nozzle 6e on one side faces directly below. . The drive motors 6f provided on the outer sides of both bracket members 6d are rotationally driven, whereby the positions of the pair of nozzles 6e are alternately switched. Further, by driving a drive motor (not shown), the bracket member 6d is moved up and down with respect to the frame member 6c, and the entire first wafer head 6a including the nozzle 6e is moved up and down. The second wafer head 6b has the same configuration. The interval between the nozzles 6e of the first wafer head 6a and the second wafer head 6b (interval in the X-axis direction) is the interval between the component mounting heads 41a mounted on the first head unit 41 and the second head unit 42. The interval is the same as the interval of the component mounting heads 42a mounted on the substrate. As a result, the two component mounting heads 41a of the first head unit 41 or the two component mounting heads 42a of the second head unit 42 from the two wafer heads (the first wafer head 6a and the second wafer head 6b). At the same time, two bare chips can be delivered.

  The camera 8 is a camera including an image sensor such as a CCD or a CMOS. Prior to taking out the bare chip from the wafer W, the camera 8 images the bare chip to be taken out, and outputs the image signal to the control device 110. When the take-out device 6 delivers a part to the head unit, the take-out device 6 is moved to a position closest to the conveyor 2.

  FIG. 10 is a block diagram showing a control system of the mounting machine main body 100. As shown in FIG. 10, the mounting machine main body 100 includes a control device 110 including a CPU, various memories, an HDD, and the like. The control device 110 includes the above-described drive motors and the like (the drive motor 53, the frame drive motor 64, the drive motor 65, the drive motor 66, the drive motor 6f, the other drive motors, and the air for raising and lowering the first push-up rod 71a. The control valve drive solenoid in the air circuit to the cylinder and the second push-up rod 71b ascending / descending air cylinder), the camera 8, the fixed cameras 9a and 9b, etc. are electrically connected to each other. It is controlled by the control device 110 in a centralized manner. In addition, an input device (not shown) is electrically connected to the control device 110, and various information by the operator is input based on the operation of the input device. An output signal from position detection means such as an encoder is also input. In the coupled state, the wafer storage device 200 and the control device 110 are electrically connected by a cable 200 a, and a motor for raising and lowering the rack 201 of the wafer storage device 200 is also controlled by the control device 110.

  As a functional element, the control device 110 includes a shaft control unit 111 that controls driving of the driving motors and driving solenoids of the control valves, and cameras (fixed cameras 9a and 9b, cameras 41b and 42b, etc.). An image processing unit 112 that performs predetermined processing on an image signal, an I / O processing unit 113 that controls input of signals from a sensor (not shown), output of various control signals, and the like, and communication that controls communication with an external device It includes a control unit 114, a storage unit 115 that stores various programs such as a mounting program and various data, and a main calculation unit 116 that performs overall control and executes various calculation processes.

  The control device 110 controls the drive motors and the like based on a predetermined program, whereby the conveyor 2, the wafer holding table 5, the take-out device 6, the push-up device 7, the first head unit 41, and the first head unit 41 2 The head unit 42 and the like are controlled. As a result, a series of operations (component mounting operation) such as loading / unloading of the wafer W into / from the wafer storage device 200, removal of the bare chip from the wafer W, and mounting of components by the first head unit 41 and the second head unit 42 are executed.

  The control device 110 is mainly housed inside the base 1. Here, in this embodiment, a part of the control device 110 is accommodated in the second portion 1c. Specifically, as shown in FIG. 11, a control box 117 in which the image processing unit 112, the communication control unit 114, the storage unit 115, and the main calculation unit 116 are integrated is housed in one second portion 1c. ing. A main switch 118 (shown only in FIG. 11) is provided outside the other second portion 1c, and a main breaker 119 is housed inside the other second portion 1c. The control box 117 is an example of the “electric component” in the present invention.

  Note that the shaft control unit 111 and the I / O processing unit 113 described above are accommodated in the first portion 1b. Various devices such as a voltage transformer 120, a transformer 121, and a vacuum source 122 are also housed in the first portion 1b.

  Next, control of the component mounting operation by the control device 110 will be described. The following description will be made in a state where the wafer storage device 200 is connected to the mounting machine main body 100.

  First, the control device 110 carries the printed circuit board P into the mounting machine main body 100 by controlling the conveyor 2. And the control apparatus 110 fixes the printed circuit board P in the state arrange | positioned in 1st work position S1 and 2nd work position S2 by controlling the conveyor 2. FIG.

  Thereafter, the control device 110 pulls out the wafer W from the wafer storage device 200 by controlling the wafer holding table 5. Specifically, by driving the drive motor 53, the wafer holding table 5 is moved to the wafer receiving position. Then, the wafer W (holder Wh) is pulled out from the wafer storage device 200 onto the wafer holding table 5 by the loading / unloading mechanism 5a. Then, the pulled wafer W is fixed to the wafer holding table 5. Thereafter, the wafer holding table 5 is controlled so as to be placed at the part picking work position.

  When the wafer W is placed at the component extraction work position, the control device 110 controls the camera 8 to image the bare chip to be extracted.

  Next, the control device 110 controls the push-up device 7, the take-out device 6, and the wafer holding table 5 on the basis of the imaging result by the camera 8, and the push-up pin of the push-up head 71, the nozzle 6 e of the take-out device 6, The bare chip to be taken out is moved to the same position on the XY plane.

  Then, the control device 110 pushes up the bare pin from the lower side by raising (driving) the push-up pin from the first push-up rod 71a or the second push-up rod 71b according to the size of the component. At this time, a negative pressure is generated on the front end surface of the push-up rod 71a or 71b to suck and hold the wafer sheet to which the bare chip is attached, and the push-up pin is inserted from the center of the front end surface of the push-up rod 71a or 71b. Push up. On the other hand, the first wafer head 6a or the second wafer head 6b is lowered and the bare chip peeled off from the wafer sheet by being pushed up is adsorbed by the negative pressure at the tip of the nozzle 6e. Thereby, the bare chip is taken out from the wafer W.

  Next, the control device 110 delivers the bare chip from the take-out device 6 to the head unit. Specifically, the control device 110 controls the take-out device 6 to move the take-out device 6 to a predetermined component delivery position (position closest to the conveyor 2) and to control the mounting unit 4 to The one head unit 41 (or the second head unit 42) is moved to the component delivery position. Accordingly, the take-out device 6 and the first head unit 41 (or the second head unit 42) are arranged vertically at the component delivery position.

  During the movement until the take-out device 6 and the first head unit 41 (second head unit 42) are arranged at the component delivery position, the control device 110 rotates the first wafer head 6a and the second wafer head 6b, As a result, the bare chip adsorbed by each nozzle 6e is reversed (reversed to the face-down state), and then the two heads 41a or the second head unit 42 in which the first head unit 41 descends the bare chip. It is adsorbed by the two component mounting heads 42a lowered. As a result, the bare chip is delivered from the take-out device 6 to the first head unit 41 (second head unit 42).

  Next, the control device 110 moves the first head unit 41 above the fixed camera 9a (in the case of the second head unit 42, the fixed camera 9b), and images the bare chip adsorbed by each component mounting head on the fixed camera. In addition, the bare chip suction deviation with respect to each component mounting head is calculated based on the image data.

  Next, the control device 110 uses fiducial marks (not shown) attached to the printed circuit board P fixed to the conveyor 2 by the camera 41b (42b) of the first head unit 41 (second head unit 42). )). Thereby, the control apparatus 110 recognizes the position shift with respect to the conveyor 2 of the printed circuit board P. FIG.

  Then, the control device 110 moves the first head unit 41 (second head unit 42) to a corrected position above the printed circuit board P based on the bare chip suction displacement and the printed circuit board P positional displacement. Then, the bare chip is mounted on the printed circuit board P by lowering the component mounting head at a predetermined mounting position.

  When the above operation is repeated and mounting of all bare chips is completed, the control device 110 controls the conveyor 2 to release the fixing of the printed circuit board P. And the control apparatus 110 carries out the printed circuit board P out of the mounting machine main body 100 by controlling the conveyor 2. FIG.

  Next, with reference to FIGS. 12-16, the connection operation | movement of the mounting machine by this embodiment is demonstrated.

  First, as shown in FIGS. 12 and 13, the user moves the wafer storage device 200 in the connecting direction (Y1 direction) to fit into the connecting portion 1 a of the mounting machine body 100. At this time, the grounding portion 221a of the support mechanism 220 is separated from the floor surface F.

  When fitting, guide rollers 205 and 206 first run on the inclined surface (upper surface 14a) of the guide rail 14 and the inclined surface (upper surface 15a) of the guide rail 15, respectively. Then, when the user further moves the wafer storage device 200 in the connecting direction (Y1 direction), the guide rollers 205 and 206 ride on the horizontal plane (upper surface 14b) and the horizontal plane (upper surface 15b), respectively. In the state where the guide roller rides on the horizontal plane, as shown in FIG. 14, the guide roller is raised by the height of the inclined surface, so that the main body 202, the bottom plate 203 and the caster 204 to which the guide roller is attached are also raised. As a result, the casters 204 on the connecting direction (Y1 direction) side of the wafer storage device 200 are in a separated state. In this state, the caster 204 on the front side of the wafer storage device 200 remains in contact with the floor surface F.

  When the wafer storage device 200 is further moved in the connecting direction (Y1 direction), the contact portion 211a and the contact member 214 of the contact member 211 are respectively brought into contact with the protrusion portion 14c of the guide rail 14 and the protrusion portion 15c of the guide rail 15. The abutting portion 214a abuts. Thereby, it becomes impossible to move further in the connecting direction (Y1 direction). When there is an inclination in the left and right height directions when viewed from the front in this state, the height position of the guide roller 205 is adjusted by adjusting the height position of the moving block 209.

  Next, the second leg 222 and the first leg 221 are lowered by turning the handle 223 of the support mechanism 220. When the handle 223 is turned until it stops turning, the first leg 221 abuts against the floor surface F and the pair of casters 204 on the front side (separation direction side) are separated from the floor surface F as shown in FIGS. To do. Thereby, the front side portion of the wafer storage device 200 is supported by the support mechanism 220.

  In this state, the nut 225 is loosened and the first leg 221 is rotated with respect to the second leg 222 to adjust the protruding length of the first leg 221. Then, the nut 225 is tightened in a state in which the protruding length of the first leg portion 221 is adjusted so that the inclination of the wafer storage device 200 with respect to the mounting machine main body 100 in the front-rear direction is eliminated. As a result, the wafer storage device 200 is supported at the three points of the guide roller 205, the guide roller 206, and the support mechanism 220 in a state parallel to the mounting machine main body 100. In this state, as shown in FIG. 16, the four casters 204 are all separated from the floor surface F.

  After the adjustment is completed, the screw 213 is screwed and inserted into the screw hole 14d of the guide rail 14, and the screw 216 is screwed and inserted into the screw hole 15d of the guide rail 15. This prevents the wafer storage device 200 from moving in the separation direction. As a result, the connection between the wafer storage device 200 and the mounting machine main body 100 is completed, and in this state, the wafer W is transferred from the wafer storage device 200 to the mounting machine main body 100 such as delivery of the wafer W.

  In some cases, the wafer storage device 200 is once separated for maintenance of the mounting machine body 100 during the mounting operation of the mounting machine. In this case, first, the screw 213 is extracted from the screw hole 14 d of the guide rail 14, and the screw 216 is extracted from the screw hole 15 d of the guide rail 15. Then, by turning the handle 223, the support mechanism 220 is raised and the caster 204 is grounded to the floor surface F. Thereafter, the wafer storage device 200 is separated from the mounting machine main body 100 by moving the wafer storage device 200 in the separation direction (Y2 direction).

  Then, after the maintenance of the mounting machine body 100 is completed, the wafer storage device 200 is connected to the mounting machine body 100 again. In this case, the wafer storage device 200 is moved in the connecting direction (Y1 direction) until it cannot move in the connecting direction (Y1 direction), and then the handle 223 is rotated until it can no longer be rotated to lower the support mechanism 220. Let In this state, the protrusion length of the first leg portion 221 is the protrusion length adjusted first, so that the wafer storage device 200 and the mounting machine main body 100 are parallel to each other. That is, in the mounting machine of this embodiment, when the relative position between the wafer storage device 200 and the mounting machine main body 100 is adjusted at the first connection, the wafer storage device 200 is not adjusted at the second and subsequent connections. The relative position with respect to the mounting machine main body 100 can be made parallel to each other.

  In the present embodiment, as described above, the guide rollers 205 and 206 provided in the wafer storage device 200 are provided in the mounter main body 100 in a state where the mounting device main body 100 and the wafer storage device 200 are coupled. By mounting on the rails 14 and 15, the caster 204 on the mounting machine main body 100 side of the wafer storage device 200 is separated from the floor surface F, the guide rails 14 and 15 and the guide rollers 205 and 206 The relative positional relationship of the wafer storage device 200 with respect to the mounting machine main body 100 in the connected state can be determined without depending on the flatness of the floor surface F. Thus, by appropriately setting the positions of the guide rails 14 and 15 and the guide rollers 205 and 206, even when the flatness of the floor surface F is not good, the mounting machine main body 100 of the wafer storage device 200 in the connected state. The relative positional relationship with respect to can be prevented from deviating from parallel. For this reason, when the wafer W is transferred from the wafer storage device 200 to the mounting machine main body 100 side, it is possible to suppress the wafer W from being transferred while being inclined with respect to the mounting machine main body 100. As a result, it is possible to prevent the mounting machine body 100 and the wafer W from interfering during the transfer or the wafer W from being held in an appropriate posture in the mounting machine body 100.

  Further, since the wafer storage device 200 can be supported by the guide rails 14 and 15 and the guide rollers 205 and 206 at two points with respect to the mounting machine main body 100, the mounting device of the wafer storage device 200 in a connected state with higher accuracy. It is possible to suppress a relative positional relationship with respect to the main body 100 (particularly, left and right inclinations when viewed from the front) from deviating from parallel.

  Further, in the present embodiment, as described above, the guide rails 14 and 15 are provided in the mounting machine main body 100 and the guide rollers 205 and 206 are provided in the wafer storage device 200 so that they are fixedly installed and relatively large. Since the guide rails 14 and 15 that require a relatively large space are provided in the mounting machine main body 100 of a size, and the guide rollers 205 and 206 that require a relatively small space are provided in the relatively small wafer storage device 200 that moves, the wafer storage device 200. Unlike the case where guide rails are provided on the wafer storage device 200, the wafer storage device 200 can be prevented from becoming large. Further, by configuring the casters 204 of the wafer storage device 200 to be separated from the floor surface F, the mounting machine main body 100 and the wafer storage can be easily stored even when the flatness of the floor surface F with which the casters 204 contact is not good. The relative positional relationship with the device 200 can be kept parallel.

  Further, in the present embodiment, as described above, by providing the guide rollers 205 and 206 that can roll on the contact surfaces with the guide rails 14 and 15, the contact resistance between the guide rail and the guide member is reduced. Therefore, when the mounter body 100 and the wafer storage device 200 are connected or separated, the wafer storage device 200 can be smoothly moved while the guide rails 14 and 15 and the guide rollers 205 and 206 are in contact with each other. it can.

  Further, in the present embodiment, as described above, the support mechanism capable of supporting the wafer storage device 200 with respect to the floor surface F in a connected state on a portion of the wafer storage device 200 opposite to the mounting machine main body 100. By providing 220, the height position of the portion of the wafer storage device 200 opposite to the mounting device main body 100 can be adjusted by the support mechanism 220 in a state where the wafer storage device 200 and the mounting device main body 100 are connected. it can. Thereby, the relative positional relationship (especially the inclination of the front-back direction) with respect to the mounting machine main body 100 of the wafer storage apparatus 200 in a connected state can be determined without depending on the flatness degree of the floor surface F. Thereby, even when the flatness of the floor surface F is not good, it is possible to further suppress the relative positional relationship of the wafer storage apparatus 200 in the connected state with respect to the mounting machine main body 100 from deviating from parallel.

  In the present embodiment, as described above, when the wafer storage device 200 moves in the connecting direction toward the mounting machine main body 100, the portion of the wafer storage device 200 on the mounting machine main body 100 side is separated from the floor surface F. In this state, stoppers (a stopper made up of the protrusion 14c and the contact part 211a and a stopper made up of the protrusion 15c and the contact part 214a) are provided to restrict the movement of the wafer storage device 200 in the connecting direction. With this configuration, the user can move the wafer storage device 200 on the mounting machine main body 100 side away from the floor surface F only by moving the wafer storage device 200 in the connecting direction until it is stopped by the stopper and stops moving. However, the mounting machine main body 100 and the wafer storage device 200 can be connected. By appropriately setting the position of the stopper, it is possible to suppress the relative displacement of the wafer storage device 200 with respect to the mounting machine main body 100 in the connected state. In addition, since two stoppers are provided, the movement of the wafer storage device 200 relative to the mounting machine main body 100 can be restricted at two points. Thereby, it is possible to prevent the relative positional relationship of the wafer storage apparatus 200 in the connected state with respect to the mounting machine main body 100 (particularly, the shift in the planar rotational direction when viewed from above) from shifting from parallel.

  Further, in the present embodiment, as described above, the wafer storage device 200 is fitted in the state in which the wafer storage device 200 is connected to the base 1 of the mounting machine body 100, and the connection portion having a concave shape as viewed in a plan view. 1a is provided. With this configuration, a part of the wafer storage device 200 fits into the mounting machine main body 100 in the connected state, so that the overall size of the mounting machine in the connected state can be reduced. In addition, since the distance between the mounting machine main body 100 and the wafer storage device 200 in the connected state can be reduced, the wafer W can be smoothly transferred from the wafer storage device 200 to the mounting machine main body 100.

  In the present embodiment, as described above, the control unit 117 of the mounting machine main body 100 is stored in the second portion 1c constituting the side wall portions 13 on both sides of the concave connecting portion 1a, thereby storing the wafer. The control box 117 can be arranged by effectively using the space of the second portion 1c of the base 1 for fitting the device 200 therein.

  In the present embodiment, as described above, the guide rails 14 and 15 are fixed to the side wall portion 13 of the second portion 1c of the base 1 so that the guide rail is attached to the base 1 that is a strong member. Since it is provided, the strength of the guide rail for supporting the wafer storage device 200 during connection can be increased.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, an example in which a guide rail is provided in the mounting machine body 100 and a guide member is provided in the wafer storage device 200 has been described. However, the present invention is not limited thereto, and a guide member is provided in the mounting machine body 100. The guide rail may be provided in the wafer storage device 200. In this case, when the guide rail rides on the guide member of the mounting machine body, the part on the mounting machine body side of the wafer storage device is separated from the floor surface.

  Moreover, although the example which rolls on a guide rail with a wheel-shaped guide roller (rolling element) was shown in the said embodiment, this invention is not restricted to this, You may roll with a spherical rolling element. Further, if the friction between the guide rail and the guide member is small, the guide member need not be a rolling element.

  Moreover, although the example which provided the support mechanism 220 separately from the caster 204 was shown in the said embodiment, this invention is not limited to this, You may provide a height adjustment mechanism in the back caster itself.

  In the above-described embodiment, an example is shown in which only the front portion (portion direction side portion) of the wafer storage device 200 is mounted on the guide rail. However, the present invention is not limited to this. That is, not only the front part but also the rear part (front part) may be configured to ride on the guide rail. Thereby, it is not necessary to provide the support mechanism 220.

DESCRIPTION OF SYMBOLS 1 Base 1a Connection part 1b 1st part 1c 2nd part 4 Mounting part (mounting mechanism)
12 Front wall part 13 Side wall part 14, 15 Guide rail 14c, 15c Protruding part (stopper)
100 Mounting machine body (component supply device)
117 Control box 200 Wafer storage device 204 Caster (supporting part)
205, 206 Guide rollers (guide members, rolling elements)
211a, 214a Contact part (stopper)
220 Support mechanism P Printed circuit board (board)
W wafer

Claims (9)

A wafer storage device that stores a wafer including electronic components and is movable with respect to the floor, and a mounting mechanism that mounts the electronic components on a substrate is provided to supply the electronic components to the floor. And an electronic component transfer device comprising a component supply device capable of connecting the wafer storage device,
One of the component supply device and the wafer storage device is provided with a guide rail,
The other of the component supply device and the wafer storage device is provided with a guide member for moving the wafer storage device along the guide rail when the wafer storage device is connected to or separated from the component supply device. And
In a state where the component supply device and the wafer storage device are connected, one of the guide rail or the guide member provided in the wafer storage device is the guide rail or the guide member provided in the component supply device. The electronic component transport apparatus is configured such that a support portion of the wafer storage device with respect to the floor surface on the component supply device side is separated from the floor surface by riding on the other of the two. The support portion includes a caster that supports the wafer storage device with respect to the floor surface in a rollable manner,
The guide rail is provided in the component supply device,
The guide member is provided in the wafer storage device,
In a state where the component supply device and the wafer storage device are connected, the caster on the component supply device side of the wafer storage device is separated from the floor surface by the guide member riding on the upper surface of the guide rail. The electronic component transport apparatus according to claim 1, configured as described above.   The electronic component conveying apparatus according to claim 1, wherein the guide member includes a rolling element that rolls on a contact surface with the guide rail. The wafer storage device can be supported on the floor surface in a state where the component supply device and the wafer storage device are connected to a portion of the wafer storage device opposite to the component supply device. A support mechanism is provided,
The electronic component according to claim 1, wherein the support mechanism is configured to be able to adjust a height position of a portion of the wafer storage device opposite to the component supply device. Conveying device.   When at least one of the component supply device and the wafer storage device moves in the connecting direction toward the component supply device in order to connect the wafer storage device to the component supply device, The stopper which controls the movement to the said connection direction of the said wafer storage apparatus in the state which the part by the side of the said component supply apparatus of a wafer storage apparatus spaced apart from the floor surface is provided. The electronic component conveying apparatus according to the item. The component supply device includes a base,
The said base is provided with the connection part of concave shape seeing planarly in which the said wafer storage apparatus fits in the state in which the said wafer storage apparatus was connected. The electronic component conveying apparatus described in 1. The base includes a first portion constituting a front wall portion of the connecting portion, and a second portion constituting side wall portions on both sides of the connecting portion,
The electronic component transport apparatus according to claim 6, wherein an electrical component of the component supply device is accommodated in the second portion. The base includes a first portion constituting a front wall portion of the connecting portion, and a second portion constituting side wall portions on both sides of the connecting portion,
The electronic component transport device according to claim 6 or 7, wherein the guide rail or the guide member provided in the component supply device is fixed to a side wall portion of the second portion. A mounting mechanism for mounting electronic components on a substrate;
The mounting machine provided with the electronic component conveyance apparatus of any one of Claims 1-8 provided in order to supply the said electronic component to the said mounting mechanism.

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