CN102347262A - Electronic component conveying device and mounting machine - Google Patents

Electronic component conveying device and mounting machine Download PDF

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Publication number
CN102347262A
CN102347262A CN2011101865753A CN201110186575A CN102347262A CN 102347262 A CN102347262 A CN 102347262A CN 2011101865753 A CN2011101865753 A CN 2011101865753A CN 201110186575 A CN201110186575 A CN 201110186575A CN 102347262 A CN102347262 A CN 102347262A
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CN
China
Prior art keywords
wafer
accommodation device
wafer accommodation
supplying apparatus
guide rail
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Granted
Application number
CN2011101865753A
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Chinese (zh)
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CN102347262B (en
Inventor
小木曾武
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Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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Publication of CN102347262A publication Critical patent/CN102347262A/en
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Publication of CN102347262B publication Critical patent/CN102347262B/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides an electronic component conveying device and a mounting machine. The electronic component conveying device comprises a wafer holding device capable of moving relative to the ground; a component supply device arranged on the ground and capable of being connected with the wafer holding device; a guide rail arranged on one side of the component supply device and the wafer holding device; and a guide member arranged on the other side of the component supply device and the wafer holding device. The wafer holding device is guided along the guide rail when connected with the component supply device or separated from the component supply device. The wafer holding device moves along a specific direction so as to be connected with the component supply device or separated from the component supply device. The end of one side of the specific direction toward the component supply device is equipped with a support part for supporting the wafer holding device with respect to the ground. When the wafer holding device is connected with the component supply device, the support part of the wafer holding device is off the ground through the guide rail and the guide member.

Description

Electronic component carrying device and fitting machine
Technical field
The present invention relates to a kind ofly possess the wafer accommodation device that can move on the ground and be arranged on ground and can be linked to electronic component carrying device and the fitting machine that possesses this electronic component carrying device of the component supplying apparatus of said wafer accommodation device.
Background technology
All the time; Take in the liquid crystal panel and the transportation vehicle that can move on the ground and be arranged on ground and can be linked to the conveyance shifting apparatus of the liquid crystal panel manufacturing installation of said transportation vehicle as possessing, for example known have (Japan) spy to open the device that 2003-176021 communique (below be called patent documentation 1) is put down in writing.
A kind of structure that is used for transportation vehicle is linked to the liquid crystal panel manufacturing installation is disclosed in this patent documentation 1.The liquid crystal panel manufacturing installation that the document 1 is put down in writing possesses: the pair of guide rails that moves of guiding transportation vehicle when linking; And a pair of trepanning that is used to locate transportation vehicle.On the other hand, transportation vehicle possesses a pair of guide block in the position corresponding with said pair of guide rails, and is possessing a pair of alignment pin with the corresponding position of said a pair of trepanning.Promptly; When transportation vehicle and the binding of liquid crystal panel manufacturing installation; Along with transportation vehicle is moved to the liquid crystal panel manufacturing installation; The a pair of guide block of transportation vehicle is directed along the pair of guide rails of liquid crystal panel manufacturing installation; When transportation vehicle was moved, a pair of trepanning that a pair of alignment pin of transportation vehicle inserts the liquid crystal panel manufacturing installation linked to accomplish.And the position relation of transportation vehicle under the connecting state and liquid crystal panel manufacturing installation is confirmed by said trepanning and said alignment pin.In addition, the conveyance shifting apparatus that this patent documentation 1 is put down in writing is to make that alignment pin also can insert trepanning under the good inadequately situation of the smooth degree on ground, considers that the size that makes trepanning has (play) more than needed with respect to alignment pin.
On the other hand,, possess with respect to ground wafer accommodation device and be arranged on ground and can be linked to the electronic component carrying device of component supplying apparatus of said wafer accommodation device known movably all the time.In this electronic component carrying device, be linked at the wafer accommodation device under the state of component supplying apparatus, wafer be transplanted on component supplying apparatus from the wafer accommodation device.Wafer remains under the state of posture of appointment in component supplying apparatus, to being used for the installing mechanism that electronic component is installed on the substrate is supplied with the electronic component that constitutes said wafer.
In addition, for this electronic component carrying device, construct as the binding of wafer accommodation device and component supplying apparatus structure also can be considered to be suitable for as patent documentation 1 is put down in writing the transportation vehicle and the binding of liquid crystal panel manufacturing installation.But; In the binding structure that patent documentation 1 is put down in writing; Owing to make the size of the trepanning of the position relation of confirming transportation vehicle and liquid crystal panel manufacturing installation have (play) more than needed with respect to alignment pin; Therefore under the good inadequately situation of the smooth degree on ground, be in the relative position relation parallel deviate sometimes of transportation vehicle and the liquid crystal panel manufacturing installation of connecting state.Therefore, the binding this patent documentation 1 put down in writing structure also can produce same problem when being applicable to existing electronic component carrying device.Promptly; Under the good inadequately situation of the smooth degree on ground; The relative position relation parallel deviate of wafer accommodation device and component supplying apparatus, when from the wafer accommodation device when the component supplying apparatus sidesway send wafer, wafer the state that tilts with respect to component supplying apparatus down quilt transferred.In this case, have that component supplying apparatus and wafer interfere in the handover process, or in component supplying apparatus, can not keep the problem of wafer with correct posture.
Summary of the invention
Even the object of the present invention is to provide a kind ofly under the good inadequately situation of the smooth degree on ground, also can under connecting state, keep the electronic component carrying device and the fitting machine of the relative position relation of wafer accommodation device and component supplying apparatus more abreast.
One aspect of the present invention, an electronic component conveyance apparatus comprising: wafer holding means, including electronic components housed wafer and movable relative to the ground; component supply unit, provided in the ground and can be linked to the wafer housing means; guide rails disposed in the component supply means and said wafer holding means into an upper; and a guide member provided in the component supply means and said wafer holding means out of the other, the said wafer holding means relative to said component supply device is connected or separated is guided along the guide rail, wherein said wafer holding means, through the phase to said component supply unit in a particular direction relative to the component link or separate supply means, and in the specific direction toward the component supply unit with the one end portion may be supported with respect to said ground storage device of the wafer support portion, said guide rail and the guide member in said crystal circular storage device is coupled to the component supply device state, the storage means of said wafer away from said portion of said supporting surface.
Description of drawings
Fig. 1 is the integrally-built front view of the fitting machine (state that does not link the wafer accommodation device) of expression an embodiment of the invention.
Fig. 2 is the vertical view of overall structure (state that does not link the wafer accommodation device) of the fitting machine of expression an embodiment of the invention.
Fig. 3 is the integrally-built front view of the fitting machine (state that links the wafer accommodation device) of expression an embodiment of the invention.
Fig. 4 is the vertical view of the overall structure (state that links the wafer accommodation device) of the fitting machine of expression an embodiment of the invention.
Fig. 5 is the stereogram of the primary structure key element of the summary fitting machine of representing an embodiment of the invention.
Fig. 6 is the stereogram that expression is arranged on the guide rail on the base station of fitting machine of an embodiment of the invention.
Fig. 7 is the stereogram of wafer accommodation device of the fitting machine of expression an embodiment of the invention.
Fig. 8 is the stereogram of sidepiece of wafer accommodation device of the fitting machine of expression an embodiment of the invention.
Fig. 9 is the cutaway view of supporting device of wafer accommodation device of the fitting machine of expression an embodiment of the invention.
Figure 10 is the block diagram of control system of the fitting machine of expression an embodiment of the invention.
Figure 11 is the inner cutaway view of base station of the fitting machine of expression an embodiment of the invention.
Figure 12 is the upward view of binding action (before linking) of wafer accommodation device that is used to illustrate the fitting machine of an embodiment of the invention.
Figure 13 is binding action (before linking) and the phantom observed from the side of wafer accommodation device that is used to illustrate the fitting machine of an embodiment of the invention.
Figure 14 is binding action (binding process) and the phantom observed from the side of wafer accommodation device that is used for illustrating the fitting machine of an embodiment of the invention.
Figure 15 is the upward view of binding action (linking the back) of wafer accommodation device that is used to illustrate the fitting machine of an embodiment of the invention.
Figure 16 is binding action (linking the back) and the phantom observed from the side of wafer accommodation device that is used to illustrate the fitting machine of an embodiment of the invention.
Embodiment
Below referring to figs. 1 through Figure 11, the structure of the fitting machine of an embodiment of the invention is described.In addition, for the specific direction relation, the XYZ rectangular axes are shown aptly in the drawings.X-direction is the direction parallel with horizontal plane, Y direction be on horizontal plane with the direction of X-direction quadrature, Z-direction be respectively with the direction of X-axis and Y-axis quadrature.
Fitting machine is so-called compound fitting machine, and it can be from taking out bare chip and (assembling) is installed to printed circuit board (PCB) P through the wafer W of crystal grain cutting, and will be installed on the printed circuit board (PCB) P by the potted element of component supplying apparatus 300 supplies etc.
To shown in Figure 4, fitting machine comprises the fitting machine main body 100 that fixedly installs with respect to ground F and is removable and can be linked to wafer (wafer) accommodation device 200 of fitting machine main body 100 with respect to ground F like Fig. 1.In addition, fitting machine main body 100 (stating installation portion 4 after removing) is an example of " component supplying apparatus " of the present invention, and wafer accommodation device 200 is an example of " electronic component carrying device " of the present invention with fitting machine main body 100 (stating installation portion 4 after removing).
To shown in Figure 4, this fitting machine main body 100 comprises: base station 1 like Fig. 1; Be used for printed circuit board (PCB) P is moved into or takes out of the conveyer belt 2 of the installation exercise position of appointment; And the chip component supply unit 3 that is used to supply with chip component.In addition, like Fig. 1, Fig. 3 and shown in Figure 5, fitting machine main body 100 comprises: installation portion 4 is used for installation elements on printed circuit board (PCB) P (bare chip or chip component); Wafer keeps workbench 5, the wafer W that supporting is extracted out from wafer accommodation device 200; Withdrawing device 6 takes out bare chip and is delivered to installation portion 4 from the wafer W that is kept workbench 5 supportings by wafer; Pushing-up device 7 pushes away this bare chip from the below when utilizing withdrawing device 6 to take out bare chips; And the movable camera 8 of position of components identification usefulness, take this bare chip before in the taking-up action that utilizes withdrawing device 6 to carry out bare chip.In addition, bare chip is an example of " electronic component " of the present invention.
Base station 1 for example is made up of metal firm parts, and supporting conveyor 2, chip component supply unit 3, installation portion 4, wafer keep workbench 5 etc.Base station 1 fixedly installs with respect to ground F through a plurality of legs 11.In addition; As depicted in figs. 1 and 2; Base station 1 mainly have the 1b of first and respectively from the two ends (directions X two ends) of the 1b of this first to the outstanding second portion of the nearly body side (downside of Fig. 2) of fitting machine main body 100 to 1c; In view of the above, base station 1 possesses the linking part 1a that the observation overlooked is concavity at its nearly body side central portion.Fitting machine main body 100 can be fixed this wafer accommodation device 200 under the state of the said linking part 1a that wafer accommodation device 200 is embedded base station 1 along Y direction (being equivalent to specific direction of the present invention).Below, the moving direction (Y1 direction) of the wafer accommodation device 200 during with binding is called link direction, and the moving direction (Y2 direction) of the wafer accommodation device 200 during with separation is called detaching direction.
Overlook and observe the linking part 1a be concavity and have from wafer accommodation device 200 directions and observe front wall portion 12 relative and relative with the two sides of wafer accommodation device 200 respectively pair of sidewalls portion 13 with the front.
In addition, in pair of sidewalls portion 13, be respectively arranged with guide rail 14 and guide rail 15.Guide rail 14 is linked at wafer accommodation device 200 under the state of fitting machine main body 100 with guide rail 15, the part of the front side (fitting machine main body 100 sides) of supporting wafer accommodation device 200.
Like Fig. 1 and shown in Figure 6, guide rail 14 is from the outstanding to the inside block parts of side wall portion 13.Guide rail 14 extends to form along the Y direction.Among the upper surface of guide rail 14; The upper surface 14a of the part of nearly body side (detaching direction (the Y2 direction of Fig. 6) side) is the inclined plane that raises along with trend link direction (the Y1 direction of Fig. 6), and the upper surface 14b of the part of rear side (link direction (Y1 direction) side) is a horizontal plane.In addition, guide rail 14 comprises the jut 14c as the stopper of giving prominence to from its lower surface downwards.In addition, be provided with screw 14d in the side of the nearly body side (Y2 direction side) of guide rail 14.Likewise, the size of guide rail 15 and position etc. form with guide rail 14 accordingly, have the upper surface 15a of inclined plane formation, upper surface 15, jut 15c and the screw 15d that horizontal plane constitutes.
Conveyer belt 2 comprises: conveyer belt main body of extending along the directions X of conveyance printed circuit board (PCB) P and lifting printed circuit board (PCB) P and to the not shown detent mechanism of its location on this conveyer belt main body.Conveyer belt 2 from the right side of Fig. 1 to Fig. 4 to the left with flat-hand position conveyance printed circuit board (PCB) P on directions X almost, with the installation exercise position of printed circuit board (PCB) P positioning and fixing in appointment.In this execution mode, will be on the conveyance path of conveyer belt 2 and the position (position of the printed circuit board (PCB) P of Fig. 2 and Fig. 4) that on directions X, separates appointed interval be made as the installation exercise position respectively.In addition, in following explanation, the position of the conveyance direction upstream side of printed circuit board (PCB) P among the installation exercise position is called the first job position S1, the position in downstream is called the second job position S2.
Chip component supply unit 3 is arranged on the two ends of the nearly body side of fitting machine main body 100.Chip component supply unit 3 is used to supply with chip components such as transistor, resistance, capacitor and is provided with.In chip component supply unit 3, for example arrange component supplying apparatus 300 such as belt feeder is set along conveyer belt 2.Each belt feeder comprises: be wound with the spool with the band of chip components such as appointed interval maintenance transistor; The holding member that keeps spool; And extract band out and chip component passed out to the element delivering mechanism etc. of the component feeding position of belt feeder front end from spool.Belt feeder carries out the action of seeing off of chip component with 100 interlocks of fitting machine main body under the state that is installed on chip component supply unit 3.That is, the installation portion 4 that makes fitting machine main body 100 is the pick-up chip element in the component feeding position, and is accompanied by this and picks up next chip component is passed out to the component feeding position.In addition, replace belt feeder, chip component supply unit 3 also can be provided with and carry the pallet (not shown) of putting large-scale potted elements such as semiconductor packages.In this case, directly pick up potted element through installation portion 4 from this pallet.
Installation portion 4 is that bare chip or chip component are installed to the device on the printed circuit board (PCB) P, the driver element that is included on the top position of conveyer belt 2 respectively on (XY direction) in the horizontal direction two head units movably (being called first head unit 41, second head unit 42) and drives them respectively.In addition, installation portion 4 is examples of " installing mechanism " of the present invention.
First head unit 41 mainly also only can move in this zone as movable area with the upstream side zone that comprises the first job position S1 on the base station 1; On the other hand, second head unit 42 mainly also only can move in this zone as movable area with the zone, downstream that comprises the second job position S2 on the base station 1.These first head units 41 and second head unit 42 have following structure (structure of second head unit 42 is in parenthetic explanation).
As depicted in figs. 1 and 2, first head unit 41 (second head unit 42) possesses two elements on X-direction, arranging and installs with a head 41a and a video camera 41b (two elements installations are with head 42a and a video camera 42b).
First head unit 41 (second head unit 42) is installed the chip component of being supplied with by component supplying apparatus 300 (belt feeder) with head 41a (42a) absorption through these elements and is installed on the printed circuit board (PCB) P, and adsorbs the bare chip that from wafer W, is taken out by withdrawing device 6 with head 41a (42a) and be installed on the printed circuit board (PCB) P through the element installation.In view of the above, chip component such as transistor, capacitor and bare chip (bare chip) the two be installed on the printed circuit board (PCB) P.In addition, first head unit 41 (second head unit 42) utilizes the benchmark sign (not shown) that has on video camera 41b (42b) the shooting printed circuit board (PCB) P before printed circuit board (PCB) P installation elements.This picture signal is stated control device 110 outputs backward from video camera 41b (42b), based on the position deviation of this image recognition printed circuit board (PCB) P, enforcing location drift correction when mounted.
First head unit 41 and 42 driver element comprise: support unit 43 and 44, support first head unit 41 and second head unit 42 respectively movably on directions X; Fixed guide 45 and 46 is arranged at the end face 100a of fitting machine main body 100 and on the Y direction, supports support unit 43 and 44 independently movably; Be used to make first head unit 41 and second head unit 42 with respect to support unit 43 and 44 travel mechanism (not shown) that mobile linear motor constitutes on directions X; And be used to make support unit 43 and 44 respectively along fixed guide 45 and 46 travel mechanism (not shown) that mobile linear motor constitutes on the Y direction independently.
In addition, like Fig. 2 and shown in Figure 4, be provided with fixed cameras 9a and the 9b that component recognition is used on the base station 1 and in the movable area separately of first head unit 41 and second head unit 42.Fixed cameras 9a and 9b are for example for possessing the video camera of capturing elements such as CCD, CMOS.Fixed cameras 9a and 9b take to install with the element of the head 41a and second head unit 42 through the element of first head unit 41 from downside the element that adsorbs with head 42a are installed, and the control device of stating after its picture signal outputed to 110.
Wafer accommodation device 200 is like Fig. 4 and many pieces of wafer W that accommodate through the crystal grain cutting shown in Figure 7.This wafer accommodation device 200 comprises: the shelf 201 of accommodating the roughly circular carriage Wh that keeps wafer W with multilayer up and down; The main body 202 that liftably keeps the case shape of shelf 201; The base plate 203 of support body 202; And be installed in four castors 204 on the base plate 203.In main body 202, be provided with the driver elements such as motor that go up and down to drive shelf 201.Wafer accommodation device 200 is arranged on the wafer W of hope through up-down shelf 201 the discrepancy height and position of the appointment that can come in and go out with respect to wafer maintenance workbench 5.
Each bare chip that is housed in each the wafer W in the wafer accommodation device 200 sticks on the film like wafer thin slice with (face up) state that faces up (circuit forms the state that face (with respect to the installed surface of printed circuit board (PCB) P) makes progress), is kept by carriage Wh via this wafer thin slice.
In addition, castor 204 is installed a pair of respectively in the end of the link direction side of wafer accommodation device 200 and the end of detaching direction side.In view of the above, wafer accommodation device 200 is supported on ground F movably through 4.
In addition; In this execution mode; Like Fig. 7 and shown in Figure 8; At the sidepiece of the side on the directions X of main body 202 and near the end of link direction (Y1 direction) side, be provided with the deflector roll 205 of the wheel shape corresponding, at the sidepiece of the opposite side on the directions X of main body 202 and near the end of link direction (Y1 direction) side, be provided with the deflector roll 206 of the wheel shape corresponding with guide rail 15 with guide rail 14. Deflector roll 205 and 206 is rotatably installed around the axle parallel with directions X respectively with respect to fixed block of giving prominence to laterally from the sidepiece of main body 202 207 and 208 side.These deflector rolls 205 and 206 ride over respectively on guide rail 14 and 15 making wafer accommodation device 200 when link direction (Y1 direction) moves.In view of the above; Wafer accommodation device 200 with the connecting state of fitting machine main body 100 under; The part of the link direction of wafer accommodation device 200 (Y1 direction) side is supported on pair of guide rails 14 and 15 via a pair of deflector roll 205 and 206, and a pair of castor 204 built on stilts F of the link direction of wafer accommodation device 200 (Y1 direction) side.In addition, deflector roll 205 and 206 is examples of " guide member " of the present invention and " rotor ".
Said deflector roll 206 is directly installed on the fixed block 208, and on the other hand, deflector roll 205 is installed in respect to fixed block 207 and can goes up on the moveable block 209 that moves at above-below direction (Z direction).This moveable block 209 forms the L word shape of the side of the upper surface that covers fixed block 207 and X1 direction side.Be formed with a pair of slotted hole 209a that extends along the vertical direction in the side of moveable block 209, be formed with screw (not shown) in the side of the X1 of fixed block 207 direction side.And bolt 210 inserts said slotted hole 209a from the outside of moveable block 209, and screws togather in the said screw that inserts fixed block 207 along with this bolt 210, and is through this bolt 210 that said moveable block 209 is fastening with fixed block 207.Moveable block 209 can slotted hole 209a length exceed and move up at upper and lower.Like this, among a pair of deflector roll 205 and 206, a deflector roll 205 can be regulated height and position with respect to another deflector roll 206.
In addition, like Fig. 2, Fig. 7 and shown in Figure 8, the sidepiece of the side on the directions X of main body 202 and be provided with outstanding laterally flat butt parts 211 in the position of the nearly body side (detaching direction (Y2 direction) side) of deflector roll 205.Butt parts 211 have by the end face formation of its link direction (Y1 direction) side and overlook and observe the abutting part 211a that is along the linearity (with reference to Fig. 2) of directions X extension.Under the state of the upper surface 14b that link direction (Y1 direction) moves, deflector roll 205 rides over guide rail 14, the jut 14c (with reference to Fig. 1, Fig. 6) that is connected to guide rail 14 further moves to link direction (Y1 direction) with restriction wafer accommodation device 200 this abutting part 211a at wafer accommodation device 200.In addition, the jut 14c of guide rail 14 and abutting part 211a are examples of " stopper " of the present invention.
In addition, as shown in Figure 8, on butt parts 211, be fixed with plate member 212.On this plate member 212, form bolt-inserting hole, inserting bolt 213 rotatably in this bolt-inserting hole.This bolt-inserting hole and bolt 213 are set to when linking and the screw 14d of guide rail 14 coincide.
In addition, like Fig. 2 and shown in Figure 7, the sidepiece of the opposite side on the directions X of main body 202 and be provided with outstanding laterally flat butt parts 214 in the position of the nearly body side (detaching direction (Y2 direction) side) of deflector roll 206.Butt parts 214 have by the end face formation of its link direction (Y1 direction) side and overlook and observe the abutting part 214a that is concavity (nick shaped).Under the state of the upper surface 15b that link direction (Y1 direction) moves, deflector roll 206 rides over guide rail 15, the jut 15c (with reference to Fig. 1) that the sunk part of said concavity (nick shaped) is connected to guide rail 15 further moves to link direction (Y1 direction) with restriction wafer accommodation device 200 this abutting part 214a at wafer accommodation device 200.In addition, the jut 15c of guide rail 15 and abutting part 214a are examples of " stopper " of the present invention.
In addition, shown in the line E of Fig. 2, the position of the Y direction of the sunk part of the said recess shapes (nick shaped) of abutting part 214a equates with the position of the Y direction of the abutting part 211a of butt parts 211.In addition, the jut 14c of guide rail 14 also equates with the position of the Y direction of the jut 15c of guide rail 15.In view of the above, be connected to respectively at abutting part 211a and abutting part 214a under the state of jut 15c of jut 14c and guide rail 15 of guide rail 14, wafer accommodation device 200 obtains restriction with respect to the departing from of direction of rotation of overlooking of fitting machine main body 100.
In addition, the gap width of butt parts 214 (width D of directions X shown in Figure 2) is the diameter size about equally with the jut 15c of guide rail 5.In view of the above, under connecting state, wafer accommodation device 200 was inhibited with respect to move (the departing from) of fitting machine main body 100 on horizontal (directions X).
In addition, on butt parts 214, be fixed with plate member 215.On plate member 215, form bolt-inserting hole, inserting bolt 216 rotatably in this bolt-inserting hole.This bolt-inserting hole and bolt 216 are set to when linking and the screw 15d of guide rail 15 coincide.Just; When linking; The bolt 213 of plate member 212 is screwed togather the screw 14d that inserts guide rail 14 and passes through this bolt 213 binding parts 212 and guide rails 14; And the said bolt 216 of plate member 215 is screwed togather the screw 15d of insertion guide rail 15 and passes through this bolt 216 binding parts 215 and guide rails 15, thereby wafer accommodation device 200 and fitting machine main body 100 can be interfixed under the maintenance connecting state.
In addition, as shown in Figure 7, be provided with the supporting device 220 that is different from castor 204 and can supports wafer accommodation device 200 with respect to ground F at the rear side (detaching direction (Y2 direction) side) of wafer accommodation device 200.Supporting device 220 is provided with one at the central portion of directions X.Supporting device 220 under connecting state (thereby deflector roll 205 and 206 rides over the state of the castor built on stilts F of the link direction side that makes wafer accommodation device 200 on guide rail 14 and 15), the height and position of the rear section of scalable wafer accommodation device 200.
Particularly, like Fig. 7 and shown in Figure 9, supporting device 220 comprises: first shank 221 comprises the grounding parts 221a that is contacted with ground F; Second shank 222 is linked to first shank 221; Handle 223 is used for the user and makes 222 rotations of second shank; And framework 224, be fixed in the bottom 202a of main body 202 and support second shank 222.
Second shank, 222 one comprise the top 222a that inserts framework 224, the 222b of body portion that is positioned at framework 224 and the bottom 222c that gives prominence to the more below of the bottom of main body 202 202a.Top 222a is fixed in handle 223, and the rotation through handle 223 makes the 222 whole rotations of second shank.In addition, be formed with pin thread, and 224a is formed with the corresponding negative thread of pin thread with the top 222a of second shank 222 on the top of framework 224 at the outer surface of the top 222a of second shank 222.In view of the above, the user passes through rotating handles 223, thereby can make second shank, 222 integral body go up at above-below direction (Z direction) with respect to framework 224.In addition, when making the direction rotating handles 223 of second shank, 222 declines, because the lower surface of the 222b of body portion of second shank 222 is connected to the upper surface of the bottom 224b of framework 224, handle 223 (second shank 222) can not rotate again.Therefore, the user can reproduce the lower position of second shank 222 easily.
In addition, form negative thread at the bottom 222c of second shank 222, and at the outer surface formation of first shank 221 and the corresponding pin thread of negative thread of the bottom 222c of second shank 222.In view of the above, the user can make first shank 221 go up and down on above-below direction with respect to the bottom 222c of second shank 222 through rotation first shank 221.In addition, on the pin thread of first shank 221, screwed togather nut 225.Through nut 225 being tightened against second shank, 222 sides, prevent of the bottom 222c rotation of first shank 221 with respect to second shank 222.In view of the above, under the state of unscrewing nut 225, scalable first shank 221 is with respect to the outstanding length of the bottom 222c of second shank 222, and after adjusting through fastening nut 225, the outstanding length of first shank 221 can be fixed in the length of adjusting.
In addition, as shown in Figure 7, be provided with pluggable pin 226 towards the 222b of body portion in the nearly body side of the 222b of body portion of second shank 222.Pin 226 is installed on the pin support unit 227 of the bottom 224b that is fixed on framework 224.And the 222b of body portion of second shank 222 is provided with pin insertion hole 222d.Be positioned at second shank 222 under the state of lower position,, can prevent the rotation (rotation of handle 223) of second shank 222 through selling the 226 pin insertion hole 222d that insert the body 222b of portion.In addition, extract from pin insertion hole 222d under the state of pin 226,, second shank 222 is risen with first shank 221 through rotating handles 223.
In addition, as depicted in figs. 1 and 2, wafer keeps workbench 5 to possess the 5a of discrepancy mechanism of wafer W.Workbench 5 is removable on (Y direction) in front and back, front end possesses the arm that carriage holds the 5b of mechanism in order to keep with respect to wafer for the 5a of this discrepancy mechanism.The 5a of mechanism that comes in and goes out keeps workbench 5 to be arranged under the state of wafer receiving position (position of body side (Y2 direction side) recently) at wafer; The shelf 201 interior wafer W (carriage Wh) that are arranged on the height and position of coming in and going out can be retracted to wafer from wafer accommodation device 200 and keep on the workbench 5, and after taking out and wafer element is installed, keep the carriage Wh on the workbench 5 to accommodate (putting back to) in shelf 201 wafer.
Wafer keeps workbench 5 to have circular open portion at central portion, can keep carriage Wh with the overlapping mode of peristome of the peristome of the carriage Wh that keeps wafer W and wafer maintenance workbench 5.In view of the above, on wafer keeps workbench 5, maintain under the state of wafer W (carriage Wh), can from below that wafer keeps workbench 5 through after the pushing-up device 7 stated push away bare chip.
Wafer keeps workbench 5 to take out the job position (position of inboard (Y1 direction side) at element; With reference to Fig. 2) and be linked between near the wafer receiving position the wafer accommodation device 200 of said linking part 1a, can on base station 1, move along the Y direction.Particularly, wafer keeps workbench 5 to be extended a pair of fixed guide 51 that is provided with in base station 1 upper edge Y direction supporting movably, and the driver element through appointment moves along fixed guide 51.Driver element comprises the ball-screw 52 that extends in parallel and screw togather the nut portion of inserting wafer maintenance workbench 5 with fixed guide 51; And the drive motor 53 that is used to rotate driving ball-screw 52.In addition, as shown in Figure 1, wafer keeps the lower position of workbench 5 through conveyer belt 2, takes out between job position and the wafer receiving position at element and moves.
Pushing-up device 7 is arranged on wafer that element takes out job position and keeps among the wafer W on the workbench 5 as the bare chip that takes out object this bare chip being peeled off and lifting from the wafer thin slice through pushing away from downside.
As shown in Figure 5, this pushing-up device 7 comprises: on the portion 71 of cutting somebody's hair, possess the built-in respectively upper push-rod (being called the first upper push-rod 71a, the second upper push-rod 71b) of going up a pair of path of promoting (not shown); Fixed guide 72 supports the portion 71 of cutting somebody's hair movably at base station 1 upper edge directions X; And driver element, be used to make the portion of cutting somebody's hair 71 to move along fixed guide 72.This driver element comprises: extend in parallel and screw togather the outer ball-screw of figure of the portion of cutting somebody's hair in the insertion 71 with fixed guide 72; And be used to rotate drive this ball-screw on the portion's drive motor (not shown) of cutting somebody's hair.Thus, pushing-up device 7 is removable on directions X, can keep the wafer W on the workbench 5 at the wafer that moves on the Y direction for only being bearing in, on cut somebody's hair portion 71 can on push away bare chip arbitrarily.
On the cut somebody's hair first upper push-rod 71a and the second upper push-rod 71b of portion 71 extend along the vertical direction, go up and down to drive respectively through not shown actuator (cylinder etc.).Promptly; Keep the peristome inboard of workbench 5 to dispose under the state of these the first upper push-rod 71a or the second upper push-rod 71b at wafer; The first upper push-rod 71a or the second upper push-rod 71b are urged to almost and wafer thin slice downside position contacting by rising; After the directions X position of the bare chip that is positioned thereafter to hope, last distribution drives to the top by drive motor (not shown) thereby from the first upper push-rod 71a or the second upper push-rod 71b and pushes away bare chip.In addition, the first upper push-rod 71a and the second upper push-rod 71b can according to as on push away the element of object size wait and change the thickness promoted etc.For example, the distribution of going up that diameter is differed from one another is installed on the first upper push-rod 71a and the second upper push-rod 71b, thereby can use the first upper push-rod 71a or the second upper push-rod 71b according to the differentiations such as size of element.
The first upper push-rod 71a and the second upper push-rod 71b can be urged to the height and position of two retainings by up-down.Promptly; When making wafer keep moving between near the wafer receiving position of workbench 5 element takes out job position and wafer accommodation device 200; Can be used to avoid with wafer keep workbench 5 interference lower position and keep workbench 5 to be positioned under the state that element takes out job position at wafer; In the peristome inboard of carriage Wh, push away near the lower surface of wafer W between the position of readiness to go up and down to drive, last distribution can the position that is built in the first upper push-rod 71a that is in position of readiness or the second upper push-rod 71b and the upper surface that keeps workbench 5 at wafer more above element on up-down driving between the push position.
Withdrawing device 6 adsorbs through the bare chip that pushes away on the pushing-up device 7 and consigns to first head unit 41 and second head unit 42.
This withdrawing device 6 moves on (XY direction) in the top position that element takes out job position through the driver element of appointment in the horizontal direction.This driver element has following structure.
That is, taking out job position at element is provided with: at a pair of overhead fixed guide 61 that separates the appointed interval setting on the X-direction and on Y direction, extend parallel to each other; The frame parts 62 that two ends are bearing in movably respectively on the fixed guide 61 and extend along X-direction; Be arranged on a pair of ball screw 63 that extends and screw togather respectively the nut part (diagram is omitted) that inserts frame parts 62 two ends near the position of fixed guide 61 and along Y direction; And rotation drives the pair of frames drive motor 64 of ball screw 63.
Second guide rail (diagram is omitted) that frame parts 62 is provided with first guide rail (diagram is omitted) that is fixed on its nearly body side and extends along X-direction and is fixed on its rear side and extends along X-direction.On first guide rail, support withdrawing device 6 movably, on second guide rail, support video camera 8 movably.And, possess in the frame parts 62: the ball screw (diagram is omitted) that extends and screw togather the nut part (diagram is omitted) that inserts withdrawing device 6 along X-direction; Rotation drives the drive motor 65 of this ball screw; Extend and screw togather the ball screw (diagram is omitted) of the nut part (diagram is omitted) that inserts video camera 8 along X-direction; And rotation drives the drive motor 66 of this ball screw.That is, through each framework drive motor 64 that turns round frame parts 62 is moved along fixed guide 61, mobile withdrawing device 6 and the video camera 8 of making that is accompanied by this frame parts 62 moves on Y direction integratedly.
In addition, at the nearly body side position of the Y of frame parts 62 direction withdrawing device 6 is moved on directions X, and in the Y of frame parts 62 direction rearward position video camera 8 is moved on directions X through running drive motor 66 through running drive motor 65.Withdrawing device 6 can be distinguished independently in the horizontal direction on (XY direction) mobile with video camera 8 in the top position that element takes out job position in view of the above.
Withdrawing device 6 partly repeats at the movable area on the XY direction and first head unit 41 and the movable area of second head unit 42 on the XY direction.In view of the above, as described in the back, can realize paying bare chip to first head unit 41 and second head unit 42 from withdrawing device 6.In addition, as shown in Figure 1, withdrawing device 6, video camera 8 and above-mentioned their driver element are positioned at the below of first head unit 41 and second head unit 42 and their driver element.Therefore, though each movable area of movable area such as withdrawing device 6 and first head unit 41 and second head unit 42 as described above part repeat, withdrawing device 6 can not interfered with first head unit 41 and second head unit 42 each other.
Withdrawing device 6 possesses a pair of wafer head (being called the first wafer head 6a, the second wafer head 6b).
As shown in Figure 5, the drum type head of a pair of nozzle 6e that extends below on being respectively and possessing of the first wafer head 6a and the second wafer head 6b.In detail; The frame parts 6c of withdrawing device 6 be provided with on directions X with appointed interval arrange and driving through the drive motor outside the figure respectively with respect to liftable two the bracket component 6d of this frame parts 6c; Be provided with the said first wafer head 6a and the second wafer head 6b in the inboard of these bracket components 6d, and this first wafer head 6a can center on spool state lower support that rotate parallel with directions X in each bracket component 6d respectively with the second wafer head 6b.
Each a pair of nozzle 6e of the first wafer head 6a and the second wafer head 6b is arranged on up and down diametical position, its be set to a nozzle 6e towards under the time another nozzle 6e towards directly over.And the drive motor 6f rotation in the outside through being separately positioned on two stands parts 6d drives the first wafer head 6a and the second wafer head 6b (that is, inversion driving) up and down, and the position of said a pair of nozzle 6e is changed alternately.And through the driving of not shown said drive motor, bracket component 6d goes up and down with respect to frame parts 6c, comprises the first wafer head 6a integral elevating of nozzle 6e.The second wafer head 6b too.
In addition, the interval (interval of X-direction) between the nozzle 6e of the first wafer head 6a and the second wafer head 6b and the element that is equipped on first head unit 41 are installed with the interval of head 41a and are equipped on the be spaced apart same intervals of the element installation of second head unit 42 with head 42a.In view of the above, can install with two bare chips of head 42a payment with two elements of the head 41a or second head unit 42 two elements installations of first head unit 41 from two wafer heads (the first wafer head 6a and the second wafer head 6b) simultaneously.
Video camera 8 is for example for possessing the video camera of capturing elements such as CCD, CMOS.Video camera 8 was taken as the bare chip that takes out object before from wafer W, taking out bare chip, and its picture signal is outputed to control device 110.In addition, withdrawing device 6 is when craniad element is paid in the unit, and withdrawing device 6 moves to the position near conveyer belt 2.
Figure 10 is with the control system of this fitting machine main body 100 of block representation.As shown in figure 10, this fitting machine main body 100 possesses the control device 110 that CPU, various memory, HDD etc. constitute.Be electrically connected with (each up-down that comprises drive motor 53, framework drive motor 64, drive motor 65, drive motor 66, drive motor 6f, other drive motors and upper push-rod 71a, 71b drives solenoid with the control valve in the air circuit of cylinder), video camera 8, fixed cameras 9a, 9b etc. such as each above-mentioned drive motor on this control device 110 respectively, pass through the action of control device 110 each one of Comprehensive Control in view of the above.In addition, be electrically connected with the outer input unit of figure on this control device 110, the operator imports various information based on the operation of this input unit, and also imports the output signal that comes from the position detecting units such as encoder outside the figure that is built in each drive motor.In addition, wafer accommodation device 200 is electrically connected through cable 200a with control device 110 under connecting state, and the motor etc. of shelf 201 that is used to go up and down wafer accommodation device 200 is also through control device 110 controls.
Functional imperative as this control device 110 comprises: axle control part 111, the driving of above-mentioned each drive motor of control, the driving solenoid of each control valve; Image processing part 112 is implemented the processing of appointment to the picture signal that comes from each video camera (fixed cameras 9a, 9b, video camera 41b, 42b etc.); I/O handling part 113 is controlled the input of the signal that comes from the outer transducer of figure and the output of various control signals etc.; Communication control unit 114, control is communicated by letter with external device (ED); Storage part 115, various programs, various data such as storage installation procedure; And main operational part 116, above-mentioned each one of Comprehensive Control also carries out various calculation process.
And this control device 110 is controlled each drive motor etc. according to predetermined program, thus control conveyer belt 2, wafer maintenance workbench 5, withdrawing device 6, pushing-up device 7, first head unit 41 and second head unit 42 etc.In view of the above, carrying out wafer W takes out bare chip and utilizes first head unit 41 and a series of actions (element installation action) such as second head unit, 42 installation elements with respect to the discrepancy of wafer accommodation device 200, from wafer W.
Control device 110 mainly is accommodated in the inside of base station 1.Here, in this execution mode, the part of control device 110 is accommodated among the second portion 1c.Particularly, as shown in figure 11, above-mentioned image processing part 112, communication control unit 114, storage part 115 and main operational part 116 are accommodated among the second portion 1c for the control cabinet 117 of one.In addition, main switch 118 (only in Figure 11, illustrating) is arranged, taken in main circuit breaker 119 in the inside of another second portion 1c in the outer setting of another second portion 1c.In addition, control cabinet 117 is examples of " electronic equipment " of the present invention.
In addition, take in above-mentioned axle control part 111 and I/O handling part 113 in the inside of the 1b of first.In addition, various devices such as power transformation depressor 120, transformer 121, vacuum source 122 also are accommodated among the 1b of first.
Below, the control of the element installation action that utilizes this control device 110 is described.In addition, the state that is linked to fitting machine main body 100 with wafer accommodation device 200 carries out following explanation.
At first, control device 110 is moved into printed circuit board (PCB) P in the fitting machine main body 100 through control conveyer belt 2.Then, control device 110 is through control conveyer belt 2, fixed printed circuit board P under the state that is arranged at the first job position S1 and the second job position S2.
Afterwards, control device 110 keeps workbench 5 through the control wafer, from wafer accommodation device 200, extracts wafer W out.Particularly, make wafer keep workbench 5 to move to the wafer receiving position through driving drive motor 53.Then, through the 5a of mechanism that comes in and goes out wafer W (carriage Wh) being retracted to wafer from wafer accommodation device 200 keeps on the workbench 5.Then, the wafer W that extracts out being fixed on wafer keeps on the workbench 5.Afterwards, keep workbench 5, be arranged on element and take out job position through the control wafer.
After wafer W was arranged on element taking-up job position, control device 110 carried out the shooting as the bare chip that takes out object through control video camera 8.
Then; Control device 110 is based on the shooting results of video camera 8; Control pushing-up device 7, withdrawing device 6 and wafer keep workbench 5, make the nozzle 6e that goes up distribution, withdrawing device 6 of the portion of cutting somebody's hair 71 and move to the same position on the XY plane as the bare chip that takes out object.
And control device 110 makes to promote on this from the first upper push-rod 71a or the second upper push-rod 71b according to the size of element etc. and rises (driving), thereby pushes away this bare chip from its downside.At this moment, make the front end face of upper push-rod 71a or 71b produce negative pressure and adsorb the wafer thin slice that keeps being pasted with bare chip, push to distribution from the front end face central portion of upper push-rod 71a or 71b.On the other hand, the first wafer head 6a or the second wafer head 6b are descended, the negative pressure of the leading section through nozzle 6e make because of on push away the bare chip absorption of peeling off from the wafer thin slice.In view of the above, from wafer W, take out bare chip.
Then, control device 110 is craniad paid bare chip in the unit from withdrawing device 6.Particularly; Control device 110 makes withdrawing device 6 move to the element delivery position position of conveyer belt 2 (near) of appointment through control withdrawing device 6, and makes first head unit 41 (or second head unit 42) move to the element delivery position through control installation portion 4.At the element delivery position, the withdrawing device 6 and first head unit 41 (or second head unit 42) are set up and down in view of the above.
At withdrawing device 6 and the first head unit 41(, second head unit 42) be arranged in the element delivery position moving process before; Control device 110 makes the first wafer head 6a and second wafer head 6b rotation; Make the bare chip counter-rotating (being reversed to ventricumbent state) that is adsorbed in each nozzle 6e in view of the above; And install to install by each element that makes first head unit 41 and use head 42a with each element of the head 41a(or second head unit 42) descend, thereby the element installation by first head unit 41 is with the element installation head 42a of the head 41a(or second head unit 42) adsorb said bare chip.In view of the above, pay bare chip from withdrawing device 6 to first head unit 41 (or second head unit 42).
Then; Control device 110 makes first head unit 41 move to fixed cameras 9a (being fixed cameras 9b during second head unit 42) top; Fixed cameras is taken be adsorbed in the bare chip of each element installation, and with respect to each element the absorption deviation with head is installed based on its view data computing bare chip with head.
Then, control device 110 is through the video camera 41b (42b) of first head unit 41 (second head unit 42), and identification is fixed on moves the benchmark sign (not shown) that has with the printed circuit board (PCB) P on 2.In view of the above, control device 110 identification printed circuit board (PCB) P are with respect to the position deviation of conveyer belt 2.
And control device 110 makes first head unit 41 (second head unit 42) move to the revised position of printed circuit board (PCB) P top according to the absorption deviation of bare chip and the position deviation of printed circuit board (PCB) P.Then, element is installed with head descended, thereby bare chip is installed on the printed circuit board (PCB) P.
Repeat above-mentioned action, during the installation of all bare chips, control device 110 is through control conveyer belt 2, thereby removes the fixing of printed circuit board (PCB) P.And control device 110 is taken out of printed circuit board (PCB) P outside the fitting machine main body 100 through control conveyer belt 2.
Then with reference to Figure 12 to Figure 16, the binding action with respect to fitting machine main body 100 describes to wafer accommodation device 200.
At first, like Figure 12 and shown in Figure 13, the user makes wafer accommodation device 200 move to link direction (Y1 direction), thereby embeds the linking part 1a of fitting machine main body 100.In addition, at this moment, make the grounding parts 221a built on stilts F of supporting device 220.
When so wafer accommodation device 200 being embedded linking part 1a, at first, deflector roll 205 and 206 rides over respectively on the inclined plane (upper surface 15a) of inclined plane (upper surface 14a) and guide rail 15 of guide rail 14.Then, the user further makes wafer accommodation device 200 when link direction (Y1 direction) moves, and deflector roll 205 and 206 rides over respectively on horizontal plane (upper surface 14b) and the horizontal plane (upper surface 15b).Ride at deflector roll under the state of horizontal plane, as shown in figure 14, because the degree of the height of deflector roll up-wards inclination face, main body 202, base plate 203 and castor 204 that therefore deflector roll is installed also rise.In view of the above, the link direction of wafer accommodation device 200 (Y1 direction) castor 204 of side becomes the state of built on stilts F.Under this state, the castor of the rear section of wafer accommodation device 200 still keeps in touch the state of the F in ground.
And, further make wafer accommodation device 200 when link direction (Y1 direction) moves, the abutting part 211a of butt parts 211 and the abutting part 214a of butt parts 214 are connected to the jut 14c of guide rail 14 and the jut 15c of guide rail 15 respectively.In view of the above, wafer accommodation device 200 can't further move to link direction (Y1 direction) again.Under this state during from top view, about short transverse have under the situation of inclination, thereby regulate the height and position of deflector roll 205 through the height and position of regulating moveable block 209.
Then, through the handle 223 of rotation support mechanism 220, second shank 222 and first shank 221 are descended.Rotating handles 223 is in the time can't rotating, and like Figure 15 and shown in Figure 16, first shank 221 is connected to a pair of castor 204 built on stilts F of the rear side (detaching direction side) of ground F and wafer accommodation device 200.In view of the above, the rear section of wafer accommodation device 200 is supported mechanism's 220 supportings.
Under this state, through unscrewing nut 225, and make first shank 221 with respect to 222 rotations of second shank, thus the outstanding length of regulating first shank 221.And, in the outstanding length of regulating first shank 221 so that under the state that wafer accommodation device 200 disappears with respect to the inclination of the fore-and-aft direction of fitting machine main body 100, fastening nut 225.In view of the above, wafer accommodation device 200 under the state parallel with respect to fitting machine main body 100 by deflector roll 205,206 and supporting device 220 these three-point supports.Under this state, as shown in figure 16, four castor 204 whole built on stilts F.
And after adjustment finishes, bolt 213 is screwed togather the screw 14d that inserts guide rail 14, and bolt 216 is screwed togather the screw 15d that inserts guide rail 15, wafer accommodation device 200 is fixed on the fitting machine main body 100.In view of the above, wafer accommodation device 200 is accomplished with the binding of fitting machine main body 100, under this state, carries out the conveyance of paying wafer W such as wafer W to fitting machine main body 100 from wafer accommodation device 200.
In addition, medium in the installation action process of fitting machine, when temporarily separating wafer accommodation device 200 in order to safeguard fitting machine main body 100, at first, the screw 14d from guide rail 14 takes out with bolt 213, and the screw 15d of bolt 216 from guide rail 15 taken out.Then, through rotating handles 223, thereby make supporting device 220 risings and make castor 204 be contacted with ground F.Afterwards, through make wafer accommodation device 200 to detaching direction (Y2 direction) thus move wafer accommodation device 200 separated from fitting machine main body 100.
After the maintenance of fitting machine main body 100 finishes, once more wafer accommodation device 200 is linked to fitting machine main body 100.In this case, wafer accommodation device 200 is moved up to can't be after link direction (Y1 direction) moves to link direction (Y1 direction), rotating handles 223 till can't rotating again so that supporting device 220 descend.Like this, because the outstanding length of first shank 221 becomes the outstanding length of initial adjustment, so wafer accommodation device 200 becomes parastate naturally with fitting machine main body 100.Promptly; In the fitting machine of this execution mode; After when first the binding, carrying out the adjustment of wafer accommodation device 200 and the relative position of fitting machine main body 100; Then when for the second time later binding, need not to adjust operation, just can make the wafer accommodation device 200 and the relative position of fitting machine main body 100 is state parallel to each other.
As stated; When the fitting machine of this execution mode linked with wafer accommodation device 200 when fitting machine main body 100, the deflector roll 205,206 that is arranged in the wafer accommodation device 200 rode over respectively on the guide rail 14,15 that is arranged in the fitting machine main body 100 so that the castor 204 built on stilts F of fitting machine main body 100 sides of wafer accommodation device 200.That is, the relative position relation of the fitting machine main body under the connecting state 100 and wafer accommodation device 200 and do not rely on ground F smooth degree but by guide rail 14,15 and deflector roll 205,206 decisions.Therefore; Position through suitable setting guide rail 14,15 and deflector roll 205,206; Even under the good inadequately situation of the smooth degree of ground F, also can suppress the state of fitting machine main body 100 and the relative position relation parallel deviate of wafer accommodation device 200 under the connecting state.That is, component supplying apparatus can be remained on more parallel state with the relative position relation of wafer accommodation device.Therefore, when from wafer accommodation device 200 when fitting machine main body 100 sidesways send wafer W, can suppress wafer W the state that tilts with respect to fitting machine main body 100 down quilt transferred.Consequently can suppress fitting machine main body 100 and wafer W interference in the handover process, or in fitting machine main body 100, can't keep wafer W with correct posture.
In addition; Owing to make wafer accommodation device 200 with respect to 100 supportings of fitting machine main body with 2, so the relative position relation of the wafer accommodation device 200 under the connecting state and fitting machine main body 100 (particularly from top view time tilt) can be remained on parallel state with good precision through guide rail 14,15 and deflector roll 205,206.
In addition; In this execution mode; As stated; Setting takies the guide rail 14,15 than large space on the bigger fitting machine main body 100 of ground F and size being fixedly set in; And on the less wafer accommodation device 200 of this fitting machine main body 100 deflector roll 205,206 that takies less space is set comparing; Therefore with when wafer accommodation device 200 sides are provided with guide rail, compare, can suppress wafer accommodation device 200 and increase.
In addition; In this execution mode, as stated, be arranged on rotating deflector roll 205,206 on the contact-making surface with guide rail 14,15 in wafer accommodation device 200 sides; Along guide rail 14,15 these deflector rolls 205,206 of guiding, therefore can reduce the contact resistance between guide rail and the guide member.Therefore, when linking or separate fitting machine main body 100, wafer accommodation device 200 is moved smoothly while guide rail 14,15 is contacted with deflector roll 205,206 with wafer accommodation device 200.
In addition; In this execution mode; As stated; Be arranged under the connecting state supporting device 220 that can support wafer accommodation device 200 with respect to ground F in the part with fitting machine main body 100 opposition sides of wafer accommodation device 200; Therefore under the state that wafer accommodation device 200 and fitting machine main body 100 link, can adjust height and positions wafer accommodation device 200 and parts fitting machine main body 100 opposition sides.In view of the above, can not rely on the smooth degree of ground F and confirm that wafer accommodation device 200 under the connecting state is with respect to the relative position relation (the particularly inclination of fore-and-aft direction) of fitting machine main body 100.In view of the above, even under the good inadequately situation of the smooth degree of ground F, also can more positively the wafer accommodation device 200 under the connecting state be remained on parallel state with the relative position relation of fitting machine main body 100.
In addition; In this execution mode; As implied above; Through the stopper (stopper that stopper that jut 14c and abutting part 211a constitute and jut 15c and abutting part 214a constitute) that restriction wafer accommodation device 200 moves to link direction is set; The user only is blocked device and stops and irremovable position through making this wafer accommodation device 200 move to wafer accommodation device 200, just can link fitting machine main body 100 and wafer accommodation device 200.Therefore, through the position of suitable this stopper of setting, the wafer accommodation device 200 that can suppress under the connecting state produces relative deviation with respect to fitting machine main body 100.In addition; As stated; Because two stoppers are set; With respect to the moving of fitting machine main body 100, therefore the relative position relation of wafer accommodation device connecting state under 200 and fitting machine main body 100, the position when particularly observing from the top can be concerned keeping parallelism with 2 restriction wafer accommodation devices 200.
In addition, in this execution mode, as stated, the linking part 1a that is concavity is observed in overlooking that wafer accommodation device 200 embeds under the state that is arranged on 200 bindings of wafer accommodation device on the base station 1 of fitting machine main body 100.Through formation like this,, therefore can make the whole big or small miniaturization of fitting machine under the connecting state because the part of wafer accommodation device 200 embeds fitting machine main body 100 under connecting state.In addition owing to can dwindle the distance of fitting machine main body 100 and wafer accommodation device 200 connecting state under, therefore can be successfully from wafer accommodation device 200 to fitting machine main body 100 payment wafer W.
In addition; In this execution mode; As stated; Second portion 1c through in the side walls portion 13 of the linking part 1a that constitutes concavity takes in the control cabinet 117 of fitting machine main body 100, can effectively utilize the space of the second portion 1c of the base station 1 that is used to embed wafer accommodation device 200 that control cabinet 117 is set.
In addition; In this execution mode, as stated, because at side wall portion 13 fixed guides 14,15 of the second portion 1c of base station 1; Therefore thereby at firm parts is that base station 1 is provided with guide rail 14,15, can increase the intensity of the guide rail that is used to support wafer accommodation device 200 when linking.
In addition, it all is illustration that the execution mode of this disclosure should be considered to all points, and unrestricted.Scope of the present invention also can't help the explanation of above-mentioned execution mode and is represented, and is represented by claims, further contains the meaning that is equal to claims and all changes in the scope.
For example; In the above-mentioned execution mode; Show in fitting machine main body 100 guide rail 14,15 is set; The example of guide member (deflector roll 205,206) is set at wafer accommodation device 200; But the present invention is not limited to this; Also can guide member be set, guide rail be set at wafer accommodation device 200 in fitting machine main body 100.Under the situation of this structure, ride over through guide rail on the guide member of fitting machine main body, make the part built on stilts of the fitting machine main body side of wafer accommodation device.
In addition, in the above-mentioned execution mode, show the example of deflector roll (rotor) rotation that on guide rail, makes the wheel shape, but the present invention is not limited to this, spherical rotor is rotated.In addition, if the friction of guide rail and guide member is little, then also not guide member be set to rotor.
In addition, in the above-mentioned execution mode, show and be different from the example that castor 204 is provided with supporting device 220, but the present invention is not limited to this, also can Height Adjustment mechanism be set from one's body at the castor of rear side.
In addition, in the above-mentioned execution mode, the front part (part of link direction side) that only shows wafer accommodation device 200 rides over the example on the guide rail, but the present invention is not limited to this.That is, front part not only, rear section (near body side sections) also can ride on the guide rail.In view of the above, need not to be provided with supporting device 220.
The present invention who gathers above explanation is then as shown in following.
The first aspect of the present invention, an electronic component conveyance apparatus comprising: wafer holding means, including electronic components housed wafer and movable relative to the ground; component supply unit, provided in the ground and can be linked to the wafer housing means; guide rails disposed in the component supply means and said wafer holding means out of the side; and a guide member provided in the component supply means and said wafer holding means being on the other side, the said wafer holding means relative to said component supply device is connected or separated is guided along the guide rail, wherein said wafer holding means relative to said component supply by means which in a particular direction relative to the component supply means linked or separated, and in the specific direction toward the component supply unit comprises one end portion may be supported with respect to said ground storage device of the wafer support portion, said guide and said guide member on said wafer storage device is coupled to the component supply device state, the storage means of said wafer away from said portion of said supporting surface.
In the electronic component carrying device of first aspect present invention; As stated; Under the state of component supplying apparatus and the binding of wafer accommodation device; The support built on stilts of the component supplying apparatus side of wafer accommodation device; Therefore through guide rail and guide member, can not rely on the smooth degree on ground and confirm wafer accommodation device and the relative position relation of component supplying apparatus under the connecting state.In view of the above, through the position of suitable setting guide rail and guide member,, also can suppress wafer accommodation device and the relative position relation parallel deviate of component supplying apparatus under the connecting state even under the good inadequately situation of the smooth degree on ground.That is, component supplying apparatus can be remained on more parallel state with the relative position relation of wafer accommodation device.Therefore, when from the wafer accommodation device during to component supplying apparatus side shifting wafer, can suppress wafer the state that tilts with respect to component supplying apparatus down quilt transferred.Consequently can suppress component supplying apparatus and wafer interferometer in the handover process, or in component supplying apparatus, can't keep wafer with correct posture.In addition; Be provided with respectively under the situation of a plurality of guide rails and guide member; Therefore can support with respect to component supplying apparatus to make the wafer accommodation device more than 2 o'clock, can suppress the wafer accommodation device with respect to the relative position relation of component supplying apparatus (tilting of the wafer accommodation device during particularly from top view) parallel deviate with better precision.
In the electronic component carrying device of the invention described above first aspect; Comparatively it is desirable to; Said component supplying apparatus comprises said guide rail; Said wafer accommodation device comprises said guide member; And the both ends at said specific direction comprise the castor that supports this wafer accommodation device with respect to said ground movably as said support; Said guide rail is linked under the state of said component supplying apparatus at said wafer accommodation device, makes the said castor that is positioned at the end of said component supplying apparatus side among the said castor leave said ground by the upper surface that makes said guide member ride over this guide rail.
According to this structure; Setting takies the guide rail than large space on the bigger component supplying apparatus of ground and size being fixedly set in; And the guide member that takies less space is set comparing on the less wafer accommodation device of this component supplying apparatus; Therefore compare with the structure that guide rail is set in wafer accommodation device side, can suppress the wafer accommodation device and increase.In addition, through making the castor built on stilts of wafer accommodation device, even under the good inadequately situation of the smooth degree on the ground that contacts with castor, also can be easy to relative position relation keeping parallelism with component supplying apparatus and wafer accommodation device.
In the electronic component carrying device of the invention described above first aspect, comparatively it is desirable to, said guide member for the contact-making surface of said guide rail on the rotor that rotates.
According to this structure,, therefore when binding or resolution element feedway and wafer accommodation device, the wafer accommodation device is successfully moved while guide rail is contacted with guide member owing to can reduce the contact resistance between guide rail and the guide member.
In the electronic component carrying device of the invention described above first aspect; Comparatively it is desirable to; Said wafer accommodation device comprises supporting device at said specific direction towards the end of the opposition side of said component supplying apparatus one side, and this supporting device can be linked under the state of said component supplying apparatus with respect to this wafer accommodation device of said ground supporting and adjusts the height and position of the end of said opposition side at this wafer accommodation device.
According to this structure, under the state that wafer accommodation device and component supplying apparatus link, can be accommodation device and the height and position of the part component supplying apparatus opposition side through supporting device adjustment wafer.In view of the above, can not rely on the smooth degree on ground and confirm that wafer accommodation device under the connecting state is with respect to the relative position relation (the particularly inclination of fore-and-aft direction) of component supplying apparatus.In view of the above, even under the good inadequately situation of the smooth degree on ground, also can keep wafer accommodation device and the relative position relation of component supplying apparatus under the connecting state more abreast.
In the electronic component carrying device of the invention described above first aspect; Comparatively it is desirable to; In said component supplying apparatus and the said wafer accommodation device at least one comprises stopper; When this wafer accommodation device is moved along the link direction that said wafer accommodation device is linked with respect to said component supplying apparatus; This stopper limits this wafer accommodation device and moves to said link direction in the position of the support built on stilts of the said component supplying apparatus side of said wafer accommodation device.
According to this structure; The user is only through making the wafer accommodation device move up to being blocked that device stops and till can't moving to link direction; Just can make the part built on stilts of the component supplying apparatus side of wafer accommodation device on one side, on one side link component feedway and wafer accommodation device.Through the position of suitable this stopper of setting, can keep wafer accommodation device and the relative position relation of component supplying apparatus under the connecting state more abreast.In addition; Be provided with under the situation of a plurality of stoppers; Can be with restriction wafer accommodation device more than 2 o'clock with respect to the moving of component supplying apparatus, therefore can be from the top with relative position relation (deviation of the direction of rotation on the plane when the particularly observing) keeping parallelism of better precision with wafer accommodation device and component supplying apparatus.
In the electronic component carrying device of the invention described above first aspect; Comparatively it is desirable to; Said component supplying apparatus comprises base station, and said base station is included in the linking part that is concavity of overlooking that said wafer accommodation device embeds under the state that said wafer accommodation device links.
According to this structure,, therefore can make the whole big or small miniaturization of electronic component carrying device under the connecting state because at least a portion of wafer accommodation device embeds component supplying apparatus under connecting state.In addition, owing to can dwindle component supplying apparatus and the distance of wafer accommodation device connecting state under, so can successfully carry out paying wafer from the wafer accommodation device to component supplying apparatus.
Overlook in the structure of observing the linking part be concavity in the base station setting of said elements feedway, comparatively it is desirable to, said base station comprises: first, as the wall portion of said linking part and constitute the front wall portion that said wafer accommodation device is faced; And second portion, constitute the side wall portion of the said linking part of the both sides be positioned at said front wall portion, take in the Denso article (electrical component) of said component supplying apparatus in the wherein said second portion.
According to this structure, can effectively utilize the space of the second portion of the base station that is used to embed the wafer accommodation device that the Denso article are set.
Overlook in the structure of observing the linking part that is concavity in the base station setting of said elements feedway; Comparatively it is desirable to; Said linking part has front wall portion that said wafer accommodation device faced and the side walls portion that is positioned at this front wall portion, in these side wall portions, is fixed with said guide rail or said guide member.
According to this structure, owing to be base station fixed guide or guide member, therefore when linking, be used to support the guide rail of wafer accommodation device or the intensity of guide member increases at firm parts.
On the other hand, the fitting machine of second aspect present invention comprises: installing mechanism is used for electronic component is installed to substrate; And the electronic component carrying device of the invention described above first aspect, be used for said installing mechanism is supplied with said electronic component.
In the fitting machine of second aspect present invention; The electronic component carrying device that comprises the invention described above first aspect; Even thereby under the good inadequately situation of the smooth degree on ground, also can keep wafer accommodation device and the relative position relation of component supplying apparatus under the connecting state more abreast.

Claims (9)

1. electronic component carrying device is characterized in that comprising:
The wafer accommodation device is taken in the wafer that comprises electronic component and removable with respect to ground;
Component supplying apparatus is arranged on said ground and can be linked to said wafer accommodation device;
Guide rail is arranged among said component supplying apparatus and the said wafer accommodation device; And
Guide member is arranged among said component supplying apparatus and the said wafer accommodation device another, when linking or separate with respect to said component supplying apparatus, said wafer accommodation device is directed along said guide rail, wherein,
Said wafer accommodation device; Through moving and link or separate along specific direction with respect to this component supplying apparatus with respect to said component supplying apparatus; And possesses the support that can support this wafer accommodation device with respect to said ground towards the end of component supplying apparatus one side at said specific direction
Said guide rail and said guide member are linked under the state of said component supplying apparatus at said wafer accommodation device, make the said support of said wafer accommodation device leave said ground.
2. electronic component carrying device according to claim 1 is characterized in that:
Said component supplying apparatus possesses said guide rail,
Said wafer accommodation device possesses said guide member, and possess at the both ends of said specific direction as said support support the castor of this wafer accommodation device movably with respect to said ground,
Said guide rail; Be linked under the state of said component supplying apparatus at said wafer accommodation device, leave said ground through the top said castor that is positioned at the end of said component supplying apparatus one side among the said castor that makes that makes that said guide member rides over this guide rail.
3. electronic component carrying device according to claim 1 and 2 is characterized in that:
Said guide member for the contact-making surface of said guide rail on the rotor that rotates.
4. electronic component carrying device according to claim 1 and 2 is characterized in that:
Said wafer accommodation device possesses supporting device at said specific direction towards the end of the opposition side of said component supplying apparatus one side, and this supporting device can be linked under the state of said component supplying apparatus with respect to this wafer accommodation device of said ground supporting and adjusts the height and position of the end of said opposition side at this wafer accommodation device.
5. electronic component carrying device according to claim 1 and 2 is characterized in that:
Said component supplying apparatus and said wafer accommodation device one of them comprises stopper at least; When this wafer accommodation device is moved along the link direction that said wafer accommodation device is linked with respect to said component supplying apparatus; This stopper limits this wafer accommodation device and moves to said link direction in the position of the support built on stilts of the said component supplying apparatus side of said wafer accommodation device.
6. electronic component carrying device according to claim 1 and 2 is characterized in that:
Said component supplying apparatus comprises base station,
Said base station possesses the linking part that is concavity of overlooking that said wafer accommodation device embeds under the state that said wafer accommodation device links.
7. electronic component carrying device according to claim 6 is characterized in that:
Said base station comprises as the wall portion of said linking part and constitutes the first of the front wall portion that said wafer accommodation device faced; Be positioned at the second portion of side wall portion of said linking part of the both sides of said front wall portion with formation, wherein, take in the Denso article of said component supplying apparatus in the said second portion.
8. electronic component carrying device according to claim 6 is characterized in that:
Said linking part has front wall portion that said wafer accommodation device faced and the side walls portion that is positioned at this front wall portion, and said guide rail or said guide member are fixed in these side wall portions.
9. fitting machine is characterized in that comprising:
Installing mechanism is used for electronic component is installed to substrate; And
Be used for to said installing mechanism supply with said electronic component like one of them described electronic component carrying device of claim 1 to 8.
CN201110186575.3A 2010-07-29 2011-06-30 Electronic component conveying device and mounting machine Active CN102347262B (en)

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JP2012033592A (en) 2012-02-16

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