JP2012028774A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012028774A5 JP2012028774A5 JP2011159078A JP2011159078A JP2012028774A5 JP 2012028774 A5 JP2012028774 A5 JP 2012028774A5 JP 2011159078 A JP2011159078 A JP 2011159078A JP 2011159078 A JP2011159078 A JP 2011159078A JP 2012028774 A5 JP2012028774 A5 JP 2012028774A5
- Authority
- JP
- Japan
- Prior art keywords
- nanoparticle
- nanoparticles
- dispersion
- preform
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002105 nanoparticle Substances 0.000 claims 53
- 238000000034 method Methods 0.000 claims 18
- 239000006185 dispersion Substances 0.000 claims 14
- 238000002360 preparation method Methods 0.000 claims 11
- 239000007788 liquid Substances 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims 4
- 238000001704 evaporation Methods 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 2
- 238000001246 colloidal dispersion Methods 0.000 claims 2
- 230000008020 evaporation Effects 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000003960 organic solvent Substances 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 229910052684 Cerium Inorganic materials 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 claims 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 229910052793 cadmium Inorganic materials 0.000 claims 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI2010003445 | 2010-07-21 | ||
| MYPI2010003445A MY160373A (en) | 2010-07-21 | 2010-07-21 | Bonding structure and method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015160138A Division JP6101758B2 (ja) | 2010-07-21 | 2015-08-14 | ボンディング構造および方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012028774A JP2012028774A (ja) | 2012-02-09 |
| JP2012028774A5 true JP2012028774A5 (enExample) | 2014-10-09 |
| JP5882618B2 JP5882618B2 (ja) | 2016-03-09 |
Family
ID=45496354
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011159078A Active JP5882618B2 (ja) | 2010-07-21 | 2011-07-20 | ボンディング構造および方法 |
| JP2015160138A Active JP6101758B2 (ja) | 2010-07-21 | 2015-08-14 | ボンディング構造および方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015160138A Active JP6101758B2 (ja) | 2010-07-21 | 2015-08-14 | ボンディング構造および方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20120018864A1 (enExample) |
| JP (2) | JP5882618B2 (enExample) |
| CN (1) | CN102347252B (enExample) |
| MY (1) | MY160373A (enExample) |
| TW (1) | TWI550807B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013187843A1 (en) * | 2012-06-15 | 2013-12-19 | Agency For Science, Technology And Research | Embossing method and embossing arrangement |
| WO2014091517A1 (ja) * | 2012-12-10 | 2014-06-19 | 株式会社ニッシン | 接合方法 |
| JP6245933B2 (ja) * | 2013-10-17 | 2017-12-13 | Ｄｏｗａエレクトロニクス株式会社 | 接合用銀シートおよびその製造方法並びに電子部品接合方法 |
| JP6415381B2 (ja) | 2015-04-30 | 2018-10-31 | 三菱電機株式会社 | 半導体装置の製造方法 |
| US9576922B2 (en) * | 2015-05-04 | 2017-02-21 | Globalfoundries Inc. | Silver alloying post-chip join |
| US9881895B2 (en) * | 2015-08-18 | 2018-01-30 | Lockheed Martin Corporation | Wire bonding methods and systems incorporating metal nanoparticles |
| US20170309549A1 (en) * | 2016-04-21 | 2017-10-26 | Texas Instruments Incorporated | Sintered Metal Flip Chip Joints |
| JP6763708B2 (ja) * | 2016-06-30 | 2020-09-30 | 大陽日酸株式会社 | 接合材、接合材の製造方法、及び接合体 |
| KR102531762B1 (ko) | 2017-09-29 | 2023-05-12 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
| US10347507B2 (en) * | 2017-09-29 | 2019-07-09 | Lg Innotek Co., Ltd. | Printed circuit board |
| DE102018128748A1 (de) * | 2018-11-15 | 2020-05-20 | Infineon Technologies Ag | Verfahren zur herstellung einer halbleitervorrichtung mit einerpastenschicht und halbleitervorrichtung |
| US10914018B2 (en) * | 2019-03-12 | 2021-02-09 | Infineon Technologies Ag | Porous Cu on Cu surface for semiconductor packages |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62123607A (ja) * | 1985-11-25 | 1987-06-04 | シャープ株式会社 | 異方導電性テ−プの製造方法 |
| JPH05329681A (ja) * | 1991-12-10 | 1993-12-14 | Nec Corp | 多層ろう材とその製造方法および接続方法 |
| JPH08325543A (ja) * | 1995-06-05 | 1996-12-10 | Soken Chem & Eng Co Ltd | 異方導電性接着剤 |
| JPH09326416A (ja) * | 1996-06-05 | 1997-12-16 | Kokusai Electric Co Ltd | 半導体素子の実装方法およびその製品 |
| US6344271B1 (en) * | 1998-11-06 | 2002-02-05 | Nanoenergy Corporation | Materials and products using nanostructured non-stoichiometric substances |
| US7083850B2 (en) | 2001-10-18 | 2006-08-01 | Honeywell International Inc. | Electrically conductive thermal interface |
| EP1508261B1 (en) | 2002-05-23 | 2010-09-22 | 3M Innovative Properties Company | Electronic assembly and method of making an electronic assembly |
| JP3837104B2 (ja) * | 2002-08-22 | 2006-10-25 | 日精樹脂工業株式会社 | カーボンナノ材と金属材料の複合成形方法及び複合金属製品 |
| EP1578559B1 (en) | 2002-09-18 | 2009-03-18 | Ebara Corporation | Bonding method |
| RU2311995C2 (ru) * | 2003-06-11 | 2007-12-10 | Мицубиси Денки Кабусики Кайся | Устройство для электроразрядного нанесения покрытия и способ электроразрядного нанесения покрытия |
| CN100409094C (zh) * | 2003-12-22 | 2008-08-06 | Lg化学株式会社 | 具有提高寿命的电致变色材料 |
| US8257795B2 (en) * | 2004-02-18 | 2012-09-04 | Virginia Tech Intellectual Properties, Inc. | Nanoscale metal paste for interconnect and method of use |
| JPWO2005095040A1 (ja) * | 2004-03-31 | 2008-02-21 | 株式会社荏原製作所 | 接合方法及び接合体 |
| JP2006202938A (ja) | 2005-01-20 | 2006-08-03 | Kojiro Kobayashi | 半導体装置及びその製造方法 |
| JP2006265686A (ja) | 2005-03-25 | 2006-10-05 | Nissan Motor Co Ltd | 金属／カーボンナノチューブ複合焼結体の製造方法 |
| JP4231493B2 (ja) * | 2005-05-27 | 2009-02-25 | 日精樹脂工業株式会社 | カーボンナノ複合金属材料の製造方法 |
| JP5041787B2 (ja) * | 2005-11-11 | 2012-10-03 | 株式会社半導体エネルギー研究所 | 圧着方法及び半導体装置の作製方法 |
| US7382059B2 (en) * | 2005-11-18 | 2008-06-03 | Semiconductor Components Industries, L.L.C. | Semiconductor package structure and method of manufacture |
| CN101070571B (zh) * | 2006-05-12 | 2011-04-20 | 日精树脂工业株式会社 | 制造碳纳米材料和金属材料的复合材料的方法 |
| GB2454132B (en) * | 2006-08-24 | 2011-11-23 | Ngimat Co | Optical coating |
| JP4287461B2 (ja) | 2006-11-17 | 2009-07-01 | 日精樹脂工業株式会社 | カーボンナノ複合金属材料の製造方法及びカーボンナノ複合金属成形品の製造方法 |
| JP4247800B2 (ja) * | 2006-11-29 | 2009-04-02 | ニホンハンダ株式会社 | 可塑性を有する焼結性金属粒子組成物、その製造方法、接合剤および接合方法 |
| JP5151150B2 (ja) * | 2006-12-28 | 2013-02-27 | 株式会社日立製作所 | 導電性焼結層形成用組成物、これを用いた導電性被膜形成法および接合法 |
| JP5063176B2 (ja) * | 2007-04-27 | 2012-10-31 | 日精樹脂工業株式会社 | カーボンナノ複合金属材料の製造方法 |
| JP5012239B2 (ja) * | 2007-06-13 | 2012-08-29 | 株式会社デンソー | 接合方法及び接合体 |
| JP4398492B2 (ja) * | 2007-08-01 | 2010-01-13 | 日精樹脂工業株式会社 | 樹脂被覆カーボンナノ材料の製造方法、カーボンナノ含有樹脂材料の製造方法及びカーボンナノ複合樹脂成形品の製造方法 |
| US20090166852A1 (en) * | 2007-12-31 | 2009-07-02 | Chuan Hu | Semiconductor packages with thermal interface materials |
| JP5182296B2 (ja) * | 2008-02-07 | 2013-04-17 | 株式会社村田製作所 | 電子部品装置の製造方法 |
| SG155778A1 (en) * | 2008-03-10 | 2009-10-29 | Turbine Overhaul Services Pte | Method for diffusion bonding metallic components with nanoparticle foil |
| JP2010098156A (ja) * | 2008-10-17 | 2010-04-30 | Seiko Epson Corp | 半導体装置、半導体装置の製造方法、電子機器 |
-
2010
- 2010-07-21 MY MYPI2010003445A patent/MY160373A/en unknown
- 2010-10-11 US US12/901,684 patent/US20120018864A1/en not_active Abandoned
-
2011
- 2011-06-20 TW TW100121478A patent/TWI550807B/zh active
- 2011-07-06 CN CN201110187482.2A patent/CN102347252B/zh active Active
- 2011-07-20 JP JP2011159078A patent/JP5882618B2/ja active Active
-
2015
- 2015-08-14 JP JP2015160138A patent/JP6101758B2/ja active Active
-
2017
- 2017-07-30 US US15/663,802 patent/US9997485B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012028774A5 (enExample) | ||
| JP7001659B2 (ja) | 焼結材料、及びそれを用いる接着方法 | |
| Araki et al. | Cu salt ink formulation for printed electronics using photonic sintering | |
| JP4247800B2 (ja) | 可塑性を有する焼結性金属粒子組成物、その製造方法、接合剤および接合方法 | |
| CN102347252B (zh) | 键合结构和方法 | |
| US9481804B2 (en) | Electroconductive ink composition | |
| KR101234597B1 (ko) | 플립 칩 본딩 방법 및 그의 구조 | |
| JP2011014556A5 (enExample) | ||
| JP2011114259A5 (ja) | 半導体装置の製造方法 | |
| WO2013061527A1 (ja) | 接合用組成物 | |
| CN103862032B (zh) | 四方超晶格的核壳贵金属纳米棒及其自组装方法 | |
| JP2008124446A5 (enExample) | ||
| Zhan et al. | Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes | |
| TWI744372B (zh) | 接合用組成物及其製造方法、接合體以及被覆銀奈米粒子 | |
| Oliva-Puigdomenech et al. | Scalable approaches to copper nanocrystal synthesis under ambient conditions for printed electronics | |
| JP6446069B2 (ja) | 導電性の微小粒子 | |
| CN106366769A (zh) | 一种抗氧化纳米铜导电墨水及其制备方法和印刷应用 | |
| CN102816462A (zh) | 一种表面包覆着有机保护剂的纳米银颗粒的制备方法 | |
| JP2012218020A (ja) | 接合方法 | |
| JP6347385B2 (ja) | 銅材の接合方法 | |
| CN104861786A (zh) | 用于超声气溶胶(ua)的低粘度高负载的银纳米粒子油墨 | |
| KR101423384B1 (ko) | 금속 나노와이어를 포함하는 전도성 코팅액 조성물 및 이를 이용한 투명 전극층을 구비한 투명 전기 디바이스 | |
| CN103607853A (zh) | 一种印刷电路导线的制备方法 | |
| JP2013181177A5 (enExample) | ||
| Sui | A Low-Temperature Printing Technology for Fabricating Electrically Conductive Structures and Devices Using Plasma-Activated Stabilizer-Free Inks |