JP2012023087A - Sheet pasting device and pasting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent formation of warpage in an adhesive sheet peeled from a peeling sheet using a peeling plate.SOLUTION: A sheet pasting device 10 has: a peeling plate 16 that folds a peeling sheet RL back to peel an adhesive sheet S from the peeling sheet RL; a supporting shaft 18 that supports the peeling plate 16 turnably; a pressure roller 20 that presses and pastes the adhesive sheet to a semiconductor wafer W, and that can move via a linear motor 22; and coupling means 25 that couples the peeling plate 16 and the pressure roller 20. In the adhesive sheet S, a part from a position guided by a flat guide surface 16A of the peeling plate 16 to a peeling edge RL1 of the peeling sheet RL is formed as a peeling standby surface SA, and a part between the peeling edge RL1 and the pressure roller 20 is formed as a peeled surface SB. The coupling means 25 is provided so as to enable the peeling plate 16 to turn in accordance with the movement of the pressure roller 20 so that the peeling standby surface SA and the peeled surface SB are positioned in the same plane.

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more particularly, to a sheet sticking apparatus and a sticking method that can peel and attach an adhesive sheet from a release sheet.

  Conventionally, a sheet sticking apparatus for sticking an adhesive sheet to an adherend such as a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) has been widely used. As such a sheet sticking apparatus, for example, It is disclosed in Patent Document 1. The sheet sticking device disclosed in Patent Document 1 presses a release plate that peels the release sheet from the adhesive sheet and an adhesive sheet that is supplied from the release plate toward the adherend while the adhesive sheet temporarily attached to the release sheet is being fed. And a pressing roller that can be attached.

JP 2007-227553 A

  However, in the sheet sticking apparatus of Patent Document 1, as shown in FIGS. 3 and 4 of the same document, the adhesive sheet is bent at the tip of the release plate while applying tension to the adhesive sheet. Since the adhesive sheet is attached to the adhesive sheet, the adhesive sheet is in a so-called squeezed state, and the adhesive sheet is warped. In order to prevent the adhesive sheet from being squeezed, even if the peeling means is constituted by a roller or the like and a gentle arc is applied, the adhesive sheet will be bent. For this reason, for example, when the adherend is a wafer that has been ground to a thickness of several tens of μm, the wafer after the adhesive sheet is pasted is warped and cracked.

[Object of invention]
An object of the present invention is to provide a sheet sticking device and a sticking method capable of preventing the adherend to which the adhesive sheet is stuck from being bent by the adhesive sheet being bent by the peeling means. .

In order to achieve the above object, the present invention provides a feeding means for feeding out an adhesive sheet temporarily attached to one surface of a release sheet, a peeling means for peeling the release sheet from the adhesive sheet, and the peeling means can be rotated. Supporting means for supporting the adhesive sheet, pressing means for pressing and adhering the adhesive sheet to the adherend surface, moving means for moving the pressing means along the adherend surface, the peeling means and the pressing means A sheet sticking device comprising a connecting means for connecting the means,
In the adhesive sheet, a predetermined area in front of the peeling edge where the peeling sheet is peeled off by the peeling means is formed as a peeling standby surface, while a space between the peeling edge and the pressing means is formed as a peeled surface,
The connecting means adopts a configuration in which a peeling plate is rotatably provided in accordance with the movement of the pressing means by the moving means so that the peeling standby surface and the peeled surface are located in the same plane. ing.

In the present invention, the peeling means includes a peeling plate having a flat guide surface for guiding the feeding of the adhesive sheet,
The adhesive sheet has a configuration in which a space up to the peeling edge guided by the guide surface is formed as a peeling standby surface, and a space between the peeling edge and the pressing unit is formed as a peeled surface. be able to.

  Further, the connecting means includes a connecting arm that is attached to the peeling plate and contacts the pressing means, and the peeling plate is rotatably provided via the connecting arm by the movement of the pressing means. Also good.

  Moreover, the structure of providing the peeling angle maintenance means which maintains the peeling angle of the peeling sheet in the said peeling means constant is preferably employ | adopted.

  Further, it is preferable that the peeling means is provided with a friction suppressing means for suppressing the rubbing of the original fabric at the center of rotation.

Furthermore, the sticking method of the present invention includes a step of feeding out an adhesive sheet temporarily attached to one surface of the release sheet;
Peeling the release sheet from the adhesive sheet;
When the predetermined area in the previous stage of the peeling edge from which the release sheet is peeled is the peeling standby surface of the adhesive sheet, and when the gap between the peeling edge and the adherend surface is the peeled surface of the adhesive sheet, the peeling standby surface and And a step of pressing and adhering the adhesive sheet to the adherend surface of the adherend in a state where the peeling means and the pressing means are connected so that the peeled surface is located in the same plane. Is adopted.

  According to the present invention, since the peeling plate is rotatably supported and the peeling plate and the pressing means are connected by the connecting means, when the adhesive sheet is fed out, the peeling standby surface and the peeled surface of the adhesive sheet Can be rotated so that they are in the same plane. This prevents the adhesive sheet from being bent by the peeling means, can suppress the warpage of the adhesive sheet due to the adhesive sheet being squeezed or bent, and can deform the adherend. It is possible to prevent damage. As a result, for example, even if the adherend is a wafer having a thickness of several tens of μm, it is possible to avoid the disadvantage that the wafer is warped and cracked.

  Further, the structure can be simplified by rotating the peeling plate via the connecting arm that contacts the pressing means.

  Furthermore, by keeping the release sheet peel angle at the release means constant, the release sheet does not change even if the release means rotates, so the release sheet can be stably peeled from the adhesive sheet. Can do.

  Further, since the friction suppressing means is provided, it is possible to prevent the adhesive sheet from being squeezed or bent and wrinkled.

The schematic front view of the sheet sticking apparatus which concerns on embodiment. The schematic perspective view around a peeling board. The partial side view around a press means. The principal part schematic front view of the sheet sticking apparatus which concerns on a modification. (A), (B) is a partial schematic front view of the sheet sticking apparatus which concerns on a modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In FIG. 1, a sheet sticking apparatus 10 is provided with a holding means 12 for holding a wafer W as an adherend, and an original fabric R in which a belt-like adhesive sheet S is temporarily attached to a belt-like release sheet RL. The feeding means 14 for feeding the sheet S, the peeling plate 16 as a peeling means for folding the peeling sheet RL of the original fabric R fed by the feeding means 14 and peeling the peeling sheet RL from the adhesive sheet S, and the peeling plate 16 are rotated. A support shaft 18 as a support means for supporting movement, a pressing roller 20 as a pressing means for pressing and adhering the adhesive sheet S to the adherend surface (upper surface in FIG. 1) of the wafer W, and the pressing roller 20 are moved. Connecting means 2 for connecting the linear motor 22 as a driving device constituting the moving means to be moved, the cutting means 24 provided above the holding means 12, the peeling plate 16 and the pressing roller 20. When the retaining means 12, feeding means 14, and the operation, etc. of 24 such as a linear motor 22 and the cutting means are constituted by a control unit 26 for predetermined control. The linear motor 22 is configured such that the pressure roller 20 is rotatably supported by the slider 22A, and the pressure roller 20 can be moved in the direction along the adherend surface of the wafer W, that is, in the left-right direction in FIG.

  The holding means 12 includes a bottomed outer table 28 that opens at the upper end side, and an inner table 29 that is disposed inside the outer table 28 and can hold the wafer W by suction. The inner table 29 is provided so as to be able to be lifted and lowered via a lifting / lowering means 30 composed of a linear motion motor as a driving device located at the bottom of the outer table 28.

  The feeding means 14 includes a support shaft 33 that supports the roll-shaped raw fabric R, a guide roller 34 that guides the raw fabric R fed from the support shaft 33 to the peeling plate 16, and after passing through the peeling plate 16. The release sheet RL is wound around, and a drive roller 36 that is rotatably provided via a motor M1 as a driving device, and the release sheet RL is sandwiched between the drive roller 36 and the pinch roller 37, and passes therethrough. After the release sheet RL is wound by a driving device (not shown) with a predetermined torque, and after being pressed by the pressing roller 20, the unnecessary sheet portion S1 generated outside the wafer W is released by cutting the adhesive sheet S. A pair of pinch rollers 40 and a take-up roller 41 that is rotated by a motor M2 as a driving device and winds up an unnecessary sheet portion S1 are configured. That. The pinch roller 40 is rotatably supported by the slider 22B of the linear motor 22 and is provided so as to be movable in the left-right direction in FIG.

  The release plate 16 has a shape that narrows in a front view toward the distal end side (left end side in FIG. 1) where the release sheet RL is folded back, and the base end side (right end side in FIG. 1) can be rotated to the support shaft 18. It is supported by. The peeling plate 16 includes a guide surface 16A formed flat on the upper surface side, and the feeding of the original fabric R including the adhesive sheet S is guided by the guide surface 16A. Here, a predetermined area from the guide on the guide surface 16A in the adhesive sheet S to the release edge RL1 from which the release sheet RL is peeled is defined as a release standby surface SA, and an area located between the release edge RL1 and the pressing roller 20 Is the peeled surface SB. In order to maintain the planar shape of the separation standby surface SA, suction means capable of sucking the original fabric R from the separation sheet RL side may be provided on the guide surface 16A.

  A guide roller 46 is provided on the surface 16B (the lower surface in FIG. 1) of the release plate 16 opposite to the guide surface 16A as a release angle maintaining means on which the release sheet RL released by the release plate 16 is wound. . The guide roller 46 can maintain the state in which the release sheet RL is in line with the opposite surface 16B even if the release plate 16 is rotated, so that the release angle of the release sheet RL on the release plate 16 can be maintained constant. It has become.

  At the rotation center of the peeling plate 16, a friction suppressing means 48 that suppresses the rubbing of the original fabric R is provided. As shown in FIG. 2, the friction suppressing means 48 is disposed in an opening 49 formed on the base end side of the peeling plate 16 and is rotatably provided on the support shaft 18 via a bearing (not shown). The roller 50 is configured to guide the unwinding of the raw fabric R just before reaching the guide surface 16 </ b> A by the rotation of the roller 50, thereby suppressing the release sheet RL from rubbing against the release plate 16.

  The cutting means 24 has a cutter blade 53 that is rotated by a motor M3 as a driving device via an arm 52 and cuts the adhesive sheet S attached to the wafer W according to the size of the wafer W. The cutting means 24 is supported via a driving device (not shown), and is movable so that the cutter blade 53 reaches the adhesive sheet S when the adhesive sheet S is cut.

  The connecting means 25 is connected to a bracket 56 attached to the peeling plate 16, a connecting arm 57 supported by the bracket 56, and a support shaft 20 </ b> A that rotatably supports the pressing roller 20, and the linear motor 22. And a bearing member 58 supported rotatably with respect to the slider 22A (see FIG. 3). The bearing member 58 is provided with a slide hole 58A for slidably supporting the connecting arm 57. In addition, the dimension from the guide surface 16 </ b> A of the bracket 56 to the axis of the connecting arm 57 is set to be the same as the radial dimension of the pressing roller 20.

  The control means 26 can be constituted by a sequencer, a personal computer or the like. The control means 26 is connected to an input means (not shown) composed of an operation panel and the like, and operating conditions, data, etc. of the holding means 12, the feeding means 14, the linear motor 22 and the cutting means 24 can be input by this input means. ing. In addition, it has a function of determining conditions such as the operation amount, operation speed, and operation direction of each drive device and controlling them. The control means 26 is connected to each driving device by a cable (not shown), a wireless structure, or the like.

  Next, a method for sticking the adhesive sheet S by the sheet sticking apparatus 10 will be described.

  As an initial operation, the original fabric R supported by the support shaft 33 is pulled out by a predetermined length and is wound around the guide roller 34, and then the release sheet RL is peeled from the adhesive sheet S on the lead end side. The release sheet RL peeled off from the adhesive sheet S is looped around at the tip of the release plate 16 and passed between the drive roller 36 and the pinch roller 37 via the guide roller 46, and then the lead end is wound. It fixes to the taking shaft 38. The adhesive sheet S passes through the pressing roller 20 and the pinch rollers 40 in this order, and then fixes the lead end to the winding roller 41.

  After the wafer W is placed on the inner table 29 by a transfer device (not shown), the elevating means 30 is operated, and the upper surface of the wafer W and the upper surface of the outer table 28 are flush with each other as shown in FIG. The inner table 29 is moved up and down so as to be positioned at the position. Thereafter, by causing the motor M1 and the linear motor 22 to operate synchronously, the pressure roller 20 rolls on the adhesive sheet S from the position indicated by the solid line in FIG. Then, the adhesive sheet S is pressed and stuck to the wafer W.

  As indicated by a two-dot chain line in FIG. 1, during pressing of the adhesive sheet S, the peeling plate 16 is rotated via the connecting arm 57 in accordance with the movement of the pressing roller 20. That is, when the pressing roller 20 moves to the right side in FIG. 1 along with the movement of the slider 22A, the bearing member 58 rotates around the rotation center of the pressing roller 20 in the left rotation direction in FIG. 58A allows the connecting arm 57 to slide in its axial direction. By the operation of the connecting arm 57, the peeling plate 16 is rotated in the left rotation direction in FIG. 1 about the support shaft 18 via the bracket 56. Accordingly, the adhesive sheet S can be fed out so that the peeling standby surface SA and the peeled surface SB are positioned in the same plane without the adhesive sheet S being bent by the peeling plate 16.

  After affixing the adhesive sheet S to the wafer W, the cutting means 24 is lowered, and the adhesive sheet S is cut into a closed loop by the cutter blade 53. Next, the wafer W to which the adhesive sheet S is attached is transferred to another position by a transfer means (not shown), and the pinch is pinched as indicated by a two-dot chain line in FIG. By moving the roller 40 to the right side in FIG. 1, the unnecessary sheet S <b> 1 on the outer peripheral side of the wafer W is peeled from the upper surface of the outer table 28.

  Thereafter, the motor M1 is operated to release the adhesive sheet S by the release plate 16, and the linear motor 22 is operated to move the pressing roller 20 and the pinch roller 40 to the left side in FIG. 1, and the motor M2 is synchronized with this. Is operated to wind up the unnecessary sheet S1 by the winding roller 41. At this time, in accordance with the movement of the pressing roller 20, the peeling plate 16 is rotated via the connecting arm 57 so that the peeling standby surface SA and the peeled surface SB are maintained in the same plane. The pinch roller 40 is returned to the initial position, and the same operation is repeated thereafter.

  Therefore, according to such an embodiment, the adhesive sheet S can be affixed to the wafer W without being bent at the tip of the peeling plate 16. Thereby, it is possible to prevent the wafer W to which the adhesive sheet S is attached from being warped by bending the adhesive sheet S by the release plate 16.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  The connecting means 25 can be variously changed in design, and may be configured as shown in FIG. 4, for example. In the figure, the peeling plate 16 is constantly urged in the clockwise direction by the urging means 60 formed of a spring or the like, so that the connecting arm 57 is always in contact with the support shaft 20A of the pressing roller 20. . When the pressing roller 20 is moved in the right direction from the state shown in the figure, the support shaft 20A rotates the peeling plate 16 in the left rotation direction through the connecting arm 57. On the other hand, when the pressing roller 20 is moved to the left side in the figure, the peeling plate 16 is rotated in the right rotation direction via the connecting arm 57 along with the movement of the pressing roller 20. Thereby, even when the pressing roller 20 moves in any of the left and right directions in FIG. 3, the peeling plate 16 is rotated in accordance with the movement, and the peeling standby surface SA and the peeled surface SB are positioned in the same plane. To be maintained.

In the above-described embodiment, the separation standby surface SA is maintained flat by the guide surface 16A of the separation plate 16, but as shown in FIG. 5A, the raw fabric R is lifted from the guide surface 16A. It is good also as a structure which maintains peeling standby surface SA in a plane.
Further, as shown in FIG. 5B, the peeling means may be constituted by a roller 63.
Further, the feeding means 12 can be variously modified as long as the adhesive sheet S can be fed.

  Furthermore, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

  Further, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a semiconductor wafer or a compound semiconductor wafer.

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 14 Feeding means 16 Peeling plate (peeling means)
16A Guide surface 18 Support shaft (support means)
20 Pressing roller (pressing means)
22 Linear motor (moving means)
25 connecting means 46 guide roller (peeling angle maintaining means)
48 Friction suppression means 57 Connecting arm 63 Roller (peeling means)
RL Release sheet RL1 Release edge S Adhesive sheet SA Release standby surface SB Release completed surface W Semiconductor wafer (adhered body)

Claims (6)

A feeding means for feeding out the adhesive sheet temporarily attached to one surface of the release sheet; a peeling means for peeling the release sheet from the adhesive sheet; a support means for rotatably supporting the release means; and the adhesive sheet. A pressing unit that presses and adheres to an adherend surface of an adherend, a moving unit that moves the pressing unit along the adherend surface, and a connecting unit that connects the peeling unit and the pressing unit. A sheet sticking device,
In the adhesive sheet, a predetermined area in front of the peeling edge where the peeling sheet is peeled off by the peeling means is formed as a peeling standby surface, while a space between the peeling edge and the pressing means is formed as a peeled surface,
The connecting means is provided such that the peeling plate can be rotated in accordance with the movement of the pressing means by the moving means so that the peeling standby surface and the peeled surface are located in the same plane. Sheet sticking device. The peeling means includes a peeling plate having a flat guide surface for guiding the feeding of the adhesive sheet,
The adhesive sheet is formed as a separation standby surface between the separation edge guided by the guide surface and formed between the separation edge and the pressing means as a separation surface. The sheet sticking apparatus according to claim 1.   The connecting means includes a connecting arm attached to the peeling plate and in contact with the pressing means, and the peeling plate is rotatably provided via the connecting arm by the movement of the pressing means. Item 3. A sheet sticking device according to item 1 or 2.   The sheet sticking apparatus according to claim 1, 2 or 3, further comprising a peeling angle maintaining means for maintaining the peeling angle of the peeling sheet at the peeling means constant.   The sheet sticking device according to any one of claims 1 to 4, wherein the peeling means is provided with friction suppressing means for suppressing rubbing of the original fabric at the center of rotation. Extending the adhesive sheet temporarily attached to one surface of the release sheet;
Peeling the release sheet from the adhesive sheet;
When the predetermined area in the previous stage of the peeling edge from which the release sheet is peeled is the peeling standby surface of the adhesive sheet, and when the gap between the peeling edge and the adherend surface is the peeled surface of the adhesive sheet, the peeling standby surface and A step of pressing and adhering the adhesive sheet to the adherend surface of the adherend in a state where the peeling means and the pressing means are connected so that the peeled surface is located in the same plane. The sheet sticking method characterized by this.

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