JP2012014002A5 - - Google Patents
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- Publication number
- JP2012014002A5 JP2012014002A5 JP2010151244A JP2010151244A JP2012014002A5 JP 2012014002 A5 JP2012014002 A5 JP 2012014002A5 JP 2010151244 A JP2010151244 A JP 2010151244A JP 2010151244 A JP2010151244 A JP 2010151244A JP 2012014002 A5 JP2012014002 A5 JP 2012014002A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- semiconductor
- bonding
- bonding layer
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 11
- 229910000673 Indium arsenide Inorganic materials 0.000 claims description 8
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 claims description 8
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000002096 quantum dot Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010151244A JP2012014002A (ja) | 2010-07-01 | 2010-07-01 | 半導体装置およびその製造方法、集積基板、光モジュール、光通信装置 |
| PCT/JP2011/060909 WO2012002045A1 (ja) | 2010-07-01 | 2011-05-12 | 半導体装置およびその製造方法、集積基板、光モジュール、光通信装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010151244A JP2012014002A (ja) | 2010-07-01 | 2010-07-01 | 半導体装置およびその製造方法、集積基板、光モジュール、光通信装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012014002A JP2012014002A (ja) | 2012-01-19 |
| JP2012014002A5 true JP2012014002A5 (enrdf_load_stackoverflow) | 2012-12-27 |
Family
ID=45401780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010151244A Pending JP2012014002A (ja) | 2010-07-01 | 2010-07-01 | 半導体装置およびその製造方法、集積基板、光モジュール、光通信装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2012014002A (enrdf_load_stackoverflow) |
| WO (1) | WO2012002045A1 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8469588B2 (en) * | 2010-05-03 | 2013-06-25 | General Electric Company | System and method for compressor inlet temperature measurement |
| JP6601791B2 (ja) * | 2015-07-13 | 2019-11-06 | 株式会社Ｑｄレーザ | 半導体レーザ、光モジュール、光通信装置、及び光通信システム |
| US10168475B2 (en) | 2017-01-18 | 2019-01-01 | Juniper Networks, Inc. | Atomic layer deposition bonding for heterogeneous integration of photonics and electronics |
| KR102510356B1 (ko) * | 2018-05-03 | 2023-03-17 | 오픈라이트 포토닉스, 인크. | 포토닉스와 일렉트로닉스의 이종 통합을 위한 원자 층 퇴적 본딩 |
| WO2021219856A1 (en) * | 2020-04-30 | 2021-11-04 | Universiteit Gent | Colloidal quantum dot light emitters and detectors |
| JP7578025B2 (ja) * | 2021-03-01 | 2024-11-06 | 住友電気工業株式会社 | 半導体光素子およびその製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2624119B2 (ja) * | 1993-06-03 | 1997-06-25 | 日本電気株式会社 | 複合型半導体積層構造の製造方法 |
| US6730990B2 (en) * | 2000-06-30 | 2004-05-04 | Seiko Epson Corporation | Mountable microstructure and optical transmission apparatus |
| JP4167812B2 (ja) * | 2001-03-07 | 2008-10-22 | セイコーエプソン株式会社 | 面発光型半導体レーザおよびその製造方法 |
| JP2002305144A (ja) * | 2001-04-05 | 2002-10-18 | Seiko Epson Corp | 半導体基板の製造方法、ならびに半導体基板の製造装置 |
| JP2007164110A (ja) * | 2005-12-19 | 2007-06-28 | National Institute Of Advanced Industrial & Technology | 光ｉ／ｏ部作製方法および光集積回路 |
| JP2008198957A (ja) * | 2007-02-16 | 2008-08-28 | Hitachi Ltd | 半導体レーザ装置および光増幅装置 |
-
2010
- 2010-07-01 JP JP2010151244A patent/JP2012014002A/ja active Pending
-
2011
- 2011-05-12 WO PCT/JP2011/060909 patent/WO2012002045A1/ja active Application Filing
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