JP2011530803A5 - - Google Patents

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Publication number
JP2011530803A5
JP2011530803A5 JP2011521455A JP2011521455A JP2011530803A5 JP 2011530803 A5 JP2011530803 A5 JP 2011530803A5 JP 2011521455 A JP2011521455 A JP 2011521455A JP 2011521455 A JP2011521455 A JP 2011521455A JP 2011530803 A5 JP2011530803 A5 JP 2011530803A5
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JP
Japan
Prior art keywords
template
nanostructures
template according
base substrate
substrate
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JP2011521455A
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English (en)
Japanese (ja)
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JP5405574B2 (ja
JP2011530803A (ja
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Priority claimed from PCT/EP2009/005340 external-priority patent/WO2010015333A2/en
Publication of JP2011530803A publication Critical patent/JP2011530803A/ja
Publication of JP2011530803A5 publication Critical patent/JP2011530803A5/ja
Application granted granted Critical
Publication of JP5405574B2 publication Critical patent/JP5405574B2/ja
Expired - Fee Related legal-status Critical Current
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JP2011521455A 2008-08-05 2009-07-23 テンプレート、およびリソグラフィ用高アスペクト比テンプレートを製造する方法、ならびにナノスケールで基板を穿孔するためのテンプレートの使用 Expired - Fee Related JP5405574B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0801770 2008-08-05
SE0801770-9 2008-08-05
PCT/EP2009/005340 WO2010015333A2 (en) 2008-08-05 2009-07-23 Template and method of making high aspect ratio template for lithography and use of the template for perforating a substrate at nanoscale

Publications (3)

Publication Number Publication Date
JP2011530803A JP2011530803A (ja) 2011-12-22
JP2011530803A5 true JP2011530803A5 (enExample) 2012-11-15
JP5405574B2 JP5405574B2 (ja) 2014-02-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011521455A Expired - Fee Related JP5405574B2 (ja) 2008-08-05 2009-07-23 テンプレート、およびリソグラフィ用高アスペクト比テンプレートを製造する方法、ならびにナノスケールで基板を穿孔するためのテンプレートの使用

Country Status (7)

Country Link
US (1) US9028242B2 (enExample)
EP (1) EP2307928A2 (enExample)
JP (1) JP5405574B2 (enExample)
KR (1) KR20110055586A (enExample)
CN (1) CN102119363B (enExample)
MY (1) MY153444A (enExample)
WO (1) WO2010015333A2 (enExample)

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CN107175939B (zh) * 2016-03-09 2020-02-28 华邦电子股份有限公司 用于印刷线路制程的印章及其制造方法以及印刷线路制程
US9955584B2 (en) 2016-04-25 2018-04-24 Winbond Electronics Corp. Stamp for printed circuit process and method of fabricating the same and printed circuit process
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CN112960641B (zh) * 2020-10-12 2024-01-23 重庆康佳光电科技有限公司 转移构件、其制备方法及具有其的转移头

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